Transcript
The Most Advanced SSD
Innodisk 3ME3 Series Achieves High IOPS with DRAM-less Design Innodisk’s new embedded storage series 3ME3, is the perfectly upgrade from the industrial 3ME series. The 3ME3 offers an outstanding 25,000 IOPS 4K random read and write all without an external DRAM buffer. The DRAMless design not only prevents data loss from sudden power failure, but also makes for an even more compact form factor SSD, saving you precious space in your embedded system. The 3ME3 series is designed with an innovative flash algorithm and uses the latest synchronous NAND Flash IC to enhance disk performance in both sequential and random data transfers.
Features ▪ DRAM-less, 100% data integrity even in the event of power failure ▪ High random IOPS to enhance boot up times and general IO performance ▪ Enhanced performance with innovative firmware algorithm ▪ Supports TRIM, NCQ, and SMART ▪ Supports data integrity in the event of abnormal power failure with iData Guard technology ▪ Wide operating temperature range from -40°C to 85°C
The 3ME3 offers more advantages to you
What’s the breakthrough technology of Innodisk’s 3ME3? DRAM-less design for more reliable storage While using DRAM as a data buffer has become a common SSD architecture designed to enhance random transfer performance, Innodisk has approached the problem of achieving high performance in a reliable way from a different angle. Temporary data stored in the DRAM buffer is lost when power cuts unexpectedly, so data integrity is a critical issue for SSDs using a DRAM buffer. The New Innodisk 3ME3 embedded SATA modules are designed from the ground up for industrial use with the DRAM-less concept, brand-new firmware, and iData Guard to ensure data integrity.
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A cost-effective solution comparable to SLC iSLC is our exclusive technology, which is designed to outdo the endurance, performance and reliability onto superior-MLC solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 times, increasing lifespans about 7 times longer than consumer-MLC solutions. In addition, iSLC improves the performance of solid state drives, with similar read/write performance of SLC-based solutions, and with data quality that is on par with SLC technologies.
Why do we recommend you to choose our iSLC?
Suitable Lifespan For Your Application SSDs with iSLC can sustain 32GB capacity drive writes per day for over 5 years, delivering a lifespan that is suitable for industrial and enterprise applications.
Performance and data quality congruent to SLC Lifespan 7 times longer than MLC Half or less cost than SLC
Notes: The iSLC lifespan is based on flash quality & Innodisk L² algorithm.
Product specifications are subject to change without prior notice.
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A Commitment to Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary technologies. Here are just few examples of Innodisk’s breakthroughs and innovations.
Pin 7
iCell
Pin 7 is a Serial ATA device-to-host connection technology. It eliminates the need for power cables, making SSDs more shock-resistant and better suited for extreme environments. Pin 7 is the choice for system integrators who require flexibility, reliability, and space-maximization in the design of their systems. Pin 7 technology is used in Innodisk’s SATADOM series, which is featured in Intel’s Romley server boards and is currently the smallest flash storage device available.
iSMART
iSMART is a powerful, easy-to-use SSD and HDD health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan, and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk, before the end of its life cycle.
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iCell is a smart data protection technology that is built into Innodisk’s SSDs. iCell is crucial for mission-critical applications, where working under extreme conditions and without backup power is unavoidable. Our iCell technology provides a mechanism to instantaneously discharge data stored in temporary volatile DRAM buffers to flash storage, to ensure the safety of data during power failures.
iData Guard
Thermal Sensor
Innodisk’s Thermal Sensor is a robust heat and workload management technology that is built into our DRAM modules and flash storage. It is a crucial solution for industrial & aerospace and defense applications, which are often susceptible to extreme heat and performance stress. Innodisk’s Thermal Sensors help to lower the working temperature while distributing workloads, which prevents modules from overworking and overheating, and greatly enhances system performance and system stability.
Innodisk’s iData Guard is a comprehensive data protection mechanism that functions before and after a sudden power outage to the SSD. Low-power detection terminates data writing before an abnormal poweroff, while table-remapping after power-on deletes corrupt data and maintains data integrity. Innodisk’s iData Guard provides effective power cycling management, preventing data stored in flash from degrading with use.
Garbage Collection/ TRIM
Innodisk’s Garbage Collection/TRIM technology is used to maintain data consistency and perform continual data cleansing on SSDs. It runs as a background process, freeing up valuable controller resources while sorting good data into available blocks, and deleting bad blocks. It also significantly reduces write operations to the drive, thereby increasing the SSD’s speed and lifespan. With Innodisk Garbage Collection/TRIM technology, an SSD’s health and performance is optimized. Product specifications are subject to change without prior notice.
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nanoSSD The Innodisk nanoSSD is an integrated SATA storage device. It combines Innodisk's ID106 NAND flash controller and latest NAND flash in a JEDEC MO-276(SATA μSSD) form factor with one single ball grid array (BGA) package, which makes nanoSSD within a tiny dimension, and very easy to design in. The Innodisk nanoSSD , supporting SATA III 6.0Gbp/s , offers excellent high data transfer rates, along with lower power consumption. It is an ideal solution for any kind of miniaturization applications.
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Benefits of nanoSSD • Chip type, easy to design in without mechanical interference • SATA interface, highly compatible with x86 system • Excellent data transfer rates • Fully compliant with industrial standard • Suitable for ultra-thin or compact system • Zero peripheral circuit
Features • Integrated NAND Flash controller with Flash in a single chip • Compliant with JEDEC MO-276 (SATA μSSD) specification • Adopted SATA III interface with BGA package • Intelligent Flash management & real time garbage collection
The Innodisk nanoSSD SATA Eye Pattern
BOTTOM VIEW
DETAIL A
The Innodisk nanoSSD mechanical drawing
Model Name
nanoSSD 3IE
Key Features Interface Flash Type Capacity
nanoSSD 3ME
SATA III 6.0Gb/s iSLC
SLC
MLC
8~32GB
2~16GB
8~64GB
480/270
450/200
Max. Channel Sequential R/W (MB/sec, max.)
nanoSSD 3SE 1. Using BGA package to make controller and flash as single chip 2. Adopt SATA III interface,well Compatibility 3. Complaint with JEDEC MO-276 SPEC
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Max. Power Consumption
480/150
0.99W (300mA x 3.3v)
Thermal Sensor
N
External DRAM Buffer
N
iCell
N
TRIM
N
ATA Security
Y
S.M.A.R.T
Y
Dimension (WxLxH/mm)
16.0 x 20.0 x 1.7
Environment
Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHNSD-XXXD062C***
DENSD-XXXD06SC***
DENSD-XXXD06SC***
Wide Temp. OP (-40°C~+85°C)
N/A
DENSD-XXXD06SW***
N/A
Note
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XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code)
SSD
Innodisk SSDs bring a whole new level of high performance to memory storage. Our wide selection of SSDs are designed for different applications, including industrial/embedded, enterprise server, aviation, defense, and other semi-industrial applications, such as thin clients, POS, and kiosk. Our SSDs come in iSLC, SLC and MLC types, and support PATA/IDE 44 pin, SATA II (3.0Gb/s), and SATA III (6.0Gb/s).
Model Name
2.5" SATA SSD 3IE
Key Features
1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC
Interface
2.5" SATA SSD 3SE-P
2.5 SATA SSD 3SE
2.5" SATA SSD 3SR-P
1. Built-in DRAM buffer 1. Intelligent error recovery system 1. Compliant with MIL-STD-810-F/G 2. Intelligent error recovery system 2. Excellent data transfer speed 2. HW/SW Data Security (QEraser/ 3. Excellent data transfer speed 3. iData Guard protection Destroy/ SEraser/ Write Protect) 4. iData Guard protection 3. iCell supported, 100% data protection
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
iSLC
SLC
SLC
SLC
8GB-256GB
8GB-512GB
8GB-256GB
8GB-512GB
4
4
4
4
Sequential R/W (MB/sec, max.)
500/420
470/340
490/430
490/340
Max. Power Consumption
4.3W (5V x 870mA)
3.15W (5Vx630mA)
2.75W (5Vx550mA)
3.25W (5Vx650mA)
Flash Type Capacity Max. Channel
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
Y
N
Y
iCell
N
Optional
N
Y
TRIM
N
Y
N
Y
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
69.8 x 100.1 x 6.8
69.8 X 99.8 X 9.2
69.8 X 99.8 X 9.2
69.8 X 99.8 X 9.2
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHS25-XXXD062C***
DES25-XXXD67SC***(P)
DES25-XXXD06SC***
DRS25-XXXD67SC***
Wide Temp. OP (-40°C~+85°C)
DHS25-XXXD062W***
DES25-XXXD67SW***(P)
DES25-XXXD06SW***
DRS25-XXXD67SW***
Notes
Model Name
Key Features
Interface
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T ) ***= flash configuration (internal control code) %=Flash
2.5" SATA SSD 3ME 1. 7mm height mechanical design 2. Low power consumption 3. Budget - friendly MLCbased solution
2.5" SATA SSD 3ME3
2.5" SATA SSD 3MR-P
1. High IOPS with DRAM-less 1. Compliant with design MIL-STD-810-F/G 2. 7mm height mechanical 2. HW/SW Data Security design (QEraser/ Destroy/ 3. Low power consumption SEraser/ Write Protect) 3. iCell supported, 100% data protection
2.5" SATA SSD 3MG-P
2.5" SATA SSD 3MG2-P
1. EverGreen L² architecture 2. 7mm height mechanical design 3. Excellent random performance
1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
MLC
MLC
8GB-512GB
8GB-256GB
32GB-512GB
8GB-512GB
8GB-1TB
4
4
4
4
4
Sequential R/W (MB/sec, max.)
470/260
450/260
510/340
460/240
520/460
Max. Power Consumption
4.3W (5V x 870mA)
4.3W (5V x 870mA)
5W (5V x 1A)
5W (5V x 1A)
6W (5Vx1.2A)
Flash Type Capacity Max. Channel
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
Y
Y
Y
iCell
N
Optional
Y
Optional
Optional
TRIM
N
Y
Y
Y
Y
ATA Security
Y
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
Y
69.8 X 100.1 X 6.8
69.8 x 99.8 x 9.2
69.8 x 100.1 x 6.8
69.8 X 100.1 X 6.8
Dimension (WxLxH/mm) Environment
69.8 x 100.1 x 6.8
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million
Standard Temp. OP (0°C~+70°C)
DES25-XXXD06%C*** DES25-XXXD07%C***
DES25-XXXD09SC*** DES25-XXXD08SC***
DRS25-XXXD67%C***
DGS25-XXXD67%C***(P)
DGS25-XXXD81%C***(P)
Wide Temp. OP (-40°C~+85°C)
DES25-XXXD06%W*** DES25-XXXD07%W***
DES25-XXXD09SW*** DES25-XXXD08SW***
DRS25-XXXD67%W***
DGS25-XXXD67%W***(P)
DGS25-XXXD81%W***(P)
Notes
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 13
Slim SSD 3ME
Model Name Key Features
1.8" housing, 50% space saving
Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
1.8" SATA SSD 3SR-P 1. Compliant with MIL-STD-810-F/G 2. SW Data Security (QEraser/Destroy/SEraser/Write Protect)
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
SLC
8GB~ 128GB
8GB~ 256GB
4
4
460/160
490/340
1.6W (5V x 310mA)
Thermal Sensor
3W (5V x 600mA) STD : N , W/T : Y
External DRAM Buffer
N
Y
iCell
N
N
TRIM
N
Y
ATA Security
Y
Y
S.M.A.R.T
Y
Y
69.8 x 50.0 x 9.0
54.0 x 78.5 x 5.0
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million
Standard Temp. OP (0°C~+70°C)
DEMLM-XXXD07%C***
DRS18-XXXD67%C***
Wide Temp. OP (-40°C~+85°C)
DEMLM-XXXD07%W***
DRS18-XXXD67%W***
Notes
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
What is iCell?
What is TRIM?
Innodisk's R&D team has developed iCell Technology into several SSD drives. iCell Technology ensures reliable and accurate data transfers, even in the event of an abnormal power failure.
SSDs are made up of millions of NAND flash cells. They can be written into groups called pages (generally 4KB in size) but can only be erased in larger groups called blocks (generally 128 pages or 512KB). The addresses of the deleted files, or HDD formats are sent along with the TRIM command to the SSD’s controller so the drive can function optimally. TRIM commands clean up garbage data on the SSD that can slow performance down. The TRIM command is generally sent from the OS when the system is idle this cleans up the blocks with data that need to be erased so that the drive can perform like new.
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SATADOM Innodisk’s Serial ATA Disk on Module (SATADOM) is the world’s smallest form factor with exclusive Pin 7 VCC built-in, which simplifies motherboard design. Since it has no external cables, it is more robust and enhances the disk functions of various industrial and enterprise applications. Innodisk’s SATADOM also supports the SATA II and SATA III interface with faster data transfer rates and is available in capacities ranging from 512MB up to 128GB.
SATADOM advantage
Recommendation for Pin7 VCC issues
• Smallest
Innodisk suggests that customers who want to use products with the Pin7 VCC feature do so as a design-in feature, including a fuse circuit to prevent over-current issues. We recommend our reference circuit to protect the motherboard and device by using either a "POWER SWITCH" or "JUMPER + FUSE"
high speed SATA storage, supports low profile 1U Rack-mounted • Up to 128GB, great for SATA storage device • Reliable industrial grade quality • No moving parts for better vibration and shock resistance • Custom Firmware service available • Qualified by Intel, Supermicro…etc. • Available in Standard & Industrial temperature
*Warning DO NOT lay out 5V VCC on the SATA socket directly.
Pin7 VCC MB Reference Circuit Design
Model Name
Key Features
Interface Flash Type Capacity Max. Channel
SATADOM-ML 3IE 1. Vertical and low-profile design for 1U server 2. Cost-effective industrial Flash with iSLC 3. Write protect 4. Lifespan 7 times longer than MLC 5. Performance and data quality congruent to SLC SATA III 6.0Gb/s
SATADOM-SL 3IE
SATADOM-SV 3IE
1. Vertical and low-profile design for 1U server 2. Cost-effective industrial Flash with iSLC 3. Best boot drive solution 4. Lifespan 7 times longer than MLC 5. Performance and data quality congruent to SLC
1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATADOM-MV 3IE 1. Vertical version 2. Cost-effective industrial Flash with iSLC 3. Lifespan 7 times longer than MLC 4. Performance and data quality congruent to SLC
SATA III 6.0Gb/s
iSLC
iSLC
iSLC
iSLC
8GB-64GB
4GB-32GB
4GB-32GB
8GB-64GB
4
2
1
4
Sequential R/W (MB/sec, max.)
500/300
300/190
300/190
470/220
Max. Power Consumption
2.79W (5V x 558mA)
0.65W (5V x 125mA)
0.65W (5V x 125mA)
1W (5V x 200mA)
External DRAM Buffer
N
N
N
N
iCell
N
N
N
N N
Thermal Sensor
STD : N , W/T : Y
TRIM
N
N
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
32.9x29.5x8
20.9 x 39.5 x 8.1
25.3x41.5x6.8
Dimension (WxLxH/mm) Environment
35.5 x 30 x 9.5
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million
Standard Temp. OP (0°C~+70°C)
DHSML-XXXD062C***(F)
DESSL-XXXD072C***(F)
DESSV-XXXD072C***(F)
DHSMV-XXXD062C***(F)
Wide Temp. OP (-40°C~+85°C)
DHSML-XXXD062W***(F)
DESSL-XXXD072W***(F)
DESSV-XXXD072W***(F)
DHSMV-XXXD062W***(F)
Notes
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Product specifications are subject to change without prior notice. 15
Model Name
Key Features
Interface
SATADOM-SV 3SE 1. Vertical version 2. Anti-vibration mechanical design
SATADOM-ML 3SE-P 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Write protect 4. High performance
SATADOM-ML 3SE 1. Vertical and low-profile design for 1U server 2. Write protect 3. High performance
SATADOM-SL-3SE 1 Vertical and low-profile design for 1U server 2. Write protect 3. High performance
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SLC
SLC
SLC
SLC
512MB~32GB
8GB-64GB
8G-64GB
512MB~32GB
2
4
4
2
Sequential R/W (MB/sec, max.)
300/130
480/240
480/240
300/130
Max. Power Consumption
0.65W (5V x 130mA)
2.79W (5Vx558mA)
2.79W (5V x 558mA)
0.65W (5V x 130mA)
Flash Type Capacity Max. Channel
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
Y
N
N
iCell
N
N
N
N N
TRIM
N
Y
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
20.9 x 39.5 x 7.9
35.5 x 30 x 9.5
35.5x30x9.5
32.9x29.5x8
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million
Standard Temp. OP (0°C~+70°C)
DESSV-XXXD07SC***(F)
DESML-XXXD67SC***(F)
DESML-XXXD06SC***(F)
DESSL-XXXD07*C***(F)
Wide Temp. OP (-40°C~+85°C)
DESSV-XXXD07SW***(F)
DESML-XXXD67SW***(F)
DESML-XXXD06SW***(F)
DESSL-XXXD07*W***(F)
Notes
Model Name Key Features Interface
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
SATADOM-MH 3SE 1. Low-profile design 2. Write protect 3. High performance
SATADOM-SH 3SE
SATADOM-SH Type C 3SE
1. Low profile horizontal design 1. Low profile horizontal design 2. Only expose 12mm height on 2. Opposite direction of the motherboard when applying SATADOM-SH in practical
SATADOM-SH Type D 3SE Low profile horizontal design
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SLC
SLC
SLC
SLC
4GB-32GB
512MB-32GB
512MB-32GB
512MB-32GB
2
2
2
2
Sequential R/W (MB/sec, max.)
300/130
300/130
300/130
300/130
Max. Power Consumption
1.8W (5Vx360mA)
0.65W (5V x 130mA)
0.65W (5V x 130mA)
0.65W (5V x 130mA)
Flash Type Capacity Max. Channel
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
N
N
iCell
N
N
N
N
TRIM
N
N
N
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
40.0 x 30.0 x 12.3
18.0 x 30.3 x 12.5
30.3 x 18 x 10.4
30.3 x 20.3 x 12.0
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours
Stantard Temp. OP (0°C~+70°C)
DESMH-XXXD07SC***(F)
DESSH-XXXD07*C***(F)
DESSF-XXXD07*C***(F)
DESSF-XXXD07*C***(F)
Wide Temp. OP (-40°C~+85°C)
DESMH-XXXD07SW***(F)
DESSH-XXXD07*W***(F)
DESSF-XXXD07*W***(F)
DESSF-XXXD07*W***(F)
Notes
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XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Model Name
Key Features
Interface
SATADOM-MV 3ME
SATADOM-ML 3MG-P
1. Vertical version 1. Vertical version 2. Write protect 2. High IOPS 3. Anti-vibration mechanical design 3. Write protect 4. Supports TRIM SATA III 6.0Gb/s
Flash Type Capacity
SATADOM-MV 3ME3
1. Vertical and low-profile design for 1U server 2. High IOPS 3. Write protect 4. High performance
SATA III 6.0Gb/s
SATADOM-ML 3ME 1. Vertical and low-profile design for 1U server 2. Write protect 3. High performance
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
MLC
16GB-128GB
16GB-128GB
16GB-128GB
16GB-128GB
4
4
4
4
Sequential R/W (MB/sec, max.)
Max. Channel
460/160
450/220
500/160
500/160
Max. Power Consumption
1W (5V x 200mA)
1W (5V x 200mA)
2.79W (5V x 558mA)
2.79W (5V x 558mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
Y
N
iCell
N
N
N
N
TRIM
N
Y
Y
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
25.3 X 41.5X 6.8
25.3 x 41.5 x 6.8
35.5 x 30 x 9.5
35.5 x 30 x 9.5
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million
Standard Temp. OP (0°C~+70°C)
DESMV-XXXD07%C***(F) DESMV-XXXD06%C***(F)
DESMV-XXXD09SC***(F) DESMV-XXXD08SC***(F)
DGSML-XXXD67%C***(F)
DESML-XXXD06%C***(F)
Wide Temp. OP (-40°C~+85°C)
DESMV-XXXD07%W***(F) DESMV-XXXD06%W***(F)
DESMV-XXXD09SW***(F) DESMV-XXXD08SW***(F)
DGSML-XXXD67%W***(F)
DESML-XXXDO6%W***(F)
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Notes
Model Name
Key Features
Interface Flash Type Capacity Max. Channel
SATADOM-ML 3ME3
SATADOM-SL 3ME
1. Low-profile design for 1U 1. Vertical and low-profile server design for 1U server 2. High IOPS 2. Best boot drive solution 3. Write protect 3. Lower power consumption
SATADOM-SL 3ME3
SATADOM-SV 3ME
1. Vertical and low-profile design for 1U server 2. High IOPS 3. Best boot drive solution 4. Lower power consumption
SATADOM-SV 3ME3
1. Vertical version 1. Vertical version 2. Anti-vibration mechanical 2. High IOPS design 3. Best boot drive solution
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
MLC
SATA III 6.0Gb/s MLC
16GB-256GB
4GB-64GB
4GB-128GB
4GB-64GB
4GB-128GB
4
2
2
2
2
Sequential R/W (MB/sec, max.)
450/220
300/80
300/80
300/80
300/80
Max. Power Consumption
1W (5V x 200mA)
0.65W (5V x 125mA)
0.65W (5V x 125mA)
0.65W (5V x 125mA)
0.65W (5V x 125mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
N
N
N
iCell
N
N
N
N
N
TRIM
Y
N
Y
N
Y
ATA Security
Y
Y
Y
Y
Y
S.M.A.R.T Dimension (WxLxH/mm) Environment
Y
Y
Y
Y
Y
35.5x30x9.5
32.9 x 29.5 x 8
32.9 x 29.5 x 8
20.9 x 39.5 x 8.1
20.9 x 39.5 x 8.1
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DESML-XXXD08SC***(F)
DESSL-XXXD07%C***(F)
DESSL-XXXD09SC***(F)
DESSV-XXXD07%C***(F)
DESSV-XXXD09SC***(F)
Wide Temp. OP (-40°C~+85°C)
DESML-XXXD08SW***(F)
DESSL-XXXD07%W***(F)
DESSL-XXXD09SW***(F)
DESSV-XXXD07%W***(F)
DESSV-XXXD09SW***(F)
Notes
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Product specifications are subject to change without prior notice. 17
Model Name Key Features Interface
SATADOM-MH 3ME
SATADOM-MH 3ME3
1. Horizontal design 2. Write protect
SATADOM-SH 3ME
1. Horizontal design 2. High IOPS 3. Write protect
Low profile horizontal design
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
8GB-128GB
8GB-128GB
4GB-32GB
2
2
1
Sequential R/W (MB/sec, max.)
300/150
300/150
150/40
Max. Power Consumption
1W (5V x 200mA)
1W (5V x 200mA)
0.65W (5V x 125mA)
Flash Type Capacity Max. Channel
Thermal Sensor
SATA III 6.0Gb/s
STD : N , W/T : Y
External DRAM Buffer
N
N
N
iCell
N
N
N
TRIM
N
Y
N
ATA Security
Y
Y
Y
S.M.A.R.T
Y
Y
Y
40.0 X 30.0 X12.3
40.0 x 30.0 x 12.3
18.0 x 30.3 x 12.5
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DESMH-XXXD07%C***(F)
DESMH-XXXD09SC***(F)
DESSV-XXXD07%C***(F)
Wide Temp. OP (-40°C~+85°C)
DESMH-XXXD07%W***(F)
DESMH-XXXD09SW***(F)
DESSV-XXXD07%W***(F)
Notes
Model Name Key Features Interface Flash Type Capacity Max. Channel
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
SATADOM-SH 3ME3 1. Low profile horizontal design 2. High IOPS
SATA III 6.0Gb/s
SATADOM-SH Type C 3ME3
SATADOM-SH Type D 3ME
1. Low profile horizontal design 2. High IOPS 3. Opposite direction of SATADOM-SH
1. Low profile horizontal design
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATADOM-SH Type D 3ME3 1. Low profile horizontal design 2. High IOPS
SATA III 6.0Gb/s
MLC
MLC
MLC
MLC
4GB~128GB
4GB~128GB
4G-32GB
4GB~128GB
2
2
1
2
Sequential R/W (MB/sec, max.)
300/80
300/80
150/40
300/80
Max. Power Consumption
0.65W (5V x 125mA)
0.65W (5V x 125mA)
0.65W (5V x 125mA)
0.65W (5V x 130mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
N
N
iCell
N
N
N
N
TRIM
Y
Y
N
Y
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
18.0 x 30.3 x 12.5
30.3 x 18 x 10.4
30.3 x 20.3 x 12.0
30.3 x 20.3 x 12.0
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours
Stantard Temp. OP (0°C~+70°C)
DESSV-XXXD09SC***(F)
DESSC-XXXD09SC***(F)
DESSF-XXXD07%C***(F)
DESSF-XXXD09SC***(F)
Wide Temp. OP (-40°C~+85°C)
DESSV-XXXD09SW***(F)
DESSC-XXXD09SW***(F)
DESSF-XXXD07%W***(F)
DESSF-XXXD09SW***(F)
Notes
18
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
SATA Slim The Innodisk SATA Slim is compliant with the JEDEC SFF-8156 standard form factor and ATA protocol. It does not require drivers, and can be configured as a boot device or a data storage device. It is also suitable for portable/hand-held devices, thin clients, and industrial applications that require the effective reduction of operation system boot time and power consumption. With a 7+15 pin SATA interface, the Innodisk SATA Slim supports most platforms with a standard SATA port.
Model Name Key Features Interface
SATA Slim 3IE
SATA Slim 3SE-P
1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC
SATA Slim 3SE
1. Half Slim, space saving 2. High quality SLC-based solution 3. Excellent data transfer speed 4. Compatible with JEDEC MO297
1. Half Slim, space saving 2. High quality SLC-based solution 3. Compatible with JEDEC MO297
SATA III 6.0Gb/s
SATA III 6.0Gb/s
iSLC
SLC
SLC
4GB-128GB
4GB-128GB
4GB-128GB
4
4
4
Sequential R/W (MB/sec, max.)
460/370
480/330
460/360
Max. Power Consumption
1.6W (5V x 315mA)
1.65W (5V x 330mA)
1.1W (5Vx220mA)
Flash Type Capacity Max. Channel
Thermal Sensor
SATA III 6.0Gb/s
STD : N , W/T : Y
External DRAM Buffer
N
Y
N
iCell
N
N
N
TRIM
N
Y
N
ATA Security
Y
Y
Y
S.M.A.R.T
Y
Y
Y
54.0 x 39.8 x 4.0
54.0 x 39.8 x 4.0
54.0 x 39.8 x 4.0
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHSLM-XXXD06SC***
DESLM-XXXD67SC***
DESLM-XXXD06SC***
Wide Temp. OP (-40°C~+85°C)
DHSLM-XXXD06SW***
DESLM-XXXD67SW***
DESLM-XXXD06SW***
Notes
3Model Name
Key Features
Interface Flash Type Capacity Max. Channel
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
SATA Slim 3MG-P 1. EverGreen L² architecture 2. Excellent data transfer speed 3. Compatible with JEDEC MO297
SATA Slim 3MG2-P
SATA Slim 3ME
1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection
1. Half Slim,space saving 2. Budget -friendly MLC-based solution 3. Compatible with JEDEC MO297
SATA Slim 3ME3 1. Half Slim,space saving 2. High random performance 3. Budget -friendly MLC-based solution 4. Compatible with JEDEC MO297
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
SATA III 6.0Gb/s MLC
8GB-256GB
8GB-128GB
8GB-128GB
8GB-128GB
4
4
4
4
Sequential R/W (MB/sec, max.)
460/240
520/165
460/160
460/160
Max. Power Consumption
2.1W (5V x 428mA)
2.6W (5Vx520mA)
1.6W(5V x 315mA)
1.6W(5V x 315mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
Y
Y
N
Y
iCell
N
N
N
N
TRIM
Y
Y
N
Y
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
54.0 x 39.8 x 4.0
54.0 x 39.8 x 4.0
54.0 x 39.8 x 4.0
54.0 x 39.8 x 4.0
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz
Standard Temp. OP (0°C~+70°C)
DGSLM-XXXD67%C***
Wide Temp. OP (-40°C~+85°C)
DGSLM-XXXD67%W***
Notes
Shock:
[email protected]
Storage Temperature: -55°C ~ +95°C
MTBF: >3 million hours
DGSLM-XXXD81%C***
DESLM-XXXD07%C*** DESLM-XXXD06%C***
DESLM-XXXD09%C*** DESLM-XXXD08%C***
DGSLM-XXXD81%W***
DESLM-XXXD07%W*** DESLM-XXXD06%W***
DESLM-XXXD09%W*** DESLM-XXXD08%W***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 19
mSATA mSATA, which is distinct from the micro connector, was announced by the Serial ATA International Organization on September 21, 2009. Applications include netbooks, portable devices and other devices that require a smaller solid-state drive. The connector is similar in appearance to a PCI Express Mini Card interface and is electrically compatible; however, the data signals need a connection to the SATA host controller instead of the PCI-express host controller. Innodisk’s mSATA supports high-performance data transfer rates of 1.5 Gb/s, 3.0 Gb/s and 6.0 Gb/s.
Model Name
Key Features
Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
mSATA 3IE
mSATA 3SE-P
1. Cost-effective industrial Flash with iSLC 2. Lifespan 10 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed
mSATA 3SE
1. Excellent data transfer speed and IOPS 2. Support TRIM command 3. Built-in DRAM buffer
1. Excellent data transfer speed and IOPS 2. High quality SLC-based solution
mSATA 3ME 1. Excellent data transfer speed and IOPS 2. Budget- friendly MLC-based solution
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
iSLC
SLC
SLC
MLC
8GB~64GB
8GB~64GB
4GB~64GB
4GB-128GB
4
4
4
4
460/ 350
490/260
510/250
510/160
1.1 W (3.3V x 335 mA )
1.2 W (3.3V x 360 mA )
1.1 W (3.3V x 319 mA )
1.1W (3.3V x 335mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
Y
N
N
iCell
N
N
N
N
TRIM
N
Y
N
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
29.8 x 50.8 x 3.4
29.8 x 50.8 x 4.4
29.8 x 50.8 x 3.4
29.8 x 50.8 x 3.4
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours***
Standard Temp. OP (0°C~+70°C)
DHMSR-XXXD063C***
DEMSR-XXXD67SC***
DEMSR-XXXD06SC*** DEMSR-XXXD07SC***
DEMSR-XXXD07%C*** DEMSR-XXXD06%C***
Wide Temp. OP (-40°C~+85°C)
DHMSR-XXXD062W***
DEMSR-XXXD67SW***
DEMSR-XXXD06SW*** DEMSR-XXXD07SW***
DEMSR-XXXD07%W*** DEMSR-XXXD06%W***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type
Note
Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
mSATA 3ME3 1. Excellent data transfer speed and IOPS 2. Budget- friendly MLC-based solution
mSATA 3MG-P 1. EverGreen L² architecture 2. Intelligent error recovery system 3. Built-in DRAM buffer
1. Write protect 2. Half mSATA50% space saving 3. Low power consumption
mSATA mini 3ME3 1. Write protect 2. Half mSATA50% space saving 3. Low power consumption
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
MLC
MLC
4GB-256GB
8GB~128GB
4GB~128GB
4GB~64GB
4
4
2
2
420/220
490/150
290/80
180/100
1.4W (3.3V x 434 mA )
1.3 W (3.3V x 390mA )
0.8W (3.3V x 240mA)
0.77W (3.3V x 234mA)
Thermal Sensor External DRAM Buffer
mSATA mini 3ME
STD : N , W/T : Y N
Y
N
N N
iCell
Y
N
N
TRIM
Y
Y
N
Y
ATA Security
Y
Y
Y
Y
S.M.A.R.T Dimension (WxLxH/mm) Environment
Y
Y
Y
Y
29.8 x 50.8 x 3.4
29.8 x 50.8 x 4.4
30 x 26.8 x 3.7
30 x 26.8 x 3.7
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours***
Standard Temp. OP (0°C~+70°C)
DEMSR-XXXD09SC*** DEMSR-XXXD08SC***
DGMSR-XXXD67%C***
DEMSM-XXXD07%C***
DEMSM-XXXD09%C***
Wide Temp. OP (-40°C~+85°C)
DEMSR-XXXD09SW*** DEMSR-XXXD08SW***
DGMSR-XXXD67%W***
DEMSM-XXXD07%W***
DEMSM-XXXD09%W***
Note
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Mini PCIeDOM The Innodisk Mini PCIeDOM is a Flash based disk module with standard Mini PCIe form factor, and PCI Express Gen.1 interface. It is suitable for board maker or SI to design in the product as a boot drive or a storage device. Meanwhile, it supports multiple operation systems and no driver needed, including Windows XP, Windows 7, and Linux based OS.
Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
Mini PCIeDOM 1SE
Mini PCIeDOM 1ME 1. Standard PCIe Interface 2. Driver-less
1. Standard PCIe Interface 2. Driver-less PCI Express Gen.1 x1
PCI Express Gen.1 x1
SLC
MLC
4GB~64GB
8GB~128GB
4
2
85/85
170/120
2.3 W (3.3V x 700 mA )
Thermal Sensor
2 W (3.3V x 6200 mA ) STD: N , W/T: Y
External DRAM Buffer
N
N
iCell
N
N
TRIM
N
N
ATA Security
Y
Y
S.M.A.R.T
Y
Y
30 x 50.95 x 5
30 x 50.95 x 5
Dimension (WxLxH/mm)
Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Environment Standard Temp. OP (0°C~+70°C)
DEEDM-XXXJ30AC***
DEEDM-XXXD07SC***
Wide Temp. OP (-40°C~+85°C)
DEEDM-XXXJ30AW***
DEEDM-XXXD07SW***
Note
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Download our iSMART to monitor the health of storage
iSMART is a powerful, easy-to-use solid-state drive (SSD) and hard disk drive (HDD) health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan, and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk, before the end of its life cycle.
Users can easily enable/disable write protect, ATA Security, quick erase, and power saving features in one button.
Performance/Alert page can show any installed disk’s R/W performance and alert in time for abnormality.
The Lifespan graph helps user understand the expiry date of Innodisk own’s products.
On the iSMART iAnalyzer page, it records read/write behavior of a SSD in real-time, categorizing these operations as either sequential or random I/O, as well as segmenting by the size of the operation. Product specifications are subject to change without prior notice. 21
M.2-SATA(NGFF)
M.2-SATA (NGFF) stands for Next Generation Form Factor, which is comprised of several interfaces and the corresponding system interconnect based on 67pin edge card connectors. The Innodisk M.2-SATA (NGFF) offers wide range capacities in several standard form factors to fulfill different applications, including type 2242, type 2260, type 2280, and 22110.
Benefits • Small form factor, M.2 (S42) save about 40% PCB dimension compared to Mini PCIe form factor • Innodisk's exclusive iData Guard ensures reliable data transfers in the event of an abnormal power failure • Fully compliant with industrial standard • Suitable for ultra-thin or compact system M.2-2242
Features • Adopted SATA III 6.0 Gb/s interface, complaint with M.2 ( NGFF ) type 2242 and 2280 • Excellent data transfer speed in small form factor • iCell technology for data protection • Supports iSMART disk health monitoring M.2-2280
Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
M.2 (S42) 3IE
M.2 (S42) 3SE
1. Type 2242-D2-B-M 2. Cost-effective industrial flash with iSLC 3. iData Guard Protection
M.2 (S42) 3ME3 1. Type 2242-D2-B-M 2. High IOPS 3. iData Guard Protection
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
iSLC
SLC
MLC
8GB~32GB
1GB~32GB
4GB~64GB
2
2
2
300/190
300/130
300/70
0.5W (3.3V x 150mA )
0.5 W (3.3V x 150 mA )
0.5W (3.3V x 150mA)
Thermal Sensor External DRAM Buffer
1. Type 2242-D2-B-M 2. High quality SLC-based solution 3. iData Guard Protection
STD : N , W/T : Y N
N
N N
iCell
N
N
TRIM
N
N
Y
ATA Security
Y
Y
Y
S.M.A.R.T Dimension (WxLxH/mm) Environment
Y
Y
Y
22.0 x 42.0 x3.4
22.0 x 42.0 x 3.4
22.0x42.0x3.4
Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHM24-XXXD072C***
DEM24-XXXD07SC***
DEM24-XXXD09%C***
Wide Temp. OP (-40°C~+85°C)
DHM24-XXXD072W***
DEM24-XXXD07SW***
DEM24-XXXD09%W***
Note
22
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code) %=Flash Type
l
M.2 (S80) 3IE
Model Name Key Features
1. Type 2280-D2-B-M 2. Cost-effective industrial flash with iSLC 3. iData Guard Protection
Interface
SATA III 6.0Gb/s
Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
M.2 (S80) 3SE 1. Type 2280-D2-B-M 2. High quality SLC-based solution 3. iData Guard Protection SATA III 6.0Gb/s
iSLC
SLC
32GB~256GB
32GB~256GB
4
4
450/350
450/350
1.3W (3.3V x 390mA)
Thermal Sensor
1.3W (3.3V x 390mA) STD : N , W/T : Y
External DRAM Buffer
N
N
iCell
N
N
TRIM
N
N
ATA Security
Y
Y
S.M.A.R.T
Y
Y
22.0x80.0x3.5
22.0x80.0x3.5
Dimension (WxLxH/mm) Environment
Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHM28-XXXD062C***
DEM28-XXXD06SC***
Wide Temp. OP (-40°C~+85°C)
DHM28-XXXD062W***
DEM28-XXXD06SW***
Note
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
l
M.2 (S80) 3ME3
Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
1. Type 2280-D2-B-M 2. High IOPS 3. iData Guard Protection
M.2 (S80) 3MG2-P 1. Type 2280-D2-B-M 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection
SATA III 6.0Gb/s
SATA III 6.0Gb/s
MLC
MLC
64GB~512GB
128GB~512GB
4
4
420/220
420/ 430
1.3W (3.3V x 390mA)
3.63W (3.3Vx1.1A )
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
Y
iCell
N
N
TRIM
Y
Y
ATA Security
Y
Y
S.M.A.R.T
Y
Y
22.0x80.0x3.5
22.0 X 80.0 X 3.5
Dimension (WxLxH/mm) Environment
hock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DEM28-XXXD08%C***
DGM28-XXXD81%C***
Wide Temp. OP (-40°C~+85°C)
DEM28-XXXD08%W***
DGM28-XXXD81%W***
Note
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
Product specifications are subject to change without prior notice. 23
CFast The Innodisk CFast is a small form factor card standard with high data storage capacity. It is suitable for semi-industrial applications. Compliant with the CFast 2.0 standard, it is designed with a 7+17 pin connector and is SATA compatible. The Innodisk CFast offers data transfer rates of sequential read up to 470 MB/sec. and of sequential write up to 280MB/sec.
Moedel Name
Key Features
Interface Connector Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption
CFast 3IE
CFast 3SE
CFast 3ME
CFast 3ME3
1. Cost-effective industrial Flash with 1. Compliant with CFast 2.0 1. Compliant with CFast 2.0 iSLC standard satndard 2. Lifespan 7 times longer than 2. Excellent data transfer speed 2. Budget friendly MLC-based MLC 3. Support hardware write protect solution 3. Performance and data quality 3. Support hardware write protect congruent to SLC 4. Support hardware write protect
1. Compliant with CFast 2.0 satndard 2. Buget friendly MLC-based solution 3. Support hardware write protect 4. High IOPS
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
SATA III 6.0Gb/s
7+17pin
7+17pin
7+17pin
7+17pin
iSLC
SLC
MLC
MLC
8GB~64GB
1GB~64GB
4GB~128GB
4GB~128GB
2
4
2
2
310/280
470/250
300/150
300/150
1.1W (3.3V x 320mA)
1.1W (3.3V x 360mA)
1.1W (3.3V x 320mA)
1.1W (3.3V x 320mA)
Thermal Sensor
STD : N , W/T : Y
External DRAM Buffer
N
N
N
N
iCell
N
N
N
N
TRIM
N
N
N
Y
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
42.8 x 36.4 x3.6
42.8 x 36.4 x3.6
42.8 x 36.4 x3.6
42.8 x 36.4 x3.6
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DHCFA-XXXD07%C***
DECFA-XXXD06SC***
DECFA-XXXD07%C***
DECFA-XXXD09%C***
Wide Temp. OP (-40°C~+85°C)
DHCFA-XXXD07%W***
DECFA-XXXD06SW***
DECFA-XXXD07%W***
DECFA-XXXD09%W***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) % =Flash Type
Note
CF Card
Innodisk’s Industrial CompactFlash Memory Card (iCF) complies with the PCMCIA* ATA standard. Designed to replace traditional rotating disk drives, Innodisk iCFs are embedded solid-state data storage systems that are designed for mobile computing and the industrial work place.
Model Name Key Features Interface Connector Flash Type Capacity Max. Channel
iCF 9000 1. High sustained data transfer speed 2. Enhanced power cycling management
iCF 1SE High quality SLC-based solution
iCF 1ME 1. Budget friendly MLC-based solution 2. Enhanced power cycling management
PATA
PATA
PATA
50pin CF connector
50pin CF connector
50pin CF connector
SLC
SLC
MLC
1GB~64GB
128MB~8GB
4GB~128GB
4
2
2
110/100
50/40
110/65
1.05W (5V x 210mA) 0.69W (3.3V x 210mA)
0.75W (5V x 150mA) 0.5W (3.3V x 150mA)
1.05W (5V x 150mA) 0.69W (3.3V x 150 mA)
Thermal Sensor
N
N
N
ATA Security
Y
Y
Y
S.M.A.R.T
Y
Y
Y
42.8 x 36.4 x 3.3
42.8 x 36.4 x 3.3
42.8 x 36.4 x 3.3
Sequential R/W (MB/sec, max.) Max. Power Consumption
Dimension (WxLxH/mm) Environment
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DC1M-XXXD71%C***
DC1M-XXXD41AC***
DECFC-XXXD53%C***
Wide Temp. OP (-40°C~+85°C)
DC1M-XXXD71%W***
DC1M-XXXD41AW***
DECFC-XXXD53%W***
PIO mode 0-6 UDMA mode 0-7
PIO mode 0-6 UDMA mode 0-4
PIO mode 0-6 UDMA mode 0-7
Note Notes
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) % =Flash Type
EDC
The Innodisk Embedded Disk Card (EDC) complies with PCMCIA* ATA standards and fits into all platforms with an IDE connector. The Innodisk Embedded Disk Card comes in capacities ranging from 128MB to 32GB and is available in 40-pin and 44-pin connector packages.
Model Name
EDC 1SE Vertical Type
Key Features
1. Dust prevention 2. High quality SLC-based solution
Connector
EDC 1SE Horizontal Type 1. High quality SLC-based solution 2. Supported mounting hole
EDC 1ME Vertical Type
EDC 1ME Horizontal Type
1. Budget- friendly MLC-based 1. Budget- friendly MLC-based solution solution 2. High performacne PATA solution 2. High performacne PATA solution
40/44 pin
40/44 pin
44 pin
44 pin
Interface
PATA
PATA
PATA
PATA
Flash Type
SLC
SLC
MLC
MLC
128MB~4GB
128MB~8GB
4GB~64GB
4GB~128GB
Capacity Max. Channel
2
2
2
2
35/25
35/25
110/75
110/75
0.75W(5V x 150mA) 0.5W(3.3V x 150mA)
0.75W(5V x 150mA) 0.5W(3.3V x 150mA)
1.05W(5V x 150mA) 0.69W(3.3V x 150mA)
1.05W(5V x 150mA) 0.69W(3.3V x 150mA)
Sequential R/W (MB/sec, max.) Max. Power Consumption Thermal Sensor
N
N
N
N
External DRAM Buffer
N
N
N
N
ATA Security
Y
Y
Y
Y
S.M.A.R.T
Y
Y
Y
Y
40 pin: 60.2 x 27.3 x 6.4 44 pin: 50.3 x 27.3 x 5.8
40 pin (A,B type): 55 x 32.4 x 12.9 40 pin (C,D type): 55 x 32.4 x 14.6 40 pin (E,F type): 55 x 32.4 x 18.3 44 pin (A,B type): 48 x 32.6 x 6.7 44 pin (C,D type): 48 x 32.6 x 9.6 44 pin (E,F type): 48 x 32.6 x 12.9
44 pin 50.3 x 27.3 x 7.5
Dimension (WxLxH/mm)
Environment
44 pin (A,B type): 48 x 34.1 x 7.4
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DE0H-XXXD41AC*** DE4H-XXXD41AC***
DE0P%-XXXD41AC*** DE4P%-XXXD41AC***
DEE4H-XXXD53RC***
DEE4%-XXXD53RC***
Wide Temp. OP (-40°C~+85°C)
DE0H-XXXD41AW*** DE4H-XXXD41AW***
DE0P%-XXXD41AW*** DE4P%-XXXD41AW***
DEE4H-XXXD53RW***
DEE4%-XXXD53RW***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) %=Horizontal type(A, B, C, D, E, F)
Note
SD/micro SD
Innodisk SD and microSD cards are single-level flash devices built for rugged applications in the embedded field. As an industrialgrade SD/microSD card, these cards deliver outstanding performance of up to 20MB per second as well as excellent endurance and reliability, especially compared to other cards used in the mobile market. The Innodisk SD and microSD cards are compatible with SD 2.0 standards and support SDHC Class 10. They also feature SMART technology, which monitors the reliability of these SD cards.
Model Name
Industrial micro SD Card Enhanced power cycling management
Key Features
Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption S.M.A.R.T Dimension (WxLxH/mm) Environment
Industrial SD Card 1. Designed for industrial applications 2. High reliability 3. Customizeable 4. Power Fail mangement 5. Supported SPI mode
SD 1.01/2.00
SD 3.00
SLC
SLC/MLC
1G~8GB
SLC: 128MB~32GB MLC: 4GB~64GB
1
1
20/16
SLC: 35/25 MLC: 45/20
0.17W (3.3V x 50mA)
0.26W (3.3V x 77mA)
Y
Y
11.0 x 15.0 x 1.0
24.0 x 32.0 x 2.1
Vibration: 20G@7~2000Hz Shock:
[email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours
Standard Temp. OP (-20°C~+85°C)
DS2M-XXXI81AC***
DESDC-XXXY81%C***
Wide emp. OP (-40°C~+85°C)
DS2M-XXXI81AW***
DESDC-XXXY81%W***
Note
XXX = density (02GB=02G, 04GB=04G, 08GB=08G) *** = flash configuration (internal control code) %=Flash Type
Product specifications are subject to change without prior notice. 25
USB The Innodisk industrial-grade USB series is built using SLC NAND flash and features an attractive small form factor. It provides highcapacity flash memory storage while delivering faster data transmission with high reliability. It also complies with the high-speed USB 3.0 interface and is backward compatible with USB 1.1. The Innodisk USB series has a variety of special features, from plastic and metal housing to secure mounting holes to EDC choices.
Model Name
Key Features
Industrial Nano USB
USB Drive 3SE
USB Drive 3ME
USB Drive 2SE
1. Only expose 5mm height 1. Metal housing to enhance ESD protection on the motherboard 2. 30μ golden finger for highly reliable data transfer when applying in quality practical 2. Smallest USB Drive for industrial application 3. Very low power consumption
USB Drive 2ME
1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality
Interface
USB 2.0
Connector
Type A
Flash Type
SLC
SLC
MLC
SLC
MLC
1GB~ 8GB
4GB-32GB
4GB~ 32GB
512MB~ 16GB
4GB~ 32GB
1
1
1
1
1
19/17
106/94
105/50
28/24
26/10
Capacity Max. Channel Sequential R/W (MB/sec, max.)
USB 3.0
USB 2.0
Type A
Type A
Max. Power Consumption
0.45W (5V x 90mA)
0.70W (5V x 140mA)
Dimension (WxLxH/mm)
15.4 x 19.4 x 6.9
16.5 x 45.8 x 7.4
Environment
Vibration: 20G@7~2000Hz
Shock:
[email protected]
0.85W (5V x 170mA) 16.5 x 45.8 x 7.4 Storage Temperature: -55°C ~ +95°C
MTBF: >3 million hours
Standard Temp. OP (0°C~+70°C)
DEUN-XXXS23AC***
DEUA1-XXXI61SC***
DEUA1-XXXI61RC***
DEUA1-XXXI72AC***
DEUA1-XXXI72RC***
Wide Temp. OP (-40°C~+85°C)
DEUN-XXXS23AW***
DEUA1-XXXI61SW***
DEUA1-XXXI61RW***
DEUA1-XXXI72AW***
DEUA1-XXXI72RW***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code)
Notes
Model Name
USB EDC Vertical 3SE USB EDC Vertical 3ME
Key Features
1. High performance with USB 3.0 interface 2. Low power consumption 3. Wear-Leveling supported
Interface Connector Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption Dimension (WxLxH/mm) Environment Standard Temp. OP (0°C~+70°C) Wide Temp. OP (-40°C~+85°C) Notes
26
USB EDC Horizontal 2SE
USB EDC Horizontal 2ME
1. Supported mounting hole 2. 2.0/2.54 pin pitch
USB EDC Vertical 2SE USB EDC Vertical 2ME 1. Very low profile 2. Low power consumption
USB 3.0
USB 2.0
USB 2.0
Standard, 20pin, 2.00mm
Standard,10pin, 2.54mm Low profile,10pin, 2.00mm
Standard, 10pin, 2.54mm
SLC
MLC
SLC
MLC
SLC
MLC
4GB~32GB
4GB~32GB
512MB~ 32GB
4G~ 64G
512MB-16GB
4GB~16GB
1
1
1
1
1
1
100/85
100/50
28/24
26/10
28/24
26/10
0.79 W (5VX158)
0.85W (5V x 170mA)
0.85W (5V x 170mA)
24 x 22 x 5
26.6x36.9x9.6(Pin Pitch2.54) 26.6x36.9x6.6(Pin Pitch2.00)
15.2 x 34.1 x 6.4
Vibration: 20G@7~2000Hz DEUV1-XXXI61SC***
Shock:
[email protected]
Storage Temperature: -55°C ~ +95°C
DEUH1-XXXI72AC*** DEUH1-XXXI72RC*** DEUV1-XXXI61RC*** DEUH2-XXXI72AC*** DEUH2-XXXI72RC***
DEUV1-XXXI61SW*** DEUV1-XXXI61RW***
MTBF: >3 million hours
DEUV1-XXXI72AC***
DEUV1-XXXI72RC***
DEUH1-XXXI72AW*** DEUH1-XXXI72RW*** DEUV1-XXXI72AW*** DEUV1-XXXI72RW*** DEUH2-XXXI72AW*** DEUH2-XXXI72RW***
XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code)