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Innodisk 3me3

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The Most Advanced SSD Innodisk 3ME3 Series Achieves High IOPS with DRAM-less Design Innodisk’s new embedded storage series 3ME3, is the perfectly upgrade from the industrial 3ME series. The 3ME3 offers an outstanding 25,000 IOPS 4K random read and write all without an external DRAM buffer. The DRAMless design not only prevents data loss from sudden power failure, but also makes for an even more compact form factor SSD, saving you precious space in your embedded system. The 3ME3 series is designed with an innovative flash algorithm and uses the latest synchronous NAND Flash IC to enhance disk performance in both sequential and random data transfers. Features ▪ DRAM-less, 100% data integrity even in the event of power failure ▪ High random IOPS to enhance boot up times and general IO performance ▪ Enhanced performance with innovative firmware algorithm ▪ Supports TRIM, NCQ, and SMART ▪ Supports data integrity in the event of abnormal power failure with iData Guard technology ▪ Wide operating temperature range from -40°C to 85°C The 3ME3 offers more advantages to you What’s the breakthrough technology of Innodisk’s 3ME3? DRAM-less design for more reliable storage While using DRAM as a data buffer has become a common SSD architecture designed to enhance random transfer performance, Innodisk has approached the problem of achieving high performance in a reliable way from a different angle. Temporary data stored in the DRAM buffer is lost when power cuts unexpectedly, so data integrity is a critical issue for SSDs using a DRAM buffer. The New Innodisk 3ME3 embedded SATA modules are designed from the ground up for industrial use with the DRAM-less concept, brand-new firmware, and iData Guard to ensure data integrity. 4 A cost-effective solution comparable to SLC iSLC is our exclusive technology, which is designed to outdo the endurance, performance and reliability onto superior-MLC solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 times, increasing lifespans about 7 times longer than consumer-MLC solutions. In addition, iSLC improves the performance of solid state drives, with similar read/write performance of SLC-based solutions, and with data quality that is on par with SLC technologies. Why do we recommend you to choose our iSLC? Suitable Lifespan For Your Application SSDs with iSLC can sustain 32GB capacity drive writes per day for over 5 years, delivering a lifespan that is suitable for industrial and enterprise applications. Performance and data quality congruent to SLC Lifespan 7 times longer than MLC Half or less cost than SLC Notes: The iSLC lifespan is based on flash quality & Innodisk L² algorithm. Product specifications are subject to change without prior notice. 5 A Commitment to Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary technologies. Here are just few examples of Innodisk’s breakthroughs and innovations. Pin 7 iCell Pin 7 is a Serial ATA device-to-host connection technology. It eliminates the need for power cables, making SSDs more shock-resistant and better suited for extreme environments. Pin 7 is the choice for system integrators who require flexibility, reliability, and space-maximization in the design of their systems. Pin 7 technology is used in Innodisk’s SATADOM series, which is featured in Intel’s Romley server boards and is currently the smallest flash storage device available. iSMART iSMART is a powerful, easy-to-use SSD and HDD health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan, and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk, before the end of its life cycle. 6 iCell is a smart data protection technology that is built into Innodisk’s SSDs. iCell is crucial for mission-critical applications, where working under extreme conditions and without backup power is unavoidable. Our iCell technology provides a mechanism to instantaneously discharge data stored in temporary volatile DRAM buffers to flash storage, to ensure the safety of data during power failures. iData Guard Thermal Sensor Innodisk’s Thermal Sensor is a robust heat and workload management technology that is built into our DRAM modules and flash storage. It is a crucial solution for industrial & aerospace and defense applications, which are often susceptible to extreme heat and performance stress. Innodisk’s Thermal Sensors help to lower the working temperature while distributing workloads, which prevents modules from overworking and overheating, and greatly enhances system performance and system stability. Innodisk’s iData Guard is a comprehensive data protection mechanism that functions before and after a sudden power outage to the SSD. Low-power detection terminates data writing before an abnormal poweroff, while table-remapping after power-on deletes corrupt data and maintains data integrity. Innodisk’s iData Guard provides effective power cycling management, preventing data stored in flash from degrading with use. Garbage Collection/ TRIM Innodisk’s Garbage Collection/TRIM technology is used to maintain data consistency and perform continual data cleansing on SSDs. It runs as a background process, freeing up valuable controller resources while sorting good data into available blocks, and deleting bad blocks. It also significantly reduces write operations to the drive, thereby increasing the SSD’s speed and lifespan. With Innodisk Garbage Collection/TRIM technology, an SSD’s health and performance is optimized. Product specifications are subject to change without prior notice. 7 nanoSSD The Innodisk nanoSSD is an integrated SATA storage device. It combines Innodisk's ID106 NAND flash controller and latest NAND flash in a JEDEC MO-276(SATA μSSD) form factor with one single ball grid array (BGA) package, which makes nanoSSD within a tiny dimension, and very easy to design in. The Innodisk nanoSSD , supporting SATA III 6.0Gbp/s , offers excellent high data transfer rates, along with lower power consumption. It is an ideal solution for any kind of miniaturization applications. 1.7 Benefits of nanoSSD • Chip type, easy to design in without mechanical interference • SATA interface, highly compatible with x86 system • Excellent data transfer rates • Fully compliant with industrial standard • Suitable for ultra-thin or compact system • Zero peripheral circuit Features • Integrated NAND Flash controller with Flash in a single chip • Compliant with JEDEC MO-276 (SATA μSSD) specification • Adopted SATA III interface with BGA package • Intelligent Flash management & real time garbage collection The Innodisk nanoSSD SATA Eye Pattern BOTTOM VIEW DETAIL A The Innodisk nanoSSD mechanical drawing Model Name nanoSSD 3IE Key Features Interface Flash Type Capacity nanoSSD 3ME SATA III 6.0Gb/s iSLC SLC MLC 8~32GB 2~16GB 8~64GB 480/270 450/200 Max. Channel Sequential R/W (MB/sec, max.) nanoSSD 3SE 1. Using BGA package to make controller and flash as single chip 2. Adopt SATA III interface,well Compatibility 3. Complaint with JEDEC MO-276 SPEC 4 Max. Power Consumption 480/150 0.99W (300mA x 3.3v) Thermal Sensor N External DRAM Buffer N iCell N TRIM N ATA Security Y S.M.A.R.T Y Dimension (WxLxH/mm) 16.0 x 20.0 x 1.7 Environment Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHNSD-XXXD062C*** DENSD-XXXD06SC*** DENSD-XXXD06SC*** Wide Temp. OP (-40°C~+85°C) N/A DENSD-XXXD06SW*** N/A Note 12 XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) SSD Innodisk SSDs bring a whole new level of high performance to memory storage. Our wide selection of SSDs are designed for different applications, including industrial/embedded, enterprise server, aviation, defense, and other semi-industrial applications, such as thin clients, POS, and kiosk. Our SSDs come in iSLC, SLC and MLC types, and support PATA/IDE 44 pin, SATA II (3.0Gb/s), and SATA III (6.0Gb/s). Model Name 2.5" SATA SSD 3IE Key Features 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC Interface 2.5" SATA SSD 3SE-P 2.5 SATA SSD 3SE 2.5" SATA SSD 3SR-P 1. Built-in DRAM buffer 1. Intelligent error recovery system 1. Compliant with MIL-STD-810-F/G 2. Intelligent error recovery system 2. Excellent data transfer speed 2. HW/SW Data Security (QEraser/ 3. Excellent data transfer speed 3. iData Guard protection Destroy/ SEraser/ Write Protect) 4. iData Guard protection 3. iCell supported, 100% data protection SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s iSLC SLC SLC SLC 8GB-256GB 8GB-512GB 8GB-256GB 8GB-512GB 4 4 4 4 Sequential R/W (MB/sec, max.) 500/420 470/340 490/430 490/340 Max. Power Consumption 4.3W (5V x 870mA) 3.15W (5Vx630mA) 2.75W (5Vx550mA) 3.25W (5Vx650mA) Flash Type Capacity Max. Channel Thermal Sensor STD : N , W/T : Y External DRAM Buffer N Y N Y iCell N Optional N Y TRIM N Y N Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 69.8 x 100.1 x 6.8 69.8 X 99.8 X 9.2 69.8 X 99.8 X 9.2 69.8 X 99.8 X 9.2 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHS25-XXXD062C*** DES25-XXXD67SC***(P) DES25-XXXD06SC*** DRS25-XXXD67SC*** Wide Temp. OP (-40°C~+85°C) DHS25-XXXD062W*** DES25-XXXD67SW***(P) DES25-XXXD06SW*** DRS25-XXXD67SW*** Notes Model Name Key Features Interface XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T ) ***= flash configuration (internal control code) %=Flash 2.5" SATA SSD 3ME 1. 7mm height mechanical design 2. Low power consumption 3. Budget - friendly MLCbased solution 2.5" SATA SSD 3ME3 2.5" SATA SSD 3MR-P 1. High IOPS with DRAM-less 1. Compliant with design MIL-STD-810-F/G 2. 7mm height mechanical 2. HW/SW Data Security design (QEraser/ Destroy/ 3. Low power consumption SEraser/ Write Protect) 3. iCell supported, 100% data protection 2.5" SATA SSD 3MG-P 2.5" SATA SSD 3MG2-P 1. EverGreen L² architecture 2. 7mm height mechanical design 3. Excellent random performance 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC MLC MLC 8GB-512GB 8GB-256GB 32GB-512GB 8GB-512GB 8GB-1TB 4 4 4 4 4 Sequential R/W (MB/sec, max.) 470/260 450/260 510/340 460/240 520/460 Max. Power Consumption 4.3W (5V x 870mA) 4.3W (5V x 870mA) 5W (5V x 1A) 5W (5V x 1A) 6W (5Vx1.2A) Flash Type Capacity Max. Channel Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N Y Y Y iCell N Optional Y Optional Optional TRIM N Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y 69.8 X 100.1 X 6.8 69.8 x 99.8 x 9.2 69.8 x 100.1 x 6.8 69.8 X 100.1 X 6.8 Dimension (WxLxH/mm) Environment 69.8 x 100.1 x 6.8 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million Standard Temp. OP (0°C~+70°C) DES25-XXXD06%C*** DES25-XXXD07%C*** DES25-XXXD09SC*** DES25-XXXD08SC*** DRS25-XXXD67%C*** DGS25-XXXD67%C***(P) DGS25-XXXD81%C***(P) Wide Temp. OP (-40°C~+85°C) DES25-XXXD06%W*** DES25-XXXD07%W*** DES25-XXXD09SW*** DES25-XXXD08SW*** DRS25-XXXD67%W*** DGS25-XXXD67%W***(P) DGS25-XXXD81%W***(P) Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 13 Slim SSD 3ME Model Name Key Features 1.8" housing, 50% space saving Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption 1.8" SATA SSD 3SR-P 1. Compliant with MIL-STD-810-F/G 2. SW Data Security (QEraser/Destroy/SEraser/Write Protect) SATA III 6.0Gb/s SATA III 6.0Gb/s MLC SLC 8GB~ 128GB 8GB~ 256GB 4 4 460/160 490/340 1.6W (5V x 310mA) Thermal Sensor 3W (5V x 600mA) STD : N , W/T : Y External DRAM Buffer N Y iCell N N TRIM N Y ATA Security Y Y S.M.A.R.T Y Y 69.8 x 50.0 x 9.0 54.0 x 78.5 x 5.0 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million Standard Temp. OP (0°C~+70°C) DEMLM-XXXD07%C*** DRS18-XXXD67%C*** Wide Temp. OP (-40°C~+85°C) DEMLM-XXXD07%W*** DRS18-XXXD67%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type What is iCell? What is TRIM? Innodisk's R&D team has developed iCell Technology into several SSD drives. iCell Technology ensures reliable and accurate data transfers, even in the event of an abnormal power failure. SSDs are made up of millions of NAND flash cells. They can be written into groups called pages (generally 4KB in size) but can only be erased in larger groups called blocks (generally 128 pages or 512KB). The addresses of the deleted files, or HDD formats are sent along with the TRIM command to the SSD’s controller so the drive can function optimally. TRIM commands clean up garbage data on the SSD that can slow performance down. The TRIM command is generally sent from the OS when the system is idle this cleans up the blocks with data that need to be erased so that the drive can perform like new. 14 SATADOM Innodisk’s Serial ATA Disk on Module (SATADOM) is the world’s smallest form factor with exclusive Pin 7 VCC built-in, which simplifies motherboard design. Since it has no external cables, it is more robust and enhances the disk functions of various industrial and enterprise applications. Innodisk’s SATADOM also supports the SATA II and SATA III interface with faster data transfer rates and is available in capacities ranging from 512MB up to 128GB. SATADOM advantage Recommendation for Pin7 VCC issues • Smallest Innodisk suggests that customers who want to use products with the Pin7 VCC feature do so as a design-in feature, including a fuse circuit to prevent over-current issues. We recommend our reference circuit to protect the motherboard and device by using either a "POWER SWITCH" or "JUMPER + FUSE" high speed SATA storage, supports low profile 1U Rack-mounted • Up to 128GB, great for SATA storage device • Reliable industrial grade quality • No moving parts for better vibration and shock resistance • Custom Firmware service available • Qualified by Intel, Supermicro…etc. • Available in Standard & Industrial temperature *Warning DO NOT lay out 5V VCC on the SATA socket directly. Pin7 VCC MB Reference Circuit Design Model Name Key Features Interface Flash Type Capacity Max. Channel SATADOM-ML 3IE 1. Vertical and low-profile design for 1U server 2. Cost-effective industrial Flash with iSLC 3. Write protect 4. Lifespan 7 times longer than MLC 5. Performance and data quality congruent to SLC SATA III 6.0Gb/s SATADOM-SL 3IE SATADOM-SV 3IE 1. Vertical and low-profile design for 1U server 2. Cost-effective industrial Flash with iSLC 3. Best boot drive solution 4. Lifespan 7 times longer than MLC 5. Performance and data quality congruent to SLC 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC SATA III 6.0Gb/s SATA III 6.0Gb/s SATADOM-MV 3IE 1. Vertical version 2. Cost-effective industrial Flash with iSLC 3. Lifespan 7 times longer than MLC 4. Performance and data quality congruent to SLC SATA III 6.0Gb/s iSLC iSLC iSLC iSLC 8GB-64GB 4GB-32GB 4GB-32GB 8GB-64GB 4 2 1 4 Sequential R/W (MB/sec, max.) 500/300 300/190 300/190 470/220 Max. Power Consumption 2.79W (5V x 558mA) 0.65W (5V x 125mA) 0.65W (5V x 125mA) 1W (5V x 200mA) External DRAM Buffer N N N N iCell N N N N N Thermal Sensor STD : N , W/T : Y TRIM N N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 32.9x29.5x8 20.9 x 39.5 x 8.1 25.3x41.5x6.8 Dimension (WxLxH/mm) Environment 35.5 x 30 x 9.5 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million Standard Temp. OP (0°C~+70°C) DHSML-XXXD062C***(F) DESSL-XXXD072C***(F) DESSV-XXXD072C***(F) DHSMV-XXXD062C***(F) Wide Temp. OP (-40°C~+85°C) DHSML-XXXD062W***(F) DESSL-XXXD072W***(F) DESSV-XXXD072W***(F) DHSMV-XXXD062W***(F) Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 15 Model Name Key Features Interface SATADOM-SV 3SE 1. Vertical version 2. Anti-vibration mechanical design SATADOM-ML 3SE-P 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Write protect 4. High performance SATADOM-ML 3SE 1. Vertical and low-profile design for 1U server 2. Write protect 3. High performance SATADOM-SL-3SE 1 Vertical and low-profile design for 1U server 2. Write protect 3. High performance SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SLC SLC SLC SLC 512MB~32GB 8GB-64GB 8G-64GB 512MB~32GB 2 4 4 2 Sequential R/W (MB/sec, max.) 300/130 480/240 480/240 300/130 Max. Power Consumption 0.65W (5V x 130mA) 2.79W (5Vx558mA) 2.79W (5V x 558mA) 0.65W (5V x 130mA) Flash Type Capacity Max. Channel Thermal Sensor STD : N , W/T : Y External DRAM Buffer N Y N N iCell N N N N N TRIM N Y N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 20.9 x 39.5 x 7.9 35.5 x 30 x 9.5 35.5x30x9.5 32.9x29.5x8 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million Standard Temp. OP (0°C~+70°C) DESSV-XXXD07SC***(F) DESML-XXXD67SC***(F) DESML-XXXD06SC***(F) DESSL-XXXD07*C***(F) Wide Temp. OP (-40°C~+85°C) DESSV-XXXD07SW***(F) DESML-XXXD67SW***(F) DESML-XXXD06SW***(F) DESSL-XXXD07*W***(F) Notes Model Name Key Features Interface XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type SATADOM-MH 3SE 1. Low-profile design 2. Write protect 3. High performance SATADOM-SH 3SE SATADOM-SH Type C 3SE 1. Low profile horizontal design 1. Low profile horizontal design 2. Only expose 12mm height on 2. Opposite direction of the motherboard when applying SATADOM-SH in practical SATADOM-SH Type D 3SE Low profile horizontal design SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SLC SLC SLC SLC 4GB-32GB 512MB-32GB 512MB-32GB 512MB-32GB 2 2 2 2 Sequential R/W (MB/sec, max.) 300/130 300/130 300/130 300/130 Max. Power Consumption 1.8W (5Vx360mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) Flash Type Capacity Max. Channel Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N N N iCell N N N N TRIM N N N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 40.0 x 30.0 x 12.3 18.0 x 30.3 x 12.5 30.3 x 18 x 10.4 30.3 x 20.3 x 12.0 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours Stantard Temp. OP (0°C~+70°C) DESMH-XXXD07SC***(F) DESSH-XXXD07*C***(F) DESSF-XXXD07*C***(F) DESSF-XXXD07*C***(F) Wide Temp. OP (-40°C~+85°C) DESMH-XXXD07SW***(F) DESSH-XXXD07*W***(F) DESSF-XXXD07*W***(F) DESSF-XXXD07*W***(F) Notes 16 XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Model Name Key Features Interface SATADOM-MV 3ME SATADOM-ML 3MG-P 1. Vertical version 1. Vertical version 2. Write protect 2. High IOPS 3. Anti-vibration mechanical design 3. Write protect 4. Supports TRIM SATA III 6.0Gb/s Flash Type Capacity SATADOM-MV 3ME3 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Write protect 4. High performance SATA III 6.0Gb/s SATADOM-ML 3ME 1. Vertical and low-profile design for 1U server 2. Write protect 3. High performance SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC MLC 16GB-128GB 16GB-128GB 16GB-128GB 16GB-128GB 4 4 4 4 Sequential R/W (MB/sec, max.) Max. Channel 460/160 450/220 500/160 500/160 Max. Power Consumption 1W (5V x 200mA) 1W (5V x 200mA) 2.79W (5V x 558mA) 2.79W (5V x 558mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N Y N iCell N N N N TRIM N Y Y N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 25.3 X 41.5X 6.8 25.3 x 41.5 x 6.8 35.5 x 30 x 9.5 35.5 x 30 x 9.5 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million Standard Temp. OP (0°C~+70°C) DESMV-XXXD07%C***(F) DESMV-XXXD06%C***(F) DESMV-XXXD09SC***(F) DESMV-XXXD08SC***(F) DGSML-XXXD67%C***(F) DESML-XXXD06%C***(F) Wide Temp. OP (-40°C~+85°C) DESMV-XXXD07%W***(F) DESMV-XXXD06%W***(F) DESMV-XXXD09SW***(F) DESMV-XXXD08SW***(F) DGSML-XXXD67%W***(F) DESML-XXXDO6%W***(F) XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Notes Model Name Key Features Interface Flash Type Capacity Max. Channel SATADOM-ML 3ME3 SATADOM-SL 3ME 1. Low-profile design for 1U 1. Vertical and low-profile server design for 1U server 2. High IOPS 2. Best boot drive solution 3. Write protect 3. Lower power consumption SATADOM-SL 3ME3 SATADOM-SV 3ME 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Best boot drive solution 4. Lower power consumption SATADOM-SV 3ME3 1. Vertical version 1. Vertical version 2. Anti-vibration mechanical 2. High IOPS design 3. Best boot drive solution SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC MLC SATA III 6.0Gb/s MLC 16GB-256GB 4GB-64GB 4GB-128GB 4GB-64GB 4GB-128GB 4 2 2 2 2 Sequential R/W (MB/sec, max.) 450/220 300/80 300/80 300/80 300/80 Max. Power Consumption 1W (5V x 200mA) 0.65W (5V x 125mA) 0.65W (5V x 125mA) 0.65W (5V x 125mA) 0.65W (5V x 125mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N N N N iCell N N N N N TRIM Y N Y N Y ATA Security Y Y Y Y Y S.M.A.R.T Dimension (WxLxH/mm) Environment Y Y Y Y Y 35.5x30x9.5 32.9 x 29.5 x 8 32.9 x 29.5 x 8 20.9 x 39.5 x 8.1 20.9 x 39.5 x 8.1 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DESML-XXXD08SC***(F) DESSL-XXXD07%C***(F) DESSL-XXXD09SC***(F) DESSV-XXXD07%C***(F) DESSV-XXXD09SC***(F) Wide Temp. OP (-40°C~+85°C) DESML-XXXD08SW***(F) DESSL-XXXD07%W***(F) DESSL-XXXD09SW***(F) DESSV-XXXD07%W***(F) DESSV-XXXD09SW***(F) Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 17 Model Name Key Features Interface SATADOM-MH 3ME SATADOM-MH 3ME3 1. Horizontal design 2. Write protect SATADOM-SH 3ME 1. Horizontal design 2. High IOPS 3. Write protect Low profile horizontal design SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC 8GB-128GB 8GB-128GB 4GB-32GB 2 2 1 Sequential R/W (MB/sec, max.) 300/150 300/150 150/40 Max. Power Consumption 1W (5V x 200mA) 1W (5V x 200mA) 0.65W (5V x 125mA) Flash Type Capacity Max. Channel Thermal Sensor SATA III 6.0Gb/s STD : N , W/T : Y External DRAM Buffer N N N iCell N N N TRIM N Y N ATA Security Y Y Y S.M.A.R.T Y Y Y 40.0 X 30.0 X12.3 40.0 x 30.0 x 12.3 18.0 x 30.3 x 12.5 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DESMH-XXXD07%C***(F) DESMH-XXXD09SC***(F) DESSV-XXXD07%C***(F) Wide Temp. OP (-40°C~+85°C) DESMH-XXXD07%W***(F) DESMH-XXXD09SW***(F) DESSV-XXXD07%W***(F) Notes Model Name Key Features Interface Flash Type Capacity Max. Channel XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type SATADOM-SH 3ME3 1. Low profile horizontal design 2. High IOPS SATA III 6.0Gb/s SATADOM-SH Type C 3ME3 SATADOM-SH Type D 3ME 1. Low profile horizontal design 2. High IOPS 3. Opposite direction of SATADOM-SH 1. Low profile horizontal design SATA III 6.0Gb/s SATA III 6.0Gb/s SATADOM-SH Type D 3ME3 1. Low profile horizontal design 2. High IOPS SATA III 6.0Gb/s MLC MLC MLC MLC 4GB~128GB 4GB~128GB 4G-32GB 4GB~128GB 2 2 1 2 Sequential R/W (MB/sec, max.) 300/80 300/80 150/40 300/80 Max. Power Consumption 0.65W (5V x 125mA) 0.65W (5V x 125mA) 0.65W (5V x 125mA) 0.65W (5V x 130mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N N N iCell N N N N TRIM Y Y N Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 18.0 x 30.3 x 12.5 30.3 x 18 x 10.4 30.3 x 20.3 x 12.0 30.3 x 20.3 x 12.0 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95° CMTBF: >3 million hours Stantard Temp. OP (0°C~+70°C) DESSV-XXXD09SC***(F) DESSC-XXXD09SC***(F) DESSF-XXXD07%C***(F) DESSF-XXXD09SC***(F) Wide Temp. OP (-40°C~+85°C) DESSV-XXXD09SW***(F) DESSC-XXXD09SW***(F) DESSF-XXXD07%W***(F) DESSF-XXXD09SW***(F) Notes 18 XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type SATA Slim The Innodisk SATA Slim is compliant with the JEDEC SFF-8156 standard form factor and ATA protocol. It does not require drivers, and can be configured as a boot device or a data storage device. It is also suitable for portable/hand-held devices, thin clients, and industrial applications that require the effective reduction of operation system boot time and power consumption. With a 7+15 pin SATA interface, the Innodisk SATA Slim supports most platforms with a standard SATA port. Model Name Key Features Interface SATA Slim 3IE SATA Slim 3SE-P 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC SATA Slim 3SE 1. Half Slim, space saving 2. High quality SLC-based solution 3. Excellent data transfer speed 4. Compatible with JEDEC MO297 1. Half Slim, space saving 2. High quality SLC-based solution 3. Compatible with JEDEC MO297 SATA III 6.0Gb/s SATA III 6.0Gb/s iSLC SLC SLC 4GB-128GB 4GB-128GB 4GB-128GB 4 4 4 Sequential R/W (MB/sec, max.) 460/370 480/330 460/360 Max. Power Consumption 1.6W (5V x 315mA) 1.65W (5V x 330mA) 1.1W (5Vx220mA) Flash Type Capacity Max. Channel Thermal Sensor SATA III 6.0Gb/s STD : N , W/T : Y External DRAM Buffer N Y N iCell N N N TRIM N Y N ATA Security Y Y Y S.M.A.R.T Y Y Y 54.0 x 39.8 x 4.0 54.0 x 39.8 x 4.0 54.0 x 39.8 x 4.0 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHSLM-XXXD06SC*** DESLM-XXXD67SC*** DESLM-XXXD06SC*** Wide Temp. OP (-40°C~+85°C) DHSLM-XXXD06SW*** DESLM-XXXD67SW*** DESLM-XXXD06SW*** Notes 3Model Name Key Features Interface Flash Type Capacity Max. Channel XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type SATA Slim 3MG-P 1. EverGreen L² architecture 2. Excellent data transfer speed 3. Compatible with JEDEC MO297 SATA Slim 3MG2-P SATA Slim 3ME 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection 1. Half Slim,space saving 2. Budget -friendly MLC-based solution 3. Compatible with JEDEC MO297 SATA Slim 3ME3 1. Half Slim,space saving 2. High random performance 3. Budget -friendly MLC-based solution 4. Compatible with JEDEC MO297 SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC SATA III 6.0Gb/s MLC 8GB-256GB 8GB-128GB 8GB-128GB 8GB-128GB 4 4 4 4 Sequential R/W (MB/sec, max.) 460/240 520/165 460/160 460/160 Max. Power Consumption 2.1W (5V x 428mA) 2.6W (5Vx520mA) 1.6W(5V x 315mA) 1.6W(5V x 315mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer Y Y N Y iCell N N N N TRIM Y Y N Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 54.0 x 39.8 x 4.0 54.0 x 39.8 x 4.0 54.0 x 39.8 x 4.0 54.0 x 39.8 x 4.0 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Standard Temp. OP (0°C~+70°C) DGSLM-XXXD67%C*** Wide Temp. OP (-40°C~+85°C) DGSLM-XXXD67%W*** Notes Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours DGSLM-XXXD81%C*** DESLM-XXXD07%C*** DESLM-XXXD06%C*** DESLM-XXXD09%C*** DESLM-XXXD08%C*** DGSLM-XXXD81%W*** DESLM-XXXD07%W*** DESLM-XXXD06%W*** DESLM-XXXD09%W*** DESLM-XXXD08%W*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 19 mSATA mSATA, which is distinct from the micro connector, was announced by the Serial ATA International Organization on September 21, 2009. Applications include netbooks, portable devices and other devices that require a smaller solid-state drive. The connector is similar in appearance to a PCI Express Mini Card interface and is electrically compatible; however, the data signals need a connection to the SATA host controller instead of the PCI-express host controller. Innodisk’s mSATA supports high-performance data transfer rates of 1.5 Gb/s, 3.0 Gb/s and 6.0 Gb/s. Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption mSATA 3IE mSATA 3SE-P 1. Cost-effective industrial Flash with iSLC 2. Lifespan 10 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed mSATA 3SE 1. Excellent data transfer speed and IOPS 2. Support TRIM command 3. Built-in DRAM buffer 1. Excellent data transfer speed and IOPS 2. High quality SLC-based solution mSATA 3ME 1. Excellent data transfer speed and IOPS 2. Budget- friendly MLC-based solution SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s iSLC SLC SLC MLC 8GB~64GB 8GB~64GB 4GB~64GB 4GB-128GB 4 4 4 4 460/ 350 490/260 510/250 510/160 1.1 W (3.3V x 335 mA ) 1.2 W (3.3V x 360 mA ) 1.1 W (3.3V x 319 mA ) 1.1W (3.3V x 335mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N Y N N iCell N N N N TRIM N Y N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 29.8 x 50.8 x 3.4 29.8 x 50.8 x 4.4 29.8 x 50.8 x 3.4 29.8 x 50.8 x 3.4 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DHMSR-XXXD063C*** DEMSR-XXXD67SC*** DEMSR-XXXD06SC*** DEMSR-XXXD07SC*** DEMSR-XXXD07%C*** DEMSR-XXXD06%C*** Wide Temp. OP (-40°C~+85°C) DHMSR-XXXD062W*** DEMSR-XXXD67SW*** DEMSR-XXXD06SW*** DEMSR-XXXD07SW*** DEMSR-XXXD07%W*** DEMSR-XXXD06%W*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type Note Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption mSATA 3ME3 1. Excellent data transfer speed and IOPS 2. Budget- friendly MLC-based solution mSATA 3MG-P 1. EverGreen L² architecture 2. Intelligent error recovery system 3. Built-in DRAM buffer 1. Write protect 2. Half mSATA50% space saving 3. Low power consumption mSATA mini 3ME3 1. Write protect 2. Half mSATA50% space saving 3. Low power consumption SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC MLC MLC 4GB-256GB 8GB~128GB 4GB~128GB 4GB~64GB 4 4 2 2 420/220 490/150 290/80 180/100 1.4W (3.3V x 434 mA ) 1.3 W (3.3V x 390mA ) 0.8W (3.3V x 240mA) 0.77W (3.3V x 234mA) Thermal Sensor External DRAM Buffer mSATA mini 3ME STD : N , W/T : Y N Y N N N iCell Y N N TRIM Y Y N Y ATA Security Y Y Y Y S.M.A.R.T Dimension (WxLxH/mm) Environment Y Y Y Y 29.8 x 50.8 x 3.4 29.8 x 50.8 x 4.4 30 x 26.8 x 3.7 30 x 26.8 x 3.7 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSR-XXXD09SC*** DEMSR-XXXD08SC*** DGMSR-XXXD67%C*** DEMSM-XXXD07%C*** DEMSM-XXXD09%C*** Wide Temp. OP (-40°C~+85°C) DEMSR-XXXD09SW*** DEMSR-XXXD08SW*** DGMSR-XXXD67%W*** DEMSM-XXXD07%W*** DEMSM-XXXD09%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Mini PCIeDOM The Innodisk Mini PCIeDOM is a Flash based disk module with standard Mini PCIe form factor, and PCI Express Gen.1 interface. It is suitable for board maker or SI to design in the product as a boot drive or a storage device. Meanwhile, it supports multiple operation systems and no driver needed, including Windows XP, Windows 7, and Linux based OS. Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption Mini PCIeDOM 1SE Mini PCIeDOM 1ME 1. Standard PCIe Interface 2. Driver-less 1. Standard PCIe Interface 2. Driver-less PCI Express Gen.1 x1 PCI Express Gen.1 x1 SLC MLC 4GB~64GB 8GB~128GB 4 2 85/85 170/120 2.3 W (3.3V x 700 mA ) Thermal Sensor 2 W (3.3V x 6200 mA ) STD: N , W/T: Y External DRAM Buffer N N iCell N N TRIM N N ATA Security Y Y S.M.A.R.T Y Y 30 x 50.95 x 5 30 x 50.95 x 5 Dimension (WxLxH/mm) Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Environment Standard Temp. OP (0°C~+70°C) DEEDM-XXXJ30AC*** DEEDM-XXXD07SC*** Wide Temp. OP (-40°C~+85°C) DEEDM-XXXJ30AW*** DEEDM-XXXD07SW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Download our iSMART to monitor the health of storage iSMART is a powerful, easy-to-use solid-state drive (SSD) and hard disk drive (HDD) health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan, and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk, before the end of its life cycle. Users can easily enable/disable write protect, ATA Security, quick erase, and power saving features in one button. Performance/Alert page can show any installed disk’s R/W performance and alert in time for abnormality. The Lifespan graph helps user understand the expiry date of Innodisk own’s products. On the iSMART iAnalyzer page, it records read/write behavior of a SSD in real-time, categorizing these operations as either sequential or random I/O, as well as segmenting by the size of the operation. Product specifications are subject to change without prior notice. 21 M.2-SATA(NGFF) M.2-SATA (NGFF) stands for Next Generation Form Factor, which is comprised of several interfaces and the corresponding system interconnect based on 67pin edge card connectors. The Innodisk M.2-SATA (NGFF) offers wide range capacities in several standard form factors to fulfill different applications, including type 2242, type 2260, type 2280, and 22110. Benefits • Small form factor, M.2 (S42) save about 40% PCB dimension compared to Mini PCIe form factor • Innodisk's exclusive iData Guard ensures reliable data transfers in the event of an abnormal power failure • Fully compliant with industrial standard • Suitable for ultra-thin or compact system M.2-2242 Features • Adopted SATA III 6.0 Gb/s interface, complaint with M.2 ( NGFF ) type 2242 and 2280 • Excellent data transfer speed in small form factor • iCell technology for data protection • Supports iSMART disk health monitoring M.2-2280 Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption M.2 (S42) 3IE M.2 (S42) 3SE 1. Type 2242-D2-B-M 2. Cost-effective industrial flash with iSLC 3. iData Guard Protection M.2 (S42) 3ME3 1. Type 2242-D2-B-M 2. High IOPS 3. iData Guard Protection SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s iSLC SLC MLC 8GB~32GB 1GB~32GB 4GB~64GB 2 2 2 300/190 300/130 300/70 0.5W (3.3V x 150mA ) 0.5 W (3.3V x 150 mA ) 0.5W (3.3V x 150mA) Thermal Sensor External DRAM Buffer 1. Type 2242-D2-B-M 2. High quality SLC-based solution 3. iData Guard Protection STD : N , W/T : Y N N N N iCell N N TRIM N N Y ATA Security Y Y Y S.M.A.R.T Dimension (WxLxH/mm) Environment Y Y Y 22.0 x 42.0 x3.4 22.0 x 42.0 x 3.4 22.0x42.0x3.4 Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHM24-XXXD072C*** DEM24-XXXD07SC*** DEM24-XXXD09%C*** Wide Temp. OP (-40°C~+85°C) DHM24-XXXD072W*** DEM24-XXXD07SW*** DEM24-XXXD09%W*** Note 22 XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code) %=Flash Type l M.2 (S80) 3IE Model Name Key Features 1. Type 2280-D2-B-M 2. Cost-effective industrial flash with iSLC 3. iData Guard Protection Interface SATA III 6.0Gb/s Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption M.2 (S80) 3SE 1. Type 2280-D2-B-M 2. High quality SLC-based solution 3. iData Guard Protection SATA III 6.0Gb/s iSLC SLC 32GB~256GB 32GB~256GB 4 4 450/350 450/350 1.3W (3.3V x 390mA) Thermal Sensor 1.3W (3.3V x 390mA) STD : N , W/T : Y External DRAM Buffer N N iCell N N TRIM N N ATA Security Y Y S.M.A.R.T Y Y 22.0x80.0x3.5 22.0x80.0x3.5 Dimension (WxLxH/mm) Environment Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHM28-XXXD062C*** DEM28-XXXD06SC*** Wide Temp. OP (-40°C~+85°C) DHM28-XXXD062W*** DEM28-XXXD06SW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type l M.2 (S80) 3ME3 Model Name Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption 1. Type 2280-D2-B-M 2. High IOPS 3. iData Guard Protection M.2 (S80) 3MG2-P 1. Type 2280-D2-B-M 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection SATA III 6.0Gb/s SATA III 6.0Gb/s MLC MLC 64GB~512GB 128GB~512GB 4 4 420/220 420/ 430 1.3W (3.3V x 390mA) 3.63W (3.3Vx1.1A ) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y 22.0x80.0x3.5 22.0 X 80.0 X 3.5 Dimension (WxLxH/mm) Environment hock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM28-XXXD08%C*** DGM28-XXXD81%C*** Wide Temp. OP (-40°C~+85°C) DEM28-XXXD08%W*** DGM28-XXXD81%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 23 CFast The Innodisk CFast is a small form factor card standard with high data storage capacity. It is suitable for semi-industrial applications. Compliant with the CFast 2.0 standard, it is designed with a 7+17 pin connector and is SATA compatible. The Innodisk CFast offers data transfer rates of sequential read up to 470 MB/sec. and of sequential write up to 280MB/sec. Moedel Name Key Features Interface Connector Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption CFast 3IE CFast 3SE CFast 3ME CFast 3ME3 1. Cost-effective industrial Flash with 1. Compliant with CFast 2.0 1. Compliant with CFast 2.0 iSLC standard satndard 2. Lifespan 7 times longer than 2. Excellent data transfer speed 2. Budget friendly MLC-based MLC 3. Support hardware write protect solution 3. Performance and data quality 3. Support hardware write protect congruent to SLC 4. Support hardware write protect 1. Compliant with CFast 2.0 satndard 2. Buget friendly MLC-based solution 3. Support hardware write protect 4. High IOPS SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s 7+17pin 7+17pin 7+17pin 7+17pin iSLC SLC MLC MLC 8GB~64GB 1GB~64GB 4GB~128GB 4GB~128GB 2 4 2 2 310/280 470/250 300/150 300/150 1.1W (3.3V x 320mA) 1.1W (3.3V x 360mA) 1.1W (3.3V x 320mA) 1.1W (3.3V x 320mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N N N iCell N N N N TRIM N N N Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 42.8 x 36.4 x3.6 42.8 x 36.4 x3.6 42.8 x 36.4 x3.6 42.8 x 36.4 x3.6 Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHCFA-XXXD07%C*** DECFA-XXXD06SC*** DECFA-XXXD07%C*** DECFA-XXXD09%C*** Wide Temp. OP (-40°C~+85°C) DHCFA-XXXD07%W*** DECFA-XXXD06SW*** DECFA-XXXD07%W*** DECFA-XXXD09%W*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) % =Flash Type Note CF Card Innodisk’s Industrial CompactFlash Memory Card (iCF) complies with the PCMCIA* ATA standard. Designed to replace traditional rotating disk drives, Innodisk iCFs are embedded solid-state data storage systems that are designed for mobile computing and the industrial work place. Model Name Key Features Interface Connector Flash Type Capacity Max. Channel iCF 9000 1. High sustained data transfer speed 2. Enhanced power cycling management iCF 1SE High quality SLC-based solution iCF 1ME 1. Budget friendly MLC-based solution 2. Enhanced power cycling management PATA PATA PATA 50pin CF connector 50pin CF connector 50pin CF connector SLC SLC MLC 1GB~64GB 128MB~8GB 4GB~128GB 4 2 2 110/100 50/40 110/65 1.05W (5V x 210mA) 0.69W (3.3V x 210mA) 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 1.05W (5V x 150mA) 0.69W (3.3V x 150 mA) Thermal Sensor N N N ATA Security Y Y Y S.M.A.R.T Y Y Y 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 Sequential R/W (MB/sec, max.) Max. Power Consumption Dimension (WxLxH/mm) Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DC1M-XXXD71%C*** DC1M-XXXD41AC*** DECFC-XXXD53%C*** Wide Temp. OP (-40°C~+85°C) DC1M-XXXD71%W*** DC1M-XXXD41AW*** DECFC-XXXD53%W*** PIO mode 0-6 UDMA mode 0-7 PIO mode 0-6 UDMA mode 0-4 PIO mode 0-6 UDMA mode 0-7 Note Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) % =Flash Type EDC The Innodisk Embedded Disk Card (EDC) complies with PCMCIA* ATA standards and fits into all platforms with an IDE connector. The Innodisk Embedded Disk Card comes in capacities ranging from 128MB to 32GB and is available in 40-pin and 44-pin connector packages. Model Name EDC 1SE Vertical Type Key Features 1. Dust prevention 2. High quality SLC-based solution Connector EDC 1SE Horizontal Type 1. High quality SLC-based solution 2. Supported mounting hole EDC 1ME Vertical Type EDC 1ME Horizontal Type 1. Budget- friendly MLC-based 1. Budget- friendly MLC-based solution solution 2. High performacne PATA solution 2. High performacne PATA solution 40/44 pin 40/44 pin 44 pin 44 pin Interface PATA PATA PATA PATA Flash Type SLC SLC MLC MLC 128MB~4GB 128MB~8GB 4GB~64GB 4GB~128GB Capacity Max. Channel 2 2 2 2 35/25 35/25 110/75 110/75 0.75W(5V x 150mA) 0.5W(3.3V x 150mA) 0.75W(5V x 150mA) 0.5W(3.3V x 150mA) 1.05W(5V x 150mA) 0.69W(3.3V x 150mA) 1.05W(5V x 150mA) 0.69W(3.3V x 150mA) Sequential R/W (MB/sec, max.) Max. Power Consumption Thermal Sensor N N N N External DRAM Buffer N N N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y 40 pin: 60.2 x 27.3 x 6.4 44 pin: 50.3 x 27.3 x 5.8 40 pin (A,B type): 55 x 32.4 x 12.9 40 pin (C,D type): 55 x 32.4 x 14.6 40 pin (E,F type): 55 x 32.4 x 18.3 44 pin (A,B type): 48 x 32.6 x 6.7 44 pin (C,D type): 48 x 32.6 x 9.6 44 pin (E,F type): 48 x 32.6 x 12.9 44 pin 50.3 x 27.3 x 7.5 Dimension (WxLxH/mm) Environment 44 pin (A,B type): 48 x 34.1 x 7.4 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DE0H-XXXD41AC*** DE4H-XXXD41AC*** DE0P%-XXXD41AC*** DE4P%-XXXD41AC*** DEE4H-XXXD53RC*** DEE4%-XXXD53RC*** Wide Temp. OP (-40°C~+85°C) DE0H-XXXD41AW*** DE4H-XXXD41AW*** DE0P%-XXXD41AW*** DE4P%-XXXD41AW*** DEE4H-XXXD53RW*** DEE4%-XXXD53RW*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) %=Horizontal type(A, B, C, D, E, F) Note SD/micro SD Innodisk SD and microSD cards are single-level flash devices built for rugged applications in the embedded field. As an industrialgrade SD/microSD card, these cards deliver outstanding performance of up to 20MB per second as well as excellent endurance and reliability, especially compared to other cards used in the mobile market. The Innodisk SD and microSD cards are compatible with SD 2.0 standards and support SDHC Class 10. They also feature SMART technology, which monitors the reliability of these SD cards. Model Name Industrial micro SD Card Enhanced power cycling management Key Features Interface Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption S.M.A.R.T Dimension (WxLxH/mm) Environment Industrial SD Card 1. Designed for industrial applications 2. High reliability 3. Customizeable 4. Power Fail mangement 5. Supported SPI mode SD 1.01/2.00 SD 3.00 SLC SLC/MLC 1G~8GB SLC: 128MB~32GB MLC: 4GB~64GB 1 1 20/16 SLC: 35/25 MLC: 45/20 0.17W (3.3V x 50mA) 0.26W (3.3V x 77mA) Y Y 11.0 x 15.0 x 1.0 24.0 x 32.0 x 2.1 Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (-20°C~+85°C) DS2M-XXXI81AC*** DESDC-XXXY81%C*** Wide emp. OP (-40°C~+85°C) DS2M-XXXI81AW*** DESDC-XXXY81%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G) *** = flash configuration (internal control code) %=Flash Type Product specifications are subject to change without prior notice. 25 USB The Innodisk industrial-grade USB series is built using SLC NAND flash and features an attractive small form factor. It provides highcapacity flash memory storage while delivering faster data transmission with high reliability. It also complies with the high-speed USB 3.0 interface and is backward compatible with USB 1.1. The Innodisk USB series has a variety of special features, from plastic and metal housing to secure mounting holes to EDC choices. Model Name Key Features Industrial Nano USB USB Drive 3SE USB Drive 3ME USB Drive 2SE 1. Only expose 5mm height 1. Metal housing to enhance ESD protection on the motherboard 2. 30μ golden finger for highly reliable data transfer when applying in quality practical 2. Smallest USB Drive for industrial application 3. Very low power consumption USB Drive 2ME 1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality Interface USB 2.0 Connector Type A Flash Type SLC SLC MLC SLC MLC 1GB~ 8GB 4GB-32GB 4GB~ 32GB 512MB~ 16GB 4GB~ 32GB 1 1 1 1 1 19/17 106/94 105/50 28/24 26/10 Capacity Max. Channel Sequential R/W (MB/sec, max.) USB 3.0 USB 2.0 Type A Type A Max. Power Consumption 0.45W (5V x 90mA) 0.70W (5V x 140mA) Dimension (WxLxH/mm) 15.4 x 19.4 x 6.9 16.5 x 45.8 x 7.4 Environment Vibration: 20G@7~2000Hz Shock: [email protected] 0.85W (5V x 170mA) 16.5 x 45.8 x 7.4 Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEUN-XXXS23AC*** DEUA1-XXXI61SC*** DEUA1-XXXI61RC*** DEUA1-XXXI72AC*** DEUA1-XXXI72RC*** Wide Temp. OP (-40°C~+85°C) DEUN-XXXS23AW*** DEUA1-XXXI61SW*** DEUA1-XXXI61RW*** DEUA1-XXXI72AW*** DEUA1-XXXI72RW*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) Notes Model Name USB EDC Vertical 3SE USB EDC Vertical 3ME Key Features 1. High performance with USB 3.0 interface 2. Low power consumption 3. Wear-Leveling supported Interface Connector Flash Type Capacity Max. Channel Sequential R/W (MB/sec, max.) Max. Power Consumption Dimension (WxLxH/mm) Environment Standard Temp. OP (0°C~+70°C) Wide Temp. OP (-40°C~+85°C) Notes 26 USB EDC Horizontal 2SE USB EDC Horizontal 2ME 1. Supported mounting hole 2. 2.0/2.54 pin pitch USB EDC Vertical 2SE USB EDC Vertical 2ME 1. Very low profile 2. Low power consumption USB 3.0 USB 2.0 USB 2.0 Standard, 20pin, 2.00mm Standard,10pin, 2.54mm Low profile,10pin, 2.00mm Standard, 10pin, 2.54mm SLC MLC SLC MLC SLC MLC 4GB~32GB 4GB~32GB 512MB~ 32GB 4G~ 64G 512MB-16GB 4GB~16GB 1 1 1 1 1 1 100/85 100/50 28/24 26/10 28/24 26/10 0.79 W (5VX158) 0.85W (5V x 170mA) 0.85W (5V x 170mA) 24 x 22 x 5 26.6x36.9x9.6(Pin Pitch2.54) 26.6x36.9x6.6(Pin Pitch2.00) 15.2 x 34.1 x 6.4 Vibration: 20G@7~2000Hz DEUV1-XXXI61SC*** Shock: [email protected] Storage Temperature: -55°C ~ +95°C DEUH1-XXXI72AC*** DEUH1-XXXI72RC*** DEUV1-XXXI61RC*** DEUH2-XXXI72AC*** DEUH2-XXXI72RC*** DEUV1-XXXI61SW*** DEUV1-XXXI61RW*** MTBF: >3 million hours DEUV1-XXXI72AC*** DEUV1-XXXI72RC*** DEUH1-XXXI72AW*** DEUH1-XXXI72RW*** DEUV1-XXXI72AW*** DEUV1-XXXI72RW*** DEUH2-XXXI72AW*** DEUH2-XXXI72RW*** XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code)