Transcript
Installing and Configuring TSL EBSD Software
February 2011 Revision 6.1.3 9499.089.00611
Installing TSL-EDAX Software version 6.x Installing Camera Support Software Installing TSL-EDAX Application Software Installing 3D Visualization Extension Software Setting-Up TSL Standalone Delphi Set-Up OIM Data Collection 6.x Set-Up OIM Analysis 6.x 32-bit and 64-bit
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Configuring an Integrated EDS/EBSD System
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Configuring the Plugins
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Configuring the DigiView & Hikari Camera Settings
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Setting the Resolution Presets and Making Camera/Signal Adjustments Background Image Processing Troubleshooting
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Calibrating the EBSD System 1a Microscope Image Setup for MSC 2200 unit (Historic) 1b Magnification Calibration in OIM DC for MSC 2200 unit (Historic) 2a Microscope Image Setup for EDI & SG (Current) 2b Magnification Calibration in Genesis and OIM DC for EDI & SG Pattern Center Calibration Pattern Center Shift Calibration Final Verification
Configuring the EDAX integrated Forward Scatter Detector (FSD)
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Installing and Configuring TSL Software This document describes how to install and configure the TSL–EDAX Software Suite to ensure proper operation. This also includes setting up the software license file. It is strongly suggested that you read the online manuals for the TSL-EDAX products after you install them, since they more fully describe many of the features that are used to configure the system. First we provide a walk-through for installing the software, and then we focus on procedures for achieving the best configuration possible for your TSL-EDAX system.
Installing TSL-EDAX Software version 6.x This section includes a step-by-step guide for installing the TSL software on your system, as well as sections for setting up each TSL product after installation. For more information on the use of the different applications, refer to the application’s online help and the documents folder on the TSL-EDAX install DVD. NOTE: On a Pegasus system, install and configure the Genesis software before installing the TSL software.
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Insert the EDAX-TSL DVD into your DVD-ROM drive. The DVD front end should automatically load. If it does not, browse the DVD and double-click the Setup.exe file located in the root directory.
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Installing Camera Support Software Before applications such as OIM DC or Delphi can be used on-line (in conjunction with the microscope and EBSD detector) the camera drivers must be installed. It is assumed that the necessary camera adapter card (Firewire/C-Link/GigE) are already installed on the PC –details on the hardware installation are included in “EBSD PC Hardware Configuration.doc”. Note that it is not necessary to install camera support software for OIM Analysis or if the OIM DC or Delphi application is to be run off-line (without the EBSD detector) 1. For installations requiring EBSD detector support (Hikari, DigiView II, DigiView III &
DigiView IV) first select the Install Camera Support Software menu item. This will launch the DVC installer application. There are two versions available, one for 32 bit operating systems and one for 64 bit operating systems. During the installation process driver files and camera libraries will be copied to the hard drive. On completion complete one of the following steps, according to the EBSD camera type: (Also refer to the DVC documentation provided at the end of the Camera Support Software installation process.) (a) For Hikari camera systems on 32 bit MS Windows browse to the DVD OIM “Drivers” "EDTpdv_4_2_4_3.exe" to install the Camera-Link (C-Link) hardware drivers. For 64 bit, locate the C:\DVCCO\Drivers\C-Link folder and run “EDTpdv_5.1.1.5.exe.” To check that installation is successful, look for the EDT Device item in the Windows Device Manager (see below). Use MS Windows Settings, Control Panel, System .
(b) For DigiView cameras I-III Firewire update the DVC Digiview driver, go to the device manager, expand the imaging devices section, select the DVC company Firewire camera, and goto driver. Select update driver and manually point to the C:\DVCCo\Drivers\Firewire\ and select the appropriate operating system (XP or 2000) and point to the DVCCam.inf file. Do not select the automatic mode. 4
(c) For DigiView IV camera’s using GigE protocol follow the procedure outlined in the EBSD PC Hardware Configuration.doc included on the TSL DVD. 2 On completion of the camera drivers installation the OIM applications can be carried out and the camera configured and tested –see sections below.
Installing TSL-EDAX Application Software 1. For OIM DC, OIM Analysis and Delphi click Install TSL-EDAX Software, located on the navigation bar on the left. This will launch the installation software. 2. As part of the installation process you will come to the Select Features dialog shown below. It contains all of the TSL applications and choices for all possible hardware configurations for camera, microscope, EDS control. These are typically referred to as Plugins and determine which files will be copied to your PC’s hard drive.
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The installer will initially be setup for the Hikari camera configuration that is typical for most systems. If your camera is a Digiview or other camera, you must modify the feature selections to specify the correct camera. Likewise, if your system differs from the standard EDAX beam control, integrated Pegasus Genesis chemistry acquisition, and so forth you will need to modify the selections by expanding the drop-down components and clicking on the individual option to switch it on or off. A cross indicates the component will not be installed. On completion, new icons should appear on your desktop (and in your Start Menu) for each TSL product you installed. Note that you can also select all plugins by toggling the checkmark before the Plugins entry off and on again. This will copy all available dll’s into the C:\Program Files\TexSEM\Plugins folder and you may select the applicable dll’s from the settings ¦ environment menu. 3. The OIM applications use a software key file. The key file GenKey.edx resides off of the C:/ root on the PC's hardrive. This software key file will lock either to the PC’s unique ID, or to a USB HASP dongle. If a key-file is not present the application will start in Demonstration mode. To confirm your key file/application status, refer to the application's About Box off of the Help menu. If you experience problems with your key file please contact EDAX technical support. 4. For information concerning the installation of the camera and video hardware, refer to the document titled Installing and Configuring TSL Hardware located on this DVD. 5. For data collection applications such as OIM DC and Delphi, ensure the latest EBSD detector drivers and software has been installed before proceeding (see (9) below). Finish setting up your TSL products. For Delphi 3 go to the Setting-Up TSL Standalone Delphi section of this document. For OIM go to the Set-Up OIM Data Collection 6.x and Set-Up OIM Analysis 6.x 32-bit and 64-bit sections below.
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Installing 3D Visualization Extension Software For users who purchased the 3D Visualization components, typically in conjunction with OIM Analysis batch processing tools and 3D data collection tools, you will need to install the 3D visual extension library for OIM Analysis. 1. Click Install 3D Visualization Extension, from the installer start-up screen, located on the navigation bar on the left. This will launch the installation software. 2. During the install, select the option to install “IDL Virtual Machine” only.
Setting-Up TSL Standalone Delphi 1. On completion of the installation for Delphi 3.x, two icons will be added to the Window's desktop: • TSL Delphi 3, secure version of the full phase identification application. • TSL Delphi Reports, report generator for Delphi. 2. During initial startup you will be asked to identify an index file for the the active database. This file contains a record of the phase entries and their chemical composition in the database to assist in the search process. Select Generate from the popup dialog and save the file (index.odx) in the \xxx Database folder in the TexSEM folder where xxx is the name of the database that is active (TSL, AMCS, ICDD, or ICSD). It is important to remember that Delphi uses the location of the index file to identify the folder in which the phase files are to be found . 3. The following folder/directory structure will be built during the install: • TexSEM/Delphi 3/bin - holds executables and support files for the executables. • TexSEM/TSL database - holds the collection of TSL material files • TexSEM/User database - area put aside for building a custom set of material • TexSEM/Delphi 3/Demo Images - demonstration EBSD and SEM images. • TexSEM/Delphi 3/Demo Data - holds a demonstration Delphi project file (.dpj). • TexSEM/Delphi 3/Projects - area put aside for storing Delphi analysis projects (.dpj). Please refer to the Delphi on-line help files for a complete description of the Delphi product, including tutorials and reference guides. The Delphi tutorial can be found in the documents folder on the TSL install CD.
Set-Up OIM Data Collection 6.x 1. Please refer to the OIM Data Collection 6 on-line help files for a complete description of the product, including tutorials and reference guides. 2. The following folder/directory structure will be built during the install: • • • • •
TexSEM/OIM Data Collection 6/bin - holds executables and support files TexSEM/OIM Data Collection 6/Demo Images – holds demo EBSD and SEM images. TexSEM/OIM Data Collection 6/Help – holds the on-line help and release notes. TexSEM/TSL database - holds the collection of TSL material files (.bmt) TexSEM/User database - area put aside for building a custom set of material files
Under Windows 7 x64 all OIM DC application files will be installed to the /Program Files (x86) folder.
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Set-Up OIM Analysis 6.x 32-bit and 64-bit 1. Please refer to the OIM Analysis 6 on-line help files for a complete description of the product, including tutorials and reference guides. 2. Please note that OIM Analysis 64 bit can only be installed on a Windows XP 64 bit or Windows 7 64 bit operating system. 3. The following folder/directory structure will be built during the install: • TexSEM/OIM Analysis 6/bin - holds executables, dll libraries, and on-line help files. • TexSEM/OIM Analysis 6/Samples - holds the demo datasets provided by TSL. These are OIM scans of various samples. • TexSEM/OIM Analysis 6/Templates - holds the collection of TSL and user created template files. • TexSEM/OIM Analysis 6/TslReports – holds files needed for the OIM Analysis report tool
Configuring an Integrated EDS/EBSD System OIM DC 6 and Delphi 3 are designed to integrate with the EDAX Genesis 6.x EDS system (known as Pegasus) and are not compatible with earlier versions of Genesis. Access to the EDAX beam control hardware and EDS collection is given through the special Pegasus beam and eds libraries. The TSL application is installed on the same platform as the EDAX Genesis software applications and communicates via the BeamEDAX.dll library plugin for SEM beam control and EDSGenesis.dll library plugin for chemistry collection. These plugins are selected with the Environment Settings dialog inside the TSL application. Do not use dll’s that were provided with older software versions!
Configuring the Plugins TSL applications use dynamic link libraries or DLLs to communicate with the various hardware and software components that are needed for data acquisition. This includes camera and video hardware, microscope control, materials databases and EDS collection. These DLLs are typically referred to as plugins and will vary according to the hardware and software installed on your system. Typically, the TSL install CD process will select the DLLs automatically, according to the hardware configurations selected during the application installation. These DLLs are also available on the TSL DVD in the TSL OIM 6\Program Files\TexSEM\Plugins6 and can be copied manually into the C:\Program Files\TexSEM\Plugins6 folder when needed. For the most up to date versions, also check the Support section of the TSL-EDAX website at http://www.edax.com.
Plugin List The following section provides a breakdown and description of the various plugin DLLs provided by TSL. Use the tables below to help identify the components you currently have installed and match the dates on the actual DLL files to ensure you are using the latest version. The dll’s shown in the image below and given in bold print are the default dll’s to use with a new Pegasus system. Make sure that no dll is loaded in the Camera Control section (this is only used with the now obsolete DageCCD camera). NOTE: make sure that you only use dll’s from the used install CD, not older versions!
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VIDEO AND CAMERA This includes software for acquiring EBSD and diffraction images via video frame grabbers, capture boards and cameras. DLL Name
Description
VideoDvc
Camera control and image acquisition for the Hikari C-Link and DigiView (I-III) digital Firewire (1394) CCD camera and DigiView IV GigE CCD cameras
VideoDvc_x64
Camera control and image acquisition for the Hikari C-Link and DigiView (I-III) digital Firewire (1394) CCD camera and DigiView IV GigE CCD cameras for 64 bit Windows 7.
VideoDigiView
Camera control and image acquisition for the DigiView 1612 digital CCD camera. Requires Matrox MIL library version 7.1 and above.
VideoOrion
Image acquisition using the Matrox Orion frame grabber for analogue SIT/CCD cameras. Requires Matrox MIL library version 7.1 and above.
VideoMatrox
Image acquisition using the Matrox Meteor II frame grabber for analogue SIT/CCD cameras. Requires Matrox MIL library version 7.1 and above
VideoGatan
Image acquisition for Gatan TEM-based cameras. E.g. Dual Vision, MultiScan. Requires Digital Micrograph version 3.6.5.
VideoGatanStdRes
Image acquisition for Gatan TEM-based cameras –standard DFD resolution. E.g. Dual Vision, MultiScan. Requires Digital Micrograph version 1.1.11 and above.
VideoGatanHiRes
Image acquisition for Gatan TEM-based cameras –high DFD resolution. E.g. Dual Vision, MultiScan. Requires Digital Micrograph version 1.1.11 and above.
MICROSCOPE CONTROL This covers software for beam and stage control. DLL Name
Description
BeamEDAX
Latest version of beam & imaging control using the EDAX EDI and SG hardware. This version also supports the integrated Forward Scatter Detector (FSD).
BeamEDIcs
COMscope version of SEM beam (and column) control via the EDAX EDAM/EDI hardware used with Genesis EDS installations. EDI II and SG hardware.
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BeamEDI
SEM beam (and column) control via the EDAX EDAM/EDI hardware used with Genesis EDS installations. EDI II and SG hardware.
BeamMSC3
SEM beam control using the TSL MSC 2200 unit (1999 onward).
BeamEDI_1
SEM beam (and column) control via the EDAX EDAM/EDI hardware used with Genesis EDS installations. EDI I hardware.
BeamMSC1
SEM beam control using the TSL MSC 1100 unit (pre 1996).
BeamMSC2
SEM beam control using the TSL MSC 2200 unit (1996-1998).
TEMCtlMSC1
TEM beam control using the TSL MSC 1100 unit (pre 1996).
TEMCtlMSC2
TEM beam control using the TSL MSC 2200 unit (1996-1998).
TEMCtlMSC3
TEM beam control using the TSL MSC 2200 unit (1999 onward).
TEMCtlTecnai
TEM beam control for FEI Tecnai instruments.
TEMCtlCM
TEM beam control for FEI/Philips CM instruments.
StageEDAXcs
COMscope version of SEM stage control. Requires EDAX stage shell software to be present. (See EDAX documentation for full range of supported stage models)
StageEDAX
SEM stage control. Requires EDAX stage shell software to be present. (See EDAX documentation for full range of supported stage models)
EDS COLLECTION Acquisition of EDS chemistry data via EDAX Genesis systems. DLL Name
Description
EDSGenesis
EDS via EDAX Genesis software.
EDSGenesis_Pre3_5
EDS via EDAX Genesis software. Used with all Genesis system files before version 3.5.
MATERIAL DATABASES Access to the TSL material’s databases, custom/user databases and third party materials databases. Dll Name
Description
Db_TSL
Interface to the TSL Certified materials database.
Db_User
Interface to a custom user-defined materials database for Delphi 2.5 Phase Id.
Db_ICDD
Interface to the ICDD materials database.
Db_ICSD
Interface to the ICSD materials database.
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Db_AMCS
Interface to the AMCS materials database.
Configuring the DigiView & Hikari Camera Settings Once the DigiView Camera hardware has been installed correctly (see EBSD PC Hardware Configuration.doc for more information) and either the VideoDVC.dll (Hikari camera) or VideoDVC_X64.dll (DigiView camera) has been loaded (see above section entitled Configuring the Plugins) you are ready to configure your EBSD detector camera settings. OIM 6 and Delphi contain a vertical Instrument Console to the right hand side of the application desktop. This contains a live view of the camera’s incoming signal and camera controls for gain, black level, exposure and bin size. If it does not either the hardware or the plugins are not configured correctly. When you open the Video Settings dialog in your TSL software it should look similar to the dialog shown below:
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You should observe a live image from the camera with a frame rate number. Do NOT switch on the “save images when scanning” option. Finally you can make adjustments to the capture circle shown by the overlay on the live image via the scroll bars contained within the Cropping and Positioning controls. When required, uncheck the Maximize and Center options to fit the circle to the phosphor screen in the image. This circle indicates the actual area captured from an incoming frame of the Hikari/DigiView camera. Always try to center and maximize the actual image of the phosphor screen.
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Control of the Hikari and DigiView CCD camera is provided in software via the Instrument Console Camera Control panel as shown above. This contains a live view of the camera’s incoming signal and camera controls for gain, black level, exposure and bin size. This also contains a tab page for image processing functions. The standard background subtract function is available, together with new enhanced image processing functions. For in-depth information regarding the use and functionality of the Hikari and DigiView controls, refer to the manual for your TSL software.
Setting the Resolution Presets and Making Camera/Signal Adjustments Mount the Ni test specimen at 70 degree tilt at the WD specified in the design drawings. Check that EBSD patterns can be obtained by setting the SEM in spot mode. An EBSD pattern should appear in the live video window This image can be enlarged or reduced by clicking the + / magnifying symbols in the Camera window. The center tool will set the size of the window to that of the incoming image size - in pixels, according to the binning size set in the camera control panel. Four capture resolution “Preset” radio buttons are available in the control panel. At the time of installation these should be programmed as described below. During day-to-day operation these settings can be used as starting points to obtain EBSD patterns and may be modified to optimize the image for the different specimens and SEM settings. RECORDING THE PRESETS 1. Check that you have selected the required preset radio button. If not, depress it. The following bin sizes should be selected from the Binning pull down list for each of the preset buttons: DigiView settings High
1x1 binning (1300x1026 pixels)
Normal
2x2 binning (800x600 pixels)
Reduced
4x4 binning (240x198 pixels)
Scan
8x8 binning (162x126 pixels)
Hikari settings High
1x1 binning (640x480 pixels)
Normal
2x2 binning (320x240 pixels)
Reduced
4x4 binning (160x120 pixels)
Scan
6x6 binning (106x80 pixels)
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2. Adjust the gain and exposure slider controls to obtain a satisfactory image. For DigiView, choose Long exposure from the drop down list to set the required time range. Only use the Short exposure if the exposure and gain are at their minimum and the image is still too bright (but preferably: reduce the beam current). For example, at 8x8 binning select Long and adjust the Exposure slider control to minimum (71 frames/sec). Adjust the gain control to optimise the image brightness. For Hikari adjust the Exp-Range pull down to obtain the required exposure timing range. 3. Increase the Black Level slider or use the spin control for fine adjustment. Try to keep the black level as low as possible as high black level values will decrease the final EBSD contrast. 4. Typically the scan (8x8/6x6 binning) and reduced (4x4 binning) presets are setup to provide fast framerates using high gain values for use during EBSD mapping, while the high (1x1 binning) and normal (2x2 binning) preset resolutions are used to obtain individual patterns of high quality using low gain settings and long exposures 5. You may now record the preset so this setting will be stored for future use. Right-click the mouse over the currently selected Camera Resolution Preset radio button. Choose Update from the popup window. The next time this button is selected these settings will be automatically restored. 6. The above procedure can be used to adjust any of the Capture Resolution Preset radio buttons. Note that for the DigiView III camera’s, a 10x10 binning setting is also available to obtain the highest scan speeds of 83 fps. This binning setting cannot be stored under a radiobutton, but has to be selected manually from the binning pull down menu.
Background Image Processing Background image processing is used to enhance the quality of the final image by reducing image noise and removing the intensity gradient in the individual patterns. It can be applied to the live, incoming image by the following method: Please note that the same method applies for any of the capture resolutions but you must obtain a new background image for each one. This example is for Scan resolution preset mode. 1. Set SEM mode to rapid scan and cover an area that includes more than 20 grains. 2. Make sure that the SEM image is fully on the sample. If necessary use a reduced scan area. Imaging an edge of the sample will give a too dark background 3. Click on the Image Processing tab in the camera control panel. 4. Select the “scan” preset and optimize the camera signal using the gain and exposure settings if the image brightness is not satisfactory. 5. Ensure that the “Standard” image processing radio button is selected and if necessary, deselect the Background Subtract checkbox in the Image Processing list above. 6. Click on the Collect After a short time (8x the current exposure setting) a stored background image will be collected. (To verify that there is no diffraction pattern visible you can also use the Modify button to open a dialog box with additional image processing tools). 7. Reduce the SEM magnification to include more grains and capture the background again. Make sure that the sample completely fills the entire SEM image. Note that the background image store can always be observed via the Video Page by clicking on the “Background” radio button. 8. If you are looking at a single crystal or very large grains capturing a background may be problematic. In these cases you can try rotating the specimen during background acquisition, or use a background that was collected on another material. 13
9. Set the SEM to spot mode. 10. To apply background correction select the checkbox adjacent to the Background subtract item in the list box. 11. The corrected image can be brightness adjusted by using the Balance slider control. Note that the position of this slider is also recorded for each resolution preset.
Troubleshooting •
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No image / black image. Check that the detector is inserted and that the sample is tilted properly Make sure that the SEM provides an appropriate beam current and is set at a HT above 15 kV. Check that the camera power supply is switched on. Check all cables are connected. Adjust the gain and exposure controls on the DigiView camera control panel. Check the aperture on the camera lens itself, it should be fully open. Restart the TSL application if necessary. Image is out of focus. Slightly loosen the screws holding the camera to the interface. Adjust the lens focus adjustment that can be reached through the sides of the tube covering the lens. If necessary readjust the Gain and Black Level sliders to obtain a good image. Save the settings in the appropriate preset button using the mouse right click control. Tighten the screws holding the camera to the interface. Image appears out of sync –with horizontal or vertical lines passing through it. This has been due to an incorrect power supply. Please note the serial number on the power supply case: "nnnn-02" (cooled camera supply -this is correct) "nnnn-01" (non-cooled camera supply -incorrect) "nnnn-01 modified for cool use" (modified -this should be ok) Live Image freezes. Firewire camera only. You probably have an older version of the DigiView Firewire driver. Always make sure that you are applying the DVC driver included on the used TSL install CD. Cannot load BeamEDAX.dll: Ensure that Genesis 4.6 or later is installed, and that the files pwimg42.dll, edaxfi32.dll, provided by Edax, are located in the Edax32/Sys directory. Ensure that the ‘Environment – Path’ settings (available from Windows Control Panel under ‘System’) reads as follows –“%systemroot%\system32;%systemroot%;c;\edax32\sys” Cannot load EdsGenesis.dll: Ensure that Genesis 4.6 or later is installed, and that the files pwedamRem.dll, edaxfi32.dll, elmprm32.dll, edqunt32.dll and edpeak32.dll, provided by Edax, are located in the Edax32/Sys directory. Ensure that the ‘Environment -Path’ settings (available from Windows NT Control Panel under ‘System’) reads as follows – “%systemroot%\system32;%systemroot%;c;\edax32\sys” No magnification value /slow response /serial io error: Your system may be operating slowly and you may observe that the SEM magnification is incorrect. In this case you probably have a problem with the column control interface. Verify the setup of the EDAX column control configuration (below). In the case that this does not resolve the problem, deselect Column Control from the SEM Communication group in the beam settings and enter values by hand.
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Cannot create Edax System Object: Ensure that Genesis 5.1 or later is installed correctly.
Calibrating the EBSD System Calibrating the system consists of the following three calibrations, options 1 or 2 and 3, 4: 1. a Calibrating the MSC 2200 scan generator to correctly capture the SEM image. b Calibrating the magnification in OIM DC 2. a Calibrating the EDAX scan generator to correctly capture the SEM image. b Calibrating the magnification in Genesis and OIM DC 3. Calibrating the EBSD pattern center at various working distances. 4. Calibrating the EBSD pattern center adjustment values to compensate for beam location. As a final step, in the case of OIM Data Collection a full OIM Scan should be performed to verify that the system is calibrated correctly. In the case of Delphi, various points along a known sample should be collected and properly indexed. It is easiest to do all the image and pattern calibrations in the OIM DC application and use the .ini utility from the TexSEM entry in “All Programs” off of the Windows start menu to migrate all the settings into Delphi.
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Microscope Image Setup for MSC 2200 unit (Historic) 1. Insert TEM grid (or other magnification/distance reference sample) horizontally into the chamber. Obtain a Secondary Electron (SE) image at normal working conditions (20kV, Working Distance at the specified WD in the design drawing). Set the SEM magnification at a value where recognisable features touch the upper and lower edge of the image. Make sure any tilt correction or dynamic focus is turned off. 2. Open OIM Data Collection. Go to the Settings ¦ Beam option in the Menu bar. The password is “skiutah”. 15
3. First select the proper COM port and change the COM port speed value to the maximum value of 115200. (otherwise image acquisition will take a very long time). 4. Now setup the Beam X and Beam Y limits such that the upper and lower edges of the SEM image match the image on the SEM. As the aspect ratio of the SEM image used in OIM DC is square, you will have to cut off areas on the left and right sides of the SEM image to obtain the proper image aspect ratio. It is easiest to do this using an image as above where the left and right side of the OIM image are given by the squares of the grid.
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Magnification Calibration in OIM DC for MSC 2200 unit (Historic) 1. Open the Beam Settings dialog in OIM DC and press the Advanced button in the mV per Micron section of the window. Make sure tilt correction is switched off and the specimen tilt in the environment settings is set to 0. This following dialog will appear:
2. Press the Capture SEM button. You may need to enable external scan mode on the SEM, and make sure the SEM/OIM switch is set to OIM on the MSC-2200 control unit. 3. The captured image should be very similar to the SEM image obtained in step 1. Make sure that the left to right, and top to bottom orientations are correct. If these are not, click OK, and reverse the signs on the Beam X and/or Y Limits. Then go back into the Advanced mode, and recapture the image. Note that while the complete range of the SEM image is captured top to bottom, only part of the SEM image is captured left to right in the OIM software. This is due to the aspect ratio difference between OIM (1:1) and the SEM (typically 4:3 in the x:y directions). 4. To calibrate the image, select two points on the image, the first a recognisable point in the top left, and a second point in the bottom right. Using the SEM, measure the distance between these 2 points in both the X and Y directions. Input these X and Y distances into the Distance boxes in the Advanced window. Then press calculate. Note that the mV per Micron values for X and Y are displayed in the bottom right portion of the window. Make sure that both of these numbers are positive. Once finished, press OK, and then OK out of the Beam Control Settings. 5. Test the calibration values by going to the Scan page in OIM DC, define a scan area between recognisable image features both horizontally and vertically and check if the scan dimensions match the true distance as measured on the SEM image. Note that this procedure assumes that thet SEM image calibration is setup properly! When a 16
change is made to the magnification setup of the SEM, the magnification calibration oin OIM DC will have to be redone. When a magnification calibration standard is used and the size calibration in OIM is different from the SEM, notify the user to have the SEM calibration checked 6. Now tilt the sample, typically to 70 degrees. In the Settings ¦ Environment window, insert this value for the specimen tilt. If you use a pre-tilted specimen holder, make sure the grid is aligned with the sample holder so that one grid direction is parallel to the tilt axis, and the other grid direction is parallel to the tilt direction. 7. Go to the Scan page. Capture the SEM image. Determine the scan tilt direction: X (right/left), Y (top/bottom), or mixed. In the images below, the scan tilt direction is drawn in red, and the tilt axis is drawn in blue. Once determined, set the tilt direction in the Scan Tilt section of the Settings ¦ Environment window. If you have a mixed image, use the scan rotation on the SEM to align the grid in either the X or Y direction. Set this scan tilt direction, and note the rotation value for future use. Make sure that either X or Y axis is aligned with the specimen tilt axis
8. Close the OIM Data Collection program and save the Environment and Beam settings when prompted. The imaging part is now calibrated.
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Microscope Image Setup for EDI & SG (Current)
When setting up a Pegasus system, there is no need to modify the image acquisition values in the OIM DC beam settings. Both Beam X Limits and Beam Y Limits are automatically set to 0 and 51199. The software will use the image as setup in the EDAM3shell or SG2shell software.
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Magnification Calibration in Genesis and OIM DC for EDI & SG
First make sure that the magnification calibration for the Genesis scan generator is setup properly. In Genesis go to the Image tab, select setup ¦ EDAX Scan Gen. Refer to the Genesis setup documentation 17
for the calibration procedure. In addition to the calibration in Genesis the magnification also needs to be calibrated in OIM Data Collection: Insert a TEM grid or other magnification/distance reference sample into the chamber with no specimen tilt. Obtain Secondary Electron (SE) image at normal working conditions (20kV, Working Distance as specified in the design drawings). Set the SEM magnification such that you have recognisable image features both horizontally and vertically. Make sure any tilt correction, dynamic focus and scan rotation are turned off on the SEM.
1. Open OIM Data Collection. Go to the Settings ¦ Environment option in the Menu bar. The password is “skiutah”. In the Environment Settings dialogue box, set the Specimen Tilt value to 0. Press OK when finished. 2. Go to the Scan page. Capture an SEM image. When the image capture has been calibrated properly, the image should be equivalent to the SEM image. 3. Define a Scan area and measure the X and Y distances of this area using the SEM measuring tools. In this example, X and Y were both 227 microns. After defining the scan area, the green square is not yet visible. To see it, press OK on the scan properties dialog, and reopen it by clicking “Properties” at the bottom of the scan page.
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4. Compare the SEM size values to the Size X and Y values in the Scan Dimensions portion of the Scan Properties window. If these values match, skip to step 6. If they do not, continue to step 5.
5. Go to the Settings ¦ Beam menu. Here you will need to adjust the Width (X) and Height (Y) SEM Calibration values. If your measured value(s) on the SEM differ from the values shown for the scan area, you need to modify the given calibration value by the same ratio as the ratio between the length in OIM and on the SEM. An iteration process of adjusting these values, and then redrawing the scan area will allow you to obtain the best fit. 6. Now tilt the sample, typically to 70 degrees. In the Settings ¦ Environment window, insert this value for the specimen tilt. If you use a pre-tilted specimen holder, make sure the grid is aligned with the sample holder so that one grid direction is parallel to the tilt axis, and the other grid direction is parallel to the tilt direction. 7. Go to the Scan page. Capture the SEM image. Determine the scan tilt direction: X (right/left), Y (top/bottom), or mixed. In the images below, the scan tilt direction is drawn in red, and the tilt axis is drawn in blue. Once determined, set the tilt direction in the Scan Tilt section of the Settings ¦ Environment window. If you have a mixed image, use the scan rotation on the SEM to align the grid in either the X or Y direction. Set this scan tilt direction, and note the rotation value for future use.
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8. Close the OIM Data Collection program, and save the Environment and Beam settings when prompted. The imaging part is now calibrated.
Pattern Center Calibration The Pattern Center (PC) in the EBSD applications is used to correct the distortion of the EBSD pattern due to the point projection onto an often tilted phosphor screen. The PC is defined as the location on the phosphor screen (e.g. in the EBSD pattern) where the diffracted electrons hit the screen perpendicularly. Consequently the PC calibration changes with different working distance values of the SEM. The calibration routine given below calibrates the PC over the range of usable WD values for any particular SEM NOTE: The pattern center calibration values for OIM Data Collection 4.x and Delphi 2.5 differ in their definition. It is easiest to do the pattern calibrations in the OIM DC application and use the .ini utility from the TexSEM entry in “All Programs” off of the Windows start menu to migrate all the settings into Delphi.
1. All systems are designed such that the PC is located at 1/3 from the top of the screen along the vertical centre line when the sample is mounted at the optimum WD as given in the design drawings. This will insure that the maximum intensity of back-scattered electrons are hitting the phosphor screen. 2. Put the Ni standard sample that is provided with the OIM system in the SEM and make sure you are at the specified working distance. 3. Go to the phase page and verify that either the fcc_generic or Nickel structure files are loaded.
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4. Obtain a good diffraction pattern (e.g using 2x2 binning) with the beam in the center of the SEM image. Capture the pattern in the OIM software. 5. Verify that the bands are detected properly in the Hough page. Then proceed to the calibration page. 6. Type in the estimated numbers for X*, Y*, and Z* in the fields provided on the calibration page together with the actual WD value: X* = 50% and Y* = 67% (center line and 1/3 from top respectively) and Z* = 70%. . 7. Click on the index button. You can usually tell if the indexing overlay is correct on the diffraction pattern. If the geometry of the overlay is correct then proceed to step 10. 8. If the overlay is not correct, select the Pattern Auto method on the calibration dialog. Instructions are given in the window on the right hand side of the screen. When finished re-index the pattern and check for good fit. The fit should be better than ~1.5 degree. If the fit is larger, go to step 10. 9. Pick up the pattern center by clicking on it with the left mouse button. Move the pattern center slightly along a vertical line and drop it. The software will automatically reindex and the fit parameter will be updated. Repeat this process until the overlay appears correct and the fit is minimised. Note: Picking up the pattern center and moving it only changes the X* and Y*. In order to change the Z* parameter, use the adjacent up/down arrows or press the shift button on the keyboard and drag with the mouse. Selecting the Z* manually can be tricky, but Z* should be between 50 and 80 depending on how far the detector was inserted. Visually compare the size of the triangles in the solution overlay and in the pattern. When the sizes are comparable, and Z* is in the range between 50 and 80% you can move the pattern centre in small increments. If you cannot get the overlay to match up at all, verify if the bands are detected properly and if the camera has been mounted with the correct side up (serial number label on top). 10. When the solution matches the pattern, but the bands do not fit exactly, perform a Tune. The fit should be better than ~0.8 degrees. 11. Record this calibration to the settings file by clicking on the Record button at the bottom of the Calibration dialog. 12. Repeat steps 4-10 for the working distances – 5mm, -2mm, +2mm, +5mm, +8mm, and +10 mm from your reference working distance. This will allow the software to interpolate the calibration when the sample is at a working distance different from the reference. 13. For each WD store the pattern in a calibration folder with the proper WD setting in the filename, e.g.
[email protected]. This will allow recalibration of the system without the need of putting a standard sample in. It is recommended to copy these reference images together with the OIMDC40.ini file to a safe place and also take them with you. 21
Pattern Center Shift Calibration 1. The Pattern Center Shift calibration is done from the Environments ¦ Settings window of OIM Data Collection. It is labeled Pixels per cm. Setting these values correctly allows the system to accurately adjust for the movement of the pattern center during EBSD mapping.
2. It is recommended that you perform this calibration on the nickel standard provided with the system. 3. Position the nickel specimen at 70 degree tilt at the optimum working distance as specified in the design drawings. 4. Insert the EBSD detector, optimise the SEM image and switch on the dynamic focus. 5. Set the SEM magnification as low as possible while still having the sample filling the entire SEM image and dynamic focus enabled. 6. Set up the DigiView control panel to obtain patterns at the Normal mode (2x2 binning) Adjust the exposure time to obtain a good signal on the phosphor screen. Try to keep the gain and blacklevel low. Speed is not important for this calibration. Collect and apply a background. Refer to the camera operating instructions for more detail. 7. Verify that you can obtain high-quality EBSD pattern from the center and recognisable patterns from top-left, top-right, bottom-left, and bottom-right positions in the SEM image. You may have to slightly adjust the gain of the camera to make sure that an acceptable image can be obtained at every point. Due to the large capture area, and high tilt, you may find that one side of the sample gives much brighter patterns than the other. Try to adjust the gain so that at any of the points, the EBSD patterns obtained are still useable. 8. Go to the Settings ¦ Environment window, and click the Advanced button in the Pixels per cm area. 9. Enter the magnification at which you were able to satisfactorily complete step 7.
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10. The system will then automatically capture a pattern from the center position, and open the calibration window. Calibrate this pattern to obtain the best fit possible. Try to get the fit smaller than 0.5 degrees. Preferable, use the manual bands method and select the bands by using ctrl click and drag the mouse. The Hough transform can have some difficulty finding the bands properly in the corners. Accurately select at least 9 bands covering the whole pattern area. Record this calibration, and then press close. 11. The system will then perform the same operation for the 4 corners of the image. Due to intensity gradients, you must watch the calibration procedure closely. It may be necessary to adjust the gain and recapture a pattern. If the patterns seem overlapping or of poor quality you can use the arrows to move the beam in small increments untill you obtain a good pattern. 12. Once you have calibrated all 4 patterns with a fit of less that 0.5 degree, you have the option of keeping this calibration by pressing OK, or discarding these numbers by pressing Cancel. If you are satisfied with these values, record these on the installation checklist, and press OK. 13. To check the accuracy of the calibration numbers, load the silicon single crystal sample at the same working distance. Load the silicon material file, and remove the nickel material file. 14. Capture an image from silicon at the same magnification. Verify that you can obtain patterns. Note you may have to increase the gain of the camera to obtain the correct exposure, but you shouldn’t have to collect a new background. 15. Capture, index, and record patterns from different edges and the center of the image on the Interactive page. Verify that the misorientation between the center point, and the edge points is below 1 degree. Note that the accurate detection of the bands in the Hough transform is critical for this test.
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Final Verification Set up a scan on the Nickel standard that was included with the system. Scan an area at least 200x200 microns with a step size of no more than 4 microns. Make adjustments to this scan depending on the time available to run the scan. Make sure that either the fcc_generic or the Nickel material file is loaded when scanning the nickel. When the scan is finished, load the data file into OIM Analysis and look at the grain structure. Check that the grains have an equal aspect ratio in both the X and Y directions. The average grain diameter should be in the neighborhood of 50 microns, but your results could vary depending on your grain distribution.
Configuring the EDAX integrated Forward Scatter Detector (FSD) It is assumed at this stage that the FSD hardware has already been installed and configured in the SGII Shell. (See “Installing and Configuring TSL Hardware” document).
Introduction The FSD diodes are mounted on the phosphor ring of the EBSD camera and can provide orientation, topographical, and compositional contrast depending on how the user varies working distance, accelerating voltage, beam current, and camera insertion distance. The FSD images below were produced from a poly-phase sulfide ore rock, for which camera insertion distance was varied. Note the different features that are apparent at different insertions. When the camera is fully inserted, topographical contrast is most dominant, but as the camera is retracted to 12 mm, orientation contrast becomes more apparent. With further retraction, compositional contrast appears, approaching the level of detail formerly only achievable with a backscatter detector.
Configuring the EBSD application (OIM DC/Delphi) for FSD 24
FSD support is provided via the beam control library plugin "BeamEDAX.dll". Ensure this is selected in the Environment settings. Next, open up the Beam Settings dialog and select the FSD/ADC Support checkbox. This will launch a configuration dialog where you can assign the name of each ADC channel. Typically this is as follows in the dialog below, where the Secondary Electron detector signal is supplied on ADC 1 and the FSD signal on 2. These imaging channels will now be available to the application on closing down and then restarting. (Save the Settings on request).
Signal Selection and Adjustment from the EBSD application An additional toolbar is included in the application for selecting the imaging channel and making adjustments to the signal itself. This toolbar is dockable and can be placed in various alternative locations but clicking on its left hand edge and dropping down in the desired spot.
This toolbar provides a pull-down menu enabling selection of the active SEM imaging channel. Adjustment of the selected signal is made via the tool to the right. On selecting the signal adjustment tool the dialog shown below will appear. For the FSD channel, both the FSD pre-amplifier controls are supplied together with the ADC amplifier controls. For the SE channel only the ADC controls are supplied. The left hand side of the dialog will display the slider controls for gain and offset of the amplifiers. Below these are two controls for the selection of the image resolution (or Matrix Size) and the number of Reads (or dwell time) controlling the quality of the signal.
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To obtain a single image frame from the selected channel, click on the Snapshot button below the imaging area in the dialog. To obtain a continuous (live) signal, updated line by line, click on the Continuous On button below the imaging area. The bar to the left of the imaging area indicates the current position of the line being read and a histogram will indicate the current dynamic range of the signal being received. Adjustments to the gain and offset can be made whilst acquiring the live signal. To terminate live signal collection click on the Continuous Off button. Once a desirable image has been obtained click the OK button. All subsequent SEM image captures will be obtained using these values. Finally, it is possible to record a set of gain and offset values and recall them for future use using the Record and Restore buttons located below the slide controls.
Procedure for obtaining a good quality FSD image •
Set the FSD (preamp) Gain to 1000 and Offset to 0.
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Set the imaging mode to Continuous On and Matrix Size at a low resolution (128x128 or 256x256).
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Optimise the gain of the ADC channel to maximise the signal range
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Use the ADC Offset to get the signal inside the visible range.
When the range of either the gain or offset of the ADC channel is insufficient, modify the FSD preamp gain / offset to compensate for this. •
Use the ADC controls first and then compensate with the FSD controls when necessary.
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When the gain/offset is setup properly, switch to higher resolution imaging (512x512 or 1024x1024) and quit the imaging setup window.
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