Transcript
IRGP4262DPbF IRGP4262D-EPbF Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode VCES = 650V
C
G
G
IC = 40A, TC =100°C tSC 5.5µs, TJ(max) = 175°C
G
C
VCE(ON) typ. = 1.7V @ IC = 24A
C
n-channel Applications G Gate
E
G IRGP4262D-EPbF TO-247AD
G IRGP4262DPbF TO-247AC
E
• Industrial Motor Drive
E
C Collector
E Emitter
• UPS
Features
Benefits
Low VCE(ON) and Switching Losses 5.5µs Short Circuit SOA Square RBSOA Maximum Junction Temperature 175°C Positive VCE (ON) Temperature Coefficient Base part number
Package Type
IRGP4262DPBF IRGP4262D-EPBF
TO-247AC TO-247AD
High Efficiency in a Wide Range of Applications Rugged Transient Performance Increased Reliability Excellent Current Sharing in Parallel Operation Standard Pack Form Quantity Tube 25 Tube 25
Orderable Part Number IRGP4262DPBF IRGP4262D-EPBF
Absolute Maximum Ratings Parameter VCES IC @ TC = 25°C IC @ TC = 100°C ICM ILM IF @ TC = 25°C IF @ TC = 100°C VGE PD @ TC = 25°C PD @ TC = 100°C TJ TSTG
Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulse Collector Current, VGE=20V Clamped Inductive Load Current, VGE=20V Diode Continuous Forward Current Diode Continuous Forward Current Continuous Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw
Max.
Units
650 60 40 96 96 45 27 ±20 250 125 -40 to +175
V A
V W
300 (0.063 in. (1.6mm) from case) 10 lbf·in (1.1 N·m)
C
Thermal Resistance RJC (IGBT) RJC (Diode) RCS RJA
1
Parameter Thermal Resistance Junction-to-Case-(each IGBT) Thermal Resistance Junction-to-Case-(each Diode) Thermal Resistance, Case-to-Sink (flat, greased surface) Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min. ––– ––– ––– –––
Typ. ––– ––– 0.24 40
Max. 0.6 1.6 ––– –––
Units °C/W
June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF Electrical Characteristics @ TJ = 25°C (unless otherwise specified) V(BR)CES V(BR)CES/TJ
Parameter Collector-to-Emitter Breakdown Voltage Temperature Coeff. of Breakdown Voltage
Min. 650 —
Typ. — 0.86
— 1.7 — 2.1 Gate Threshold Voltage 5.5 — VGE(th) Threshold Voltage Temperature Coeff. — -20 VGE(th)/TJ gfe Forward Transconductance — 16 — 1.0 Collector-to-Emitter Leakage Current ICES — 530 Gate-to-Emitter Leakage Current — — IGES — 1.6 Diode Forward Voltage Drop VF — 1.26 Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max. — —
Units Conditions V VGE = 0V, IC = 100µA V/°C VGE = 0V, IC = 2mA (25°C-175°C)
2.1 V IC = 24A, VGE = 15V, TJ = 25°C — IC = 24A, VGE = 15V, TJ = 175°C 7.7 V VCE = VGE, IC = 700µA — mV/°C VCE = VGE, IC = 700µA (25°C-150°C) — S VCE = 50V, IC = 24A, PW = 20µs 35 µA VGE = 0V, VCE = 650V — VGE = 0V, VCE = 650V, TJ = 175°C ±100 nA VGE = ±20V 2.4 V IF = 24A — IF = 24A, TJ = 175°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg Qge Qgc Eon Eoff Etotal td(on) tr td(off) tf Eon
Parameter Total Gate Charge (turn-on) Gate-to-Emitter Charge (turn-on) Gate-to-Collector Charge (turn-on) Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Turn-On Switching Loss
Eoff Etotal td(on) tr td(off) tf Cies Coes Cres
Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
5.5
—
—
µs
Erec trr Irr
Reverse Recovery Energy of the Diode Diode Reverse Recovery Time Peak Reverse Recovery Current
— — —
292 170 17
— — —
µJ ns A
Min. — — — — — — — — — — —
Typ. 47 15 20 520 240 760 24 27 73 23 1120
— — — — — — — — —
475 1595 22 28 88 74 1550 124 43
Max Units Conditions 70 IC = 24A nC VGE = 15V 23 VCC = 400V 30 740 350 µJ IC = 24A, VCC = 400V, VGE=15V 1090 RG = 10, L = 0.40µH, TJ = 25°C 40 Energy losses include tail & diode 45 ns reverse recovery 90 40 — — — — — — — — — —
µJ
ns
pF
FULL SQUARE
IC = 24A, VCC = 400V, VGE=15V RG = 10, L = 0.40µH, TJ = 175°C Energy losses include tail & diode reverse recovery VGE = 0V VCC = 30V f = 1.0MHz TJ = 175°C, IC = 96A VCC = 480V, Vp ≤ 650V VGE = +20V to 0V TJ = 150°C,VCC = 400V, Vp ≤ 650V VGE = +15V to 0V TJ = 175°C VCC = 400V, IF = 24A VGE = 15V, Rg = 10
Notes:
VCC = 80% (VCES), VGE = 20V. R is measured at TJ of approximately 90°C. Refer to AN-1086 for guidelines for measuring V(BR)CES safely. Maximum limits are based on statistical sample size characterization. Pulse width limited by max. junction temperature. Values influenced by parasitic L and C in measurement.
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June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 60 For both: Duty cycle : 50% Tj = 175°C Tcase = 100°C Gate drive as specified Power Dissipation = 108.7W
Load Current ( A )
50
40 Square Wave: VCC
30 I
20 Diode as specified
10 0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency (Load Current = IRMS of fundamental) 60
250
50
200
Ptot (W)
IC (A)
40 30
150
100
20 50
10 0
0
25
50
75
100
125
150
175
25
TC (°C)
50
75
100
125
150
175
TC (°C)
Fig. 3 - Power Dissipation vs. Case Temperature
Fig. 2 - Maximum DC Collector Current vs. Case Temperature 1000
1000
100 100 IC (A)
IC (A)
10µsec 10 100µsec 10 1
1msec Tc = 25°C Tj = 175°C Single Pulse
DC 1
0.1 1
10
100
1000
10000
VCE (V)
Fig. 4 - Forward SOA TC = 25°C; TJ ≤ 175°C; VGE = 15V 3
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10
100
1000
VCE (V)
Fig. 5 - Reverse Bias SOA TJ = 175°C; VGE = 20V June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 100
100
80
80
60
VGE = 18V VGE = 15V VGE = 12V
40
VGE = 12V VGE = 10V VGE = 8.0V
60
ICE (A)
ICE (A)
VGE = 18V VGE = 15V
40
VGE = 10V VGE = 8.0V
20
20
0
0 0
2
4
6
8
10
0
2
4
6
8
10
V CE (V)
V CE (V)
Fig. 6 - Typ. IGBT Output Characteristics TJ = -40°C; tp = 20µs
Fig. 7 - Typ. IGBT Output Characteristics TJ = 25°C; tp = 20µs 100
100 VGE = 18V VGE = 15V
80
80
VGE = 12V VGE = 10V VGE = 8.0V
60 IF (A)
ICE (A)
60
40
40
20
20
-40°C 25°C 175°C
0
0 0
2
4
6
8
0
10
1
12
12
10
10 ICE = 12A ICE = 24A
8
ICE = 12A ICE = 24A
8
ICE = 48A
V CE (V)
V CE (V)
3
Fig. 9 - Typ. Diode Forward Voltage Drop Characteristics
Fig. 8 - Typ. IGBT Output Characteristics TJ = 175°C; tp = 20µs
6
ICE = 48A 6
4
4
2
2
0
0 5
10
15
20
V GE (V)
Fig. 10 - Typical VCE vs. VGE TJ = -40°C 4
2 V F (V)
V CE (V)
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5
10
15
20
V GE (V)
Fig. 11 - Typical VCE vs. VGE TJ = 25°C June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 12
100
10 8
ICE = 48A
60
ICE (A)
V CE (V)
80
ICE = 12A ICE = 24A
6
40
4
TJ = 25°C TJ = 175°C
20
2 0
0 5
10
15
20
4
8
10
12
14
V GE (V)
Fig. 12 - Typical VCE vs. VGE TJ = 175°C
Fig. 13 - Typ. Transfer Characteristics VCE = 50V; tp = 20µs
3000
1000
2500
Swiching Time (ns)
tdOFF
2000 Energy (µJ)
6
V GE (V)
1500
EON
1000
100 tF tdON 10 tR
EOFF
500 0
1 0
10
20
30
40
50
0
10
20
IC (A)
30
40
50
IC (A)
Fig. 14 - Typ. Energy Loss vs. IC TJ = 175°C; L = 0.40mH; VCE = 400V, RG = 10; VGE = 15V
Fig. 15 - Typ. Switching Time vs. IC TJ = 175°C; L = 0.40mH; VCE = 400V, RG = 10; VGE = 15V
2400
1000
2000
Energy (µJ)
Swiching Time (ns)
EON
1600 1200
EOFF 800
tdOFF 100 tF tR
400
tdON 0
10 0
20
40
60
80
100
0
20
40
60
80
100
Rg ()
RG ( )
Fig. 16 - Typ. Energy Loss vs. RG TJ = 175°C; L = 0.40mH; VCE = 400V, ICE = 24A; VGE = 15V
Fig. 17 - Typ. Switching Time vs. RG TJ = 175°C; L = 0.40mH; VCE = 400V, ICE = 24A; VGE = 15V
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June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 17
17 16
15
15
RG = 22
14
IRR (A)
IRR (A)
16
RG = 10
RG = 47
13
14 13 12
12 RG = 100
11
11 10
10 10
15
20
25
30
35
40
45
0
50
20
40
60
IF (A)
RG (
Fig. 18 - Typ. Diode IRR vs. IF TJ = 175°C
Fig. 19 - Typ. Diode IRR vs. RG TJ = 175°C
17
100
2.5 48A
16 15 14 13
47
1.5
12
10
22
2.0 QRR (µC)
IRR (A)
80
24A
100 12A
11 1.0
10 0
200
400
600
800
0
1000
200
400
600
800
1000
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 20 - Typ. Diode IRR vs. diF/dt VCC = 400V; VGE = 15V; IF = 24A; TJ = 175°C
Fig. 21 - Typ. Diode QRR vs. diF/dt VCC = 400V; VGE = 15V; TJ = 175°C 21
400
140 Isc
Tsc
18
120
Time (µs)
RG = 10
200
RG = 22 RG = 47
100
RG = 100
100
12
80
9
60
6
40
3
0 0
10
20
30
40
50
IF (A)
Fig. 22 - Typ. Diode ERR vs. IF TJ = 175°C 6
15
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Current (A)
Energy (µJ)
300
20 8
10
12
14
16
18
VGE (V)
Fig. 23 - VGE vs. Short Circuit Time VCC = 400V; TC = 150°C June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 16 V GE, Gate-to-Emitter Voltage (V)
10000
Capacitance (pF)
Cies 1000
Coes
100
Cres
V CES = 400V
14
V CES = 300V
12 10 8 6 4 2 0
10 0
100
200
300
400
500
0
600
10
20
30
40
50
Q G, Total Gate Charge (nC)
V CE (V)
Fig. 25 - Typical Gate Charge vs. VGE ICE = 24A
Fig. 24 - Typ. Capacitance vs. VCE VGE= 0V; f = 1MHz 1
Thermal Response ( ZthJC )
D = 0.50 0.20
0.1
0.10 0.05
0.01
J
R1 R1 J 1
0.02
R2 R2
R3 R3
R4 R4 C
2
1
2
3
4
3
4
Ci= iRi Ci= iRi
0.01
1E-005
i (sec)
0.014255
0.000015
0.163283
0.000127
0.257883
0.003125
0.164579
0.019104
Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE ( THERMAL RESPONSE ) 0.001 1E-006
C
Ri (°C/W)
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 26 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
Thermal Response ( Z thJC )
10
1
D = 0.50 0.20 0.10 0.05
0.1
J
0.02
R1 R1 J 1
R2 R2
R3 R3
R4 R4 C
2
1
2
3
4
3
Ci= iRi Ci= iRi
0.01
SINGLE PULSE ( THERMAL RESPONSE ) 1E-005
0.0001
0.001
C
i (sec)
0.026766
0.000026
0.573978
0.000561
0.655762
0.005131
0.344981 0.039505 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc
0.01
0.001 1E-006
4
Ri (°C/W)
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE) 7
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June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF L
L VCC
DUT
0
80 V +
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp / DUT L
4X DC
VCC
-5V DUT / DRIVER
DUT
VCC
Rg
RSH Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
C force
R=
VCC ICM
100K D1
22K C sense
DUT
VCC G force
DUT
0.0075µF
Rg E sense
E force
Fig.C.T.5 - Resistive Load Circuit 8
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Fig.C.T.6 - BVCES Filter Circuit June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF 60
600
500
50
500
400
40
400
30 90% ICE
200
20
VCE (V)
300
ICE (A)
50
10
300
30
200 100
10 10%ICE
0 Eoff Loss
-100 -0.3
-0.05
0.2
0.45
-10 0.7
0 Eon Loss
-100 -0.5
0
0.5
-10 1
time(µs)
time (µs)
Fig. WF1 - Typ. Turn-off Loss Waveform @ TJ = 175°C using Fig. CT.4
Fig. WF2 - Typ. Turn-on Loss Waveform @ TJ = 175°C using Fig. CT.4
600 500
tRR
20
Vce (V)
0 Peak IRR
100
300
75
200
50
100
25 0
-100
0.00
0.15
0.30
time (µs)
Fig. WF3 - Typ. Diode Recovery Waveform @ TJ = 175°C using Fig. CT.4
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VCE
0
-20 -30 -0.15
125
400
10
-10
150
ICE
QRR
30
IF (A)
10% VCE
0
40
9
20
90% ICE
10% ICE
0
40
TEST CURRENT
10% VCE
100
60
tr
© 2013 International Rectifier
Ice (A)
VCE (V)
tf
ICE (A)
600
-5.0
0.0
5.0
-25 10.0
time (µs)
Fig. WF4 - Typ. S.C. Waveform @ TJ = 150°C using Fig. CT.3
June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF TO-247AC Package Outline Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information Notes: This part marking information applies to devices produced after 02/26/2001 EXAMPLE: THIS IS AN IRFPE30 WITH ASSEMBLY LOT CODE 5657 ASSEMBLED ON WW 35, 2001 IN THE ASSEMBLY LINE "H" Note: "P" in assembly line position indicates "Lead-Free"
INTERNATIONAL RECTIFIER LOGO
PART NUMBER IRFPE30 56
135H 57
ASSEMBLY LOT CODE
DATE CODE YEAR 1 = 2001 WEEK 35 LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10
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June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF TO-247AD Package Outline Dimensions are shown in millimeters (inches)
E
Q
A
A
E2/2
"A" A2
E2 2X D
B
L1
"A" L
SEE VIEW "B"
2x b2
3x b
Ø .010
B A
c
b4 e
A1
2x LEAD TIP
ØP Ø .010
B A
-A-
S
D1
VIEW: "B" THERMAL PAD PLATING BASE METAL E1 Ø .010
(c) B A
VIEW: "A" - "A"
(b, b2, b4)
SECTION: C-C, D-D, E-E
TO-247AD Part Marking Information E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E W IT H A S S E M B L Y LO T C O D E 5657 ASSEM BLED O N W W 35, 2000 IN T H E A S S E M B L Y L IN E "H " N o te : "P " in a s s e m b ly lin e p o s itio n in d ic a te s "L e a d - F r e e "
PART NUM BER
IN T E R N A T IO N A L R E C T IF IE R LO G O 56
035H 57
ASSEM BLY LO T CO DE
DATE CO D E YEAR 0 = 2000 W EEK 35 L IN E H
TO-247AD package is not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
11
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June 12, 2013
IRGP4262DPbF/IRGP4262D-EPbF
Qualification Information† Industrial
Qualification Level
(per JEDEC JESD47F) †† Moisture Sensitivity Level
TO-247AC
N/A
TO-247AD
N/A Yes
RoHS Compliant †
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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June 12, 2013