Transcript
K900G3 HPC Server
Density
Performance
Affordability
Power Efficiency
K900G3 HPC server series are Intel® Grantley platform systems in 2U height with 4 compute nodes, up to 8 CPUs! With extreme high density and noncompromising performance, K900G3 systems enable excellent computing jobs such as Hadoop and virtualization solutions, suitable for render and compute farms. The series present, Incomparable Performance: Compared with previous Romley platform, dual Intel ® E5-2600 v3 series processor solutions are based on Intel ® 22nm process technology and yield up to 33% improved performance, with power enhancement, virtualization enhancement, security enhancement and DDR4 support. The latest v4 platform is further enhanced by Intel ® 14nm process technology in 50% smaller package, highlighting up to even 47% faster, 27% average generational performance gain across key industry-standard workloads and applications, moving steps forward to better virtualization efficiency, smarter resource orchestration and more enhanced protection of systems and data. High Density: With dual Intel® Xeon® E5-2600 v3/v4 processors, K900G3 provides up to twenty four 2.5” hard drive bays, 112 cores and 224 threads within a single 2U system, and eight channels of DDR4-2133 DIMMs in one single node! Applications Failure-free Operation Support: The adoption of power redundancy and hot-swappable node design enables more reliability during operation. The hot-swappable feature on all serviceable parts makes maintenance even easier. Flexible Network Configuration: By offering a variety of network choices through OCP NIC mezzanine card options, ranging from 1G Ethernet to 10G Ethernet (optical), the high speed performance and IO flexibility are realized, catering to suitable demands of different application procedures.
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All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, Intel Atom and Intel Atom Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders. ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1988 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients. Copyright ©2016 Inventec Corp. All rights reserved. 161227
Model Name Positioning Form Factor Processor
K900G3
Memory Slot Chipset Storage Controller
16x DDR4 DIMM slot Intel® C612 Onboard: Intel® C612: 6x SATA 6Gb/s port; SATA RAID 0,1,5,10 Inventec storage mezz card options: Option1: SAS2-2308-8i (6Gb/s) Option2: SAS2-2208-8i (6Gb/s) Option3: SAS3-3008-8i (12Gb/s) Onboard: Dedicated 10/100 management port Network OCP mezz card options: Option1: NIC-I350-1GDC Option2: NIC-I599-10GD
Network Controller
High Performance Computing 2U4N rack mount Dual Socket Intel® Xeon® Processor E5-2600 v3/v4 Family
Expansion Slot 1x PCIe Gen3 x8 (LP/MD2) 1x PCIe Gen3 x8 storage mezz slot 1x PCIe Gen3 x8 network OCP mezz slot Disk Drive Bay Internal port per node: 1x SATA DOM port Front primary bays: Option1: 24x 2.5" SAS3-12Gb/s hot-plug drive Option2: 12x 3.5" SAS2-6Gb/s hot-plug drive System Management TPM Power Supply
IPMI 2.0 compliant Option: 1.2 1600W Platinum 1+1 redundancy
Multi-nodes of K900G3
© 2016 Inventec Corp.
K900G3 12x 3.5"/24x 2.5" HDD SKU
