Transcript
Service Manual
Service Manual KG270/MG160
Model : KG270/MG160
Date: April, 2007 / Issue 1.0
Table Of Contents 1. INTRODUCTION ...............................5
4.13 Headphone Trouble .............................75
1.1 Purpose .................................................. 5
4.14 Charging Trouble .................................77
1.2 Regulatory Information............................ 5
4.15 FM Radio Trouble ................................79
2. PERFORMANCE...............................7
5. DOWNLOAD.......................................82
2.1 H/W Features...........................................7
5.1 Download Setup.....................................82
2.2 S/W Features ...........................................8
5.2 Download Process .................................83
3. TECHNICAL BRIEF ........................14
6. BLOCK DIAGRAM ..........................88
3.1 Digital Main Processor(PMB7880).........14
7. Circuit Diagram ..............................89
3.2 Power Amplifier Module (SKY77318) ....22 3.3 26 MHz Clock (DCXO)...........................24 3.4 RTC(32.768KHz Crystal) .......................25 3.5 LCD Interface(3-wire SPI interface) .......26
8. PCB LAYOUT ..................................93 9. ENGINEERING MODE ....................95
3.6 SIM Card Interface.................................28
9.1 About Engineering Mode .......................95
3.7 KEYPAD Interface .................................29
9.2 Access Codes ........................................95
3.8 Battery Charging Block Interface ...........30
9.3 Key Operation ........................................95
3.9 RF Interface ...........................................31
9.4 Engineering Mode Menu Tree ...............95
3.10 Audio Interface.....................................33
10. CALIBRATION ..............................92
3.11 Key LED Interface................................37 3.12 Vibrator Interface .................................38 3.13 Memory Interface .................................39
10.1 Test Equipment Setup .........................92 10.2 Calibration Steps..................................92
3.14 Power Block Interface ..........................40
11. STAND ALONE TEST .................109
3.15 FM Radio Interface ..............................42
11.1 Test Program Setting .........................109
4. TROUBLE SHOOTING ...................44
11.2 Tx Test ...............................................111
4.1 RF Trouble .............................................44
11.3 RX Test ..............................................112
4.3 Power On Trouble..................................54
12. EXPLODED VIEW & REPLACEMENT PART LIST ..... 113
4.4 SIM Card Trouble...................................56
12.1 Exploded View .................................. 113
4.2 TX Trouble .............................................50
4.5 Vibrator Trouble .....................................58 4.6 Keypad Trouble......................................60 4.7 RTC Trouble ..........................................62 4.8. Key backlight Trouble ...........................64 4.9. LCD Trouble..........................................66 4.10. Microphone Trouble ............................69 4.11. Receiver Trouble.................................71 4.12 Speaker Trouble ..................................73 -3-
12.2 Replacement Parts ............................115 12.3 Accessory ......................................... 124
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1. INTRODUCTION
1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, description and download the features of this model.
1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling: • Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. • Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used. • When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE 2.1 H/W Features Item
Specifications
Band
GSM DUAL Band(900/1800)
Type
Bar type
Dimension
98 * 45 * 12.9mm
Weight
60g
Battery
750mAh Li-ion
Talk Time
Over 2hours @EGSM,TX Level : 5
Stand-by Time
Over 200 hours @Paging period : 5
RTC
Under 4 hours when removed battery.
Antenna
Internal Type(Dual-band)
LCD(Main)
1.52"(128x128 pixels), 65K Color STN LCD
Back Light
Yes
Back Light color
Blue
Vibrator
Yes
Speaker&Receiver
Yes(11x07 Receiver, 16®™ Speaker)
C-MIC
Yes
Earphone Jack
Mono or Stereo(Optional)
SIM
Yes(Plug in Type) : 3.0V
MIDI
16 poly
I/O Connect
18 Pins (included Earphone Jack)
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2. PERFORMANCE
2.2 S/W Features Function
Detail Item
Specification
Operating System OS
O
Data
Circuit
O
Packet
X
Infrared (IrDA)
X
Bluetooth
X
USB
X
USB Mass storage
X
RS232
O
Voice Recording
X
Voice Command
X
Answering machine
X
User Memory
O
TBD
X
MMS
Connectivity
Voice Function
Memory
Etc.
OSE
Under 300KB
Pictures (Still Image & X Moving Image) X
MP3 (Music Contents)
X
Java Contents
O
Wallpaper
3 bitmap images
O
Ringtone
10 MIDI Ringtones
X
external memory (microSD)
Camera
Camera Module
X
Audio
Voice Codec
O
AMR
O
FM Radio
O
Integrated handsfree speaker
O
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FR, HR, EFR, AMR-NB
Speaker phone mode
2. PERFORMANCE
Function Display
Detail Item
Specification
RSSI
O
6 level
Battery Level
O
5 level
RTC
O
Multi?Language
O
Basic:English Max. 4 language of Latin 2 or 3 language of etc.
Quick Access Mode
X
PLMN/Service Indicator
O
Dimming Clock
X
Dual Clock
X
Local Time / Selected Area Time
Last Dialed Number
O
10
Last Received Number
O
10
Last Missed Number
O
10
Scratch Pad Memory
X
Call
Call Waiting
O
Manage-ment
Call Swap
O
Call Retrieve
O
Auto Answer
X
Automatic Redial
O
Calling Line dentification
O
Full Call divert
O
Speed Dialing
O
Last Number Redial
O
Multi-party Call (Conference Call)
O
Explicit Call Transfer
X
Normal Features
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Etc.
2. PERFORMANCE
Function Network
DTMF
Audio
Cell Broadcast
Detail Item
Specification
Automatic Network Selection
O
Manual Network Selection
O
Network Service Status
O
DTMF Signaling
O
DTMF Enable & Disable
O
Key Tone Volume
O
6 Level (Include Mute)
Ring Tone Volume
O
6 Level (Include Mute)
Ring Tone Pattern
O
10Type(fixed)
Ring Type Silent
O
Vibrator & Ring (Indicator)
Earpiece Volume
O
6 Level (Include Mute)
Mute
O
Read Cell Broadcast
O
Cell Broadcast Categories
O
Cell Broadcast Message
O
Language Phone Book
Entry
O
300
Field
O
Office,Mobile
Numeric Store and Recall
O
Alphabetic Store
O
Alphabetic Recall
O
Scroll by alphabetic or
O
numeric order Last Number Dialed
O
10
Last Number Missed
O
10
Last Number Received
O
10
Copy & Move
O
Fixed Dial Number
O
Barred Dial Number
X
Service Dial Number
O
Email Entry
X
Picture ID
X
Video Caller ID
X
My Name card
X
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Etc.
2. PERFORMANCE
Function Supp. Services
Detail Item Call Forwarding
Call Barring
Specification O
All Incoming Calls,
O
No Reply
O
On Busy,
O
Not reachable
O
All Outgoing Calls,
O
International Calls,
O
Etc.
Calls except to Home Country incoming Calls,
O
All incoming Calls when roaming
Conference Call
O
up to 3 calls
Plug?In Type
O
3 V only
SIM Lock
O
Service Provider / Network Lock
SIM Toolkit
O
Class 1, 2, 3
Prepaid SIM Operation
O
Mega SIM
X
Short Messaging
Read Message
O
Manage-ment
Write and Edit Message
O
Send and Receive Message
O
Reply to Message
O
SIM
Not Support EMS
Forward Message Extract Number from Message
O
Message Status
O
Message Unread Indicator
O
Settable Message Center Number, O Reply Path and Validity Visible and Audible Message
O O
Receive Alerting Voice Mail
O
Settable Voice Mail Center Number
O
Message Protocol
O
Normal, Fax, National Paging, Email, X400, ERMES, Voice
Message Overflow Indicator
O
Message Center Number
O
Help Menu
X
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2. PERFORMANCE
Function Sound contents
Detail Item
Specification
Ringtones
O
Karaoke
X
Stutter Sound
X
Flip tone
X
Button tone
O
Others
X
Miscellaneous
Development & Test Facility
O
Function
Field Test Facility
O
Display Software Version
O
IMEI
O
Language
O
Selectable Auto Language
Predictive word input
O
T9
Schedule
O
20 input (20 character)
To Do List
X
50 input
Memo
O
20 input (40 character)
D-day counter
X
Send via Bluetooth
X
Setting Local Time
O
Display Two Number of Cities Time
X
Dual clock
Daylight saving
X
Summer time calibration function
NITS
X
Automatic setting as country code in SIM
O
Currency, Surface, Length, Weight,
Text Input Scheduler
World Time
Unit converter
Schedule, Memo, To Do list, Messaging
Temperature, Volume, Velocity Stop watch
O
Calculator
Calculation
O
PC Sync
Phone Book Sync
X
Message Sync
X
Multimedia Contents Sync
X
Scheduler Sync
X
+-*/
E-MAIL, EMS, Schedule, Phonebook, Name card etc.
Sync ML
DS
X
DM
X
Game Menu
X Quick Access Mode (Profile)
X
External Interface Electrical Man Machine Interface O Development and Test Facility
O
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Etc.
2. PERFORMANCE
Function Handset
Security
Real Time Clock
Accessory
Detail Item
Specification
Restore Factory Setting Read Software Version Battery Charging Mode Emergency Call Handset Lock Security Code SIM Lock Key guard 12/24 hour Calendar Time Zone Daylight saving Alarm Manager Dimming Clock Power-off Alarm On Alarm Event Hand strap Embedded microSD Card microSD Adapter Stereo earmic
O O O O O O O O O O O X O X O O X X X O
earmic w/music remote controller Neck strap LCD Cleaner Holster Data cable CD Holster charger
X X X X O X X
additional standard battery Extended Battery Desktop Charger Cigar Lighter Adapter Portable Handsfree Bluetooth headset Bluetooth stereo earset controller Car kit Leather Pouch Stylus Pen
X X X X X X X X X X X X
Compass
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Etc.
Delete all
Automatic Leap Year Adjustment
Once, Daily, Mon~Fri, Mon~Sat
Display
EarMic Type
Provides optionally only for supporting FM radio function.
RS232 cable
Option
Standard battery Back-up and Holster function
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF 3.1 Digital Main Processor(PMB7880)
Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
3.1.1 Overview of E-GOLDvoice The E-GOLDvoice is a GSM baseband modem including RF transceiver covering the low bands GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands. E-GOLDvoice is Dual Band, therefore, it supports by default a low / high pair of bands at the same time: 1. GSM850 / GSM1800 2. GSM850 / GSM1900 3. GSM900 / GSM1800 4. GSM900 / GSM1900 The E-GOLDvoice is optimized for voice-centric Mobile Phone applications. The E-GOLDvoice is designed as a single chip solution that integrates the digital, mixed-signal, RF functionality and a direct-to-battery Power Management Unit. The transceiver consists of: • Constant gain direct conversion receiver with an analog I/Q baseband interface • Fully integrated Sigma/Delta-synthesizer capability • Fully integrated two-band RF oscillator • Two-band digital GMSK modulator with digital TX interface • Digitally controlled crystal oscillator generating system clocks. The E-GOLDvoice supports a direct battery connection, hence eliminating the need for an external Power Management Unit. The E-GOLDvoice has different power down modes and an integrated power up sequencer. The E-GOLDvoice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating temperature range from -40C to 85C. It is manufactured using the 0.13 •Ïm CMOS process.
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3. TECHNICAL BRIEF
3.1.2 Features ] Baseband • High performance fixed-point TEAKlite DSP • C166S high performance microcontroller • There are several Interfaces: - I2S interface for DAI connections (for Tape Approval) - High Speed SSC Interface for connection of external peripherals - SIM Interface - Keypad Interface (6x4 or 5x5 keys) - EBU for external RAM/FLASH connection - Asynchronous serial interface - JTAG Interface - Black & white and color displays are supported - PWM source to drive vibrator - Keypad and display backlight supported. ] Receiver • Constant gain, direct conversion receiver with fully integrated blocking filter • Two integrated LNAs • No need of interstage and IF filter • Highly linear RF quadrature demodulator • Programmable DC output level • Very low power budget. ] Transmitter • Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz • Single ended outputs to PA, Pout = +3.5 dBm • Very low power budget. ] RF-Synthesizer • Σ∆Synthesizer for multi-slot operation • Fast lock-in times (< 150 •Ïs) • Integrated loop filter • RF Oscillator • Fully integrated RF VCO. ] Crystal Oscillator • Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.
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3. TECHNICAL BRIEF
] Mixed Signal and Power Management Unit • DC/DC boost for voltages up to 15V for driving White or Blue LEDs • 8-Ohm loud speaker driver (250/350mW) • 16-Ohm earpiece driver • 32-Ohm headset driver • 4 measurement interfaces (PA temperature, battery voltage, battery temperature,and ambient temperature) • Differential microphone input • System start up circuitry • Charger circuitry for NiCd, NiMh and LiIon cells • Integrated regulators for direct connection to battery.
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3. TECHNICAL BRIEF
3.1.3 GSM System Description The E-GOLDvoice is suited for mobile stations operating in the GSM850/900/1800/1900 bands. In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified to target level by the RF transceiver chipset. Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital baseband filter in each path. The DSP performs: 1. The GMSK equalization of the received baseband signal (SAIC support available) 2. Viterbi channel decoding supported by an hardware accelerator. The recovered digital speech data is fed into the speech decoder. The E-GOLDvoice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC algorithms. The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a programmable gain stage. The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output driver for external loud speaker is implemented. In the transmit direction the differential microphone signal is fed into a programmable gain amplifier. The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal passes a digital decimation filter. The E-GOLDvoice performs speech and channel encoding (including voice activity detection (VAD) and discontinuous transmission (DTX)) and digital GMSK modulation. In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLDvoice supports dual band applications. Finally, an RF power module amplifies the RF transmit signal at the required power level. Using software, the E-GOLDvoice controls the gain of the power amplifier by predefined ramping curves (16 words, 11 bits). For baseband operation, the E-GOLDvoice supports: • Making or receiving a voice call • Sending or receiving an SMS.
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3. TECHNICAL BRIEF
3.1.4 PMU Details The E-GOLDvoice includes battery charger support (various sensor connections for temperature, battery technology, voltage, etc.) and a ringer buffer. E-GOLDvoice avoids the need for an external power management component because its internal power management unit contains: • Voltage regulators for the On-chip and Off-chip functional blocks • Charger circuitry for NiCd, NiMh and LiIon cells.
3.1.5 Bus Concept The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus. There is an interconnection between the TEAKlite bus and the C166S X-Bus.
3.1.6 C166S Buses The C166S is connected to three buses: 1. Local Memory (LM) bus 2. X-Bus 3. PD-Bus.
3.1.7 TEAKLite Bus The TEAKlite is connected to the TEAKlite bus.
3.1.8 Bus Interconnections The interconnection between the X-Bus and the TEAKlite Bus uses: • Multicore Synchronization • Shared Memory.
3.1.9 Clock Concept The E-GOLDvoice has a flexible clock control.
3.1.10 Interrupt Concept The C166 MCU carries out the E-GOLDvoice interrupt system.
3.1.11 Debug Concept The E-GOLDvoice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in parallel with: • A single JTAG port (that is, on a single host) • Mutual breakpoint control.
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3. TECHNICAL BRIEF
3.1.12 C166 Debug Concept The debugging of the C166 uses the OCDS and the Cerberus.
3.1.13 TEAKLite Debug Concept TEAKlite debugging uses the OCEM and the SEIB.
3.1.14 Power Management The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone application. The integrated PMU is directly connected to the battery and provides a set of linear voltage regulators (LDO’s). These LDO’s generate all required supply voltages and currents needed in a low feature mobile phone. A charger control circuit charges NiCd, NiMH and LiIon batteries. The charger control supports hardware controlled pre-charging and software controlled charging. It offers a wide charger voltage range, making halfwave/full-wave charging with cheap transformers possible. White/blue backlight generation is supported with a special driver for very a low external parts count. Power consumption during operation phases is minimized due to flexible clock switching In the Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during Standby via SW.
3.1.15 On-Chip Security Concept Secure boot is based on a public/private key approach. Flash images that are not signed with the private key during phone manufacture cannot be loaded. Verification of the Flash code is done with the public key. The public key as well as hash and verify algorithms are stored in the ROM, which ensures a hardware secured boot procedure. The following security features are supported: • Prevention of illegal Flash programming • Flash programming makes use of the E-GOLDvoice ID for personalization checks with IMEI and SIM-lock protection
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3. TECHNICAL BRIEF
The security features use the following mechanism: • Boot ROM flow: - Controls the boot transition to external flash - Controls the flash update • Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLDvoice chip has its own fused ID. Further details on the E-GOLDvoice security concept are not publicly documented.
3.1.16 Asynchronous Operation Mode Concept The E-GOLDvoice can operate in either: • The traditional synchronous mode with the 26MHz system clock synchronized on the base station • A special asynchronous mode (XO concept). In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the residual frequency offset is compensated in the digital signal processing domain. This processing includes frequency and timing compensation of the baseband and voiceband signals.
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3. TECHNICAL BRIEF
3.2 Power Amplifier Module (SKY77318)
Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 Ω input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
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3. TECHNICAL BRIEF
RF input and output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT orGSM_OUT) and the Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
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3. TECHNICAL BRIEF
3.3 26 MHz Clock (DCXO)
Figure. 3-3 E-GoldVoice DCXO Overview
DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) are two different techniques used To maintain the mobile’s reference oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial crystal frequency offset, temperature drift and aging. These static and dynamic frequency variations have to be compensated, otherwise the mobile would be in danger of losing connection to the network. The technique used to perform the frequency compensation is generally termed Automatic Frequency Control (AFC). To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation (which is continuously updated) required based on the measured frequency error. Then the required AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns control the DCXO core and generates The 26MHz system clock.
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3. TECHNICAL BRIEF
3.4 RTC(32.768KHz Crystal)
32.768KHZ CRYSTAL X100 32KIN 32KOUT
4
3
1
2
MC-146_12_5PF 18p
18p
C104
C105
32.768KHz
Figure. 3-4 E-Gold Voice RTC Interface
The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup battery. This allows the generation of external interrupts, even when the main PMB7880 supply voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and VSS_RTC. The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880 F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip 32 KHz oscillator module. The low clock frequency and the optimized low power design give the possibility to run the chip with a minimum of power dissipation. For example, for this specific application the 26 MHz reference oscillator can be switched off during system standby and a lowpower time reference can be kept when the 32k clock is provided to the RTC. The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32 kHz oscillator, as described in the following sections. The module RTC Shell solely performs level translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally associated with the RTC.
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3. TECHNICAL BRIEF
3.5 LCD Interface(3-wire SPI interface) 2V8_VIO CN200 1 2
LCD_RESET SSC0_CLK
R205 R207
4
47
5
47
7
R206
47
8
R208
47
CS3 SSC0_MTSR
10
MLED1
11
MLED2 C209 27p
6
9
MLED
C208 NA
MTPD
3
MTPG
C210 27p
12 14 15
13 R210 100K
C211 27p
LCD_ID
C212 27p
C213 NA
C221 1u
IMSA-9671S-13Y902 (ENQY0013801)
Figure 3-5-1. LCD Interface
VBAT
CHARGE PUMP U200 5
8
MLED
11
W_LED_DRV
R202 100K
C202 27p
4
IN
AAT3157ITP-T1 10 C1+
C1C2+
C200 1u
9 7 C201
CP
1u C2-
EN_SET
GND
D1 D2 D3 NC
6 1 2 3 12
MLED1 MLED2
C203 27p
Figure 3-5-2. Charge pump interface
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C204 27p
C214 NA
3. TECHNICAL BRIEF
Signals CS3
Description This signal enable to access to the driver IC of LCD.
SSC0_MTSR
This signal transfer serial data to driver IC.
SSC0_CLK
This signal transfer serial clock to driver IC.
LCD_RESET MLED
This signal makes driver IC to HW default status. This signal provide power to white LEDs.
MLED1/2
This signal be feed back from white LEDs.
2V8_VIO
This signal provides power to LCD modules.(2.8V)
The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a trimode load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel from a 2.7V to 5.5V input. The current sinks may be operated individually or in parallel for driving higher current LEDs. A low external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make this part ideally suited for small, battery-powered applications. AnalogicTech's S2Cwire™ (Simple Serial Control™) serial digital input is used to enable, disable, and set current for each LED with 16 settings down to 50µA. The low-current mode supply current can be as low as 50µA to save power.
Data
Output (mA/Ch)
Data
Output (mA/Ch)
1
20.0
9
5.0
2
17.0
10
4.2
3
14.0
11
3.4
4
12.0
12
2.8
5
10.0
13
1.0
6
8.6
14
0.5
7
7.0
15
0.1
8
6.0
16
0.05
Figure 3-5-3. Charge pump Output Current
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3. TECHNICAL BRIEF
3.6 SIM Card Interface 2V85_VSIM
SIM_DATA
R303
2V85_VSIM 0
R302
4.7K
2V85_VSIM
J300 4 GND VCC 5 VPP RST 6 CLK I_O 8 GND2 GND1
1 2 3 7
SIM_RST SIM_CLK C311 0.1u
C310 22p
C312 22p
Figure 3-6. SIM CARD Interface
The EGoldVoice provides SIM Interface Module. The AD6527 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.
Signals
Description
SIM_RST
This signal makes SIM card to HW default status.
SIM_CLK
This signal is transferred to SIM card.
SIM_DATA
This signal is interface datum.
- 28 -
3. TECHNICAL BRIEF
3.7 KEYPAD Interface 2V0_VRTC
KEY MATRIX END SW200 END_KEY
1
SW201
2
SW202
3
SW203
SW204
LEFT
SW205
MENU
R201 KEY_OUT1 680 C205 NA
SW206
4
SW207
7
SW212
5
SW208
8
SW213
6
SW209
9
SW214
UP
SW210
SEL
R203 KEY_OUT2 680 C206 NA
SW211
RIGHT
SW215
SEND
R204 KEY_OUT3 680 C207 NA
SW216
*
SW2170
SW218
#
SW219
DOWN
R209 KEY_OUT4 680 C215 NA
C216 NA
C217 NA
C218 NA
C219 NA
C220 NA
R211 680 KEY_IN0 R212 680 KEY_IN1 R213 680 KEY_IN2 R214 680 KEY_IN3 R215 680 KEY_IN4
Figure 3-7 KEY MAXTRIX Interface
The keypad interface is connected to the X-Bus, together with the XBIU and the Shared Memory Register, using a single Bus Interface. The keypad supports two scan modes: • By default, the keypad is a 4x6 scan matrix (4 input and 6 output pins). • To set the keypad to a 5x5 scan matrix (5 input and 5 output pins) The scan mode should be determined at the very beginning of the system start because changes are not allowed later.
- 29 -
3. TECHNICAL BRIEF
3.8 Battery Charging Block Interface CHARGING IC 2V8_VIO
VBAT VCHARGE
VCHARGE R118 NA R119
1.8K
U101 1
CHARGE_DETECT
2 R121 CHG_STATUS NA C126 (10V,K,X5R) 1u C127 0.015u
VIN _FAULT
VBAT VSEN_TEMP
10 C125 1u
9
R120 NA
(10V,K,X5R) 3 4
_STATUS
IREF
TIME
V2P8
5 GND 11 PGND
EN
8 R122
0 CHG_EN_TEST
7 R123
6
NA CHG_EN
C128
R124
R125
1u
160K
100K
ISL9201IRZ-T (1%)
Figure 3-8. Charging IC Interface
The AAT3681A is a high performance battery charger designed to charge single Cell lithiumion/polymer batteries with up to 500mA of current from an external power source. It is a stand-alone charging solution, with just one external component required For complete functionality. The AAT3681A precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells. The adapter/USB charge input constant current level can be programmed up to 500mA for rapid charging applications. The AAT3681A has four basic modes for the battery charge cycle: pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.
- 30 -
3. TECHNICAL BRIEF
3.9 RF Interface LMSP2PAA-575TEMP
FL400 9 3 7
VC1 VC2 C417 27p
5 8 10
C418 27p
IN
GSM1800_1900TX GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX GND1 GND2 GND3
GSM850_900TX GSM850_900RX
1 6
2 4
Figure 3-9-1. ASM interface C419
G4
G3
G1
4 I2
O2_2
6
O2_1
7
O1_2
8
O1_1
9
C420
1 I1
FL401
GSM_RXN
L403 18nH
5 10 G2
3
2
3p
C421
3p
GSM_RXP
3p
DCS_RXN
B9308 L404 5.1nH
PART_NO SFSB0001401
IN CASE OF GSM850/PCS1900 CHANGE THIS DUAL SAW FILTER TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Figure 3-9-2. SAW Filter interface
E-GOLDvoice features a fully integrated constant-gain direct conversion receiver, i.e. there is no interstage filter needed and the baseband level at the analogue IQinterface follows directly the RF input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching schemes are possible. An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset compensation is implemented and can be switched depending on the gain setting.
- 31 -
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
VBAT
(16V,K,X7R)
(50V,J,NP0)
C401 39p
R402
1K
TX_RAMP
3. TECHNICAL BRIEF
VBAT R404
R405 DCS_PCS_OUT
0
0
VAPC 15 R406
11
0 C411 NA
19
C412 NA
EGSM_OUT RSVD_GND
U400 SKY77318
2
DCS_PCS_IN EGSM_IN
3
(50V,J,NP0) (16V,K,X7R) R407
4
GSM_OUT 0
ENABLE
P_GND
BS
18
TXON_PA
1
R408 NA
R409 NA
BS C413 27p
C414 27p
16 14 13 12 10 9 8 7 5
R410 0 C415 NA
DCS_PCS_OUT
C408 0.01u C409 NA
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1
21
C407 27p VCC1A
C406 18p
6
C405 33p
VCC1B
C402 10u (2012)
VBATT
C404 0.01u
20
C403 12p
17
L402 NA
C416 NA
Figure 3-9-3. PAM(Power Amplifier Module) interface The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design with a reduced external component count. The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface signal into the digital modulator. The following Gaussian filter shapes the digital data stream for the GMSK modulation. Additionally a pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low distortion at the transmit output. The filtered digital data stream is scaled appropriately and added to the channel word. This sum is fed into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values representing the high resolution fractional input signal. This sequence controls the MMD (multi modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the VCO is achieved.
- 32 -
3. TECHNICAL BRIEF
3.10 Audio Interface
K14 LOUD2 L15 LOUD1 VMIC MICP2 MICN2 MICP1 MICN1 EPPA1 EPP1 EPN1
VMIC
SPK_N SPK_P
P12 P11 R12 P15 R13 M14 M12 N15
AUXIP AUXIN VINNORP VINNORN EPPA1 REC_P REC_N
C124 1000p
Figure 3-10-1 Audio interface
The audio front-end of E-GOLDvoice offers the digital and analog circuit blocks for both receive and transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying stages for connecting acoustic transducers to the E-GOLDvoice. In the transmit direction the supply voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated on the E-GOLDvoice. For E-GOLDvoice the EPp1/EPn1 driver are used as differntial Earpiece-Driver, EPPa1 is used as single-ended Headset-Driver. The audio front-end itself can be considered to be organized in three sub-blocks: • Interface to processor cores (TEAKlite and - indirectly - C166S) • Digital filters • Analog part.
- 33 -
3. TECHNICAL BRIEF
The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller. The audio front-end Generates interrupts on certain occasions, for example, when exchange of data is requested. The core interface part of the audio front-end also contains the control and status registers which are used to set up certain operation modes of the peripheral. The section next to the core interface contains the digital filters for interpolation and decimation of the audio signals being received and transmitted. The data path for the receive direction can be set up to process sampling rates between 8kHz and 48kHz. The interpolation filters for the respective sampling rates are implemented in a dedi-cated hardware block and are automatically selected to suite the chosen sampling rate. Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of 4 MHz, is performed digitally. D-to-A conversion, postfiltering, and final amplification are performed on the analog part. The amplifier buffer for voiceband receive does also support ringer functionality. The ringer functionality is activated by Setting bits RINGSELPN or RINGSELPA in the voiceband part of the analog control register. In transmit direction, amplification, prefiltering and A-to-D conversion (analog ∑∆ modulation) are performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass decimation filter for further processing by DSP firmware. Two sampling rates, 8kHz and 16kHz, are supported. The analog section contains all the necessary analog functional blocks including microphone supply generation, output and input amplifiers and analog filtering. Signals
Description
EPp1
Main Receiver Positive signal(Differential signal)
EPn1
Main Receiver Negative signal(Differential signal)
EPpa1
Headset signal(Single Ended signal)
Loud1
Speaker Output Positive signal(Differential signal)
Loud2
Speaker Output Negative signal(Differential signal)
MICP1
Main Microphone Positive signal(Differential signal)
MICN1
Main Microphone Negative signal(Differential signal)
MICP2
Headset Microphone Positive signal(Differential signal)
MICN2
Headset Microphone Negative signal(Differential signal)
VMIC
Main/Headset Microphone supply power
- 34 -
3. TECHNICAL BRIEF
RECEIVER L100
22nH
L101
22nH
CN100 1
REC_P
2
C100 39p
11*07*3T receiver
REC_N
(SURY0013001) C102 39p
C103 39p
Figure 3-10-2 Main Receiver interface
SPEAKER
SPEAKER AMPLIFIER R102 C116
R103
NA
VBAT
82K
NA
C118
0.1u
R105
U100 A3
20K SPK_P
A1 C3
20K
100K
R110
0.22u
LOUD_SPK_EN
82K
R106
C1
INM
OUTA
_SD
VM
BYPASS
VP
L103
27nH CN101 1
L104
27nH 2
A2 B2
16pi 3.4T speaker
(SUSY0025801)
B3
C120 1 uF
D100
C122 C123 0.1u 0.1u
(2012) C121
RADIO_SPK_L
0.1u
R108
20K C119
NCP2890AFCT2G C2 OUTB
INP
(10V,K)
Gain : Rf/Rin
Figure 3-10-3 Main Speaker interface
- 35 -
diode
R104
diode
0.1u
VM_P
C117
B1
SPK_N
D101
3. TECHNICAL BRIEF
VMIC
MAIN_MIC R300 1K
R301
C303 39p
2.2K
R304
C306
VINNORP
C304 10u
0.1u OB4-15L42-C33L
100ohm C308
C307 0.1u
2 1
39p R307
C309
0.1u
MIC300
VINNORN
R309
C313
2.2K
C314
39p
39p
100ohm
Figure 3-10-4 Main Microphone interface
1.5K
R316
VMIC
C317
R318
AUXIN C318 NA
C320
0.1u
C321
2V8_VIO
39p
AUXIP
EAR_MIC I/O CONNECTOR
2.2K C319 10u
0.1u
R321
100K
VCHARGE
FOR RADIO FB300
1800
FB301 FB302
10u 10u
1800 1800
HS_DET 2V8_VIO
39p
39p
RPWRON R324 100K
C326
C323 C324
C325
NA
R323 100K
R322
CN301
2V8_VIO
2V8_VIO
AUXOP_FML AUXOP_FMR TXD RXD
FM_ANT VBAT
DSR C328 56p
C327 10u (2012) (10V,Z,Y5V)
(50V,J,NP0)
L300 270nH 1608
21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
FOR RADIO
2 : AUDIO 4 : EAR_L 5 : EAR_R 6 : TXD 7 : RXD 8 : JACK_D 9,10 : BATT 11 : R/ON 12,13 : CHG
20 22
HSEJ-18S04-25R VBAT
BATT_TEMP
R332
C336 3p
0
3 2 1 CN302
C337 18p (50V,J,NP0)
(50V,C,NP0) (TOL:0.25P)
Figure 3-10-5 Headset interface
- 36 -
C322 10p
3. TECHNICAL BRIEF
3.11 Key LED Interface
KEY_BACKLIGHT
R222
1K
1u C223
R221 100ohm LD205 LEBB-S14H
R220 100ohm LD204 LEBB-S14H
R219 100ohm LD203 LEBB-S14H
R218 100ohm LD202 LEBB-S14H
R217 100ohm LD201 LEBB-S14H
R216 100ohm
1u C222 (10V,K,X5R)
VBAT
LD200 LEBB-S14H
KEY BACKLIGHT
(10V,K,X5R)
2SC5585 Q200 R223 10K
Figure 3-11 Key LED interface This handset has 6 LEDs that illuminates blue color. Control signal is controlled by EGold-voice with PWM and handset has 3 methods, ON, OFF and Dimming.
- 37 -
3. TECHNICAL BRIEF
3.12 Vibrator Interface
VIBRATOR VBAT
C302 27p (50V,J,NP0)
CN300 1
D300
1SS302-T5L_F_H
VBAT
2 C305 R305 27p 10
R306
(1608)
Q300 2SC5585
VIBRATOR 100K
R308
1K
Figure 3-12 Vibrator interface This handset has vibrator operation. Control signal is controlled by EGold-voice with PWM.
- 38 -
3. TECHNICAL BRIEF
3.13 Memory Interface VBAT
(NOT MOUNTED)
2V8_VMEM_S
U300
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
C300 NA
MEMORY
C301 NA U301 G2 E3 H3 F4 F5 H6 E6 G7 H2 F3 G3 H4 G6 F6 H7 F7
DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15
G4 R310
0
G5
2V8_VMEM_S
VCCF VCCS
2V8_VMEM 2V8_VMEM
R311
NA
R315
NA
2V8_VIO
C316 0.1u
_OE _WE _LB _UB _CE1F _CE1S CE2S RY__BY WP_ACC _RSTF
G8 VSS1 E2 VSS2 C8 D8 E7 F8 H5
RFU0 RFU1 RFU2 RFU3 RFU4
_OE _WR ADD00 BHE_N CS0n CS1n
0
TP300 F2 A5 A3 B3 F1 G1 B5 C4 A4 B4
R314
C315 0.1u
ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21
R313 100K
2V8_VMEM
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
S71GL032A40BAW0F E1 A0 D1 A1 C1 A2 B1 A3 D2 A4 C2 A5 B2 A6 A2 A7 A6 A8 C6 A9 D6 A10 A7 A11 B7 A12 C7 A13 D7 A14 B8 A15 E8 A16 D3 A17 C3 A18 B6 A19 C5 A20
R312 100K
1 2 3
_RY_BY
Figure 3-13 Memory interface
In E-GOLDvoice, the 16bits demultiplex X-bus interface is used for memory device support. NOR Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be supported for flash memories. Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus interface. Up to 3 external CS signals can be generated to save external glue logic. Access to very slow memories is supported via a special ‘Ready’ function. The system MCU clock is set to run with 26Mhz.
- 39 -
3. TECHNICAL BRIEF
1V5_VRF0
2V85_VSIM
2V8_VIO
VRF1
1u
1u C109
1u
1u C108
C110
1u
C106
C112 22K
220n
R101
C114
VBAT
VBAT_4 H14 VBAT_3 H15 VBAT_2 F12 VBAT_1 H13
J13 K15 F15 B11 K10 M11 J10 G12 K12
G13 G15 G14 J12 J14 IREF VREFP AGND W_LED_FBN W_LED_FBP
VSS9 VSS8 VSS6 VSS5 VSS4 VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
6.8K
C111 1u
BAT100
C113 1u
VDD_LBUF VDD_LANA VDD_LRF2V5 VDD_LRF1V5 VDD_LMEM VDD_LSIM VDD_LIO VDD_LD1 VDD_LRTC
2V0_VRTC 2V8_VIO 2V8_VMEM
L102 18nH
M8 F10 K7 K8 J8 B9 B8 R7 R6 F6 L4 G10 J7 G9
2V85_VSIM
R100
C107
2V0_VRTC 1u
2V5_VANA
VD1
(1608)
C101
2.2u
VD1
3V2_VBUF
2V8_VMEM
3.14 Power Block Interface
C115 (1608) 2.2u REXT
D12
(16V,K,X5R)
A9 XOX A8 XO
Figure 3-14-1 Power Block interface
The E-GOLDvoice integrated power management unit (PMU) supports direct connection to battery (DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage regulators. The input of these linear voltage regulators is the battery voltage. The external memory and SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal generated supply voltages. The integrated power management also provides the control state machine for system start up, including start up with discharged batteries, trickle charging and system reset control. After system start up several methods are implemented for active and idle power saving.
- 40 -
3. TECHNICAL BRIEF
Name
Output Voltage(V) Output Current (mA)
Comment
LRTC
2.0
4
Used for the real time and digital PMU supply
LD1
1.2/1.5
150
Used for the core supplies (MCU and DSP via switch)
LIO
1.8/2.85
30
Used for the I/O pad supply and, for example, the display
LRFXO
2.5
10
Used for the crystal oscillator supply
LMEM
2.5
100
Used for the external memory supply, voltage can be configured during startup
LANA
2.5
100
Used for analog (audio and baseband processing) and headset driver
LSIM
1.8/2.85
30
Used of the SIM card supply
LBUF
2.6/2.8/3.0/3.2
300
Used for the loudspeaker and earpiece driver
LRFRX
2.5
100
Used for the RF RX part
LRFTRX
1.5
120
Used for the RF TX/TX part
Figure 3-14-2 EGold Voice PMU LDO output voltage selection • LD1, LIO, LSIM, LBUF output voltage programmable by software. • LMEM output voltage is selectable by pin configuration upon startup. Active and idle power saving options: • The flexible clock switching options allow minimizing the power consumption during the operation phases of the E-GOLDvoice. • Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is switched off and the controller RAM is switched to a power saving mode. Start-up and Reset Control State Machine Features • Power up upon battery insertion, push button, alarm, charger connection. • Detection of battery exchange or re-insertion. • Complete start-up sequence management. • System turn-on, system turn-off operation management including emergency (under-voltage) and programmed shutdown functions. • Internal reset of the baseband, including silent reset. • Tri-state function of the baseband module. • Standby mode controlled by VCXO_EN provided by SCCU module.
- 41 -
27K
2.7K
NO RADIO
RADIO_DETECT
RADIO
R339 27K
RADIO_DETECT
RADIO_EN
0
NA
C334
R343 100K
1 2 3
(10V,K,X5R)
C341 1u
VBAT
1 2 3 4 5
U302 SI4702-B16
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
C342 1u
2V8_RADIO
R334 10K
NC1 FMIP RFGND GND1 _RST
2V8_RADIO
U304
FM_RST
FM_SCL FM_SDA
FM_RST
C331 100p
NA
FM_INT RADIO_AMP_SHDN TP301 FM_INT
_SEN SCLK SDIO RCLK VIO 6 7 8 9 10
R325
4.7K
FM_ANT
R328
R336
RADIO_AMP_SHDN (FOR FM RADIO)
PGND NC2 GPIO1 GPIO2 GPIO3 VA
21 20 19 18 17 16 4.7K
15 14 13 12 11
47
R338
FM_32K
0.1u 0.1u
EPPA1
FOR RADIO
AUXOP_FMR
RADIO_SPK_R
C335 22n
C332 C333
C329 1u 2V8_RADIO
2V8_RADIO
2V8_RADIO
GND3 LOUT ROUT GND2 VD
0.1u
2V8_VIO
R337
- 42 C339
RADIO
20K 20K
R342 NA
C340 0.1u
2
5
4
3
C338 0.1u
NC1
IN1
COM1
NO1
VCC
GND
NC2
IN2
COM2
NO2
6
7
8
9
10
U305 NLAS5223BMNR2G
R335 100K
1
2V8_VIO
RADIO_AMP_SHDN
R329 R330
C330 1u
2V8_RADIO
VIN2
VIN1
VDD
VOUT2
VOUT1
U303 LM4809LD
39K
R345 100K
NA
R340
R333
R327
R331
AUXOP_FML
RADIO_SPK_L
3 9
6
8
HEADSET_RADIO_SEL
FOR RADIO
39K
2 BYPASS GND 4 _SHDN BGND
5
1
7
R326
0
0
240K
R344
330K
R341
2V8_VIO
EPPA1
RADIO_SPK_R
RADIO_SPK_L
3. TECHNICAL BRIEF
3.15 FM Radio Interface
3. TECHNICAL BRIEF
3.15.1 FM Tunner The Si4702 patented digital low-IF architecture reduces external components and eliminates the need for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers. For two-wire operation, a transfer begins with the START condition. The control word is latched internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address by setting SDIO low on the next falling SCLK edge. For write operations, the device acknowledge Is followed by an eight bit data word latched internally on rising edges of SCLK. The device always acknowledges the data by setting SDIO low on the next falling SCLK edge. An internal address counter automatically increments to allow continuous data byte writes, starting with the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous writes cease. Data transfer ceases with the STOP command. After every STOP Command, The internal address counter is reset. For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling SCLK edges. An internal address counter automatically increments to allow continuous data byte reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous reads cease. After each byte of data is read, the controller IC should return an acknowledge if an additional byte of data will be requested. Data transfer ceases with the STOP command. After every STOP command, the internal address counter is reset.
3.15.2 Headphone Amplifier The MAX4411 fixed-gain, stereo headphone driver features Maxim’s patented DirectDrive architecture, eliminating the large output-coupling capacitors required By conventional single-supply headphone drivers. The device consists of two 80mW Class AB headphone drivers, internal feedback network (fixed -1.5V/V gain), undervoltage lockout (UVLO)/shutdown control, charge pump, and comprehensive click-and-pop suppression circuitry.
- 43 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING 4.1 RF Trouble
SW400
FL400
FL401
U400
U102 X101
REFERENCE
PART Description
U400
PAM (Power Amp. Module)
X101
DCXO (26MHz)
FL400
ASM (Antenna Switch Module)
SW400
Mobile Switch
FL401
RX SAW Filter
- 44 -
4. TROUBLE SHOOTING
RF Trouble TEST POINT
Antenna Matching component
Antenna.Contact Point
SW400
TP400
TP401
TP402
TP403
TP404
TP405
CIRCUIT DIAGRAM R400 NA R401
L400
Antenna Matching component
0
R403
L401
Coupling Capacitor
- 45 -
G2
RF
G1
ANT
SW400 RF500
Mobile SW
1p
2.2nH
C400
0
C410 22p
22nH
4. TROUBLE SHOOTING
CHECKING FLOW
START
NG
Check Antenna PAD& Intenna Contact
Change Antenna
NG
Check Matching component
Resolder component
OK NG Check Mobile SW
Change SW400
OK
Download And Calibration
NG
Change PCB
- 46 -
4. TROUBLE SHOOTING
RX Trouble TEST POINT
CHECKING FLOW
START
Setup Test Equipment Cell Power :-74d Bm GSM850 CH190 PCS CH660
SW400
FL400
Check point. DCXO(X101)
FL401
U400
Check point mobile SW & ASM & SAW Filter(SW400,F L400,FL401) U102 X101
Re-Download S/W & CAL
- 47 -
4. TROUBLE SHOOTING
RX Trouble (1) Checking VCTCXO Circuit TEST POINT
CHECKING FLOW
Is the waveform of Pin3 similar to DCXO(X101) Waveform? SW400
Yes
FL400
DCXO Circuit is OK. See next page to check PLL Circuit.
FL401
U400
U102 X101
CIRCUIT
Waveform
4
HOT1 1
GND2
Pin 2
X101 NX3225SA 3 HOT2
2 GND1
26MHz
Waveform
( NX3225SA(W-188-34-7)
Pin 1
2V8_VIO
R107 NA
- 48 -
No
Replace X101
4. TROUBLE SHOOTING
RX Trouble
TEST POINT
CHECKING FLOW
Check Pin 1, 2 of SW400 with RF Cable
SW400
Signal is OK ?
Replace Mobile SW (SW400)
Yes
FL400
Pin 6
Pin 4
N o
Check Pin 4,6 of FL400 ?
FL401
N o
Replace ASM (FL400)
U400
Yes
Check Pin 6,7 and 8,9 of FL401 ? U102
N o
Replace SAW Filter (FL401)
Yes
Mobile SW & ASM is OK. See next page
* FL401 6,7 and 8,9 output are balanced
- 49 -
4. TROUBLE SHOOTING
4.2 TX Trouble TEST POINT
CHECKING FLOW Setup Test Equipment Cell Power : - 74dBm GSM850 CH190 PCS CH661
Check point DCXO(X101)
SW400
FL400
Check point ULC2(U102)Outp ut Signal
FL401
U400
Check point PAM(U400) Control Signal
Check ASM & Mobile S/W & SAW (FL400,SW400 ,FL401)
U102 X101
Re-Download S/W & RF CAL
- 50 -
4. TROUBLE SHOOTING
TX Trouble CIRCUIT
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
(50V,J,NP0)
VBAT
(16V,K,X7R)
U400
C401 39p
R402
1K
TX_RAMP
TEST POINT
VBAT R404
R405 DCS_PCS_OUT
0
0
VAPC
LB RF Input
15 R406
11
0 C411 NA
19
C412 NA
EGSM_OUT
2
DCS_PCS_IN
U400 SKY77318
RSVD_GND
EGSM_IN
(50V,J,NP0) (16V,K,X7R) R407
4
GSM_OUT 0
ENABLE
P_GND
BS
18
TXON_PA
1
R408 NA
R409 NA
BS C413 27p
C414 27p
16 14 13 12 10 9 8 7 5
R410 0
HB RF Input
DCS_PCS_OUT
C408 0.01u C409 NA
3
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1
21
C407 27p 6
C406 18p
VCC1A
C405 33p
(2012)
VCC1B
C402 10u
20
C404 0.01u
VBATT
C403 12p
17
L402 NA
C416 NA
C415 NA
U102
Waveform
CHECKING FLOW Check Control Signals
Signals are Normal ?
Yes
Paon & BS
ASM
PAM Control Signal is OK. See next page to check ASM & Mobile SW Circuit.
Vapc
- 51 -
N o
Check ULC2(U102)
4. TROUBLE SHOOTING
TX Trouble TEST POINT
CIRCUIT TP400
TP401
TP402
TP403
TP404
TP405
R400 NA R401
C400
0
1p
L400
2.2nH
SW400
L401
SW400 RF500
FL401
G2
RF
G1
ANT
U400
0
R403
FL400
22nH
C410 22p
U102 X101 FL400 9 3 7
VC1 VC2 C417 27p
LMSP2PAA-575TEMP
1 GSM1800_1900TX 6 GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX IN
5 2 GND1 GSM850_900TX 8 4 GND2 GSM850_900RX 10 GND3
C418 27p
Mode
GSM900 TX
DCS1800 TX
GSM800 RX
DCS1800 RX
VC1
H(2.7V)
L
L
L
VC2
L
H(2.7V)
L
L
- 52 -
4. TROUBLE SHOOTING
RX Trouble TEST POINT
CHECKING FLOW Check Pin 1, 2 of SW400 with RF Cable
Signal is OK ?
SW400
No
Replace Mobile SW (SW400)
No
Check ULC2 (U102)
No
Replace ASM (FL400)
Yes
FL400
Pin 1
Pin 7
Pin 2
FL401
U400
Pin 3
Check Pin 1,2
Yes
Control Signal is OK ? Yes
U102 Pin 3,7 Signal is normal ? Yes
Mobile SW & ASM is OK. Check Antenna.
- 53 -
4. TROUBLE SHOOTING
4.3 Power On Trouble TEST POINT Check Points C107
-Battery Voltage( Need to over 3.35V)
C111
-Power-On Key detection (PWRON signal)
C101
-Outputs of LDOs from EGV LDO
VOLTAGE
PART
V_BUF
3.2V
C101
V_MEM
2.8V
C109
V_IO
2.8V
C107
V_SIM
2.85V
C108
VRF0
1.5V
C110
V_ANA
2.5V
C113
C109 C110
EGV IC
C106
26Mhz
1V5_VRF0
VRF1
1u
1u C109
1u
1u C108
C110
1u
C106
C112
- 54 -
VBAT_4 H14 VBAT_3 H15 VBAT_2 F12 VBAT_1 H13
22K
220n
R101
C114 G13 G15 G14 J12 J14
J13 K15 F15 B11 K10 M11 J10 G12 K12
VBAT
IREF VREFP AGND W_LED_FBN W_LED_FBP
VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
6.8K
C111 1u
BAT100
C113 1u
VDD_LBUF VDD_LANA VDD_LRF2V5 VDD_LRF1V5 VDD_LMEM VDD_LSIM VDD_LIO VDD_LD1 VDD_LRTC
2V0_VRTC 2V8_VIO 2V8_VMEM
L102 18nH
B9 B8 R7 R6 F6 L4 G10 J7 G9
2V85_VSIM
R100
C107
2V0_VRTC 1u
2V5_VANA
VD1
(1608)
C101
2.2u
VD1
3V2_VBUF
2V8_VMEM
2V8_VIO
2V85_VSIM
CIRCUIT
C115 (1608) 2.2u REXT
D12
A9 XOX A8 XO
(16V,K,X5R)
4. TROUBLE SHOOTING
Power On Trouble CHECKING FLOW
START
Check Battery Voltage > 3.35V
NO Charge or Change Battery
YES
Push power-on key And check the level change of PWRKEY
NO
Check the contact of power key Or dome-switch
YES
Check the voltage of The LDO outputs at U102
NO Replace U102
YES
THE PHONE WILL POWER ON.
- 55 -
LDO
VOLTAGE
PART
V_BUF
3.2V
C101
V_MEM
2.8V
C109
V_IO
2.8V
C107
V_SIM
2.85V
C108
VRF0
1.5V
C110
V_ANA
2.5V
C113
4. TROUBLE SHOOTING
4.4. SIM Card Trouble TEST POINT
R302/C310
J300.PIN1 C331/C332
CIRCUIT DIAGRAM 2V85_VSIM
0
2V85_VSIM
SIM_DATA
R303
R302
4.7K
2V85_VSIM
J300 4 GND VCC 5 VPP RST 6 CLK I_O 8 GND2 GND1
1 2 3 7
SIM_RST SIM_CLK C311 0.1u
C310 22p
- 56 -
C312 22p
4. TROUBLE SHOOTING
Checking Flow
START
NO Change the SIM Card. Our phone supports only 3V SIM card.
Does the SIM cards supports 3V ?
YES
R302/C310/ C311/C312
Check soldering status of J300 and Other component
NG Resolder J300 or other component
OK
J300.PIN1 = 2.85V
NG Check J300.PIN1
OK
Re-download SW
Check Operation
OK
Change board
- 57 -
Change board
4. TROUBLE SHOOTING
4.5. Vibrator Trouble TEST POINT
Q300.PIN3 R306
R308 R305
CIRCUIT DIAGRAM VBAT
C302 27p (50V,J,NP0)
CN300 1
D300
1SS302-T5L_F_H
VBAT
2 C305 R305 27p 10
R306
Q300 2SC5585
VIBRATOR 100K
R308
1K
- 58 -
(1608)
4. TROUBLE SHOOTING
Checking Flow
START
Enter the engineering mode, and set vibrator on.
R306=2.8V R308=0.7V
Check Voltage Level of R306/R308
NG Change PCB
OK
Q300.PIN3=0V R305=0V
Check Voltage Level of Q300.PIN3 and R305
OK
Replace Vibrator
- 59 -
NG Change Q300
4. TROUBLE SHOOTING
4.6. Keypad Trouble TEST POINT
R215 R201
R214
R211
R212 R203
R209 R204
R213
CIRCUIT DIAGRAM 2V0_VRTC
KEY MATRIX END SW200 END_KEY
1
SW201
2
SW202
3
SW203
SW204
LEFT
SW205
MENU
R201 KEY_OUT1 680 C205 NA
SW206
4
SW207
7
SW212
5
SW208
8
SW213
6
SW209
9
SW214
UP
SW210
SEL
R203 KEY_OUT2 680 C206 NA
SW211
RIGHT
SW215
SEND
R204 KEY_OUT3 680 C207 NA
SW216
*
SW2170
SW218
#
SW219
DOWN
R209 KEY_OUT4 680 C215 NA
C216 NA
C217 NA
R211 680 KEY_IN0 R212 680 KEY_IN1 R213 680 KEY_IN2 R214 680 KEY_IN3 R215 680 KEY_IN4
- 60 -
C218 NA
C219 NA
C220 NA
4. TROUBLE SHOOTING
Checking Flow
START
NG Check Metal Doom
Change Metal Doom
OK
R201/R203/R204 R209/R211/R212 R213/R214/R215
Check soldering status Of component
OK Change PCB
- 61 -
NG Resolder component
4. TROUBLE SHOOTING
4.7 RTC Trouble CIRCUIT Check Points - 32.768KHz is right clock - The power of RTC is right.
N7 SWITCH_ON P6 OSC32K R5 F32K B4 CLKOUT
PWRON 32KOUT 32KIN CHG_STATUS
X100 2
1u
1
BAT100
22K R101
18p C105
C114 G13 G15 G14 J12 J14 IREF VREFP AGND W_LED_FBN W_LED_FBP
VDD_LD1 G12 VDD_LRTC K12
18p C104
32.768KHz
220n
MC-146_12_5PF
- 62 -
6.8K
VBAT_4 H14 VBAT_3 H15 VBAT_2 F12 VBAT_1 H13
32KOUT
3
C112
32KIN
R100
4
4. TROUBLE SHOOTING
CHECKING FLOW
START
Is the frequency about 32Khz?
Replace X100 and try again.
YES
Is VRTC about 2.0V?
Replace BAT100
YES
RTC will work properly
- 63 -
4. TROUBLE SHOOTING
4.8. Key backlight Trouble TEST POINT
D203
D200
Q200.PIN3 R204 D20 4
D201
R203
Q200.PIN2 D205
D202
CIRCUIT DIAGRAM
KEY_BACKLIGHT
R222
1K
2SC5585 Q200 R223 10K
- 64 -
1u C223
R221 100ohm LD205 LEBB-S14H
R220 100ohm LD204 LEBB-S14H
R219 100ohm LD203 LEBB-S14H
R218 100ohm LD202 LEBB-S14H
R217 100ohm LD201 LEBB-S14H
R216 100ohm
1u C222 (10V,K,X5R)
VBAT
LD200 LEBB-S14H
KEY BACKLIGHT
(10V,K,X5R)
4. TROUBLE SHOOTING
Checking Flow
START
R222=2.8V
Check Voltage Level Of R222
NO
Change PCB
Replace component YES NG
R222=0.7V
Check Voltage Level Of R222 and Q200.PIN2
NO Check component R222 and Q200
YES
LD200~LD205 R216~R221
Check LED component
YES
Change PCB
- 65 -
NO
Replace component
4. TROUBLE SHOOTING
4.9. LCD Trouble TEST POINT CN200
R207R205
R206R208
C221
CIRCUIT DIAGRAM 2V8_VIO CN200 1 2 MTPG
LCD_RESET SSC0_CLK
R205 R207
5
47
7
MLED2 C208 NA
4
47
MLED
C209 27p
C210 27p
MTPD
3
6
R206
47
8
R208
47
CS3 SSC0_MTSR
9 10
MLED1
11 13
R210 100K
12 14 15
IMSA-9671S-13Y902 (ENQY0013801)
- 66 -
LCD_ID C221 1u
C211 27p
C212 27p
C213 NA
C214 NA
4. TROUBLE SHOOTING
Checking Flow
START
NO Backlight is OK?
Change PCB
YES
Check Operation After LCD changes
OK
Change LCD
NG C221=2.8V Control Signal= Refer to next page
Check Control Signal and Power Including soldering status
NG
Replace component Or change PCB
OK
Check soldering status of CN200
OK
Change PCB
- 67 -
NG
Replace CN200
4. TROUBLE SHOOTING
WAVEFORM
SS0_SCK
LCD_CS
]SS0_MTSR pattern is out randomly when clock is fluctiatied. , clock frequency is 13MHz and LCD_RESET is High(2.8V).
- 68 -
4. TROUBLE SHOOTING
4.10. Microphone Trouble TEST POINT
Microphone component
R300
MIC.P
CIRCUIT DIAGRAM VMIC
MAIN_MIC R300 1K
R301
C303 39p
2.2K
R304 VINNORP
C306
C304 10u
0.1u OB4-15L42-C33L
100ohm C308
C307 0.1u
39p R307
C309
0.1u
MIC300
VINNORN 39p C314
2.2K
39p
R309
C313
100ohm
- 69 -
2 1
4. TROUBLE SHOOTING
Checking Flow
Make a call
R300.VMIC=2.5V
NO
Check voltage level of R300
Replace PCB
YES
NG
Check component status around MIC
Re-solder or replace the Component
OK
Check status of MIC
NG
Re-solder or replace Microphone
OK
Check the voltage Level of MIC_P MIC_P= about 1.2~1.5V DC with a few tens mV OK
Replace PCB
- 70 -
NG Change Microphone
4. TROUBLE SHOOTING
4.11. Receiver Trouble TEST POINT
L101 C103
L100 C102
REC.N
REC.P
CIRCUIT DIAGRAM
RECEIVER L100
22nH
L101
22nH
REC_P C100 39p
CN100 1 2
11*07*3T receiver
REC_N
(SURY0013001) C102 39p
- 71 -
C103 39p
4. TROUBLE SHOOTING
Checking Flow
Press any Key
Check L100/L101 C102/103
Check component status
NG
Re-solder or replace the Component
YES
L100&L101 bias will Fluctiate signal above 1.2V
Check L100 & L101
NG
Re-solder or replace the Component
OK
Check Receiver
OK
Replace PCB
- 72 -
NG
replace Receiver
4. TROUBLE SHOOTING
4.12 Speaker Trouble TEST POINT Check Points - Speaker spring contact - Audio amp soldering
L103
L104
CN101íS 1PIN
CN101íS 2PIN
C120
CN200 AMP IC
C117
R111
C118
CIRCUIT
SPEAKER
SPEAKER AMPLIFIER R102 C116
R103
NA
VBAT
82K
NA
C118
0.1u
R105
U100 A3
20K SPK_P
A1 C3
R106 20K
100K
R110
0.22u
LOUD_SPK_EN
82K
0.1u
C1
INM
OUTA
_SD
VM
BYPASS
VP
L103
27nH CN101 1
L104
27nH 2
A2 B2
16pi 3.4T speaker
(SUSY0025801)
B3
C120 1 uF (2012)
C121
C119
R108
20K RADIO_SPK_L
NCP2890AFCT2G C2 OUTB
INP
(10V,K)
Gain : Rf/Rin
- 73 -
D100
C122 C123 0.1u 0.1u
diode
R104
diode
0.1u
VM_P
C117
B1
SPK_N
D101
4. TROUBLE SHOOTING
Checking Flow
Start
Check the voltage level of U100 = Vbat?
No
Check The battery
Yes
Check the Signal, C117,C118
No
Check U102
Yes
Check the Level of U100.C3 = Low ?
No
Check U102
Yes
Check the Signal, L102,L103
No
Re-solder L102,L103
No
Re-Assemble or Re-place Speaker
Yes
Check the Contact Of CN101
Yes Try again or Change the Board
- 74 -
4. TROUBLE SHOOTING
4.13 Headphone Trouble TEST POINT Check Points -18pin IO connector -Passive Parts slodering Status
C321
CN301
C322 FB300 FB302 FB301
CIRCUIT DIAGRAM
1.5K
R316
VMIC
C317
R318
AUXIN C318 NA
C320
0.1u
C321
2V8_VIO
39p
AUXIP
EAR_MIC I/O CONNECTOR
2.2K C319 10u
0.1u
R321
100K
VCHARGE
FOR RADIO FB300
1800
FB301 FB302
10u 10u
1800 1800
HS_DET 2V8_VIO
39p
39p
RPWRON R324 100K
C326
C323 C324
C325
NA
R323 100K
R322
CN301
2V8_VIO
2V8_VIO
AUXOP_FML AUXOP_FMR TXD RXD
FM_ANT VBAT
DSR C328 56p
C327 10u (2012) (10V,Z,Y5V)
(50V,J,NP0)
L300 270nH 1608
21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
FOR RADIO
2 : AUDIO 4 : EAR_L 5 : EAR_R 6 : TXD 7 : RXD 8 : JACK_D 9,10 : BATT 11 : R/ON 12,13 : CHG
20 22
HSEJ-18S04-25R VBAT
BATT_TEMP
R332
C336 3p
0
3 2 1 CN302
C337 18p (50V,J,NP0)
(50V,C,NP0) (TOL:0.25P)
- 75 -
C322 10p
4. TROUBLE SHOOTING
CHECKING FLOW
START
Does the audio profile of the phone change to the earphone mode?
No
No
Re-solder CN301 or Change another Ear- Mic set and Try again
Check the voltage Level CN301.8 = Low?
Yes
Replace U100 or Change Board
Yes
Mic
Earphone
Go to MIC Trouble section Acoustic
Check the signal Level at AUX_MIC. Is it about 1.2~1.5V DC with a few tens mV AC?
No
Re-solder causal component (CN301)
Does waveform at U102.EPPA1 fluctuate?
Yes
No
Replace U100 or Change the board
Yes
Change another Ear-Mic set and Try again
Does waveform at CN301.4 and CN301.5 fluctuate?
No
Re-solder causal component (CN302,C322 etc.)
Change another Ear-Mic set and Try again
- 76 -
4. TROUBLE SHOOTING
4.14 Charging Trouble TEST POINT
R124
Check Points -Connection of TA (check TA voltage 5.2V) -Charging Current Path component voltage drop -Battery voltage -Charging IC
Charger IC U101
VBAT
VCHARGE =5.2V
C126
C125
CN301
CIRCUIT
CHARGING IC 2V8_VIO
VBAT VCHARGE
VCHARGE R118 NA R119
1.8K
U101 1
CHARGE_DETECT
2 R121 CHG_STATUS NA C126 (10V,K,X5R) 1u C127 0.015u
VIN
VBAT
_FAULT
VSEN_TEMP
10 C125 1u
9
R120 NA
(10V,K,X5R) 3 4
_STATUS
IREF
TIME
V2P8
5 GND 11 PGND
EN
8 R122
CHG_EN_TEST R123
6
NA CHG_EN
C128
R124
R125
1u
160K
100K
ISL9201IRZ-T (1%)
- 77 -
0
7
4. TROUBLE SHOOTING
Checking Flow
START
I/O Connector(CN301) Is well-soldered ?
NO
Resolder the CN300 Pin 12,13 : VCHARGE
YES
Is The Voltage of C126 5.2V ?
NO
The TA is out of order Change the TA
YES LOW
The Voltage of C128 Is 2.8V
Replace the U101
YES
Check the voltage of R124 High or Low?
NO Check the U102
YES
Battery is charged?
NO
YES
Charging is properly operating
- 78 -
The battery may have problems. Change the battery.
4. TROUBLE SHOOTING
4.15. FM Radio Trouble TEST POINT
R332 R338/R337/R336 U304.P 1
U304.P4 R327 R331
U302 U303
R329/R330 C332/C333
- 79 -
27K
2.7K
RADIO
RADIO_DETECT
NO RADIO
R339 27K
RADIO_DETECT
0
RADIO_EN
R328
NA
C334
R343 100K
1 2 3
(10V,K,X5R)
C341 1u
VBAT
1 2 3 4 5
U302 SI4702-B16
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
C342 1u
2V8_RADIO
R334 10K
NC1 FMIP RFGND GND1 _RST
2V8_RADIO
U304
FM_RST
FM_SCL FM_SDA
FM_RST
C331 100p
NA
FM_INT RADIO_AMP_SHDN TP301 FM_INT
_SEN SCLK SDIO RCLK VIO 6 7 8 9 10
R325
4.7K
FM_ANT
R336
RADIO_AMP_SHDN (FOR FM RADIO)
PGND NC2 GPIO1 GPIO2 GPIO3 VA
21 20 19 18 17 16 4.7K
15 14 13 12 11
47
R338
FM_32K
0.1u 0.1u
EPPA1
FOR RADIO
AUXOP_FMR
RADIO_SPK_R
C335 22n
C332 C333
C329 1u 2V8_RADIO
2V8_RADIO
2V8_RADIO
GND3 LOUT ROUT GND2 VD
0.1u
2V8_VIO
R337
- 80 C339
RADIO
20K 20K
R342 NA
C340 0.1u
2
5
4
3
C338 0.1u
NC1
IN1
COM1
NO1
VCC
GND
NC2
IN2
COM2
NO2
6
7
8
9
10
U305 NLAS5223BMNR2G
R335 100K
1
2V8_VIO
RADIO_AMP_SHDN
R329 R330
C330 1u
2V8_RADIO
VIN2
VIN1
VDD
VOUT2
VOUT1
U303 LM4809LD
39K
R345 100K
NA
R340
R333
R331
R327
AUXOP_FML
RADIO_SPK_L
3 9
6
8
HEADSET_RADIO_SEL
FOR RADIO
39K
2 BYPASS GND 4 _SHDN BGND
5
1
7
R326
0
0
240K
R344
330K
R341
2V8_VIO
EPPA1
RADIO_SPK_R
RADIO_SPK_L
4. TROUBLE SHOOTING
CIRCUIT DIAGRAM
4. TROUBLE SHOOTING
Checking Flow
Connector Headset and Turn on Radio and tuned channel
U304.PIN1 = High U304.PIN4=2.8V
Check LDO Power
NO Change U304
YES
R336/R337/338 Check I2C signal and 32K clock
Check Control Signal
NG Change PCB
OK
R329/R330 C332/C333
Check Audio Output Of Transceiver
NG
Change U302
OK
R327/R331
Check Audio Output Of Amplifier
OK
Change PCB
- 81 -
NG Change U303
5. DOWNLOAD
5. DOWNLOAD 5.1 Download Setup Configure system like figure 5-1.
Figure 9-1. Download Setup
- 82 -
5. DOWNLOAD
5.2 Download Process 5.2.1. Download step[1]
: Start or Stop download : Selected configuration DLL file : File name donwloading File(F) → Exit(X) : End program Setting(S) → Configuration : configuration download condition DLL, SW files and etc. About(H) → MultiGSM : Provide version information First, select Setting Menu.
- 83 -
5. DOWNLOAD
5.2.2. Download step[2]
: Select a appropriated DLL file - You must select KG270_xxxxxx.DLL file. : Select configuration file You must select cmd.m0 file : Select download speed You must 460800. System supports maximum 460800bps. : Select port select start and end port be operated
- 84 -
5. DOWNLOAD
5.2.3. Download step[3]
: Select files downloaded KG270 have 4 files, *.eep, *.fls, *.dffs and *.cust. But You must not select *.eep file.
- 85 -
5. DOWNLOAD
5.2.4. Download step[4]
: Start download and stop download next step. If configuration is finished, then push start button and then button is changed to STOP. Turn on power of multi download and connector phones. If download is started, then push start button else program will download repeatedly.
- 86 -
5. DOWNLOAD
5.2.5. Download step[5]
: This region appears donwload status. If download is finished, PASS or FAIL.message is showed.
- 87 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
- 88 -
7. CIRCUIT DIAGRAM
1
2
3
5
4
7
6
8
9
10
12
11
13
14
15
16
A
A
RECEIVER
1u
G3
2V0_VRTC TDO TDI TMS TCK TRSTn TRIG_OUT TRIG_IN CHG_EN
R115 100K
VBAT
UART PORT
GND RX TX NC1
ON_SW ON_SW
D
VBAT VBAT NC2 PWR URXD NC3 NC4 UTXD DSR RTS CTS
1 2 3 4 5 6 7 8 9 10 11 12
C2 D5 F4 E4 D4 G4 D2 H4 C1 F1 F2
ADD00 ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10
RXD TXD RPWRON
1V5_VRF0 1u
1u C109
C110
1u
C112
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
4
A3
20K 0.1u
C118
A1
R105 C3
20K 0.1u
R106 20K
LOUD_SPK_EN
68K
AUXIP AUXIN VINNORP VINNORN EPPA1 REC_P REC_N
B2 B1 B3 A2 A4 A3 P5 M7 N7 P6 R5 B4
R116
1.8K
F
U101 1
VIN
2 R121 CHG_STATUS NA C126
_FAULT
4
1u C127 0.015u
BHE_N _WR
VBAT VSEN_TEMP
10 C125 1u
9
R120 NA
(10V,K,X5R) 3
(10V,K,X5R)
_STATUS
IREF
TIME
V2P8
5 GND 11 PGND
EN
8 R122
0
R123
NA
CHG_EN_TEST
7 6
C
CHG_EN C128
R124
R125
1u
160K
100K
ISL9201IRZ-T
CS3 CS1n CS0n
(1%)
ADD21 ADD20 ADD19 ADD18 ADD17 ADD16 ADD15 ADD14 ADD13 ADD12 ADD11
D
VRF2 E_FUSE
1u
0.1u
47n C130
E
C133 GND1
E
VBAT VCHARGE R118 NA
R119
Date 11/16
Designer VBAT2
D101
VD1
VBAT
VBAT1
C122 C123 0.1u 0.1u
2V8_VIO
Section VBAT
D100
(10V,K)
VCHARGE
_OE
CS100
C120
0
CHARGE_DETECT
BHE_N _WR
16pi 3.4T speaker
(SUSY0025801)
CHARGING IC
BS FM_32K (FOR FM RADIO) VC2 VC1 TXON_PA
N5 M6 E3 E2 R3 M5 K3 P4 G1 E1 H1 D1 F3 L3 K4 J4 H3 J3 H2 G2
B2
C124 1000p
PWRON 32KOUT 32KIN CHG_STATUS
B7 A5 A6 B6 A7
D
Gain : Rf/Rin
HEADSET_RADIO_SEL (FOR FM RADIO) VIBRATOR KEY_BACKLIGHT W_LED_DRV RADIO_EN (FOR FM RADIO) (FOR FM RADIO) FM_RST _RESET
27nH
B3
C121
R112 47K
VP
27nH CN101 1
L104
2
1 uF
VMIC
SPK_N SPK_P
P12 P11 R12 P15 R13 M14 M12 N15
VM
BYPASS
L103
A2
(2012)
R110
R111 100K
100K
BATT_TEMP TX_RAMP
_SD
R109 LCD_ID
P13
C1
82K
C119
OUTA
B1
(FOR FM RADIO)
RADIO_SPK_L
INM
0.22u
RADIO_DETECT
R107 NA
NCP2890AFCT2G C2 OUTB
INP
diode
U100
R104
diode
0.1u
VM_P
HOT1 1
26MHz
GND2 3 HOT2
2 GND1
C117
VRF1
C129
E
OE_N ADV_N BHE_N WR_N RD_N CS3_N CS1_N CS0_N A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
SPK_N
2V8_VIO
R108
VBAT_4 H14 VBAT_3 H15 VBAT_2 F12 VBAT_1 H13
T_OUT8 T_OUT4 T_OUT3 T_OUT2 T_OUT0
CHARGE_DETECT
35 34 33 32 31 30 29 28
J13 K15 F15 B11 K10 M11 J10 G12 K12
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15
SC100
27 26 25 24 23 22 21 20 19
T2IN VIB_CONTROL BACK_LIGHT W_LED_DRV CC00IO RSTOUT_N RESET_N SAFE_RES SWITCH_ON OSC32K F32K CLKOUT
PMB7880 U102
1V5_VRF0
1 2 3 4 5 6 7 8 9
220n
22K
VSS9 VSS8 VSS6 VSS5 VSS4 VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
TDO TDI TMS TCK TRST_N TRIG_OUT TRIG_IN NMI_N (FOR CHARGING IC) MON1 MON2
H12 CDT J9 CS
GND RX TX UFLS
R4 P1 P2 N2 L1 M2 K1 J2 P3 R2 M1 N1 L2 K2 J1 M4
DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15
C
UA100 3G 2.5G
MON100
(FOR 2.8V VMEM SELECTION)
G4
P8 M10 P9 R9 K9 B5 C5 F7 N6 N9
NA X101 NX3225SA
( NX3225SA(W-188-34-7)
DEFAULT_BANDSEL
VBAT
82K
4700p
R117 NA
R8 CCIO M9 CCVZ_N P7 CCLK R10 CCRST N8 CCIN
SIM_DATA FM_INT SIM_CLK SIM_RST LOUD_SPK_EN
(FOR FM RADIO)
R103
NA
C132
EXTRSTn
TRIG_IN TRIG_OUT
VMIC MICP2 MICN2 MICP1 MICN1 EPPA1 EPP1 EPN1
4700p
TDO
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
H9 SCL H10 SDA
C116
SPK_P
DCS_RXP DCS_RXN GSM_RXP GSM_RXN
K14 LOUD2 L15 LOUD1
C131
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
DCS_PCS_OUT GSM_OUT
N10 M9 R14 M0 R11 M7 P10 M2
PAOUT1
VDD_TRX VDD_LO VDD_DIG VDD_RX VDD_VCO VDD_LRF_XO VSS_RF1 VSS_RF2 VSS_RF3 VSS_RF4 VSS_RF5 VSS_RF6 VSS_RF7 VSS_RF8 VSS_RF9 VSS_RF10 VSS_RF11 VSS_RF12 VSS_RF13 E_FUSE NC1 NC2 NC3 NC4
G2
(30uA) (VOLTAGE SENSING) (30uA) (90uA)
J6 SSC0_CLK K6 SSC0_MRST G6 SSC0_MTSR (FOR LCD SPI INTERFACE) H6 DISP_REST
FM_SCL FM_SDA
R102
E15 RX34 D15 RX34X C15 RX12 B15 RX12X
M7,9 : ~0.96V
SPEAKER
SPEAKER AMPLIFIER
(16V,K,X5R)
D12
C11 A11 D10 F13 F14 A10 A15 A12 B14 B13 B12 B10 C14 C10 D11 D14 E12 E13 E14 G3 R15 J15 A1 R1
G1
(FOR FM RADIO) (FOR FM RADIO)
C115 (1608) 2.2u REXT
A9 XOX A8 XO
M0,2 : ~1.92V
G7 RXD H7 TXD H8 RTS_N G8 CTS_N
(FOR CHARGING IC)
CN102
R114 NA
DSR
SSC0_CLK CHG_EN_TEST SSC0_MTSR LCD_RESET
(NOT MOUNTED) (FOR SW DEBUGGING / NOT MOUNTED)
TRSTn TDI TMS TCK
F
RXD TXD HS_DET DSR
C VBAT
A13 TX2 A14 TX1
VSS_EPLS VSS_MS1 VSS_MS2 VSS_MS3 VSS_MS4 VSS_MS5 VSS_MS6 VSS_MS7
R113 NA (R110 will be changed to NA for mass production)
RXD TXD
KP0 KP1 KP2 KP3 KP4 KP5 KP6 KP7 KP8 KP9
L12 K13 M15 L13 L14 N14 P14 N11
2V8_VIO
2V8_VMEM
ON BOARD ARM9 JTAG & ETM INTERFACE
VDD_LBUF VDD_LANA VDD_LRF2V5 VDD_LRF1V5 VDD_LMEM VDD_LSIM VDD_LIO VDD_LD1 VDD_LRTC
M8 F10 K7 K8 J8 B9 B8 R7 R6 F6 L4 G10 J7 G9 KEY_OUT1 KEY_OUT2 KEY_OUT3 KEY_OUT4 KEY_IN0 KEY_IN1 KEY_IN2 KEY_IN3 KEY_IN4
D
E
C8 D6 D7 C7 D9 C6 C9 D8 F9 F8
C106
BAT100
C113 1u
L102 18nH
R101
NA
C111 1u
C114
R199
NA
G13 G15 G14 J12 J14
R198
NA
IREF VREFP AGND W_LED_FBN W_LED_FBP
R197
0
6.8K
1u
1u
VD1
R196
2V0_VRTC 2V8_VIO 2V8_VMEM
18p C105
C
B
C103 39p
2V0_VRTC
R100
2V85_VSIM
18p C104
32.768KHz
R199
2
(SURY0013001)
C108
(1608)
KG270 MG160a
MC-146_12_5PF
R198
CN100 1
11*07*3T receiver C102 39p
C107
2
R197
22nH 22nH
C100 39p
VRF1
REC_N
KG278, MG160b, KG275
2V5_VANA
1
32KOUT
R196
L100 L101
REC_P
2.2u
3
2V8_VMEM
VD1
MODEL
X100 4
32KIN
C101
B
2V8_VIO
3V2_VBUF
32.768KHZ CRYSTAL
2V85_VSIM
3
GND2
2006
Sign & Name
SANG-YOEN.LEE
Sheet/ MODEL
GB3_RADIO SPFY0144601
Sheets
1/4
10 11 12 13 14 15 16 17 18
Checked DRAWING F
NAME
Approved
Iss. 1
2
3
4
5
6
7
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
BB
VER-1.1
9
8
LG(42)-A-5505-10:01
LG Electronics Inc.
- 89 -
7. CIRCUIT DIAGRAM
1
2
3
4
7
6
5
8
9
10
A 2V0_VRTC
A
KEY MATRIX
CHARGE PUMP
VBAT
END SW200
U200 5
END_KEY
8
MLED
1
SW201
2
SW202
3
SW203
SW204
LEFT
11
W_LED_DRV SW205
AAT3157ITP-T1 10 C1+
IN
C1C2+
1u C2-
EN_SET
R202 100K
C202 27p
4
D1 D2 D3 NC
GND
6 1 2 3 12 C203 27p
680 SW206
SW207
4
SW208
5
SW209
6
ID
SII
HIGH
1.9V
SHARP
LOW
0V
GP
MLED1 MLED2
KEY_OUT1 C205 NA
MAKER
C201
CP
MENU
R201
C200 1u
9 7
Voltage
0.9V
150Kohm pull up
C204 27p
SW210
UP
B
SEL 2V8_VIO
R203 KEY_OUT2 680 C206 NA
CN200 SW211
SW212
7
SW213
8
SW214
9
RIGHT
1
SW215
2
SEND
KEY_OUT3
LCD_RESET 680 C207 NA
SSC0_CLK SW216
SW218
SW217 0
*
SW219
#
R205 R207
4
47
5
47
7
DOWN MLED
C208 NA
KEY_OUT4 680 C215 NA
C217 NA
C216 NA
C219 NA
C218 NA
C209 27p
C220 NA
6
R206
47
8
R208
47
CS3 SSC0_MTSR
9 10
MLED1
11
MLED2
R209
MTPD
3
MTPG
R204
C210 27p
13 R210 100K
R211 680
12 14 15
LCD_ID
C211 27p
C212 27p
C213 NA
C214 NA
C221 1u
IMSA-9671S-13Y902 (ENQY0013801)
KEY_IN0
C
R212 680 KEY_IN1 R213 680 KEY_IN2 R214 680 KEY_IN3 R215 680 KEY_IN4
VBAT
KEY BACKLIGHT
D
R222
1K
1u C223
R220 100ohm
R221 100ohm LD205 LEBB-S14H
R219 100ohm
LD204 LEBB-S14H
LD203 LEBB-S14H
R217 100ohm
R218 100ohm LD202 LEBB-S14H
LD201 LEBB-S14H
1u C222 KEY_BACKLIGHT
LD200 LEBB-S14H
(10V,K,X5R)
R216 100ohm
D
(10V,K,X5R)
2SC5585 Q200 R223 10K
E
Section
Date
Designer
11/16 2006
Sign & Name MODEL
GB3_RADIO
HYUN-OK.LEE
Sheet/ Sheets
2/4
Checked DRAWING NAME
AUDIO,LCD,KEY
Approved
Iss. 1
2
3
4
Notice No.
Date
Name
DRAWING
LG Electronics Inc.
NO.
REV-1.1
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 90 -
7. CIRCUIT DIAGRAM
1
2
3
4
5
6
7
8
9
10
11
12
14
13
15
16
A
A
VIBRATOR SIM_CONNECTOR
U300
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
R310
0
G5
2V8_VMEM_S
VCCS
1SS302-T5L_F_H
D300
R304
(1608)
0.1u
VIBRATOR
C312 22p
1K
OB4-15L42-C33L C308
C307 0.1u
Q300 2SC5585
2 1
39p R307
C309
0.1u
MIC300
VINNORN 100ohm R309
2.2K 2V8_VMEM
39p
C311 0.1u
B
100ohm R306
C310 22p
C306
VINNORP
SIM_RST SIM_CLK
39p
VCCF
J300
C304 10u
C303 39p
2.2K
C305 R305 27p 10
4 1 GND VCC 5 2 VPP RST 3 6 CLK I_O 8 7 GND2 GND1
SIM_DATA
R301
2
C314
G4
C
2V8_VMEM
TP300 NA
NA
_OE _WE _LB _UB _CE1F _CE1S CE2S RY__BY WP_ACC _RSTF
G8 VSS1 E2 VSS2 C8 D8 E7 F8 H5
C316 0.1u
RFU0 RFU1 RFU2 RFU3 RFU4
_OE _WR ADD00 BHE_N CS0n CS1n
0
R311
R315
2V8_VIO
F2 A5 A3 B3 F1 G1 B5 C4 A4 B4
R313 100K
C315 0.1u
2V85_VSIM
1K
C313
C
ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21
CN300 1
R314
2V8_VMEM
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
C302 27p (50V,J,NP0)
2V85_VSIM 4.7K
G2 E3 H3 F4 F5 H6 E6 G7 H2 F3 G3 H4 G6 F6 H7 F7
DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15
2V85_VSIM
S71GL032A40BAW0F E1 A0 D1 A1 C1 A2 B1 A3 D2 A4 C2 A5 B2 A6 A2 A7 A6 A8 C6 A9 D6 A10 A7 A11 B7 A12 C7 A13 D7 A14 B8 A15 E8 A16 D3 A17 C3 A18 B6 A19 C5 A20
0
U301
100K
MEMORY
C301 NA
R302
C300 NA
B
VMIC
MAIN_MIC
VBAT
VBAT
R300
R312 100K
1 2 3
R308
(NOT MOUNTED)
2V8_VMEM_S
R303
VBAT
_RY_BY VMIC
REMOTE POWER ON
D
1.5K
R316 C317 R317 R319
RPWRON
RPWRON END_KEY
47 0
PWRON
R318
AUXIN C318 NA
C320
0.1u
C321
E
2V8_VIO
39p
AUXIP
EAR_MIC I/O CONNECTOR
2.2K C319 10u
0.1u R320 100K
1 2 3 4 5
C331 100p NA C334
FM_RST
NC1 FMIP RFGND GND1 _RST
U302 SI4702-B16
6 7 8 9 10
39p
39p
2V8_VIO
C326
C325
DSR C327 10u (2012)
C329 1u 2V8_RADIO
39K
(10V,Z,Y5V)
U303 LM4809LD 7 GND3 LOUT ROUT GND2 VD
15 14 13 12 11
C332 C333
C328 56p (50V,J,NP0)
C322 10p
1608 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
FOR RADIO
2 : AUDIO 4 : EAR_L 5 : EAR_R 6 : TXD 7 : RXD 8 : JACK_D
F
9,10 : BATT 11 : R/ON 12,13 : CHG
20 22
C330 1u
0.1u 0.1u
R329 R330
20K 20K
1 5
C335 22n
VDD
VOUT1
VOUT2
0
6
R331
0
HSEJ-18S04-25R RADIO_SPK_L
3 9
R332
BATT_TEMP
C336 3p
2V8_RADIO
0
3 2 1 CN302
C337 18p
39K
C338 0.1u
R335 100K
R334 10K
C
RADIO_SPK_R
VIN2
2 BYPASS GND 4 _SHDN BGND
RADIO_AMP_SHDN
8
R327
VBAT VIN1
R333
(50V,J,NP0) (50V,C,NP0) (TOL:0.25P)
0.1u
2V8_RADIO
1800 1800
2V8_RADIO
_SEN SCLK SDIO RCLK VIO
FM_RST
FB301 FB302
R324 100K
2V8_RADIO
21 20 19 18 17 16 0
10u 10u
1800
RPWRON
PGND NC2 GPIO1 GPIO2 GPIO3 VA R328
FM_ANT
C323 C324
FOR RADIO FB300
HS_DET
R326
C
100K
NA NA TP301 FM_INT
R325
VCHARGE
R323 100K
R322 FM_INT RADIO_AMP_SHDN
2V8_VIO
E L300 270nH
CN301
AUXOP_FML AUXOP_FMR TXD RXD
RADIO
RADIO_AMP_SHDN (FOR FM RADIO)
F
FM_ANT VBAT
2V8_VIO
2V8_VIO
R321
D
D
C339
4.7K
4.7K
R337
R336
D
2V8_VIO
FM_SCL FM_SDA R338
FM_32K
47
C340 0.1u
RADIO_DETECT
U305 NLAS5223BMNR2G 1
R339 27K
2V8_RADIO
VBAT
RADIO_SPK_R U304
E
1 2 3
RADIO_EN
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
RADIO
R342 NA
RADIO_SPK_L
9
8 IN2
4
AUXOP_FML R341
R340 NA
FOR RADIO
EPPA1
NC2 6
NC1
E
330K
7 IN1
5
EPPA1
R344
GND
Section
Date
Sign & Name
Designer
11/16 2006
SANG-YEON.LEE
Sheet/
240K C341 1u
RADIO_DETECT
COM2
COM1
FOR RADIO
R343 100K
NO2
NO1 3
AUXOP_FMR
2V8_VIO
10 VCC
2
C342 1u
HEADSET_RADIO_SEL
MODEL
Sheets
GB3_RADIO SPFY0144601
3/4
R345 100K
(10V,K,X5R)
27K
Checked 2006
NO RADIO
2.7K
DRAWING
F
NAME
Approved
RADIO,MEMORY,AUDIO,I/O
2006
Iss. 1
2
3
4
5
6
7
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
VER-1.1
9
8
LG(42)-A-5505-10:01
LG Electronics Inc.
- 91 -
7. CIRCUIT DIAGRAM
1
2
TP400
TP401
TP402
3
TP404
TP403
4
5
6
7
8
9
10
TP405
R400 NA R401
0
1p
AA
22nH
C401 39p
0
R403
R402
L401
1K
L400
2.2nH
C400
TX_RAMP
A
(50V,J,NP0)
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
(16V,K,X7R)
G2
VBAT VBAT DCS_PCS_OUT 0
0
L402 NA
VAPC 15 C410 22p
R406
11
0
19
C412 NA
21
DCS_PCS_OUT EGSM_OUT RSVD_GND
3 7
VC1 VC2 C417 27p
LMSP2PAA-575TEMP
0
1 GSM1800_1900TX 6 GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX IN
2
3
(50V,J,NP0) (16V,K,X7R) R407
4
GSM_OUT 0
ENABLE BS
18
TXON_PA
1
R408 NA
R409 NA
BS C413 27p
C414 27p
16 14 13 12 10 9 8 7 5
FL400
EGSM_IN
P_GND
R410
9
DCS_PCS_IN
U400 SKY77318
C408 0.01u C409 NA
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1
C411 NA
C407 27p 6
C406 18p
VCC1A
C405 33p
VCC1B
C402 10u (2012)
17
C404 0.01u
20
C403 12p
VBATT
B
C
R405
R404
RF
G1
ANT
SW400 RF500
C416 NA
C415 NA
C
5 2 GND1 GSM850_900TX 8 4 GND2 GSM850_900RX 10 GND3
C418 27p
C419
O2_2
6
O2_1
7
O1_2
8
O1_1
9
C420
1 I1
FL401
DEFAULT_BANDSEL
G4
G3
G1
4 I2
TP406
GSM_RXN
L403 18nH
5 10 G2
3
2
3p
C421
3p
GSM_RXP
3p
DCS_RXN
B9308 L404 5.1nH
PART_NO SFSB0001401 D
D
IN CASE OF GSM850/PCS1900 CHANGE THIS DUAL SAW FILTER TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Section Designer Checked
E
Approved
Date 11/16 2006
Sign & Name KEE-OUN.PARK
2006
1
2
3
4
5
6
Sheet/Sheets
GB3_RADIO
4/4
DRAWING NAME
RF
DRAWING NO.
VER-1.1
2006
LG Electronics Inc. LGIC(42)-A-5505-10:01
MODEL
7
LG Electronics Inc.
- 92 -
8. PCB LAYOUT
- 93 -
8. PCB LAYOUT
- 94 -
9. ENGINEERING MODE
9. ENGINEERING MODE 9.1 About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.
9.2 Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
9.3 Key Operation Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key will switch back to the original test menu.
9.4 Engineering Mode Menu Tree
ENGINEERING MODE
1. BB TEST
2. Model Version
3. Eng Mode
4. Call Timer
5. Factory Reset
6. MF Test
- 95 -
9. ENGINEERING MODE
BB TEST
1. Backlight
1. Backlight On 2. Backlight Off 3. Backlight Value
2. LCD 1. Red
1. LCD Color
2. Green 3. Blue
2. Contrast
4. Black 5. White 6. Auto LCD 3. Battery Info
4. Vibrator
1. Vibrator On 2. Vibrator Off
1. Audio Test
5. Audio
2. Close
*
6. FM Radio
* FM Radio function is not supported
- 96 -
9. ENGINEERING MODE
9.4.1 BB Test 9.4.1.1 Backlight ➀ backlight on : LCD backlight is off. ➁ backlight off : LCD backlight is on. ➂ backlight value : LCD backlight brightness is controlled by 20% from 100 to 0.
9.4.1.2 LCD ➀ LCD color : This menu includes 5 color menu and automatic color change. 5 color menu is Red, Green, Blue, Black and White. ➁ LCD contrast : This menu displays a contrast value and LCD maker.
9.4.1.3 Battery Info This menu displays the information of battery, as example battery voltage level and temperature. In line 2, battery voltage level is displayed with average and instant value. In line 3. battery temperature value is displayed, but this value is ADC value. In line 4. Icon number of battery voltage is displayed.
9.4.1.4 Vibrator This menu can control vibrator on and off operation.
9.4.1.5 Audio This menu can control MIDI operation
- 97 -
9. ENGINEERING MODE
Model Version
9.4.2 Model Version This menu displays the Model software version.
Eng Mode
1. Serving Cell
2. Neighbour Cells
3. Reset Information
- 98 -
9. ENGINEERING MODE
9.4.3 Eng Mode 9.4.3.1 Serving Cell This Menu dispays the the informations of Serving Cell environment. For example, ARFCN, RF Level etc. ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Idle mode RxLev : RX level of Serving Cell while Idle mode C1 : C1 Value of Serving Cell, This value will be used to decide cell reselection. C2 : C2 Value of Serving Cell, This value will be used to decide cell reselection. BPM : Paging period of Serving Cell ARFCND : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Dedicated mode RxLf : Full RX level of Serving Cell RxLs : Sub RX level of Serving Cell RxQf : Full RX qual of Serving Cell RxQs : Sub RX qual of Serving Cell DSC : Downlink Signal Counter RLL : Radio Link Loss Counter Chtyp : Channel type of Serving Cell Chmod : Channel Mode of Serving Cell DTX : Discontinuous Transmission mode of Serving Cell MCC : Mobile Country Code of Serving Cell MNC : Mobile Country Code of Serving Cell LAC : Location Area Code of Serving Cell CID : Cell ID of Serving Cell BSIC : Base Tranceiver Station Identity Code of Serving Cell TxPwrMax : MS_TXPWR_MAX_CCH value of Serving Cell RxMin : RXLEV_ACCESS_MIN value of Serving Cell C2vld : C2_VALID value of Serving Cell CRoff : CELL_RESELECT_OFFSET value of Serving Cell TMPoff : TEMPORARY_OFFSET value of Serving Cell PTime : PENALTY_TIME value of Serving Cell RF# : Number of frequencies in MA(Mobile Allocation) T3212 : Periodic Location Update Timer TxPwrLev : Current Tx power of MS ACC : Access Control Class Band : Current Band Information TA : Current Timing Advance Cipher : Cipher mode of Serving Cell CBQ : Cell Bar Quality flag of Serving Cell CBA : Cell Bar Access flag of Serving Cell
- 99 -
9. ENGINEERING MODE
9.4.3.2 Neighbour Cells This menu displays the informations of Neighbour Cells. ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Neighbour Cell RxLev : Rx Level of Neighbour Cell C1 : C1 Value of Neighbour Cell, This value will be used to decide cell reselection. C2 : C2 Value of Neighbour Cell, This value will be used to decide cell reselection. MCC : Mobile Country Code of Neighbour Cell MNC : Mobile Network Code of Neighbour Cell LAC : Location Area Code of Neighbour Cell CID : Cell ID of Neighbour Cell BSIC : Base Tranceiver Station Identity Code of Neighbour Cell
9.4.3.3 Reset Information This menu displays the information of reset point in source code, call stack.
- 100 -
9. ENGINEERING MODE
Call Timer
9.4.4 Call Timer This menu displays the time of all calls, including the received calls.
Factory Reset
9.4.5 Factory Reset This menu is to format data block in the flash memory and this procedure set up the default value in data block.
- 101 -
9. ENGINEERING MODE
MF TEST
1. All auto Test
2. Backlight
3. Audio
4. Vibrator
5. LCD
6. Key Pad
*
7. Mic Speaker
*
8. FM radio
* function is not supported
- 102 -
9. ENGINEERING MODE
9.4.6 MF TEST This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.
9.4.6.1 All auto Test LCD, Backlight, Vibrator, Buzzer, Key Pad
9.4.6.2 Backlight LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.4.6.3 Audio This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.4.6.4 Vibrator Vibrator is on for about 1.5 seconds.
9.4.6.5 LCD Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
9.4.6.6 Key Pad When a pop-up message shows ‘Press Any Key’, you may press any keys. If the key is working properly, name of the key is displayed on the screen.
- 103 -
10. CALIBRATION
10. CALIBRATION 10.1 Test Equipment Setup
4.000V 0.0000A
10.2 Calibration Steps 10.2.1 Tune on the phone 10.2.2 Execute “HK_28.exe”
- 104 -
10. CALIBRATION
10.2.3 Click “SETTING” Memu
KG278
10.2.4 Setup “Ezlooks” menu such as the following fugure
- 105 -
10. CALIBRATION
10.2.5 Setup “Line System” menu such as the following fugure
KG278
Adjust the number of times.
10.2.6 Setup Logic operation such as the following figure
KG278
Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB
Setup UART Port PWR : Power Supply CELL :Call-Test Equipment
- 106 -
10. CALIBRATION
10.2.7 Select “MODEL” 10.2.8 Click “START” for RF calibration
KG278
10.2.9 RF Calibration finish
- 107 -
10. CALIBRATION
10.2.10 Calibration data will be saved to the following folder
- 108 -
11. STAND ALONE TEST
11. STAND ALONE TEST 11.1 Test Program Setting 11.1.1 Set COM Port 11.1.2 Check PC Baud rate(115200) 11.1.3 Confirm EEPROM & Delta file prefix name
11.1.4 Click “V24AT#ON” and then “Update Info” for communicating Phone and Test Program
Not Connected
- 109 -
11. STAND ALONE TEST
Connected
11.1.5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 11.1.6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.
Change "ptest mode"
- 110 -
11. STAND ALONE TEST
11.2 Tx Test 11.2.1 Click “Non signaling mode” bar and then confirm “OK” test in the command line
11.2.2 Put the number of TX Channel in the ARFCN 11.2.3 Select “TX” in the RF mode menu and “PCL” in the PA Level menu 11.2.4 Finally, Click “Write All” bar and try the efficiency test of Phone
- 111 -
11. STAND ALONE TEST
11.3 RX Test 11.3.1 Put the number of RX Channel in the ARFCN 11.3.2 Select “RX” in the RF mode menu 11.3.3 Finally, Click “Write All” bar and try the efficiency test of Phone
- 112 -
12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW
22
20
21 15 7 18 14
12
13 17
10
19 11
1
16
9
3
4
8
2 5
23
6
- 113 -
- 114 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts Level
Location No.
1
Description
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Part Number
Specification
Color
GSM,BAR/FILP
TGSM0050103
Black
2
AAAY00
ADDITION
AAAY0203337
Black
2
APEY00
PHONE
APEY0429703
Black
3
ACGK00
COVER ASSY,FRONT
ACGK0085205
Black
4
MCJK00
COVER,FRONT
MCJK0069001
MOLD, PC LUPOY SC-1004A, , , , ,
4
MPBG00
PAD,LCD
MPBG0058101
4
MPBM00
PAD,RECEIVER
4
MTAB00
4
Remark
Black
7
COMPLEX, (empty), , , , ,
Without Color
14
MPBM0016401
COMPLEX, (empty), , , , ,
Without Color
15
TAPE,PROTECTION
MTAB0168901
COMPLEX, (empty), , , , ,
Without Color
20
MTAD00
TAPE,WINDOW
MTAD0065701
COMPLEX, (empty), , , , ,
Without Color
21
4
MWAC00
WINDOW,LCD
MWAC0077002
CUTTING, PMMA MR 200, , , , ,
Black
22
4
SURY00
RECEIVER
SURY0013001
PIN ,109 dB,32 ohm,11*7 ,3T ,; , , , , , ,CONTACT ,
3
ACGM00
COVER ASSY,REAR
ACGM0086801
4
ENZY00
CONNECTOR,ETC
ENZY0019901
3 PIN,3 mm,STRAIGHT , ,
4
MCCZ00
CAP
MCCZ0024001
MOLD, Urethane Rubber S185A, , , , ,
Black
4
4
MCJN00
COVER,REAR
MCJN0065001
MOLD, PC LUPOY SC-1004A, , , , ,
Black
8
4
MLAB00
LABEL,A/S
MLAB0000601
HUMIDITY STICKER
Without Color
2
4
MPBN00
PAD,SPEAKER
MPBN0039901
COMPLEX, (empty), , , , ,
Without Color
16
3
GMEY00
SCREW MACHINE,BIND
GMEY0002001
1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7
3
MBJA00
BUTTON,DIAL
MBJA0023209
COMPLEX, (empty), , , , ,
Black
12
3
MCCF00
CAP,MOBILE SWITCH
MCCF0042301
MOLD, Urethane Rubber S185A, , , , ,
Black
5
3
MLAK00
LABEL,MODEL
MLAK0006901
5
ADCA00
DOME ASSY,METAL
ADCA0063901
Without Color
10
5
MLAZ00
LABEL
MLAZ0038301
PID Label 4 Array
Without Color
6
SC100
CAN,SHIELD
MCBA0016401
PRESS, NS, 0.2, , , ,
Without Color
18 Black
- 115 -
3
23
19
12. EXPLODED VIEW & REPLACEMENT PART LIST
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level
Location No.
Description
Part Number
4
SJMY00
VIBRATOR,MOTOR
SJMY0007903
3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,
VIBRATOR,MOTOR
SJMY0007904
3 V,.1 A,4*8 ,height 5.8mm ,; ,3V , , ,11000 , , , ,
Specification
Color
Remark 9
4
SNGF00
ANTENNA,GSM,FIXED
SNGF0022402
3.0 ,-2.0 dBd,, ,internal, GSM900/1800 ,; ,DUAL ,-2.0 ,50 ,3.0
11
4
SUSY00
SPEAKER
SUSY0025801
PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT
1
3
SAFY00
PCB ASSY,MAIN
SAFY0193036
4
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0061605
5
SUMY00
MICROPHONE
SUMY0003802
FPCB ,-42 dB,4*1.5 ,
5
SVLM00
LCD MODULE
SVLM0024402
MAIN ,128*128 ,35.78*39.7*2.7 ,65k ,CSTN ,TM ,S6B33BG ,1.52" Serial IF Only for CI
4
SAFF00
PCB ASSY,MAIN,SMT
SAFF0114336
5
SAFC
PCB ASSY,MAIN,SMT BOTTOM
SAFC0086602
6
BAT100
BATTERY,CELL,LITHIUM
SBCL0001901
3.3 V,0.025 mAh,COIN ,Capacitor type Backup Batt. Pb-Free ,; ,3.3 ,0.025mAh ,COIN
6
C100
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C101
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C104
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C105
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C106
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C107
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C108
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C109
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C110
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C111
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C112
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C113
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C114
CAP,CHIP,MAKER
ECZH0001216
220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C115
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C117
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C118
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C119
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C120
CAP,CERAMIC,CHIP
ECCH0002101
1 uF,10V ,K ,B ,TC ,2012 ,R/TP
17
- 116 -
13
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
C121
CAP,CERAMIC,CHIP
ECCH0002004
0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6
C122
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C123
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C124
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C125
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C126
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C127
CAP,CERAMIC,CHIP
ECCH0000157
15 nF,16V,K,X7R,HD,1005,R/TP
6
C128
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C129
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C130
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C131
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C132
CAP,CHIP,MAKER
ECZH0001106
4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP
6
C133
CAP,CHIP,MAKER
ECZH0001106
4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP
6
C200
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C201
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C202
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C203
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C204
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C209
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C210
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C211
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C212
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C221
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C222
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C223
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C302
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C303
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C304
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C305
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C306
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C307
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C308
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C309
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C310
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
Description
Part Number
Specification
- 117 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
C311
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C312
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C313
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C314
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C315
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C316
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C317
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C319
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C320
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C321
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C322
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C323
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C324
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C325
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C326
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C327
CAP,CERAMIC,CHIP
ECCH0003002
10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP
6
C328
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C329
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C330
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C331
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C332
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C333
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C335
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C336
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C337
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C338
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C339
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C340
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C341
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C342
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C400
CAP,CHIP,MAKER
ECZH0000802
1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C401
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C402
CAP,CERAMIC,CHIP
ECCH0003002
10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP
6
C403
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Specification
- 118 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
C404
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C405
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C406
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C407
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C408
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C410
CAP,CERAMIC,CHIP
ECCH0009505
22 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
6
C413
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C414
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C417
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C418
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C419
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C420
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C421
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C422
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
CN200
CONNECTOR,FFC/FPC
ENQY0013801
13 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT ,TOP ,SMD ,R/TP ,[empty] ,
6
CN301
CONNECTOR,I/O
ENRY0006401
18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6
D300
DIODE,SWITCHING
EDSY0005301
SC-70 ,80 V,0.1 A,R/TP ,
6
FB300
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FB301
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FB302
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FL400
FILTER,SEPERATOR
SFAY0010101
850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC ,Dual Band ASM, 2.5x2.5x1.2
6
FL401
FILTER,SAW,DUAL
SFSB0001401
942.5 MHz,35 MHz,2.1 dB,20 dB,1842.5 MHz,75 MHz,2.3 dB,12 dB,2.0*1.6*0.68 ,SMD ,925M~960M,1805M~1880M,10p,B,150_82,150_15,EGSM +DCS Rx ,; ,942.5, 1842.5 ,2.0*1.6*0.68 ,SMD ,R/TP
6
J300
CONN,SOCKET
ENSY0018101
6 PIN,ETC , ,2.54 mm,H=1.5
6
L102
INDUCTOR,CHIP
ELCH0001032
18 nH,J ,1005 ,R/TP ,PBFREE
6
L103
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
6
L104
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
6
L300
INDUCTOR,CHIP
ELCH0001556
270 nH,J ,1608 ,R/TP ,
6
L400
INDUCTOR,CHIP
ELCH0004721
2.2 nH,S ,1005 ,R/TP ,
6
L401
INDUCTOR,CHIP
ELCH0001413
22 nH,J ,1005 ,R/TP ,PBFREE
6
L403
INDUCTOR,CHIP
ELCH0001032
18 nH,J ,1005 ,R/TP ,PBFREE
6
L404
INDUCTOR,CHIP
ELCH0003814
5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
6
Q200
TR,BJT,NPN
EQBN0007101
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
Description
Part Number
Specification
- 119 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
Q300
TR,BJT,NPN
EQBN0007101
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
6
R100
RES,CHIP,MAKER
ERHZ0000506
6800 ohm,1/16W ,J ,1005 ,R/TP
6
R101
RES,CHIP,MAKER
ERHZ0000244
22 Kohm,1/16W ,F ,1005 ,R/TP
6
R102
RES,CHIP
ERHY0000278
82K ohm,1/16W,J,1005,R/TP
6
R104
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R105
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R106
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R108
RES,CHIP
ERHY0000278
82K ohm,1/16W,J,1005,R/TP
6
R109
RES,CHIP,MAKER
ERHZ0000507
68 Kohm,1/16W ,J ,1005 ,R/TP
6
R110
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R111
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R112
RES,CHIP,MAKER
ERHZ0000287
47 Kohm,1/16W ,F ,1005 ,R/TP
6
R115
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R116
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R119
RES,CHIP
ERHY0003401
1800 ohm,1/16W ,J ,1005 ,R/TP
6
R122
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R124
RES,CHIP
ERHY0008402
160 Kohm,1/16W ,F ,1005 ,R/TP
6
R125
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R197
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R202
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R205
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R206
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R207
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R208
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R210
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R222
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R223
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R300
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R301
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R302
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R303
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R304
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R305
RES,CHIP,MAKER
ERHZ0000702
10 ohm,1/10W ,J ,1608 ,R/TP
6
R306
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 120 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R307
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R308
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R309
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R310
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R312
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R313
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R314
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R316
RES,CHIP,MAKER
ERHZ0000529
1.5 Kohm,1/16W ,J ,1005 ,R/TP
6
R317
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R318
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R319
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R320
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R321
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R323
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R324
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R326
RES,CHIP,MAKER
ERHZ0000476
39 Kohm,1/16W ,J ,1005 ,R/TP
6
R327
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R328
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R329
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R330
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R331
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R332
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R333
RES,CHIP,MAKER
ERHZ0000476
39 Kohm,1/16W ,J ,1005 ,R/TP
6
R334
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R335
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R336
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R337
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R338
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R339
RES,CHIP,MAKER
ERHZ0000454
27 Kohm,1/16W ,J ,1005 ,R/TP
6
R341
RES,CHIP,MAKER
ERHZ0000467
330 Kohm,1/16W ,J ,1005 ,R/TP
6
R343
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R344
RES,CHIP,MAKER
ERHZ0000450
240 Kohm,1/16W ,J ,1005 ,R/TP
6
R345
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R401
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 121 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R402
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R403
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R404
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R405
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R406
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R407
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R410
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
SW400
CONN,RF SWITCH
ENWY0004501
,SMD , dB,H=3.6, Straight type
6
U100
IC
EUSY0176402
Flip-Chip CSP ,9 PIN,R/TP ,Audio Power Amplifier
6
U101
IC
EUSY0328601
DFN ,10 PIN,R/TP ,Li-ion charger IC, 1A, 10Pin, 3x3, DFN
6
U102
IC
EUSY0317401
BGA ,189 PIN,R/TP ,E-Gold voice
6
U200
IC
EUSY0238702
TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version)
6
U301
IC
EUSY0328001
BGA ,56 PIN,R/TP ,32Mb/4Mb , 200 nm, MirroBit
6
U302
IC
EUSY0320801
QFN ,20 PIN,R/TP ,FM Tuner Chip, 3*3*0.57, Pb Free
6
U303
IC
EUSY0142501
LLP ,8 PIN,R/TP ,Dual 105mW Headphone Amplifier
6
U304
IC
EUSY0223002
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 2.8V
6
U305
IC
EUSY0300101
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free
6
U400
PAM
SMPY0014001
35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band
6
X100
X-TAL
EXXY0004602
.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,
6
X101
X-TAL
EXXY0018404
26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm at 30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , , ,SMD ,R/TP
5
SAFD
PCB ASSY,MAIN,SMT TOP
SAFD0085602
6
C102
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C103
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
L100
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
L101
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
LD200
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD201
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD202
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD203
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD204
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD205
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
R201
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 122 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R203
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R204
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R209
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R211
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R212
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R213
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R214
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R215
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R216
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R217
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R218
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R219
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R220
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R221
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
SPFY00
PCB,MAIN
SPFY0144601
FR-4 ,.0.8mm,BUILD-UP 4 ,KG270/KG278 Main PCB
Description
Part Number
Specification
- 123 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.3 Accessory
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level
Location No.
3
MCJA00
COVER,BATTERY
MCJA0040301
MOLD, PC LUPOY SC-1004A, , , , ,
3
SBPL00
BATTERY PACK,LI-ION
SBPL0089503
3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Europe Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack ,Europe Label
BATTERY PACK,LI-ION
SBPL0088203
3.7 V,750 mAh,1 CELL,PRISMATIC ,GB3 BATT(CMW standard batt), Europe, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack ,Europe Label
Description
Part Number
Specification
3
SGEY00
EAR PHONE/EAR MIKE SET
SGEY0003209
; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty] ,BLACK,EARPHONE HOUSING:SILVER ,18P MMI CONNECTOR ,MONO18P(5P)LOW COST
3
SSAD00
ADAPTOR,AC-DC
SSAD0024901
100-240V ,5060 Hz,5.1 V,.7 A,CB/GOST ,AC-DC ADAPTOR ,; ,100Vac~350Vac ,5.1V (+0.15, -0.2) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC
SSAD0024902
100-240V ,5060 Hz,5.2 V,0.7 A,CB/GOST ,AC-DC ADAPTOR ,; ,100Vac~350Vac ,5.2±0.3V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,
- 124 -
Color
Remark
Black
6
Note
Note
