Transcript
LTC1419 14-Bit, 800ksps Sampling A/D Converter with Shutdown
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FEATURES ■ ■ ■ ■ ■ ■ ■
■ ■ ■ ■
DESCRIPTIO
Sample Rate: 800ksps Power Dissipation: 150mW 81.5dB S/(N + D) and 93dB THD No Missing Codes No Pipeline Delay Nap and Sleep Shutdown Modes Operates with 2.5V Internal 15ppm/°C Reference or External Reference True Differential Inputs Reject Common Mode Noise 20MHz Full-Power Bandwidth Sampling Bipolar Input Range: ±2.5V 28-Pin SSOP and SO Packages
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Telecommunications Digital Signal Processing Multiplexed Data Acquisition Systems High Speed Data Acquisition Spectrum Analysis Imaging Systems
The LTC1419 has a full-scale input range of ±2.5V. Outstanding AC performance includes 81.5dB S/(N + D) and 93dB THD with a 100kHz input; 80dB S/(N + D) and 86dB THD at the Nyquist input frequency of 400kHz. The unique differential input sample-and-hold can acquire single-ended or differential input signals up to its 20MHz bandwidth. The 60dB common mode rejection allows users to eliminate ground loops and common mode noise by measuring signals differentially from the source. The ADC has a µP compatible, 14-bit parallel output port. There is no pipeline delay in the conversion results. A separate convert start input and data ready signal (BUSY) ease connections to FIFOs, DSPs and microprocessors. , LTC and LT are registered trademarks of Linear Technology Corporation.
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The LTC ®1419 is a 1µs, 800ksps, 14-bit sampling A/D converter that draws only 150mW from ±5V supplies. This easy-to-use device includes a high dynamic range sample-and-hold and a precision reference. Two digitally selectable power shutdown modes provide flexibility for low power systems.
TYPICAL APPLICATIO
Effective Bits and Signal-to-(Noise + Distortion) vs Input Frequency
800kHz, 14-Bit Sampling A/D Converter
27
–5V
26 25
10µF 10µF
24 23 22
µP CONTROL LINES
21 20
EFFECTIVE BITS
1µF
5V 28
14
86
13
80
12
74
11
68
10
62
9 8 7 6
19
5
18
4
17
3
16
2
fSAMPLE = 800kHz 1k
15
SIGNAL/(NOISE + DISTORTION) (dB)
VREF OUTPUT 2.50V
LTC1419 DIFFERENTIAL 1 AVDD +AIN ANALOG INPUT (–2.5V TO 2.5V) 2 –AIN DVDD 3 VREF VSS 4 REFCOMP BUSY 5 10µF AGND CS 6 D13(MSB) CONVST 7 D12 RD 8 D11 SHDN 9 D10 D0 10 D9 D1 11 14-BIT D8 D2 PARALLEL 12 D7 D3 BUS 13 D6 D4 14 DGND D5
10k 100k INPUT FREQUENCY (Hz)
1M
2M
1419 TA02
1419 TA01
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LTC1419
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ABSOLUTE
RATI GS
AVDD = VDD = DVDD (Notes 1, 2)
ORDER PART NUMBER
TOP VIEW
Supply Voltage (VDD) ................................................ 6V Negative Supply Voltage (VSS) ............................... – 6V Total Supply Voltage (VDD to VSS) .......................... 12V Analog Input Voltage (Note 3).............................(VSS – 0.3V) to (VDD + 0.3V) Digital Input Voltage (Note 4) ......... (VSS – 0.3V) to 10V Digital Output Voltage ........ (VSS – 0.3V) to (VDD + 0.3V) Power Dissipation ............................................. 500mW Operating Temperature Range LTC1419C .............................................. 0°C to 70°C LTC1419I ........................................... – 40°C to 85°C Storage Temperature Range ................ – 65°C to 150°C Lead Temperature (Soldering, 10 sec)................. 300°C
+AIN 1
28 AVDD
–AIN 2
27 DVDD
VREF 3
26 VSS
REFCOMP 4
LTC1419ACG LTC1419ACSW LTC1419AIG LTC1419AISW LTC1419CG LTC1419CSW LTC1419IG LTC1419ISW
25 BUSY
AGND 5
24 CS
D13(MSB) 6
23 CONVST
D12 7
22 RD
D11 8
21 SHDN
D10 9
20 D0
D9 10
19 D1
D8 11
18 D2
D7 12
17 D3
D6 13
16 D4
DGND 14
15 D5
G PACKAGE 28-LEAD PLASTIC SSOP
SW PACKAGE 28-LEAD PLASTIC SO
TJMAX = 110°C, θJA = 95°C/W (G) TJMAX = 110°C, θJA = 130°C/W (SW)
Consult factory for Military grade parts.
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CO VERTER CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. With Internal Reference (Notes 5, 6)
PARAMETER
CONDITIONS
MIN
Resolution (No Missing Codes) Integral Linearity Error
●
(Note 7)
Differential Linearity Error
LTC1419 TYP
MAX
MIN
13
LTC1419A TYP MAX
14
UNITS Bits
●
±0.8
±2
±0.6
●
±0.7
±1.5
±0.5
±1
LSB
●
±5
±20
±5
±20
LSB
±60
±10 ±5
±60
LSB LSB
Offset Error
(Note 8)
Full-Scale Error
Internal Reference External Reference = 2.5V
±10 ±5
Full-Scale Tempco
IOUT(REF) = 0
±15
±1.25
±15
LSB
ppm/°C
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A ALOG I PUT The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER
CONDITIONS
VIN
Analog Input Range (Note 9)
4.75V ≤ VDD ≤ 5.25V, –5.25 ≤ VSS ≤ – 4.75V
●
IIN
Analog Input Leakage Current
CS = High
●
CIN
Analog Input Capacitance
Between Conversions During Conversions
tACQ
Sample-and-Hold Acquisition Time
t AP
Sample-and-Hold Aperture Delay Time
t jitter
Sample-and-Hold Aperture Delay Time Jitter
CMRR
Analog Input Common Mode Rejection Ratio
2
MIN
TYP
±1
90 –1.5
UNITS V
15 5 ●
– 2.5V < (– AIN = AIN) < 2.5V
MAX
±2.5
µA pF pF
300
ns ns
2
psRMS
60
dB
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DY A IC ACCURACY The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
78
81.5 80.0
S/(N + D)
Signal-to-(Noise + Distortion) Ratio
100kHz Input Signal 390kHz Input Signal
●
THD
Total Harmonic Distortion
100kHz Input Signal, First 5 Harmonics 390kHz Input Signal, First 5 Harmonics
●
– 93 – 86
– 86
dB dB
SFDR
Spurious Free Dynamic Range
100kHz Input Signal
●
– 95
– 86
dB
IMD
Intermodulation Distortion
fIN1 = 29.37kHz, fIN2 = 32.446kHz S/(N + D) ≥ 77dB
U U U I TER AL REFERE CE CHARACTERISTICS PARAMETER
UNITS dB dB
– 86
Full-Power Bandwidth Full-Linear Bandwidth
MAX
dB
20
MHz
1
MHz
(Note 5)
CONDITIONS
MIN
TYP
MAX
UNITS
VREF Output Voltage
IOUT = 0
2.480
2.500
2.520
VREF Output Tempco
IOUT = 0
±15
ppm/°C
VREF Line Regulation
4.75V ≤ VDD ≤ 5.25V, – 5.25 ≤ VSS ≤ – 4.75V
0.05
LSB/V
VREF Output Resistance
– 0.1mA ≤ IOUT ≤ 0.1mA
REFCOMP Output Voltage
IOUT = 0
V
2
kΩ
4.06
V
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DIGITAL I PUTS A D DIGITAL OUTPUTS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER
CONDITIONS
VIH
High Level Input Voltage
VDD = 5.25V
●
VIL
Low Level Input Voltage
VDD = 4.75V
●
IIN
Digital Input Current
VIN = 0V to VDD
●
CIN
Digital Input Capacitance
VOH
High Level Output Voltage
VOL
Low Level Output Voltage
MIN
VDD = 4.75V IO = – 10µA IO = – 200µA
●
VDD = 4.75V IO = 160µA IO = 1.6mA
●
TYP
MAX
UNITS
2.4
V 0.8
V
±10
µA
5
pF
4.5
V V
4.0 0.05 0.10
0.4
V V
IOZ
Hi-Z Output Leakage D13 to D0
VOUT = 0V to VDD, CS High
●
±10
µA
COZ
Hi-Z Output Capacitance D13 to D0
CS High (Note 9 )
●
15
pF
ISOURCE
Output Source Current
VOUT = 0V
– 10
mA
ISINK
Output Sink Current
VOUT = VDD
10
mA
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POWER REQUIRE E TS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER
CONDITIONS
VDD
Positive Supply Voltage
(Note 10)
VSS
Negative Supply Voltage
(Note 10)
IDD
Positive Supply Current Nap Mode Sleep Mode
SHDN = 0V, CS = 0V SHDN = 0V, CS = 5V
Negative Supply Current Nap Mode Sleep Mode
SHDN = 0V, CS = 0V SHDN = 0V, CS = 5V
ISS
MIN
TYP
MAX
UNITS
4.75
5.25
V
– 4.75
– 5.25
V
●
11 1.5 250
20
mA mA µA
●
19 100 1
30
mA µA µA
3
LTC1419
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POWER REQUIRE E TS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER PDIS
Power Dissipation Nap Mode Sleep Mode
CONDITIONS
MIN ●
SHDN = 0V, CS = 0V SHDN = 0V, CS = 5V
TYP
MAX
UNITS
150 7.5 1.2
240 12
mW mW mW
WU TI I G CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
fSAMPLE(MAX)
Maximum Sampling Frequency
CONDITIONS ●
MIN
tCONV
Conversion Time
●
tACQ
Acquisition Time
●
90
300
ns
tACQ + CONV
Acquisition + Conversion Time
●
1040
1250
ns
t1
CS to RD Setup Time
t2 t3 t4
SHDN↑ to CONVST↓ Wake-Up Time (Note 10)
t5
CONVST Low Time
(Notes 10, 11)
t6
CONVST to BUSY Delay
CL = 25pF
(Notes 9, 10)
●
CS↓ to CONVST↓ Setup Time
(Notes 9, 10)
●
CS↓ to SHDN↓ Setup Time
(Notes 9, 10) ●
TYP
Data Ready Before BUSY↑
950
ns
ns
40
ns
40
ns 400
ns
20
ns ns
40
ns 50
●
20 15
Delay Between Conversions
(Note 10)
●
40
t9
Wait Time RD↓ After BUSY↑
(Note 9)
●
–5
t10
Data Access Time After RD↓
CL = 25pF
50
CL = 100pF
ns 15
25 35
ns ns
20
35 50
ns ns
10
20 25 30
ns ns ns
●
Bus Relinquish Time ● ●
ns ns ns
●
0°C ≤ TA ≤ 70°C – 40°C ≤ TA ≤ 85°C
1150
0
t8
t11
UNITS kHz
●
t7
MAX
800
t12
RD Low Time
●
t 10
ns
t13
CONVST High Time
●
40
ns
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: All voltage values are with respect to ground with DGND and AGND wired together unless otherwise noted. Note 3: When these pin voltages are taken below VSS or above VDD, they will be clamped by internal diodes. This product can handle input currents greater than 100mA below VSS or above VDD without latchup. Note 4: When these pin voltages are taken below VSS, they will be clamped by internal diodes. This product can handle input currents greater than 100mA below VSS without latchup. These pins are not clamped to VDD. Note 5: VDD = 5V, VSS = – 5V, fSAMPLE = 800kHz, tr = tf = 5ns unless otherwise specified. Note 6: Linearity, offset and full-scale specifications apply for a singleended +AIN input with – AIN grounded.
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Note 7: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 8: Bipolar offset is the offset voltage measured from – 0.5LSB when the output code flickers between 0000 0000 0000 00 and 1111 1111 1111 11. Note 9: Guaranteed by design, not subject to test. Note 10: Recommended operating conditions. Note 11: The falling edge of CONVST starts a conversion. If CONVST returns high at a critical point during the conversion it can create small errors. For best performance ensure that CONVST returns high either within 650ns after the start of the conversion or after BUSY rises.
LTC1419 U W
TYPICAL PERFORMANCE CHARACTERISTICS S/(N + D) vs Input Frequency and Amplitude
Signal-to-Noise Ratio vs Input Frequency
VIN = 0dB
70
VIN = –20dB
80
60 50 40 30
AMPLITUDE (dB BELOW THE FUNDAMENTAL)
80
SIGNAL-TO -NOISE RATIO (dB)
SIGNAL/(NOISE + DISTORTION) (dB)
Distortion vs Input Frequency
90
90
VIN = –60dB
20 10
70 60 50 40 30 20 10
0
0 1k
100k 10k INPUT FREQUENCY (Hz)
1k
1M 2M
10k 100k INPUT FREQUENCY (Hz)
–10 –20 –30 –40 –50 –60 –70 –80
THD
–90
2ND
–100 3RD
– 110 1k
1M 2M
10k 100k INPUT FREQUENCY (Hz)
1419 G02
1419 G01
Spurious-Free Dynamic Range vs Input Frequency 0
Differential Nonlinearity vs Output Code
– 20
–20
1.0
fSAMPLE = 800kHz fIN1 = 95.8984375kHz fIN2 = 104.1015625kHz
–10
1M 2M 1419 G03
Intermodulation Distortion Plot
0
0.5
–40 –50 –60 –70
DNL ERROR (LSBs)
–30
AMPLITUDE (dB)
SPURIOUS-FREE DYNAMIC RANGE (dB)
0
– 40 – 60 – 80
–80
0
– 0.5
– 90
–100
–100 –110 10k
–1.0
–120 100k INPUT FREQUENCY (Hz)
1M
0
2M
50
100 150 200 250 300 350 400 FREQUENCY (kHz)
1419 G04
INL ERROR (LSBs)
0.5
0
– 0.5
–1.0 0
4096
12288 8192 OUTPUT CODE
16384 1419 G07
12288 8192 OUTPUT CODE
Input Common Mode Rejection vs Input Frequency
Power Supply Feedthrough vs Ripple Frequency 0
80
–10
70
–20 –30 –40 –50 –60 –70 –80
VDD
VSS
–90 DGND
–100 1k
100k 10k RIPPLE FREQUENCY (Hz)
16384 1419 G06
COMMON MODE REJECTION (dB)
1.0
4096
1419 G05
AMPLITUDE OF POWER SUPPLY FEEDTHROUGH (dB)
Integral Nonlinearity vs Output Code
0
60 50 40 30 20 10 0
1M
2M
1419 G08
1
1000 10 100 INPUT FREQUENCY (Hz)
10000 1419 G09
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LTC1419
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PI FU CTIO S + AIN (Pin 1): ±2.5V Positive Analog Input. – AIN (Pin 2): ±2.5V Negative Analog Input. VREF (Pin 3): 2.5V Reference Output. Bypass to AGND with 1µF. REFCOMP (Pin 4): 4.06V Reference Output. Bypass to AGND with 10µF tantalum in parallel with 0.1µF or 10µF ceramic. AGND (Pin 5): Analog Ground. D13 to D6 (Pins 6 to 13): Three-State Data Outputs. The output format is 2’s complement. DGND (Pin 14): Digital Ground for Internal Logic. Tie to AGND. D5 to D0 (Pins 15 to 20): Three-State Data Outputs. The output format is 2’s complement. SHDN (Pin 21): Power Shutdown Input. Low selects shutdown. Shutdown mode selected by CS. CS = 0 for nap mode and CS = 1 for sleep mode. RD (Pin 22): Read Input. This enables the output drivers when CS is low.
CONVST (Pin 23): Conversion Start Signal. This active low signal starts a conversion on its falling edge. CS (Pin 24): Chip Select. The input must be low for the ADC to recognize CONVST and RD inputs. CS also sets the shutdown mode when SHDN goes low. CS and SHDN low select the quick wake-up nap mode. CS high and SHDN low select sleep mode. BUSY (Pin 25): The BUSY output shows the converter status. It is low when a conversion is in progress. Data valid on the rising edge of BUSY. VSS (Pin 26): – 5V Negative Supply. Bypass to AGND with 10µF tantalum in parallel with 0.1µF or 10µF ceramic. DVDD (Pin 27): 5V Positive Supply. Short to Pin 28. AVDD (Pin 28): 5V Positive Supply. Bypass to AGND with 10µF tantalum in parallel with 0.1µF or 10µF ceramic.
U U W FU CTIO AL BLOCK DIAGRA CSAMPLE +AIN AVDD
CSAMPLE – AIN 2k VREF
DVDD
ZEROING SWITCHES
2.5V REF
VSS
+ REF AMP
COMP
14-BIT CAPACITIVE DAC
– REFCOMP (4.096V) AGND
SUCCESSIVE APPROXIMATION REGISTER
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• • •
OUTPUT LATCHES
DGND INTERNAL CLOCK
CONTROL LOGIC
1419 BD
SHDN
6
CONVST
RD
CS
BUSY
D13 D0
LTC1419
TEST CIRCUITS Load Circuits for Output Float Delay
Load Circuits for Access Timing
5V
5V
1k
1k DBN
DBN
DBN 1k
CL
1k
CL
100pF
(A) VOH TO Hi-Z
(B) Hi-Z TO VO
(A) Hi-Z TO VOH
DBN 100pF
(B) VOL TO Hi-Z 1419 TC02
1419 TC01
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APPLICATIONS INFORMATION CONVERSION DETAILS The LTC1419 uses a successive approximation algorithm and an internal sample-and-hold circuit to convert an analog signal to a 14-bit parallel output. The ADC is complete with a precision reference and an internal clock. The control logic provides easy interface to microprocessors and DSPs (please refer to Digital Interface section for the data format). Conversion start is controlled by the CS and CONVST inputs. At the start of the conversion, the successive approximation register (SAR) is reset. Once a conversion cycle has begun, it cannot be restarted. +CSAMPLE +AIN
SAMPLE HOLD
–AIN
ZEROING SWITCHES
–CSAMPLE
SAMPLE
HOLD
HOLD
HOLD
+CDAC
+ +VDAC
–CDAC
COMP
DYNAMIC PERFORMANCE
–
–VDAC
14 SAR
• D13 • • D0
OUTPUT LATCHES 1419 F01
Figure 1. Simplified Block Diagram
During the conversion, the internal differential 14-bit capacitive DAC output is sequenced by the SAR from the most significant bit (MSB) to the least significant bit (LSB). Referring to Figure 1, the +AIN and – AIN inputs are connected to the sample-and-hold capacitors (CSAMPLE) during the acquire phase and the comparator offset is nulled by the zeroing switches. In this acquire phase, a minimum delay of 200ns will provide enough time for the sampleand-hold capacitors to acquire the analog signal. During the convert phase, the comparator zeroing switches open, putting the comparator into compare mode. The input switches the CSAMPLE capacitors to ground, transferring the differential analog input charge onto the summing junction. This input charge is successively compared with the binary weighted charges supplied by the differential capacitive DAC. Bit decisions are made by the high speed comparator. At the end of a conversion, the differential DAC output balances the + AIN and – AIN input charges. The SAR contents (a 14-bit data word) which represents the difference of + AIN and – AIN are loaded into the 14-bit output latches.
The LTC1419 has excellent high speed sampling capability. FFT (Fast Fourier Transform) test techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for
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LTC1419
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APPLICATIONS INFORMATION frequencies outside the fundamental. Figure 2 shows a typical LTC1419 FFT plot. 0 fSAMPLE = 800kHz fIN = 99.804687kHz SFDR = 98dB THD = –93.3dB
– 20
AMPLITUDE (dB)
– 40
Effective Number of Bits The effective number of bits (ENOBs) is a measurement of the resolution of an ADC and is directly related to the S/(N + D) by the equation: N = [S/(N + D) – 1.76]/6.02 where N is the effective number of bits of resolution and S/(N + D) is expressed in dB. At the maximum sampling rate of 800kHz, the LTC1419 maintains near ideal ENOBs up to the Nyquist input frequency of 400kHz (refer to Figure 3).
– 60 – 80 –100 –120 –140 0
50
Figure 2a. LTC1419 Nonaveraged, 4096 Point FFT, Input Frequency = 100kHz 0 fSAMPLE = 800kHz fIN = 375kHz SFDR = 88.3dB SINAD = 80.1
AMPLITUDE (dB)
– 20
EFFECTIVE BITS
1419 F02a
14
86
13
80
12
74
11
68
10
62
9 8 7 6 5 4 3
– 40
2
fSAMPLE = 800kHz 1k
– 60
SIGNAL/(NOISE + DISTORTION) (dB)
100 150 200 250 300 350 400 FREQUENCY (kHz)
10k 100k INPUT FREQUENCY (Hz)
– 80
1M
2M
1419 TA02
–100
Figure 3. Effective Bits and Signal/(Noise + Distortion) vs Input Frequency
–120 –140 0
50
100 150 200 250 300 350 400 FREQUENCY (kHz) 1419 F02b
Figure 2b. LTC1419 Nonaveraged, 4096 Point FFT, Input Frequency = 375kHz
Signal-to-Noise Ratio The signal-to-noise plus distortion ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency to the RMS amplitude of all other frequency components at the A/D output. The output is band limited to frequencies from above DC and below half the sampling frequency. Figure 2 shows a typical spectral content with a 800kHz sampling rate and a 100kHz input. The dynamic performance is excellent for input frequencies up to and beyond the Nyquist limit of 400kHz.
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Total Harmonic Distortion Total harmonic distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as:
V22 + V32 + V 42 + … Vn2 V1 where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second through nth harmonics. THD vs Input Frequency is shown in Figure 4. The LTC1419 has good distortion performance up to the Nyquist frequency and beyond. THD = 20Log
LTC1419
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AMPLITUDE (dB BELOW THE FUNDAMENTAL)
APPLICATIONS INFORMATION 0
(fa + fb). If the two input sine waves are equal in magnitude, the value (in decibels) of the 2nd order IMD products can be expressed by the following formula:
–10 –20 –30 –40
(
)
IMD fa + fb = 20 Log
–50 –60
Amplitude at (fa + fb) Amplitude at fa
–70 –80
THD
–90
Peak Harmonic or Spurious Noise 2ND
–100 3RD
– 110 1k
10k 100k INPUT FREQUENCY (Hz)
1M 2M 1419 G03
Figure 4. Distortion vs Input Frequency
Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ±nfb, where m and n = 0, 1, 2, 3, etc. For example, the 2nd order IMD terms include 0
fSAMPLE = 800kHz fIN1 = 95.8984375kHz fIN2 = 104.1015625kHz
AMPLITUDE (dB)
– 20 – 40 – 60 – 80
–100 –120 0
50
100 150 200 250 300 350 400 FREQUENCY (kHz) 1419 G05
Figure 5. Intermodulation Distortion Plot
The peak harmonic or spurious noise is the largest spectral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full-scale input signal. Full-Power and Full-Linear Bandwidth The full-power bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full-scale input signal. The full-linear bandwidth is the input frequency at which the S/(N + D) has dropped to 77dB (12.5 effective bits). The LTC1419 has been designed to optimize input bandwidth, allowing the ADC to undersample input signals with frequencies above the converter’s Nyquist Frequency. The noise floor stays very low at high frequencies; S/(N + D) becomes dominated by distortion at frequencies far beyond Nyquist. Driving the Analog Input The differential analog inputs of the LTC1419 are easy to drive. The inputs may be driven differentially or as a singleended input (i.e., the – AIN input is grounded). The + AIN and – AIN inputs are sampled at the same instant. Any unwanted signal that is common mode to both inputs will be reduced by the common mode rejection of the sampleand-hold circuit. The inputs draw only one small current spike while charging the sample-and-hold capacitors at the end of conversion. During conversion, the analog inputs draw only a small leakage current. If the source impedance of the driving circuit is low, then the LTC1419 inputs can be driven directly. As source impedance increases so will acquisition time (see Figure 6). For minimum acquisition time with high source impedance, a buffer amplifier should be used. The only requirement is
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LTC1419
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APPLICATIONS INFORMATION that the amplifier driving the analog input(s) must settle after the small current spike before the next conversion starts (settling time must be 200ns for full throughput rate).
ACQUISITION TIME (µs)
10
0.1
1 10 0.1 SOURCE RESISTANCE (kΩ)
100 1419 F06
Figure 6. tACQ vs Source Resistance
Choosing an Input Amplifier Choosing an input amplifier is easy if a few requirements are taken into consideration. First, to limit the magnitude of the voltage spike seen by the amplifier from charging the sampling capacitor, choose an amplifier that has a low output impedance (< 100Ω) at the closed-loop bandwidth frequency. For example, if an amplifier is used in a gain of +1 and has a unity-gain bandwidth of 50MHz, then the output impedance at 50MHz should be less than 100Ω. The second requirement is that the closed-loop bandwidth must be greater than 20MHz to ensure adequate small-signal settling for full throughput rate. If slower op amps are used, more settling time can be provided by increasing the time between conversions. The best choice for an op amp to drive the LTC1419 will depend on the application. Generally applications fall into two categories: AC applications where dynamic specifications are most critical and time domain applications where DC accuracy and settling time are most critical. The following list is a summary of the op amps that are suitable for driving the LTC1419. More detailed information is available in the Linear Technology databooks, the LinearViewTM CD-ROM and on our web site at www.lineartech. com. LinearView is a trademark of Linear Technology Corporation.
10
LT1223: 100MHz video current feedback amplifier. ±5V to ±15V supplies, 6mA supply current. Low distortion at frequencies above 400kHz. Low noise. Good for AC applications. LT1227: 140MHz video current feedback amplifier. ±5V to ±15V supplies, 10mA supply current. Lowest distortion at frequencies above 400kHz. Low noise. Best for AC applications.
1
0.01 0.01
LT ® 1220: 30MHz unity-gain bandwidth voltage feedback amplifier. ±5V to ±15V supplies. Excellent DC specifications.
LT1229/LT1230: Dual/quad 100MHz current feedback amplifiers. ±2V to ±15V supplies, 6mA supply current each amplifier. Low noise. Good AC specs. LT1360: 50MHz voltage feedback amplifier. ±5V to ±15V supplies, 3.8mA supply current. Good AC and DC specs. LT1363: 70MHz, 1000V/µs op amps, 6.3mA supply current. Good AC and DC specs. LT1364/LT1365: Dual and quad 70MHz, 1000V/µs op amps. 6.3mA supply current per amplifier. Input Filtering The noise and the distortion of the input amplifier and other circuitry must be considered since they will add to the LTC1419 noise and distortion. The small-signal bandwidth of the sample-and-hold circuit is 20MHz. Any noise or distortion products that are present at the analog inputs will be summed over this entire bandwidth. Noisy input circuitry should be filtered prior to the analog inputs to minimize noise. A simple 1-pole RC filter is sufficient for ANALOG INPUT
50Ω
1
+AIN
1000pF 2
–AIN LTC1419
3
4
VREF
REFCOMP
10µF 5
AGND 1419 F07
Figure 7. RC Input Filter
LTC1419
U
W
U
U
APPLICATIONS INFORMATION many applications. For example, Figure 7 shows a 1000pF capacitor from + AIN to ground and a 100Ω source resistor to limit the input bandwidth to 1.6MHz. The 1000pF capacitor also acts as a charge reservoir for the input sample-and-hold and isolates the ADC input from sampling glitch sensitive circuitry. High quality capacitors and resistors should be used since these components can add distortion. NPO and silver mica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can also generate distortion from self heating and from damage that may occur during soldering. Metal film surface mount resistors are much less susceptible to both problems. Input Range The ±2.5V input range of the LTC1419 is optimized for low noise and low distortion. Most op amps also perform well over this same range, allowing direct coupling to the analog inputs and eliminating the need for special translation circuitry. Some applications may require other input ranges. The LTC1419 differential inputs and reference circuitry can accommodate other input ranges often with little or no additional circuitry. The following sections describe the reference and input circuitry and how they affect the input range. Internal Reference The LTC1419 has an on-chip, temperature compensated, curvature corrected, bandgap reference that is factory trimmed to 2.500V. It is connected internally to a reference amplifier and is available at VREF (Pin 3) see Figure 8a. A
2.500V
4.0625V
R1 2k
3 VREF
4 REFCOMP
1 ANALOG INPUT
VIN
2
LT1019A-2.5 VOUT
3
+AIN –AIN VREF LTC1419
4
+ 10µF
0.1µF 5
REFCOMP
AGND 1419 F08b
Figure 8b. Using the LT1019-2.5 as an External Reference
2k resistor is in series with the output so that it can be easily overdriven by an external reference or other circuitry, see Figure 8b. The reference amplifier gains the voltage at the VREF pin by 1.625 to create the required internal reference voltage. This provides buffering between the VREF pin and the high speed capacitive DAC. The reference amplifier compensation pin (REFCOMP, Pin 4) must be bypassed with a capacitor to ground. The reference amplifier is stable with capacitors of 1µF or greater. For the best noise performance, a 10µF ceramic or 10µF tantalum in parallel with a 0.1µF ceramic is recommended. The VREF pin can be driven with a DAC or other means shown in Figure 9. This is useful in applications where the peak input signal amplitude may vary. The input span of the ADC can then be adjusted to match the peak input signal, maximizing the signal-to-noise ratio. The filtering of the internal LTC1419 reference amplifier will limit the bandwidth and settling time of this circuit. A settling time of 5ms should be allowed for after a reference adjustment. 1 ANALOG INPUT 1.25V TO 3V DIFFERENTIAL
BANDGAP REFERENCE
2
+AIN
–AIN LTC1419
REFERENCE AMP
LTC1450
1.25V TO 3V 3
R2 40k
10µF
5 AGND
5V
4
VREF
REFCOMP
10µF
R3 64k
5
AGND
LTC1419
1419 F09
1419 F08a
Figure 8a. LTC1419 Reference Circuit
Figure 9. Driving VREF with a DAC
11
LTC1419
U
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U
APPLICATIONS INFORMATION Differential Inputs The LTC1419 has a unique differential sample-and-hold circuit that allows rail-to-rail inputs. The ADC will always convert the difference of + AIN – (– AIN) independent of the common mode voltage (see Figure 11a). The common mode rejection holds up to extremely high frequencies, see Figure 10a. The only requirement is that both inputs can not exceed the AVDD or AVSS power supply voltages. Integral nonlinearity errors (INL) and differential nonlinearity errors (DNL) are independent of the common mode voltage, however, the bipolar zero error (BZE) will vary. The change in BZE is typically less than 0.1% of the common mode voltage. Dynamic performance is also affected by the common mode voltage. THD will degrade as the inputs approach either power supply rail, from 86dB with a common mode of 0V to 76dB with a common mode of 2.5V or – 2.5V.
Differential inputs allow greater flexibility for accepting different input ranges. Figure 10b shows a circuit that converts a 0V to 5V analog input signal with only an additional buffer that is not in the signal path. Full-Scale and Offset Adjustment Figure 11a shows the ideal input/output characteristics for the LTC1419. The code transitions occur midway between successive integer LSB values (i.e., – FS + 0.5LSB, – FS + 1.5LSB, – FS + 2.5LSB,... FS – 1.5LSB, FS – 0.5LSB). The output is two’s complement binary with 1LSB = FS – (– FS)/16384 = 5V/16384 = 305.2µV. In applications where absolute accuracy is important, offset and full-scale errors can be adjusted to zero. Offset error must be adjusted before full-scale error. Figure 11b shows the extra components required for full-scale error adjustment. Zero offset is achieved by adjusting the offset
011...111
70
011...110 60 50
OUTPUT CODE
COMMON MODE REJECTION (dB)
80
40 30
000...001 000...000 111...111 111...110
20
100...001
10
100...000 0 10 100 1000 INPUT FREQUENCY (Hz)
1
10000
INPUT VOLTAGE [+AIN – (–AIN)] 1419 F11a
Figure 10a. CMRR vs Input Frequency
ANALOG INPUT
1 2
±2.5V
0V TO 5V
+
3
–
Figure 11a. LTC1419 Transfer Characteristics 5V R8 50k
–AIN
R4 100Ω
VREF
R6 24k
REFCOMP
1 2 3
R5 R7 47k 50k
4 5
+
10µF 5
ANALOG INPUT
R3 24k
+AIN
LTC1419
4
FS – 1LSB
– (FS – 1LSB) 1419 G09
10µF
0.1µF
+AIN –AIN LTC1419 VREF REFCOMP AGND 1419 F11b
AGND 1419 F10
Figure 10b. Selectable 0V to 5V or ±2.5V Input Range
12
Figure 11b. Offset and Full-Scale Adjust Circuit
LTC1419
U
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U
APPLICATIONS INFORMATION applied to the – AIN input. For zero offset error, apply – 152µV (i.e., – 0.5LSB) at + AIN and adjust the offset at the – AIN input until the output code flickers between 0000 0000 0000 00 and 1111 1111 1111 11. For full-scale adjustment, an input voltage of 2.499544V (FS/2 – 1.5LSBs) is applied to + A IN and R2 is adjusted until the output code flickers between 0111 1111 1111 10 and 0111 1111 1111 11.
microprocessor to the successive approximation comparator. The problem can be eliminated by forcing the microprocessor into a WAIT state during conversion or by using three-state buffers to isolate the ADC data bus. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC1419 has differential inputs to minimize noise coupling. Common mode noise on the + AIN and – AIN leads will be rejected by the input CMRR. The – AIN input can be used as a ground sense for the + AIN input; the LTC1419 will hold and convert the difference voltage between + AIN and – AIN. The leads to + AIN (Pin 1) and – AIN (Pin 2) should be kept as short as possible. In applications where this is not possible, the + AIN and – AIN traces should be run side by side to equalize coupling.
BOARD LAYOUT AND GROUNDING Wire wrap boards are not recommended for high resolution or high speed A/D converters. To obtain the best performance from the LTC1419, a printed circuit board with ground plane is required. Layout should ensure that digital and analog signal lines are separated as much as possible. Particular care should be taken not to run any digital track alongside an analog signal track or underneath the ADC.The analog input should be screened by AGND.
SUPPLY BYPASSING High quality, low series resistance ceramic, 10µF bypass capacitors should be used at the VDD and REFCOMP pins as shown in the Typical Application on the fist page of this data sheet. Surface mount ceramic capacitors such as Murata GRM235Y5V106Z016 provide excellent bypassing in a small board space. Alternatively, 10µF tantalum capacitors in parallel with 0.1µF ceramic capacitors can be used. Bypass capacitors must be located as close to the pins as possible. The traces connecting the pins and the bypass capacitors must be kept short and should be made as wide as possible.
An analog ground plane separate from the logic system ground should be established under and around the ADC. Pin 5 (AGND), Pin 14 and Pin 19 (ADC’s DGND) and all other analog grounds should be connected to this single analog ground point. The REFCOMP bypass capacitor and the DVDD bypass capacitor should also be connected to this analog ground plane. No other digital grounds should be connected to this analog ground plane. Low impedance analog and digital power supply common returns are essential to low noise operation of the ADC and the foil width for these tracks should be as wide as possible. In applications where the ADC data outputs and control signals are connected to a continuously active microprocessor bus, it is possible to get errors in the conversion results. These errors are due to feedthrough from the
1
+ –
2
Figures 13a, 13b, 13c and 13d show the schematic and layout of a suggested evaluation board. The layout demonstrates the proper use of decoupling capacitors and ground plane with a 2-layer printed circuit board.
DIGITAL SYSTEM
LTC1419
+AIN –AIN REFCOMP
ANALOG INPUT CIRCUITRY
Example Layout
AGND
4
5 10µF
AVDD DVDD
VSS 26 10µF
28
DGND
27
14
10µF
ANALOG GROUND PLANE 1419 F12
Figure 12. Power Supply Grounding Practice
13
J7
J5
VLOGIC
R19 51Ω
CS
RD
SHDN
JP5B
JP5A
HC14
2
JP5C
1
3
R20 1M
HC14
U7B
C13 10µF 16V
C11 1000pF
R15 51Ω
D15 SS12
R16 51Ω
C8 1µF 16V
JP2
U7A
JP4
DGND
C7 1000pF
R18 10k
R17 10k
VOUT
GND TABGND 2 4
VIN
3
4
C2 22µF 10V
JP3
C4 0.1µF
C12 0.1µF
C9 10µF 16V
VCC
C3 VSS 0.1µF
U3 V+ LT1363 2 7 – 6 3 + 8 1 V– 4
VCC
R14 20Ω
VOUT
VCC
C6 1000pF
+
VCC
NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL RESISTOR VALUES IN OHMS, 1/10W, 5% 2. ALL CAPACITOR VALUES IN µF, 25V, 20% AND IN pF, 50V, 10%
CLK
A–
A+
AGND
J2
J4
GND
+VIN
1
LT1121-5
14
5
26
27
28
21
22
23
24
25
4
3
2
1
C10 10µF 10V
C15 0.1µF
7
VCC U7G HC14 GND
14
VLOGIC
DGND
AGND
VSS
DVDD
AVDD
SHDN
RD
CONVST
CS
BUSY
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13 B11 B10
8 9
13 HC14
U7F
20 B00
19 B01
18 B02
17 B03
16 B04
15 B05
13 B06
12 B07
11 B08
10 B09
B12
B13
7
6
U1 79L05 1 IN OUT GND 5 D14 SS12
U4 LTC1419
REFCOMP
VREF
–AIN
+AIN
DATA READY
+
–VIN
J1 –7V TO –15V 2 VSS
12
B[00:13]
C1 22µF 10V
1
5
9
8
7
B07 B06
6
5
4
3
2
11
1
9
8
7
6
5
B08
B09
B10
B11
B12
B13
B05
B04
B03
4
3
B01 B02
2
B00
11
Figure 13a. Suggested Evaluation Circuit Schematic
C5 10µF 16V
VSS
C14 0.1µF
VLOGIC
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
HC14
U7C
D7
D6
D5
D4
D3
D2
D1
D0
0E
6
12
13
14
15
16
17
18
19
12
13
14
15
16
17
18
19
C16 15pF
R21 1k
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
U6 74HC574
D7
D6
D5
D4
D3
D2
D1
D0
0E
U5 74HC574
D06
D07
D08
D09
D10
D11
D12
D13
D05
D04
D03
D02
D01
D00
9 HC14
U7D
11
8
HC14
U7E
D[00:13]
10
D13
RDY
D13
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
D13
D12
D11
J6-12
J6-11
J6-14
JP1
LED
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
DC124 SCHEM
DGND
DGND
RDY
D13
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
HEADER 18-PIN
J6-18
J6-17
J6-16
J6-15
J6-2
J6-1
J6-4
J6-3
J6-6
J6-5
J6-8
J6-7
J6-10
J6-9
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D10
J6-13
R13
R12
R11
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0 1.2k
U U W
U2
APPLICATIONS INFORMATION U
14 +
J3 7V TO 15V
LTC1419
LTC1419
U
W
U
U
APPLICATIONS INFORMATION
Figure 13b. Suggested Evaluation Circuit Board—Component Side Silkscreen
Figure 13c. Suggested Evaluation Circuit Board—Component Side Layout
15
LTC1419
U
W
U
U
APPLICATIONS INFORMATION
Figure 13d. Suggested Evaluation Circuit Board—Solder Side Layout
DIGITAL INTERFACE The A/D converter is designed to interface with microprocessors as a memory mapped device. The CS and RD control inputs are common to all peripheral memory interfacing. A separate CONVST is used to initiate a conversion. Internal Clock The A/D converter has an internal clock that eliminates the need of synchronization between the external clock and the CS and RD signals found in other ADCs. The internal clock is factory trimmed to achieve a typical conversion time of 0.95µs and a maximum conversion time over the full operating temperature range of 1.15µs. No external adjustments are required. The guaranteed maximum acquisition time is 300ns. In addition, a throughput time of 1.25µs and a minimum sampling rate of 800ksps are guaranteed.
mode reduces the power by 95% and leaves only the digital logic and reference powered up. The wake-up time from nap to active is 400ns. In sleep mode, the reference is shut down and only a small current remains, about 250µA. Wake-up time from sleep mode is much slower since the reference circuit must power up and settle to 0.005% for full 14-bit accuracy. Sleep mode wake-up time is dependent on the value of the capacitor connected to the REFCOMP (Pin 4). The wake-up time is 10ms with the recommended 10µF capacitor. Shutdown is controlled by Pin 21 (SHDN); the ADC is in shutdown when it is low. The shutdown mode is selected with Pin 20 (CS); low selects nap. CS t3 SHDN 1419 F14a
Power Shutdown The LTC1419 provides two power shutdown modes, nap and sleep, to save power during inactive periods. The nap
16
Figure 14a. CS to SHDN Timing
LTC1419
U
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U
APPLICATIONS INFORMATION In slow memory and ROM modes (Figures 19 and 20), CS is tied low and CONVST and RD are tied together. The MPU starts the conversion and reads the output with the RD signal. Conversions are started by the MPU or DSP (no external sample clock).
SHDN t3 CONVST 1419 F14b
Figure 14b. SHDN to CONVST Wake-Up Timing
In slow memory mode, the processor applies a logic low to RD (= CONVST), starting the conversion. BUSY goes low, forcing the processor into a WAIT state. The previous conversion result appears on the data outputs. When the conversion is complete, the new conversion results appear on the data outputs; BUSY goes high, releasing the processor and the processor takes RD (= CONVST) back high and reads the new conversion data.
Timing and Control Conversion start and data read operations are controlled by three digital inputs: CONVST, CS and RD. A logic “0” applied to the CONVST pin will start a conversion after the ADC has been selected (i.e., CS is low). Once initiated, it cannot be restarted until the conversion is complete. Converter status is indicated by the BUSY output. BUSY is low during a conversion.
In ROM mode, the processor takes RD (= CONVST) low, starting a conversion and reading the previous conversion result. After the conversion is complete, the processor can read the new result and initiate another conversion.
Figures 16 through 20 show several different modes of operation. In modes 1a and 1b (Figures 16 and 17), CS and RD are both tied low. The falling edge of CONVST starts the conversion. The data outputs are always enabled and data can be latched with the BUSY rising edge. Mode 1a shows operation with a narrow logic low CONVST pulse. Mode 1b shows a narrow logic high CONVST pulse.
CS t1 RD
In mode 2 (Figure 18), CS is tied low. The falling edge of the CONVST signal again starts the conversion. Data outputs are in three-state until read by the MPU with the RD signal. Mode 2 can be used for operation with a shared MPU databus.
1419 F15
Figure 15. CS to CONVST Set-Up Timing
t CONV
CS = RD = 0
(SAMPLE N) t5 CONVST t6
t8
BUSY t7 DATA
DATA (N – 1) DB13 TO DB0
DATA N DB13 TO DB0
DATA (N + 1) DB13 TO DB0 1419 F16
Figure 16. Mode 1a. CONVST Starts a Conversion. Data Outputs Always Enabled (CONVST = )
17
LTC1419
U
U
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U
APPLICATIONS INFORMATION tCONV
CS = RD = 0
t8
t5
t13 CONVST
t6
t6
t6
BUSY t7 DATA (N – 1) DB13 TO DB0
DATA
DATA N DB13 TO DB0
DATA (N + 1) DB13 TO DB0 1419 F17
Figure 17. Mode 1b. CONVST Starts a Conversion. Data Outputs Always Enabled (CONVST = )
t13
(SAMPLE N) tCONV t5
CS = 0
t8
CONVST t6 BUSY t9
t 11 t 12
RD t 10 DATA N DB13 TO DB0
DATA
1419 F18
Figure 18. Mode 2. CONVST Starts a Conversion. Data is Read by RD
t8
t CONV
CS = 0 (SAMPLE N) RD = CONVST t6
t 11
BUSY t 10 DATA
t7 DATA (N – 1) DB13 TO DB0
DATA N DB13 TO DB0
DATA N DB13 TO DB0
DATA (N + 1) DB13 TO DB0 1419 F19
Figure 19. Slow Memory Mode Timing
18
LTC1419
W
U
U
UO
APPLICATI
S I FOR ATIO t CONV
CS = 0
t8
(SAMPLE N) RD = CONVST t6
t 11
BUSY t 10 DATA N DB13 TO DB0
DATA (N – 1) DB13 TO DB0
DATA
1419 F20
Figure 20. ROM Mode Timing
U
PACKAGE DESCRIPTIO
Dimensions in inches (millimeters) unless otherwise noted. G Package 28-Lead Plastic SSOP (0.209) (LTC DWG # 05-08-1640)
10.07 – 10.33* (0.397 – 0.407) 28 27 26 25 24 23 22 21 20 19 18 17 16 15
7.65 – 7.90 (0.301 – 0.311)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 5.20 – 5.38** (0.205 – 0.212)
1.73 – 1.99 (0.068 – 0.078)
0° – 8°
0.13 – 0.22 (0.005 – 0.009)
0.55 – 0.95 (0.022 – 0.037)
NOTE: DIMENSIONS ARE IN MILLIMETERS *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.152mm (0.006") PER SIDE **DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
0.65 (0.0256) BSC
0.25 – 0.38 (0.010 – 0.015)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.05 – 0.21 (0.002 – 0.008)
G28 SSOP 1098
19
LTC1419 U
PACKAGE DESCRIPTIO
Dimensions in inches (millimeters) unless otherwise noted.
SW Package 28-Lead Plastic Small Outline (Wide 0.300) (LTC DWG # 05-08-1620)
0.697 – 0.712* (17.70 – 18.08) 28
27
26
25
24
23
22
21
20
19
18
17
16
15
0.394 – 0.419 (10.007 – 10.643)
NOTE 1
0.291 – 0.299** (7.391 – 7.595)
1
2
3
4
5
6
7
8
9
10
11
12
13
14 0.037 – 0.045 (0.940 – 1.143)
0.093 – 0.104 (2.362 – 2.642)
0.010 – 0.029 × 45° (0.254 – 0.737) 0° – 8° TYP
0.009 – 0.013 (0.229 – 0.330)
NOTE 1
0.050 (1.270) BSC
0.016 – 0.050 (0.406 – 1.270)
0.004 – 0.012 (0.102 – 0.305)
0.014 – 0.019 (0.356 – 0.482) TYP
S28 (WIDE) 1098
NOTE: 1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS. THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
RELATED PARTS PART NUMBER
DESCRIPTION
COMMENTS
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Low Power, 5V or ±5V Supply
LTC1400
High Speed, Serial 12-Bit ADC
400ksps, Complete with Internal Reference, SO-8 Package
LTC1409
Low Power, 12-Bit, 800ksps Sampling ADC
Best Dynamic Performance, fSAMPLE ≤ 800ksps, 80mW Dissipation
LTC1410
12-Bit, 1.25Msps Sampling ADC with Shutdown
Best Dynamic Performance, THD = 84dB and SINAD = 71dB at Nyquist
LTC1415
Single 5V, 12-Bit 1.25Msps ADC
Single Supply, 55mW Dissipation
LTC1604
16-Bit 333ksps ADC
±2.5V Inputs, Pin Compatible with the LTC1608
LTC1605
Single 5V, 16-Bit 100ksps ADC
Low Power, ±10V Inputs
LTC1606
16-Bit 250ksps ADC
±10V Inputs, Pin Compatible with the LTC1605
LTC1608
16-Bit 500ksps ADC
±2.5V Inputs, Pin Compatible with the LTC1604
20
Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 ● (408) 432-1900 FAX: (408) 434-0507● TELEX: 499-3977 ● www.linear-tech.com
1419fa LT/TP 0600 2K REV A • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1997
