Mainboard Diagram - Jetway Computer Corporation

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Mainboard Diagram XBLUE-H55-MINI 1. INTEL® H55 Express Chipset 2. Support INTEL® LGA1156 Processors 3. Supports PCI-Express 2.0 4. Supports Dual Channel DDR3 1333/1066 5. Onboard Gigabit LAN 6. Integrated ALC662 HD Audio CODEC with 6.0 CH 7. Support all solid-state electric capacity 8. Support 3D Audio Technology 9. Support G.P.I Technology 10. Ready for Windows® 7 11. U-ATX Form Factor(200mm X 245mm) Features and Benefits PCI Express 2.0 Buses The PCI Express 2.0 x16 graphics delivers up to 8 GB/s per direction, 2 times more bandwidth than PCI Express x16 and up to 16 GB/s concurrent bandwidth. PCI Express x1 I/O offers 1GB/s concurrently, over 7 times more bandwidth than AGP8X, tackling the most demanding multimedia tasks nowadays Serial ATA2 3Gb/s This platform supports reliable storage solution for enhanced data protection and data accessing performance. Serial ATA 3Gb/s is firstly introduced in this platform to provide blazingly 3Gb/s bus bandwidth thus higher disk performance. The SATA RAID allows multi-disk designs to be set up as RAID 0, 1,10 based on users’ priority of protection/performance, and which even makes more accessible by introducing the innovative windows-based facility OC-CON high-polymer solid electrolysis aluminum capacitors embedded The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade, OC_CON capacitors possess superior physical characteristics that can be while reducing the working temperature between 20 degrees Centigrade each time, intact extension 10 times of effective product operation lives, at not rising degrees Centigrade of working temperatures each time a relative one Jetway G.P.I Technology G.P.I is the acronym for the “Green Power Indicator” technology. Jetway’s motherboard series with G.P.I technology have a specially designed chip for real-time detecting CPU workload. The green power indicator will automatically turn off when CPU workload is heavy and turn on when CPU workload is light to indicate power saving mold being activated. Mainboard Specifications CPU Support INTEL® LGA1156 Processors Chipset INTEL® H55 Express Chipset Memory Dual Channel DDR3 memory technology 2 * 240-pin DDR3 DIMM slots Supports DDR3 1333/1066 non-ECC ,un-buffered memory Max.8GB Expansion Slots 1 * PCI Express x16 slot by 16-lane 2 * PCI Express x1 slots 1 * 32-bit PCI slot Storage Embedded INTEL H55 Chipset: 4 * Serial ATA2 3Gb/s connectors Audio Realtek ALC662 6-Channel HD Audio CODEC Ethernet LAN Realtek RTL8111DL PCI-E Gigabit LAN USB Special Features Embedded 8 * USB 2.0 Advanced Power Design that supports the latest LGA 1156 Processors The entire solid state electric capacity power supply guaranteed that various parts' electric power supply is sufficient, is stable. Support 3D Audio Technology & G.P.I function Rear Panel I / O 4 * USB 2.0 ports 1 * PS/2 keyboard/MS port 1 * RJ-45 ports 1 * Audio I/O ports 1 * VGA Port & 1 * DVI Port & 1 * HDMI Internal I / O 2 * USB 2.0 headers for 4 USB 2.0 ports CPU / Chassis Fan connectors 1 * 8-pin ATX 12V Power connector 1 * 24-pin ATX Power connector 1 * COM port 1 * HDMI_SPDIF header BIOS 32MB SMT Flash ROM Form Factor U-ATX Form Factor(200mm X 245mm)