Transcript
MJF6388 (NPN), MJF6668 (PNP) Complementary Power Darlingtons For Isolated Package Applications Designed for general−purpose amplifiers and switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink or chassis. Features
• Isolated Overmold Package • Electrically Similar to the Popular 2N6388, 2N6668, TIP102, • • • • •
and TIP107 No Isolating Washers Required, Reduced System Cost High DC Current Gain High Isolation Voltage UL Recognized at 3500 VRMS: File #E69369 These Devices are Pb−Free and are RoHS Compliant*
Value
Unit
VCEO
100
Vdc
Collector−Base Voltage
VCB
100
Vdc
Emitter−Base Voltage
VEB
5.0
Vdc
RMS Isolation Voltage (Note 1) (t = 0.3 sec, R.H. ≤ 30%, TA = 25_C) Per Figure 14 Collector Current − Continuous Collector Current − Peak (Note 2)
VISOL
Adc
15
Adc
IB
1.0
Adc
Total Power Dissipation (Note 3) @ TC = 25_C Derate above 25_C
PD
40 0.31
W W/_C
Total Power Dissipation @ TA = 25_C Derate above 25_C
PD
2.0 0.016
W W/_C
–65 to +150
_C
TJ, Tstg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Proper strike and creepage distance must be provided. 2. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle ≤ 10%. 3. Measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of ≥ 6 in. lbs.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ THERMAL CHARACTERISTICS Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case (Note 4)
RqJC
4.0
_C/W
Thermal Resistance, Junction−to−Ambient
RqJA
62.5
_C/W
Lead Temperature for Soldering Purposes
TL
260
_C
4. Measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of ≥ 6 in. lbs.
September, 2013 − Rev. 11
EMITTER 3
MJF6388 (NPN)
MJF6668 (PNP)
TO−220 FULLPACK CASE 221D STYLE 2 UL RECOGNIZED 1
10
ICM
© Semiconductor Components Industries, LLC, 2013
EMITTER 3
V
Base Current − Continuous
Operating and Storage Temperature Range
BASE 1
4500
IC
COLLECTOR 2
BASE 1
Symbol
Collector−Emitter Voltage
COMPLEMENTARY SILICON POWER DARLINGTONS 10 AMPERES 100 VOLTS, 40 WATTS COLLECTOR 2
MAXIMUM RATINGS Rating
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1
2
3
MARKING DIAGRAM
MJF6xy8 MJF6xy8G AYWW
G A Y WW
= Specific Device Code x = 3 or 6 y = 6 or 8 = Pb−Free Package = Assembly Location = Year = Work Week
ORDERING INFORMATION Device
Package
Shipping
MJF6388G
TO−220 FULLPACK (Pb−Free)
50 Units/Rail
MJF6668G
TO−220 FULLPACK (Pb−Free)
50 Units/Rail
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: MJF6388/D
MJF6388 (NPN), MJF6668 (PNP) ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) Characteristic
Symbol
Min
Max
100
−
−
10
− −
10 3.0
−
10
−
2.0
3000 1000 200 100
15000 − − −
− − − −
2.0 2.0 2.5 3.0
− −
2.8 4.5
−
2.5
20
−
Unit
OFF CHARACTERISTICS VCEO(sus)
Collector−Emitter Sustaining Voltage (Note 5) (IC = 30 mAdc, IB = 0) Collector Cutoff Current (VCE = 80 Vdc, IB = 0)
ICEO
Collector Cutoff Current (VCE = 100 Vdc, VEB(off) = 1.5 Vdc) (VCE = 100 Vdc, VEB(off) = 1.5 Vdc, TC = 125_C)
ICEX
Collector Cutoff Current (VCB = 100 Vdc, IE = 0)
ICBO
Emitter Cutoff Current (VBE = 5.0 Vdc, IC = 0)
IEBO
Vdc mAdc
mAdc mAdc mAdc mAdc
ON CHARACTERISTICS (Note 5) hFE
DC Current Gain (IC = 3.0 Adc, VCE = 4.0 Vdc) (IC = 5.0 Adc, VCE = 3.0 Vdc) (IC = 8.0 Adc, VCE = 4.0 Vdc) (IC = 10 Adc, VCE = 3.0 Vdc) Collector−Emitter Saturation Voltage (IC = 3.0 Adc, IB = 6.0 mAdc) (IC = 5.0 Adc, IB = 0.01 Adc) (IC = 8.0 Adc, IB = 80 mAdc) (IC = 10 Adc, IB = 0.1 Adc)
VCE(sat)
Base−Emitter Saturation Voltage (IC = 5.0 Adc, IB = 0.01 Adc) (IC = 10 Adc, IB = 0.1 Adc)
VBE(sat)
Base−Emitter On Voltage (IC = 8.0 Adc, VCE = 4.0 Vdc)
VBE(on)
−
Vdc
Vdc
Vdc
DYNAMIC CHARACTERISTICS Small−Signal Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc, ftest = 1.0 MHz)
|hfe|
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) MJF6388 MJF6668
Cob
Insulation Capacitance (Collector−to−External Heatsink)
− pF − −
200 300
−
3.0 Typ
1000
−
Cc−hs
Small−Signal Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc, f = 1.0 kHz)
pF
hfe
−
5. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. NPN MJF6388
PNP MJF6668 COLLECTOR
COLLECTOR
BASE
BASE
≈8k
≈8k
≈ 120
≈ 120
EMITTER
EMITTER
Figure 1. Darlington Schematic http://onsemi.com 2
MJF6388 (NPN), MJF6668 (PNP) VCC + 30 V
RB & RC VARIED TO OBTAIN DESIRED CURRENT LEVELS D1, MUST BE FAST RECOVERY TYPES, e.g., MUR110 USED ABOVE IB ≈ 100 mA MSD6100 USED BELOW IB ≈ 100 mA
RC
SCOPE
TUT V1 APPROX. +12 V
RB
V2 APPROX. -8 V
≈120
-4 V
25 ms
tr, tf ≤ 10 ns DUTY CYCLE = 1%
≈8 k
D1
51
FOR td AND tr, D1 IS DISCONNECTED AND V2 = 0 FOR NPN TEST CIRCUIT REVERSE ALL POLARITIES.
Figure 2. Switching Times Test Circuit
NPN MJF6388
PNP MJF6668 10 7 5
7 5 ts t, TIME (s) μ
tf 1 0.7 0.3 0.2 0.1 0.07 0.1
tr VCC = 30 V IC/IB = 250 IB1 = IB2 TJ = 25°C 0.2
tr
3
td
2 ts
1 0.7 0.5 0.3 0.2
1 0.5 2 IC, COLLECTOR CURRENT (AMPS)
5
0.1 0.1
10
td tf
3 0.5 0.7 1 2 0.3 IC, COLLECTOR CURRENT (AMPS)
0.2
Figure 3. Typical Switching Times
20 IC, COLLECTOR CURRENT (AMPS)
t, TIME (s) μ
3
VCC = 30 V IC/IB = 250 IB1 = IB2 TJ = 25°C
100 ms
10 5 3 2
dc
TJ = 150°C
1
5 ms
0.5 0.3 0.2
CURRENT LIMIT SECONDARY BREAKDOWN LIMIT THERMAL LIMIT @ TC = 25°C (SINGLE PULSE)
0.1 0.05 0.03 0.02
1ms
1
5 20 30 2 3 10 50 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 4. Maximum Forward Bias Safe Operating Area
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100
5
7
10
MJF6388 (NPN), MJF6668 (PNP)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1 0.5
D = 0.5
0.3
0.2
0.2 0.1 0.05 0.03
P(pk)
RqJC(t) = r(t) RqJC RqJC = °C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RqJC(t)
0.1
0.05 SINGLE PULSE
t1 t2 DUTY CYCLE, D = t1/t2
0.02 0.01 0.01 0.02
0.05
0.2 0.3 0.5
0.1
1
2 3
5
10
20 30 50 t, TIME (ms)
100 200 300 500
1K
2K 3K 5K
10K 20K 30K 50K 100K
Figure 5. Thermal Response
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC − VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 4 is based on TJ(pk) = l50_C; TC is variable depending on conditions. Secondary breakdown pulse limits are valid for duty cycles to 10% provided TJ(pk) < 150_C. TJ(pk) may be calculated from the data in Figure 5. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by secondary breakdown.
POWER DERATING FACTOR
1 SECOND BREAKDOWN DERATING
0.8
0.6 THERMAL DERATING
0.4
0.2
0
20
40
60
80
100
140
120
160
TC, CASE TEMPERATURE (°C)
Figure 6. Maximum Power Derating NPN MJF6388
PNP MJF6668
5000 3000 2000
5000
hFE , SMALL-SIGNAL CURRENT GAIN
10,000
hfe , SMALL-SIGNAL CURRENT GAIN
10,000
1000 500 300 200
TC = 25°C VCE = 4 Vdc IC = 3 Adc
100 50 30 20 10
1
2
5
10 20 50 100 f, FREQUENCY (kHz)
200
2000 1000 500
100 50 20 10
500 1000
TC = 25°C VCE = 4 VOLTS IC = 3 AMPS
200
1
2 3
5 7 10 20 30 50 70 100 f, FREQUENCY (kHz)
Figure 7. Typical Small−Signal Current Gain
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200 300 500 1000
MJF6388 (NPN), MJF6668 (PNP) NPN MJF6388
PNP MJF6668
300
300 TJ = 25°C
TJ = 25°C 200
100
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
200
Cob
70 Cib 50
30 0.1
Cib
100
Cob
70 50
0.2
0.5 1 2 5 10 20 VR, REVERSE VOLTAGE (VOLTS)
50
30 0.1
100
0.2
0.5 1 2 5 10 20 VR, REVERSE VOLTAGE (VOLTS)
50
100
Figure 8. Typical Capacitance
20,000
20,000 VCE = 4 V
VCE = 4 V 10,000
5000
TJ = 150°C
3000 2000
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
10,000
25°C
1000
-55°C
500 300 200 0.1
0.2
0.3
0.5 0.7
1
3
2
5
7
7000 5000
2000 25°C 1000 700 500 300 200 0.1
10
TJ = 150°C
3000
-55°C
0.2
0.3
0.5 0.7
1
2
3
5
7
10
IC, COLLECTOR CURRENT (AMP)
IC, COLLECTOR CURRENT (AMP)
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 9. Typical DC Current Gain
3 TJ = 25°C 2.6
IC = 2 A
4A
6A
2.2
1.8
1.4 1 0.3
0.5 0.7
1
2
3
5
7
10
20
3 TJ = 25°C 2.6
IC = 2 A
6A
2.2
1.8
1.4 1 0.3
30
4A
IB, BASE CURRENT (mA)
0.5 0.7
1
2
3
5
IB, BASE CURRENT (mA)
Figure 10. Typical Collector Saturation Region
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7
10
20
30
MJF6388 (NPN), MJF6668 (PNP) NPN MJF6388
PNP MJF6668
3
3 TJ = 25°C
TJ = 25°C 2.5 V, VOLTAGE (VOLTS)
V, VOLTAGE (VOLTS)
2.5
2 VBE(sat) @ IC/IB = 250 1.5 VBE @ VCE = 4 V 1
2
1.5
VBE @ VCE = 4 V VBE(sat) @ IC/IB = 250
1 VCE(sat) @ IC/IB = 250
VCE(sat) @ IC/IB = 250 0.5 0.1
0.5 0.2 0.3
0.5 0.7
1
2
3
5
7
10
0.1
0.2 0.3
0.5 0.7
1
2
3
5
7
10
7
10
IC, COLLECTOR CURRENT (AMP)
IC, COLLECTOR CURRENT (AMP)
Figure 11. Typical “On” Voltages
+4
+5 θV, TEMPERATURE COEFFICIENT (mV/ °C)
θV, TEMPERATURE COEFFICIENT (mV/ °C)
+5 *IC/IB ≤ hFE/3
+3 25°C to 150°C
+2 +1
-55°C to 25°C
0 -1 -2 -3 -4 -5 0.1
*qVC for VCE(sat) qVB for VBE
25°C to 150°C -55°C to 25°C
*IC/IB ≤ hFE/3
+4 +3
25°C to 150°C
+2 +1
-55°C to 25°C
0 -1
*qVC for VCE(sat)
-2 -3
qVB for VBE
25°C to 150°C -55°C to 25°C
-4 -5
0.2 0.3
0.5 0.7
1
2
3
5
7
0.1
10
IC, COLLECTOR CURRENT (AMP)
0.2 0.3 0.5 0.7 1 2 3 IC, COLLECTOR CURRENT (AMP)
5
Figure 12. Typical Temperature Coefficients
105
104
REVERSE
REVERSE
FORWARD IC, COLLECTOR CURRENT (A) μ
IC, COLLECTOR CURRENT (A) μ
105
VCE = 30 V 103 102 TJ = 150°C 101 100
100°C
25°C 10-1 -0.6 - 0.4 -0.2
0
+0.2 +0.4 +0.6 +0.8
+1
VCE = 30 V 103 102 101
TJ = 150°C 100°C
100 25°C 10-1 +0.6 +0.4 +0.2
+1.2 +1.4
FORWARD
104
VBE, BASE-EMITTER VOLTAGE (VOLTS)
0
-0.2 -0.4 -0.6 -0.8
-1
VBE, BASE-EMITTER VOLTAGE (VOLTS)
Figure 13. Typical Collector Cut−Off Region
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-1.2 -1.4
MJF6388 (NPN), MJF6668 (PNP) TEST CONDITION FOR ISOLATION TEST* FULLY ISOLATED PACKAGE LEADS
HEATSINK
0.110, MIN
Figure 14. Mounting Position *Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION 4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK COMPRESSION WASHER HEATSINK
NUT
Figure 15. Typical Mounting Techniques* Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. ** For more information about mounting power semiconductors see Application Note AN1040.
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MJF6388 (NPN), MJF6668 (PNP) PACKAGE DIMENSIONS
TO−220 FULLPAK CASE 221D−03 ISSUE K
−T− −B−
F
SEATING PLANE
C S
Q
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03.
U
A 1 2 3
H −Y−
K
G N L D
J R
3 PL
0.25 (0.010)
M
B
M
Y
DIM A B C D F G H J K L N Q R S U
INCHES MIN MAX 0.617 0.635 0.392 0.419 0.177 0.193 0.024 0.039 0.116 0.129 0.100 BSC 0.118 0.135 0.018 0.025 0.503 0.541 0.048 0.058 0.200 BSC 0.122 0.138 0.099 0.117 0.092 0.113 0.239 0.271
MILLIMETERS MIN MAX 15.67 16.12 9.96 10.63 4.50 4.90 0.60 1.00 2.95 3.28 2.54 BSC 3.00 3.43 0.45 0.63 12.78 13.73 1.23 1.47 5.08 BSC 3.10 3.50 2.51 2.96 2.34 2.87 6.06 6.88
STYLE 2: PIN 1. BASE 2. COLLECTOR 3. EMITTER
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MJF6388/D
