Transcript
Neo_WL680 Product Specifications V1.2
Neoway Technology Co., Ltd.
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Neo_WL680 Product Specifications
Copyright © Neoway Technology Co., Ltd 2014. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Shenzhen Neoway Technology Co., Ltd.
is the trademark of Neoway Technology Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice This document provides guide for users to use the WL680. This document is intended for system engineers (SEs), development engineers, and test engineers. The information in this document is subject to change without notice due to product version update or other reasons. Every effort has been made in preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.
Neoway provides customers complete technical support. If you have any question, please contact your account manager or email to the following email addresses:
[email protected] [email protected] Website: http://www.neoway.com.cn
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Neo_WL680 Product Specifications
Revision Record Issue
Changes
Date
V1.0
Initial draft
2013-08
V1.1
V1.2
Added the picture of the module
Modified the temperature curve
Modified the packaging figure
Modified the description of some pins
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2013-10
2014-02
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Neo_WL680 Product Specifications
Contents 1 Overview ............................................................................................................................. 1 2 Block Diagram.................................................................................................................... 1 3 Specifications ..................................................................................................................... 1 4 Encapsulation and Pins .................................................................................................... 2 4.1 Model .......................................................................................................................................... 2 4.2 Specifications and Encapsulation ................................................................................................ 2 4.3 Pin Definition .............................................................................................................................. 3
5 PCB Foot Print .................................................................................................................... 5 6 Reliability Indicators and Test Standards .................................................................... 5 6.1 Temperature and Test Standards .................................................................................................. 5 6.2 EMI/EMC Index and Test Standards ........................................................................................... 6
7 Mounting the Module onto the Application Board.................................................... 6 8 Package ................................................................................................................................ 6
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Neo_WL680 Product Specifications
1 Overview WL680 is a WiFi module that supports the IEEE802.11b/g/n protocol. It integrates wireless network protocol IEEE802.11 and TCP/IP protocol stacks inside. WL680 consists of MAC, baseband controller, RF transceiver, and power amplifier. You can control the module through the UART interfaces. It is widely applied to smart tablets, smart home, smart grids, and other industrial or consumer electronics. This document defines the features, indicators, and test standards of the WL680 module and provides reference for the hardware design of each interface.
2 Block Diagram The WL680 module consists of MCU control parts and WiFi processing parts. The MCU control part contains abundant interfaces.
I2C UART
PA
SAW
ADC
Filter
RF Section
MCU
PWM
Control
Audio
eHPI
MCU
BT
MAC Layer
3 Specifications Table 3-1 WL680 specifications Specifications
Description
Frequency
2.412 GHz to 2.484 GHz
Sensitivity
802.11b: -86 .5 dBm @ 11 Mbps (typical) 802.11g: -73 dBm @ 54 Mbps (typical) 802.11n: -69 dBm @ 65 Mbps (typical)
Transmit power
802.11b: +15 dBm (typical) 802.11g: +15 dBm (typical) 802.11n: +13 dBm (typical)
Data rate
802.11b: 1, 2, 5.5, 11 Mbit/s 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbit/s 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbit/s
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Neo_WL680 Product Specifications Wireless standards
IEEE802.11b/g /n
Modulation
DSSS, OFDM, DBPSK, DQPSK, CCK, QAM16/64
Operating
STA/AP
Network type
Infra/Adhoc/WIFI Direct (WFA P-2-P standard)
Security mechanism
WFA, WPA/WPA2, WPS2.0
Encryption type
WEP64/WEP128/TKIP/CCMP(AES)
Parameter configuration
UART/WEB server
Network protocol
TCP/IP, UDP, FTP, DNS, HTTP, SMTP
Communication interface
UART
UART rate
1200 to 921600 bit/s
AT
Extended AT commands
Open resources
UART, I2C, ADC, PWM, GPIO
Operating temperature
-30℃ to +80℃
Storage temperature
-40℃ to +85℃
Operating voltage
3.5 V to 4.3 V (3.9 V is recommended)
4 Encapsulation and Pins 4.1 Model Model
Function
Packaging
WL680-1-AA02
Standard module
71 Pin LGA 封装
4.2 Specifications and Encapsulation Specifications
WL680
Dimensions
18 mm x 15 mm x 2.1 mm
Weight
2g
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Neo_WL680 Product Specifications Packaging
71-pin LGA Figure 4-1 Appearance of the M680 module
4.3 Pin Definition Table 4-1 Wl680 pin definition Pin
Signal
I/O
Function
Reset Status
Level Feature (V)
1
ON/OFF
DI
On/Off input
I/PU
0＜VIL＜0.6
Low level pulse can change the On/Off state. 2-28, 30, 32-35 39, 40, 43, 49-45, 61, 62
Reserved
29, 31, 46, 48, 60, 63-67, 69-71
GND
P
GND
36
VMC
P
2.8 V power supply output
Remarks
2.1＜VIH＜VBA T
Reserved
Supply power for IO level shifting circuit. Load capability: less than 50 mA
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Neo_WL680 Product Specifications 37
URXD
DI
UART data receive
OI/PU
0＜VIL＜0.6
38
UTXD
DO
UART data transmit
O
2.1＜VIH＜3.0
With 47K pull-up inside
0＜VOL＜0.42 2.38＜VOH＜2.8 2.8 V, maximum output current 2 mA
41
VRTC
P
RTC power supply
42
DTR
DI
Signal for controlling sleep mode
I/PD
Status LED
I/PD
BACK_L IGHT
44
DO
0＜VIL＜0.6 2.1＜VIH＜3.0 0＜VIL＜0.6
2.8 V/4 mA output
2.1＜VIH＜3.0
Drive an LED directly
0＜VOL＜0.42
45
RESET
DI
Reset input
47
WIFI_A NT
I/O
WiFi interface
56
ADC
AI
ADC input
57-59
VBAT
P
Main power supply input
68
VBAT
P
Main power supply input
O
High level lights the LED directly.
2.38＜VOH＜2.8
Low level reset
0＜VI＜2.8
10-bit converter
Connect 50 Ω antenna A/D
3.5 V to 4.3 V (3.9 V is recommended)
P: indicates power supply pins I: indicates input O: indicates output DI: indicates digital signal input pins DO: indicates digital signal output pins Reserved: indicates reserved pins DI: indicates digital signal input pins DO: indicates digital signal output pins I/PD: indicates digital signal input pins with pulldown I/PU: indicates digital signal input pins with pullup AI: indicates analogy signal input pins AO: indicates analogy signal output pins
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Neo_WL680 Product Specifications
5 PCB Foot Print LGA packaging is adopted to package the pins of the WL680 module. Figure 5-1 shows the recommended PCB foot print. (unit: mm) Figure 5-1 PCB foot print recommended for M680
6 Reliability Indicators and Test Standards 6.1 Temperature and Test Standards
Operating temperature: –30°C to + 80°C
Storage temperature: –40°C to + 85°C
Humidity: 0% to 95%
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Neo_WL680 Product Specifications Figure 6-1 Temperature test curve
6.2 EMI/EMC Index and Test Standards
ESD anti-interference −
Contact discharge: test voltage 4 kV
−
Air discharge: test voltage 8 kV
RF immunity to electromagnetic radiation −
Radio continuous disturb −
Radiation intensity 10 V/M (frequency range: 80 MHz to 1000 MHz) Test range: 30 MHz to 1 GHz (peak value & average value)
Radio stray disturb −
Test range: 30 MH to 6000 MHz
7 Mounting the Module onto the Application Board M680 is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is process dependent, so the following recommendation is just a start point guideline:
Only one flow is supported.
Quality of the solder joint depends on the solder volume. Minimum of 0.15mm stencil thickness is recommended.
Use bigger aperture size of the stencil than actual pad size.
Use a low-residue, no-clean type solder paste.
8 Package M680 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules again in case of opening for any reasons. If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%, the baking procedure is also required. The baking should last for at least 24 hours at 90℃.
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