Transcript
NGTB15N60S1EG IGBT - Short-Circuit Rated This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost effective Non−Punch Through (NPT) Trench construction, and provides superior performance in demanding switching applications. Offering both low on state voltage and minimal switching loss, the IGBT is well suited for motor drive control and other hard switching applications. Incorporated into the device is a rugged co−packaged reverse recovery diode with a low forward voltage.
www.onsemi.com
15 A, 650 V VCEsat = 1.5 V
Features
• • • • • •
Low Saturation Voltage Resulting in Low Conduction Loss Low Switching Loss in Higher Frequency Applications Soft Fast Reverse Recovery Diode 5 ms Short Circuit Capability Excellent Current versus Package Size Performance Density This is a Pb−Free Device
C
G
Typical Applications
E
• White Goods Appliance Motor Control • General Purpose Inverter • AC and DC Motor Control C
ABSOLUTE MAXIMUM RATINGS Rating Collector−emitter voltage Collector current @ TC = 25°C @ TC = 100°C Pulsed collector current, Tpulse limited by TJmax Diode forward current @ TC = 25°C @ TC = 100°C
Symbol
Value
Unit
VCES
650
V
IC
A 30 15
ICM
120
A
IF
MARKING DIAGRAM
A
IFM
120
A
Gate−emitter voltage
VGE
$20
V
Power dissipation @ TC = 25°C @ TC = 100°C
PD
Short circuit withstand time VGE = 15 V, VCE = 400 V, TJ v +150°C
tSC
5
ms
Operating junction temperature range
TJ
−55 to +150
°C
Storage temperature range
Tstg
−55 to +150
°C
Lead temperature for soldering, 1/8” from case for 5 seconds
TSLD
260
°C
15N60S1G AYWW
W 117 47
A Y WW G
= Assembly Location = Year = Work Week = Pb−Free Package
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
April, 2015 − Rev. 6
E
30 15
Diode pulsed current, Tpulse limited by TJmax
© Semiconductor Components Industries, LLC, 2015
G C
TO−220 CASE 221A STYLE 9
1
Device
Package
Shipping
NGTB15N60S1EG
TO−220 (Pb−Free)
50 Units / Rail
Publication Order Number: NGTB15N60S1E/D
NGTB15N60S1EG THERMAL CHARACTERISTICS Symbol
Value
Unit
Thermal resistance junction to case, for IGBT
Rating
RqJC
1.06
°C/W
Thermal resistance junction to case, for Diode
RqJC
3.76
°C/W
Thermal resistance junction to ambient
RqJA
60
°C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Collector−emitter breakdown voltage, gate−emitter short−circuited
VGE = 0 V, IC = 500 mA VGE = 0 V, IC = 500 mA, TJ = −40°C
V(BR)CES
650 −
720 660
− −
V
Collector−emitter saturation voltage
VGE = 15 V , IC = 15 A VGE = 15 V , IC = 15 A, TJ = 150°C
VCEsat
1.3 1.55
1.5 1.75
1.7 1.95
V
VGE = VCE , IC = 250 mA
VGE(th)
4.5
5.5
6.5
V
VGE = 0 V, VCE = 650 V VGE = 0 V, VCE = 650 V, TJ = 150°C
ICES
− −
10 −
− 200
mA
Gate leakage current, collector−emitter short−circuited
VGE = 20 V, VCE = 0 V
IGES
−
−
100
nA
Forward Transconductance
VCE = 20 V, IC = 15 A
gfs
−
10.1
−
S
Cies
−
1950
−
Coes
−
70
−
Cres
−
42
−
Qg
−
88
−
Qge
−
16
−
Qgc
−
42
−
td(on)
−
65
−
tr
−
28
−
td(off)
−
170
−
tf
−
140
−
Eon
−
0.550
−
Turn−off switching loss
Eoff
−
0.350
−
Total switching loss
Ets
−
0.900
−
Turn−on delay time
td(on)
−
65
−
tr
−
28
−
td(off)
−
180
−
STATIC CHARACTERISTIC
Gate−emitter threshold voltage Collector−emitter cut−off current, gate−emitter short−circuited
DYNAMIC CHARACTERISTIC Input capacitance Output capacitance
VCE = 20 V, VGE = 0 V, f = 1 MHz
Reverse transfer capacitance Gate charge total Gate to emitter charge
VCE = 480 V, IC = 15 A, VGE = 15 V
Gate to collector charge
pF
nC
SWITCHING CHARACTERISTIC , INDUCTIVE LOAD Turn−on delay time Rise time Turn−off delay time Fall time Turn−on switching loss
TJ = 25°C VCC = 400 V, IC = 15 A Rg = 22 W VGE = 0 V / 15 V
Rise time Turn−off delay time Fall time
TJ = 150°C VCC = 400 V, IC = 15 A Rg = 22 W VGE = 0 V / 15 V
tf
−
260
−
Eon
−
0.650
−
Turn−off switching loss
Eoff
−
0.600
−
Total switching loss
Ets
−
1.250
−
VF
− −
1.65 1.75
1.85 −
Turn−on switching loss
ns
mJ
ns
mJ
DIODE CHARACTERISTIC Forward voltage
VGE = 0 V, IF = 15 A VGE = 0 V, IF = 15 A, TJ = 150°C
www.onsemi.com 2
V
NGTB15N60S1EG ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
trr
−
270
−
ns
Qrr
−
350
−
nc
Irrm
−
5
−
A
trr
−
350
−
ns
Qrr
−
1000
−
nc
Irrm
−
7.5
−
A
DIODE CHARACTERISTIC Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current
TJ = 25°C IF = 15 A, VR = 200 V diF/dt = 200 A/µs TJ = 125°C IF = 15 A, VR = 200 V diF/dt = 200 A/µs
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com 3
NGTB15N60S1EG TYPICAL CHARACTERISTICS 60
60 VGE = 17 V to 13 V
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
TJ = 25°C
VGE = 11 V
50 40 30 20
VGE = 9 V
10 VGE = 7 V
0 0
1
2
3
5
4
6
7
VGE = 11 V 40 30 VGE = 9 V
20 10
VGE = 7 V
8
0
1
2
3
5
4
6
7
VCE, COLLECTOR−EMITTER VOLTAGE (V)
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 1. Output Characteristics
Figure 2. Output Characteristics
8
60 VGE = 17 V to 13 V
60
IC, COLLECTOR CURRENT (A)
TJ = −40°C VGE = 11 V
50 40 30 20 VGE = 9 V 10 VGE = 7 V
0 0
1
2
3
4
5
TJ = 25°C 50 −40°C
150°C
40 30 20 10 0
7
6
0
8
2
4
6
8
10
12
14
VCE, COLLECTOR−EMITTER VOLTAGE (V)
VGE, GATE−EMITTER VOLTAGE (V)
Figure 3. Output Characteristics
Figure 4. Typical Transfer Characteristics
3.0
10,000 IC = 30 A
2.5 2.0
Cies CAPACITANCE (pF)
IC, COLLECTOR CURRENT (A)
VGE = 17 V to 13 V
0
70
VCE, COLLECTOR−EMITTER VOLTAGE (V)
TJ = 150°C 50
IC = 15 A IC = 10 A
1.5
IC = 5 A 1.0
1000
100 Coes
0.5 Cres 0 −50
10 −20
10
40
70
100
130
160
0
10
20
30
40
50
60
70
80
90 100
TJ, JUNCTION TEMPERATURE (°C)
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 5. VCE(sat) vs. TJ
Figure 6. Typical Capacitance
www.onsemi.com 4
NGTB15N60S1EG TYPICAL CHARACTERISTICS
20 VGE, GATE−EMITTER VOLTAGE (V)
IF, FORWARD CURRENT (A)
35 TJ = 25°C
30
−40°C
25
150°C
20 15 10 5
15
VCES = 480 V
10
5
0
0 0.5
0
1 1.5 VF, FORWARD VOLTAGE (V)
2
0
2.5
10
20
50
60
70
80
90 100
Figure 8. Typical Gate Charge
1000
0.7
tf SWITCHING TIME (ns)
Eon
0.6 SWITCHING LOSS (mJ)
40
QG, GATE CHARGE (nC)
Figure 7. Diode Forward Characteristics
0.5 Eoff
0.4 0.3 VCE = 400 V VGE = 15 V IC = 15 A Rg = 22 W
0.2 0.1 0
td(off)
100
td(on) tr 10 VCE = 400 V VGE = 15 V IC = 15 A Rg = 22 W
1 0
20
40
60
80
100
120
140
160
0
20
40
60
80
100
120
140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Switching Loss vs. Temperature
Figure 10. Switching Time vs. Temperature
1.4
1000 VCE = 400 V VGE = 15 V TJ = 150°C Rg = 22 W
1.0
tf
Eon
SWITCHING TIME (ns)
1.2 SWITCHING LOSS (mJ)
30
Eoff
0.8 0.6 0.4
td(off)
100
td(on) tr 10
VCE = 400 V VGE = 15 V TJ = 150°C Rg = 22 W
0.2 0
1 8
12
16
20
24
28
32
8
12
16
20
24
28
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
Figure 11. Switching Loss vs. IC
Figure 12. Switching Time vs. IC
www.onsemi.com 5
32
NGTB15N60S1EG TYPICAL CHARACTERISTICS 1.2
1000
0.9
tf SWITCHING TIME (ns)
SWITCHING LOSS (mJ)
Eon
VCE = 400 V VGE = 15 V IC = 15 A TJ = 150°C Eoff
0.6
0.3
0
15
25
35
45
55
65
75
85
tr 10
VCE = 400 V VGE = 15 V IC = 15 A TJ = 150°C 15
25
35
45
55
65
Rg, GATE RESISTOR (W)
Rg, GATE RESISTOR (W)
Figure 13. Switching Time vs. Rg
Figure 14. Switching Time vs. Rg
75
85
1000 VGE = 15 V IC = 15 A Rg = 22 W TJ = 150°C
0.9
tf
Eon
SWITCHING TIME (ns)
SWITCHING LOSS (mJ)
td(on)
5
Eoff
0.6
0.3
td_off
100
td_on tr 10
VGE = 15 V IC = 15 A Rg = 22 W TJ = 150°C
1 175
225
275
325
375
425
475
525
575
175 225
275
325
375
425
475
525
VCE, COLLECTOR−EMITTER VOLTAGE (V)
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 15. Switching Loss vs. VCE
Figure 16. Switching Time vs. VCE
575
1000
1000 1 ms
100 ms
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
100
1 5
1.2
0
td(off)
100 50 ms
10 dc operation 1 Single Nonrepetitive Pulse TC = 25°C Curves must be derated linearly with increase in temperature
0.1 0.01 1
10
100
10
1
0.1 VGE = 15 V, TC = 125°C
0.01 100
1
1000
10
100
1000
VCE, COLLECTOR−EMITTER VOLTAGE (V)
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 17. Safe Operating Area
Figure 18. Reverse Bias Safe Operating Area
www.onsemi.com 6
NGTB15N60S1EG TYPICAL CHARACTERISTICS
THERMAL RESPONSE (ZqJC)
10
1
0.1
RqJC = 1.06 50% Duty Cycle
Ri (°C/W)
20% 10% 5%
Junction R1
Rn
C2
Cn
C1
1% Single Pulse
0.001 0.000001
Case
Ci = ti/Ri
2% 0.01
R2
ti (sec)
0.1 0.05010 0.15051 0.33992 0.10550
7.1E−5 1.0E−4 0.002 0.003 0.00999
0.20020
0.03
0.11423
0.1
Duty Factor = t1/t2 Peak TJ = PDM x ZqJC + TC
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 19. IGBT Transient Thermal Impedance
THERMAL RESPONSE (ZqJC)
10 50% Duty Cycle 1
RqJC = 3.76
20% 10% 5% 2%
Ri (°C/W)
0.1
Duty Factor = t1/t2 Peak TJ = PDM x ZqJC + TC
1% Single Pulse
Junction R1
Rn
Case
Ci = ti/Ri
0.01
C1 0.001 0.000001
R2
0.00001
0.0001
0.001
0.01 0.1 PULSE TIME (sec)
C2
Cn 1
Figure 20. Diode Transient Thermal Impedance
Figure 21. Test Circuit for Switching Characteristics
www.onsemi.com 7
10
ti (sec)
0.01895 0.04097 0.12956 0.1 0.20199
1.0E−7 1.0E−6 1.0E−5 7.1E−5 1.0E−4
1.62730
0.002
0.57301
0.003
0.45453
0.00498
0.40199
0.03
0.21558
0.1
100
1000
NGTB15N60S1EG
Figure 22. Definition of Turn On Waveform
www.onsemi.com 8
NGTB15N60S1EG
Figure 23. Definition of Turn Off Waveform
www.onsemi.com 9
NGTB15N60S1EG PACKAGE DIMENSIONS TO−220 CASE 221A−09 ISSUE AH
−T− B
SEATING PLANE
C
F T
S
4
DIM A B C D F G H J K L N Q R S T U V Z
A
Q 1 2 3
U
H K Z L
R
V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
J
G D N
INCHES MIN MAX 0.570 0.620 0.380 0.415 0.160 0.190 0.025 0.038 0.142 0.161 0.095 0.105 0.110 0.161 0.014 0.024 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080
STYLE 9: PIN 1. 2. 3. 4.
MILLIMETERS MIN MAX 14.48 15.75 9.66 10.53 4.07 4.83 0.64 0.96 3.61 4.09 2.42 2.66 2.80 4.10 0.36 0.61 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04
GATE COLLECTOR EMITTER COLLECTOR
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email:
[email protected]
N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050
www.onsemi.com 10
ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
NGTB15N60S1E/D