Transcript
NVC-MDCS52 Datasheet Ver.2.0
NovaComm NVC-MDCS52 Datasheet
Ver.2.0 Mar 03, 2012
Copyright © 2011-2012 NovaComm Technologies All rights reserved. NovaComm Technologies assumes no responsibility for any errors, which may appear in this document. Furthermore, NovaComm Technologies reserves the right to alter the hardware, software, and/or specifications detailed herein at any time without notice, and do not make any commitment to update the information contained herein. NovaComm Technologies’ products are not authorized for use as critical components in life support devices or systems. The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA. All other trademarks listed herein are owned by their respective owners. NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
Release Record Version
Release Date
2.0
Mar 03, 2012
Comments Release
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NVC-MDCS52 Datasheet Ver.2.0
1. Table of Contents Please also supply the customer firmware code issued by NovaComm Technologies when you place the order. 6 1. Pinout and Description
2
1.1
Pin Configuration
7
1.2
Pin Configuration
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Electrical Characteristic
10
2.1
Absolute Maximum Rating
10
2.2
Recommended Operating Conditions
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2.3
Input/output Terminal Characteristics
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2.4 3
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2.3.1
Digital Terminals
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2.3.2
Internal CODEC - Analogue to Digital Converter
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2.3.3
Internal CODEC - Digital to Analogue Converter
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2.3.4
Microphone Input
12
2.3.5
Speaker Output
12
Power consumptions
13
Physical Interfaces
13
3.1
Power Supply
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3.2
Reset
13
3.3
Audio interface
14
3.3.1
Audio input and output
14
3.3.2
Audio codec interface
14
3.4
RF Interface
17
3.5
General Purpose Analog IO
17
3.6
General Purpose Digital IO
17
3.7
Serial Interfaces
17
3.7.1
Bluetooth UART
17
3.7.2
MCU UART
18
3.7.3
SPI Interface
18
2. NVC-MDCS26 Stacks
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3. Reference Design
19
4. Recommended PCB Mounting Pattern
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5. Layout and Soldering Considerations
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5.1
Soldering Recommendations
21
5.2
Layout Guidelines
21
5.2.1 Antenna Connection and Grounding Plane Design
22
6. Package
23
7. Contact Information
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NVC-MDCS52 Datasheet Ver.2.0
2. Table of Tables Table 1: Ordering Information .......................................................................................................................... 6 Table 2: Pin Definition ....................................................................................................................................... 9 Table 3: Absolute Maximum Rating .............................................................................................................. 10 Table 4 : Recommended Operating Conditions .......................................................................................... 10 Table 5 : Digital Terminal ................................................................................................................................ 11 Table 6 : Analogue to Digital Converter ....................................................................................................... 11 Table 7 : Digital to Analogue Converter ....................................................................................................... 12 Table 8 : Microphone Input ............................................................................................................................. 12 Table 9 : Microphone Output .......................................................................................................................... 13 Table 10 : Power consumptions .................................................................................................................... 13 Table 11 : Pin Status on Reset ...................................................................................................................... 14 Table 12 : Possible UART Settings ............................................................................................................... 18
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NVC-MDCS52 Datasheet Ver.2.0
3. Table of Figures Figure 1: Pinout for NVC-MDCS52 ................................................................................................................. 7 Figure 2: Audio interface ................................................................................................................................ 14 Figure 3 : Codec Audio Input and Output Stages ....................................................................................... 15 Figure 4: Microphone Biasing (Single Channel Shown) ............................................................................. 16 Figure 5: Speaker output ................................................................................................................................ 17 Figure 6: NVC-MDCS52 Stacks .................................................................................................................... 18 Figure 7: Reference design ............................................................................................................................ 19 Figure 8: Recommended PCB Mounting Pattern ........................................................................................ 20 Figure 9 : Placement the Module on a System Board ................................................................................ 22 Figure 10 : Leave 5mm Clearance Space from the Antenna .................................................................... 22 Figure 11 : Recommended Trace Connects Antenna and the Module .................................................... 23
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NVC-MDCS52 Datasheet Ver.2.0
Description:
Features:
NVC-MDCS52 is a class 2 Bluetooth® 2.1 module. It is based on CSR’s BlueCore5-Multimedia ROM . With internal DSP and audio codec, it is an idea solution for integrating Bluetooth® audio functions into various products with limited knowledge of Bluetooth® and RF technologies. With NovaComm’s iNova® stack, designers can easily customize their applications to support different Bluetooth profiles, such as HS/HF, A2DP, AVRCP. The module includes standard CVC dual and single microphone algorithms for echo cancellation and noise suppression. Please contact NovaComm for CVC software license.
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Bluetooth® v2.1+EDR（Class2）
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Support Profiles: HS/HF, A2DP,
Typical Bluetooth audio applications:
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Automobile hands-free applications
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Stereo headset applications
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Medical devices
AVRCP. l
Built-in EEPROM can be configured to PIO events
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Internal LED control
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Programmable battery detection, charging port
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PIO control or UART control last number redial, transfer audio, three ways calling, Play/Pause/next/prey music. Build-in 64MIPS Kalimba DSP coprocessor, support echo and noise reduction.
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23.24mm x 11.30mm x 2.45mm
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SMT pads for easy and reliable PCB mounting.
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BQB/FCC/CE Certified
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RoHS compliant
Table 1: Ordering Information
Ordering Number
Package
NVC-MDCS52
Plastic tray
Items in Package 100PCS
One Comments
Please also supply the customer firmware code issued by NovaComm Technologies when you place the order. NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
1. Pinout and Description 1.1 Pin Configuration
Figure 1: Pinout for NVC-MDCS52
1.2 Pin Configuration Pin
Symbol
I/O Type
Description
1
LED0
Open drain
LED driver
2
LED1
Open drain
LED driver
UART_TX
Bi-directional CMOS output, tri-state, with weak internal
Bluetooth UART data output
3
pull-up CMOS input with weak
4
UART_RX
5
AIO1
Bi-directional
Analogue Programmable input/output line
6
AIO0
Bi-directional
Analogue Programmable input/output line
7
1V8
1V8 Power output
1V8 Power output
8
GND
Ground
Ground
9
NC
NC
NC
10
NC
NC
NC
11
NC
NC
NC
UART_RTS
Bi-directional CMOS output, tri-state, with weak internal
UART request to send active low
12
internal pull-down
Bluetooth UART data input
pull-up NovaComm Technologies Confidential
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13
UART_CTS
14
MCU_RX
15
MCU_TX
CMOS input with weak internal pull-down CMOS input with weak internal pull-down Bi-directional CMOS output, tri-state, with weak internal
NVC-MDCS52 Datasheet Ver.2.0
UART clear to send active low MCU UART data input
MCU UART data output
pull-up Bi-directional with 16
PIO9
programmable strength
Programmable input/output line
internal pull-up/down 17
NC
NC
NC
Bi-directional with 18
PIO12
programmable strength
Programmable input/output line
internal pull-up/down 19 20
GND
Ground
Ground
PIO5
Bi-directional with programmable strength
Programmable input/output line
internal pull-up/down 21 22
NC
NC
NC
PIO14
Bi-directional with programmable strength
Programmable input/output line
internal pull-up/down 23
PIO4
Bi-directional with programmable strength
Programmable input/output line
internal pull-up/down 24
NC
NC
NC
25
NC
NC
NC
26
GND
Ground
Ground
27
RESET
CMOS input with weak
Rest if low input debounced so must be low
internal put-up
for >5ms to cause a reset
28
SPI_CLK
input with weak internal
Serial Peripheral interface clock for
pull-down
programming only
29
SPI_CSB
CMOS input with weak
Chip select for Synchronous Serial
internal pull-up
Interface for programming only, active low
30
SPI_MISO
CMOS output, tri-state, with
Serial Peripheral Interface output for
weak internal pull-down
programming only
31
SPI_MOSI
CMOS input, with weak
Serial Peripheral Interface input for
internal pull-down
programming only
32
NC
NC
NC
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NVC-MDCS52 Datasheet Ver.2.0
Bi-directional with 33
Power on
programmable strength
Power on enable
internal pull-up/down 34
NC
NC
NC
35
1V8
1V8 output
1V8 output
Battery terminal +ve
Lithium ion/polymer battery positive terminal. Battery charger output and input
36
BAT
to switch-mode regulator 37
VDD_CHG
Charger input
Lithium ion/polymer battery charger input
38
GND
Ground
Ground
39
MIC_RP
Analogue
Microphone input positive(right side)
40
MIC_RN
Analogue
Microphone input negative(right side)
41
MIC_LN
Analogue
Microphone input negative(left side)
42
MIC_LP
Analogue
Microphone input positive(left side)
43
SPK_RN
Analogue
Speaker output negative (right side)
44
SPK_RP
Analogue
Speaker output positive (right side)
45
SPK_LN
Analogue
Speaker output negative (left side)
46
SPK_LP
Analogue
Speaker output positive (left side)
47
MIC_BIAS
Analogue
Microphone bias
PIO0
Bi-directional with programmable strength
Programmable input/output line
48
internal pull-up/down 49
NC
NC
NC
50
GND
Ground
Ground
51
RF_IN
RF input
RF input
52
GND
Ground
Ground
PIO1
Bi-directional with programmable strength
Programmable input/output line
53
internal pull-up/down 54
PIO2
Bi-directional with programmable strength
Programmable input/output line
internal pull-up/down 55
PIO3
Bi-directional with programmable strength
Programmable input/output line
internal pull-up/down 56
GND
Ground
Ground Table 2: Pin Definition
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NVC-MDCS52 Datasheet Ver.2.0
2 Electrical Characteristic 2.1
Absolute Maximum Rating
Rating
Min
Max
Unit
Storage Temperature
-40
+105
°C
Operating Temperature
-20
+70
°C
PIO/AIO Voltage
-0.4
+3.6
V
BAT_P
-0.4
+4.4
V
VDD_CHG
-0.4
+6.5
V
Other Terminal Voltages except RF
-0.4
VDD+0.4
V
Table 3: Absolute Maximum Rating
2.2
Recommended Operating Conditions
Operating Condition
Min
Typical
Max
Unit
Storage Temperature
-40
--
+85
°C
Operating Temperature Range
-20
20
+70
°C
PIO/AIO Voltage
1.7
3.3
3.6
V
BAT_P
+3.3
+3.7
+4.3
V
Table 4 : Recommended Operating Conditions
2.3
Input/output Terminal Characteristics
2.3.1 Digital Terminals Supply Voltage Levels
Min
Typical
Max
Unit
VIL input logic level low
-0.3
-
+0.25xVDD
V
VIH input logic level high
0.625VDD
-
VDD+0.3
V
-
-
0.125
V
0.75xVDD
-
0.625xVDD
V
Input Voltage Levels
Output Voltage Levels VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA NovaComm Technologies Confidential
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Input and Tri-state
NVC-MDCS52 Datasheet Ver.2.0
Current
Ii input leakage current at Vin=VDD or 0V
-100
0
100
nA
-100
0
100
nA
-100
-40
-10
µA
With strong pull-down
10
40
100
µA
With weak pull-up
-5
-1.0
-0.2
µA
-0.2
+1.0
5.0
µA
I/O pad leakage current
-1
0
+1
µA
CI Input Capacitance
1.0
-
5.0
pF
Rpuw weak pull-up strength at VDD-0.2V
500k
-
2M
Ω
Rpdw weak pull-up strength at 0.2V
500k
-
2M
Ω
Rpus strong pull-up strength at VDD-0.2V
10k
-
50k
Ω
Rpds strong pull-up strength at 0.2V
10k
-
50k
Ω
Ioz tri-state output leakage current at Vo=VDD or 0V With strong pull-up
With weak pull-down
Resistive Strength
Table 5 : Digital Terminal
2.3.2 Internal CODEC - Analogue to Digital Converter Parameter
Min
Typical
Max
Unit
Resolution
-
-
16
Bits
Input Sample Rate
-
8
-
kHz
-
79
-
dB
-24
-
21.5
dB
Signal / Noise, fin=1kHz, BW=20Hz->20kHz A-Weighted THD+N<1% 150mV Vpk-pk Fsample = 8kHz Digital Gain
Table 6 : Analogue to Digital Converter
2.3.3 Internal CODEC - Digital to Analogue Converter Parameter
Min
Typical
Max
Unit
Resolution
-
-
16
Bits
Output Sample Rate, Fsample
8
-
48
kHz
Signal / Noise, fin=1kHz, BW=20Hz->20kHz A-Weighted THD+N<0.01% 0dBFS signal NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
Load-100kΩ Fsample = 8kHz
-
95
-
dB
Fsample = 11.025kHz
-
95
-
dB
Fsample = 16kHz
-
95
-
dB
Fsample = 22.05kHz
-
95
-
dB
Fsample = 32kHz
-
95
-
dB
Fsample = 44kHz
-
95
-
dB
Fsample = 48kHz
-
95
-
dB
-24
-
21.5
dB
Digital Gain Gain Resolution
1/32
dB
Table 7 : Digital to Analogue Converter
2.3.4 Microphone Input Microphone Input
Min
Typical
Max
Unit
-
4
-
mV rms
800
-
mV rms
Input full scale at maximum gain Input full scale at minimum gain(differential) Gain
-3
-
42
dB
Gain resolution
-
3
-
dB
Distortion at 1kHz
-
-
-74
dB
3dB Bandwidth
-
20
kHz
Input impedance
-
6
kΩ
THD+N(microphone input)@30mV rms input
-
0.04
-
%
Table 8 : Microphone Input
2.3.5 Speaker Output Speaker Driver
Min
Typical
Max
Unit
Output voltage full scale swing (differential)
-
750
-
mV rms
THD+N 100kΩ load
-
-
0.01%
%
THD+N 16Ω load
-
-
0.1%
%
-
95
-
dB
16(8)
-
O.C.
Ω
-
-
500
pF
SNR(Load=16Ω, 0dBFS input relative to digital silence) Allowed Load NovaComm Technologies Confidential
Resistive Capacitive
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NVC-MDCS52 Datasheet Ver.2.0
Table 9 : Microphone Output
2.4
Power consumptions
Operating Condition
Min
Typical
Connected Idle (Sniff 1.28 secs)
Max
0.45
Connected with audio streaming
30
35
Deep Sleep Idle mode
Unit mA
40
50
mA uA
Table 10 : Power consumptions
3 Physical Interfaces 3.1 Power Supply The module Regulator transient response is very important. If the voltage supplied from an external power module rails, any use of the regulator's transient response is 20 microseconds or less. Best to design the circuit 4.7uF capacitor at VBAT pins plus.
3.2
Reset
The module may be reset from several sources: RESETB pin, power-on reset。The RESETB pin is an active low reset and is internally filtered using the internal high frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-downs.
Pin Name / Group
Pin Status on Reset
UART_RX
Input with PD
UART_TX
Tri-state output with PU
SPI_MOSI
Input with PD
SPI_CLK
Input with PD
SPI_CSB
Input with PU
SPI_MISO
Tri-state output with PD
RESETB
Input with PD
PIOs
Bi-directional with PU/PD
AIOs
Output, drive low
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RF-IN
NVC-MDCS52 Datasheet Ver.2.0
High impedance Table 11 : Pin Status on Reset
Note: Pull-up (PU) and pull-down (PD) default to weak values unless specified otherwise.
3.3
Audio interface
The module audio interface circuit consists of: ■ ■
Stereo audio DAC and outputs Dual channel mono voice band ADC with dual microphone inputs
The audio interface supports all requirements of the module stereo headset solution and Figure 3 shows the functional blocks of the module audio interface. The audio interface supports stereo playback of audio signals at multiple sample rates with 16-bit resolution.
Figure 2: Audio interface
3.3.1
Audio input and output
The audio input circuitry consists of a dual audio input that can be configured to be either single-ended or fully differential and programmed for either microphone or line input. It has an analogue and digital programmable gain stage for optimization of different microphones. The audio output circuitry consists of a dual differential class A-B output stage.
3.3.2 Audio codec interface The main features of the interface are: ■ Stereo and mono analogue output for voice band and audio band ■ Dual mono analogue microphone input for voice band Important Note: To avoid any confusion regarding stereo operation this data sheet explicitly states which the left and NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
right channel for audio output is. With respect to software and any registers, channel 0 or channel A represents the left channel and channel 1 or channel B represents the right channel for output.
3.3.2.1 Radio codec block diagram
Figure 3 : Codec Audio Input and Output Stages
The audio codec uses a fully differential architecture in the analogue signal path, which results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. It operates from a single power- supply of 1.5V and uses a minimum of external components.
3.3.2.2 ADC The ADC consists of: ■
2 second-order Sigma Delta converters allowing two separate channels that are identical in functionality, as shown in Figure 4 ■ 2 gain stages for each channel, one of which is an analogue gain stage and the other is a digital gain stage.
3.3.2.3 ADC sample rate Each ADC supports 8kHz sample rate only. NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
3.3.2.4 DAC The DAC consists of: ■ 2 second-order Sigma Delta converters allowing 2 separate channels that are identical in functionality, as Figure 4 shows. ■ 2 gain stages for each channel: one is an analogue gain stage and the other is a digital gain stage.
3.3.2.5 DAC sample rate Each DAC supports the following samples rates: ■ 8kHz ■ 11.025kHz ■ 12kHz ■ 16kHz ■ 22.050kHz ■ 24kHz ■ 32kHz ■ 44.1kHz ■ 48kHz
3.3.2.6 Microphone input
Figure 4: Microphone Biasing (Single Channel Shown)
The audio input is intended for use in the range from 1µA @ 94dB SPL to about 10µA @ 94dB SPL. With biasing resistors R1 and R2 equal to 1kΩ, this requires microphones with sensitivity between about – 40dBV and –60dBV.
3.3.2.7 Output stage The output stage digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to bit stream, which is fed into the analogue output circuitry. The output stage circuit comprises a DAC with gain setting and class AB output stage amplifier. The output is available as a differential signal between SPKR_A_N and SPKR_A_P for the left channel, as Figure 6 shows, and between SPKR_B_N and SPKR_B_P for the right channel.
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Figure 5:
3.4
NVC-MDCS52 Datasheet Ver.2.0
Speaker output
RF Interface
The module integrates a balun filter. The user can connect a 50ohms antenna directly to the RF port.
3.5
General Purpose Analog IO
The general purpose analog IOs can be configured as ADC inputs by software. Do not connect them if not use.
3.6
General Purpose Digital IO
There are nine general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use.
3.7
Serial Interfaces
3.7.1 Bluetooth UART The module has a standard UART serial interface that provides a simple mechanism for communicating using RS232 protocol. When The module is connected to another digital device, UART_RX and UART_TX transfer data between the 2 devices. The remaining 2 signals, UART_CTS and UART_RTS, can implement RS232 hardware flow control where both are active low indicators.
Parameter Baud Rate
Possible Values Minimum Maximum
1200 baud (≤2%Error) 9600 baud (≤1%Error) 4M baud (≤1%Error)
Flow Control
RTS/CTS or None
Parity
None, Odd or Even
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NVC-MDCS52 Datasheet Ver.2.0
Number of Stop Bits
1 or 2
Bits per Byte
8 Table 12 : Possible UART Settings
Note: This serial port is only used as a test interface
3.7.2 MCU UART The module has a MCU UART programming interface With NovaComm’s iNova® stack, designers can easily customize their applications to support different Bluetooth profiles, such as HS/HF, A2DP, AVRCP.
3.7.3 SPI Interface The synchronous serial port interface (SPI) is for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory. SPI interface is connected using the MOSI, MISO, CSB and CLK pins.
2. NVC-MDCS26 Stacks
UART
MCU
Figure 6: NVC-MDCS52 Stacks NovaComm Technologies Confidential
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NVC-MDCS52 Datasheet Ver.2.0
3. Reference Design
Figure 7: Reference design
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NVC-MDCS52 Datasheet Ver.2.0
4. Recommended PCB Mounting Pattern
Figure 8: Recommended PCB Mounting Pattern
5. Layout and Soldering Considerations
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NVC-MDCS52 Datasheet Ver.2.0
5.1 Soldering Recommendations NVC-MDCS52 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. NovaComm Technologies will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. l
Refer to technical documentations of particular solder paste for profile configurations
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Avoid using more than one flow.
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Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150mm stencil thickness is recommended.
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Aperture size of the stencil should be 1:1 with the pad size.
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A low residue, “no clean” solder paste should be used due to low mounted height of the component.
5.2 Layout Guidelines Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50Ω and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss. As indicated in Figure 9
below, RF critical circuits of the module should be clearly separated from any
digital circuits on the system board.
All RF circuits in the module are close to the antenna port.
The
module, then, should be placed in this way that module digital part towards your digital section of the system PCB.
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NVC-MDCS52 Datasheet Ver.2.0
Figure 9 : Placement the Module on a System Board
5.2.1 Antenna Connection and Grounding Plane Design
Figure 10 : Leave 5mm Clearance Space from the Antenna
General design recommendations are: l
The length of the trace or connection line should be kept as short as possible.
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Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness. Routing the RF close to digital sections of the system board should be avoided. To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing.
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NVC-MDCS52 Datasheet Ver.2.0
Figure 11 : Recommended Trace Connects Antenna and the Module
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Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes.
6. Package 7. Contact Information Sales:
[email protected] Technical support:
[email protected] Orders:
[email protected] Phone: +86 21 60453799 Fax: +86 21 60453796 Street address: 902A, #560 Shengxia Rd., ZJ Inno Park, Shanghai 201203, China
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