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Op1-bp Datasheet

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Weiss Engineering Ltd. OP1-BP General Description Noise √ 1 nV/ Hz voltage noise density at 1 kHz 30 nVPP voltage noise 0.1–10 Hz √ 0.7 pA/ Hz current noise density at 1 kHz 80 pAPP current noise 0.1–10 Hz The OP1-BP is a discrete operational amplifier particularly optimised for audio applications. Its wide output swing and superior load driving capability (27 VPP into 200 Ω), very low distortion (−152 dB) √ and very low noise (1 nV/ Hz) leads to signal paths with exceptionally wide dynamic range. The excellent AC characteristics (50 V/µs slew-rate and 95 MHz gain bandwidth) ensures exemplary performance at ultrasound frequencies. This is combined with low input offset voltage (±10 µV), low input bias and input offset current (±60 nA and ±10 nA), good CMRR and PSRR (130 dB) and wide power supply range (±5 V to ±18 V) to form a true high performance general purpose amplifier. Besides high-end audio the OP1-BP is useful for any critical application which requires very wide dynamic range and low distortion analogue signal processing; typical examples include spectrum analyzers, infrared detectors and low distortion oscillators. ar y Features im in THD+N −152 dB (+20 dBu, 1 kHz, 22 kHz BW, 600 Ω load) −148 dB (+20 dBu, 10 kHz, 80 kHz BW, 600 Ω load) AC characteristics 50 V/µs slew-rate, highly symmetrical 95 MHz gain bandwidth (G = 80 dB) 700 kHz full power bandwidth (20 VPP into 600 Ω) 300 kHz full power bandwidth (20 VPP into 200 Ω) DC characteristics ±10 µV input offset voltage ±60 nA input bias current ±2 nA input offset current Pr el Load driving capability 27 VPP (+21.8 dBu) into 200 Ω (±15 V supply) 20 VPP (+19.2 dBu) into 100 Ω (±15 V supply) 10 VPP (+13.2 dBu) into 50 Ω (±15 V supply) adjustable class A output current Applications • high performance audio • low noise, low distortion preamplifiers • high resolution ADC drivers • high resolution DAC IV converters • headphone amplifiers and high-power line driver • low distortion active filters • high resolution instrumentation 1 ar y Contents 1 Revision History 3 2 Specifications 4 im in 3 Absolute Maximum Ratings 5 4 Typical Performance Characteristics 6 5 Theory Of Operation 15 5.1 Discrete vs. IC Operational Amplifiers . . . . . . . . . . . . . . . 15 5.2 Amplifier Architecture and Implementation . . . . . . . . . . . . 16 5.3 Manufacturing Information . . . . . . . . . . . . . . . . . . . . . 18 Pr el 6 Applications Information 6.1 Noise and Source Impedance Considerations . . . . . 6.2 Low Distortion Implementation . . . . . . . . . . . . 6.3 Class A Output Current Adjustment . . . . . . . . . 6.4 DC Precision . . . . . . . . . . . . . . . . . . . . . . 6.5 Ground Pin Connection . . . . . . . . . . . . . . . . 6.6 Feedback Capacitor Selection . . . . . . . . . . . . . 6.7 Power Supply Bypassing and Layout Considerations 6.8 Driving Capacitive Loads . . . . . . . . . . . . . . . 6.9 Sockets and Handling . . . . . . . . . . . . . . . . . 7 Outline Dimensions and Pinout 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19 21 21 22 23 23 24 25 25 27 Revision History ar y Chapter 1 im in 2011-10-27, Revision 2: Revision history section added; typical performance characteristics section extended; outline dimenstions section extended. Pr el 2011-01-21, Revision 1: Initial revision, preliminary. 3 ar y Chapter 2 Specifications im in The following specifications apply for TA = +25◦ C, VS = ±15 V and amplifier fully warmed up unless otherwise noted. Parameter Input Offset Voltage Input Offset Current Input Bias Current Open Loop Gain el Gain Bandwidth Product Unity Gain Frequency Slew Rate Power Supply Rejection Input Voltage Noise Density Pr Input Voltage Noise Input Voltage Noise Density 1/f Corner Input Current Noise Density Input Current Noise Input Current Noise Density 1/f Corner Output Voltage Swing Factory Preset Class A Output Current Recommended Power Supply Voltage Quiescent Current Ground Pin Current Condition Min RL = 600 Ω RL = 200 Ω G = 80 dB RL = 600 Ω f = 10 Hz f = 1 kHz f = 10 Hz 0.1–10 Hz f = 1 kHz f = 10 Hz 0.1–10 Hz RL RL RL RL = = = = 600 Ω 200 Ω 100 Ω 50 Ω Typ ±10 ±2 ±60 136 134 95 8 ±50 130 1 1 30 0.6 0.7 1.4 80 23 ±14 ±13.5 ±10 ±5 ±30 ±5 no load 4 Max ±50 ±150 ±18 42 6.5 Unit µV nA nA dB dB MHz MHz V/µs dB √ nV/ Hz √ nV/ Hz nVPP Hz √ pA/ Hz √ pA/ Hz pAPP Hz V V V V mA V mA µA ar y Chapter 3 Absolute Maximum Ratings Ratings ±22 V VCC + 0.7 V VEE − 0.7 V ±100 mA 3W Indefinite Within Maximum Power Dissipation −65◦ C to +125◦ C −40◦ C to +85◦ C 300◦ C im in Parameter Supply Voltage Input Voltage Differential Input Current Maximum Power Dissipation Output Short-Circuit Duration Storage Temperature Range Operating Temperature Range Lead Temperature (Soldering, 10 sec.) Pr el Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5 ar y Chapter 4 im in Typical Performance Characteristics Pr el The following typical performance characteristics apply for TA = +25◦ C, VS = ±15 V and the amplifier fully warmed up unless otherwise noted. 6 Distribution of Inverting Input Bias Current, 87 Units 20 18 18 16 16 14 14 12 10 8 12 10 8 6 6 4 4 2 2 0 −150 −50 0 50 noninverting input bias current [nA] 100 0 −150 150 −100 −50 0 50 inverting input bias current [nA] 100 150 im in −100 ar y percentage of untis [%] percentage of untis [%] Distribution of Noninverting Input Bias Current, 87 Units 20 Distribution of Input Offset Current, 87 Units 60 Offset Voltage Warm Up Drift, 10 Representative Units 20 10 50 0 −10 offset [µV] percentage of untis [%] 40 30 −20 −30 20 −40 10 0 −20 el −50 −15 −10 −5 0 5 input offset current [nA] 10 15 −60 20 0 50 Input Bias Current Warm Up Drift, 10 Representative Units 100 4 input bias current [nA] input bias current [nA] 6 50 0 −50 −6 150 200 250 time [s] 300 350 400 350 400 450 500 −2 −150 100 300 0 −4 50 250 time [s] 2 −100 0 200 Input Offset Current Warm Up Drift, 10 Representative Units 150 −200 150 8 Pr 200 100 450 −8 500 7 0 50 100 150 200 250 time [s] 300 350 400 450 500 4 3 3 2 2 1 1 error voltage [µV] 4 0 ï1 0 ï1 ï2 ï2 ï3 ï3 ï4 ï4 ï5 ï10 ï8 ï6 ï4 ï2 0 2 output voltage [V] 4 6 8 ï5 ï10 10 ar y DC Transfer Characteristics, 2001 Load 5 ï8 ï6 ï4 DC Open Loop Gain, 6001 Load 140 10 DC Open Loop Gain, 2001 Load open loop gain [dB] open loop gain [dB] 130 128 126 132 130 128 126 124 124 122 el 122 ï8 ï6 ï4 ï2 0 2 output voltage [V] 4 6 8 120 ï10 10 Open Loop Gain Pr 70 100 90 80 70 phase 50 60 40 50 30 40 20 30 gain 10 phase margin [°] 60 open loop gain [dB] 8 134 132 20 0 −10 1k 6 136 134 80 4 138 136 90 0 2 output voltage [V] 140 138 120 ï10 ï2 im in error voltage [µV] DC Transfer Characteristics, 6001 Load 5 10 10k 100k 1M 10M 0 100M frequency [Hz] 8 ï8 ï6 ï4 ï2 0 2 output voltage [V] 4 6 8 10 Voltage Noise Density Voltage Noise Density 10 voltage noise density [nV/√Hz] 1 0.1 10 100 1k 1/f corner ↓ 1 0.1 0.1 10k ar y voltage noise density [nV/√Hz] 10 1 10 100 frequency [Hz] im in frequency [Hz] Current Noise Density 10 Distribution of Current Noise Density 1/f Corner Frequency, 84 Units 30 20 percentage of untis [%] current noise density [pA/√Hz] 25 1/f corner ↓ 1 15 10 0.1 10 el 5 100 1k 0 10 10k 15 20 25 1/f corner frequency [Hz] frequency [Hz] 0.1−10 Hz Voltage Noise 50 35 0.1−10 Hz Current Noise 200 Pr 40 30 150 30 100 20 50 current [pA] voltage [nV] 10 0 −10 0 −50 −20 −100 −30 −150 −40 −50 0 1 2 3 4 5 time [s] 6 7 8 9 −200 10 9 0 1 2 3 4 5 time [s] 6 7 8 9 10 Distribution of 1 kHz Voltage Noise Density, 84 Units Distribution of 10 Hz Voltage Noise Density, 84 Units 30 20 18 25 16 14 15 12 ar y percentage of untis [%] percentage of untis [%] 20 10 8 10 6 4 5 2 0.85 0.9 0.95 1 1.05 voltage noise density [nV/√Hz] 1.1 1.15 0 0.8 1.2 0.85 0.9 Distribution of 1 kHz Current Noise Density, 84 Units 30 Distribution of 10 Hz Current Noise Density, 84 Units percentage of untis [%] percentage of untis [%] 10 15 10 5 el 5 0.55 0.6 0.65 0.7 0.75 current noise density [pA/√Hz] 0.8 0.85 0 0.9 1 1.1 Voltage Noise Density Warmup Drift, 5 Representative Units Pr 0.9 current noise density [pA/√Hz] voltage noise density [nV/√Hz] 1.1 1.05 1 0.95 0.65 250 time [s] 300 350 400 450 1.8 1.9 2 0.75 0.85 200 1.7 0.8 0.7 150 1.4 1.5 1.6 current noise density [pA/√Hz] 0.85 0.9 100 1.3 Current Noise Density Warmup Drift, 5 Representative Units 0.95 50 1.2 1 1.15 0 1.2 20 15 0.8 1.15 25 20 1.2 1.1 30 25 0 0.5 0.95 1 1.05 voltage noise density [nV/√Hz] im in 0 0.8 0.6 500 10 0 50 100 150 200 250 time [s] 300 350 400 450 500 −110 −110 −120 −120 −130 −130 −140 −140 −150 −150 −160 10 100 1k −160 10 10k 100 THD+N (Inverting Configuration, 10 Hz, 600Ω Load, 22 kHz Bandwidth) −100 −120 THD+N [dB] THD+N [dB] THD+N (Inverting Configuration, 10 Hz, 200Ω Load, 22 kHz Bandwidth) −110 −120 −130 −140 −130 −140 −150 el −150 −20 −15 −10 −5 0 5 amplitude [dBu] 10 15 20 −160 −25 25 −20 THD+N (Inverting Configuration, 100 Hz, 600Ω Load, 22 kHz Bandwidth) −120 −120 THD+N [dB] THD+N [dB] −110 −130 −140 −150 −150 −15 −10 −5 0 5 amplitude [dBu] 10 15 −5 0 5 amplitude [dBu] 10 15 20 25 20 25 −130 −140 −20 −10 THD+N (Inverting Configuration, 100 Hz, 200Ω Load, 22 kHz Bandwidth) −110 −160 −25 −15 −100 Pr −100 10k −100 −110 −160 −25 1k frequency [Hz] im in frequency [Hz] ar y THD+N (Inverting Configuration, +20 dBu, 200Ω Load, 80 kHz Bandwidth) −100 THD+N [dB] THD+N [dB] THD+N (Inverting Configuration, +20 dBu, 600Ω Load, 80 kHz Bandwidth) −100 20 −160 −25 25 11 −20 −15 −10 −5 0 5 amplitude [dBu] 10 15 −110 −120 −120 THD+N [dB] −110 −130 −130 −140 −140 −150 −150 −160 −25 −20 −15 −10 −5 0 5 amplitude [dBu] 10 15 20 −160 −25 25 ar y THD+N (Inverting Configuration, 1 kHz, 200Ω Load, 22 kHz Bandwidth) −100 −20 THD+N (Inverting Configuration, 10 kHz, 600Ω Load, 80 kHz Bandwidth) −100 10 15 20 25 20 25 THD+N (Inverting Configuration, 10 kHz, 200Ω Load, 80 kHz Bandwidth) THD+N [dB] THD+N [dB] −140 −130 −140 −150 el −150 −20 −15 −10 −5 0 5 amplitude [dBu] 10 15 20 −160 −25 25 THD+N (Noninverting Configuration, +20 dBu, No Load, 80 kHz Bandwidth) Pr −110 −120 THD+N [dB] 0 5 amplitude [dBu] −120 −130 −130 −140 −150 −160 10 −5 −110 −120 −100 −10 −100 −110 −160 −25 −15 im in THD+N [dB] THD+N (Inverting Configuration, 1 kHz, 600Ω Load, 22 kHz Bandwidth) −100 100 1k 10k frequency [Hz] 12 −20 −15 −10 −5 0 5 amplitude [dBu] 10 15 Distortion Residual FFT (Inverting Configuration, 1 kHz, 600Ω Load) Distortion Residual FFT (Inverting Configuration, 1 kHz, 200Ω Load) −120 −120 −130 −130 −140 −140 −150 −150 −157.9 dB −160 −174.4 dB −180 −180 −190 −190 −200 −200 −210 −210 −220 0 1k 2k 3k 4k 5k 6k frequency [Hz] 7k 8k 9k −220 10k −165.2 dB −170 ar y −170 level [dB] −164.9 dB −174.5 dB −185.5 dB 0 1k Distortion Residual FFT (Inverting Configuration, 10 kHz, 600Ω Load) −120 5k 6k frequency [Hz] 7k 8k 9k 10k 90k 100k Distortion Residual FFT (Inverting Configuration, 10 kHz, 200Ω Load) −140 −150 −152.4 dB −150 −157.1 dB −157.8 dB −162.6 dB −160 level [dB] −160 level [dB] 4k −130 −140 −169.8 dB −169.3 dB −172.6 dB −170 −180 −160.4 dB −159.3 dB −159.8 dB −165.1 dB −172.5 dB −170 −180 −190 −190 −200 −200 −210 0 el −210 10k 20k 30k 40k 50k 60k frequency [Hz] 70k 80k 90k −220 100k Pr −130 −150 −150 level [dB] −173.8 dB −180.9 dB −210 −210 −220 3k 4k 80k −164.4 dB −171.8 dB −173.4 dB −174.6 dB −175.7 dB −176.9 dB −187.2 dB −200 2k 70k −180 −200 1k 50k 60k frequency [Hz] −167.1 dB −190 0 40k −170 −190 −220 30k −161.9 dB −160 −162.4 dB −180 20k −130 −140 −170 10k −120 −140 −160 0 Distortion Residual FFT (Noninverting Configuration, 10 kHz, No Load) Distortion Residual FFT (Noninverting Configuration, 1 kHz, No Load) −120 level [dB] 3k −186.1 dB −120 −130 −220 2k im in level [dB] −160 5k 6k frequency [Hz] 7k 8k 9k 10k 13 0 10k 20k 30k 40k 50k 60k frequency [Hz] 70k 80k 90k 100k Overload Recovery, No Load, ±15 V Supplies Current Limiting, 50Ω Load 15 8 6 10 4 5 0 0 −2 −5 −4 −10 −6 0 0.2 0.4 0.6 0.8 1 time [ms] 1.2 1.4 1.6 1.8 −8 2 Slew−Rate, Inverting (RFB = 10 kΩ || 10 pF) 15 10 amplitude [V] 5 49.9 V/μs 0 50.2 V/μs −5 0.5 1 1.5 2 2.5 time [μs] 3 3.5 4 4.5 5 Pr 0 el −10 −15 0 0.2 0.4 0.6 0.8 im in −15 ar y amplitude [V] amplitude [V] 2 14 1 time [ms] 1.2 1.4 1.6 1.8 2 ar y Chapter 5 Theory Of Operation Discrete vs. IC Operational Amplifiers im in 5.1 Pr el Operational amplifiers fabricated as integrated circuits (IC) are in ubiquitous use due to their low cost, small size and generally speaking good performance. However discrete amplifier implementation offers substantial advantages if highest performance is in demand; hence this route has been taken for the OP1-BP. Within an integrated circuit all components are tightly thermally coupled. This results in considerable interaction of the various amplifier stages; particularly troublesome is differential heating of the input stage as a result of output stage power dissipation. This alters open loop gain and causes additional low-frequency and intermodulation distortion. With a discrete implementation input and output stage (as well as any other critical circuitry) can be physically separated by a suitable layout. As thermal coupling then mostly happens through air (which is a weak thermal conductor) thermal effects are most effectively reduced to insignificant levels. Amplifiers implemented as integrated circuit typically include parasitic semiconductor elements (mostly diodes) which connect to the IC substrate. The associated voltage-dependent junction capacitances can lead to excess highfrequency distortion at critical amplifier nodes. Particularly objectionable is voltage dependent capacitance at the opamp noninverting input; this will lead to very high levels of distortion if the amplifier is used in a noninverting configuration and driven from a high source impedance. Discrete circuits are inherently free from parasitic substrate elements and hence do not suffer from these deficiencies. The maximum power dissipation of typical IC packages (in particular the more recent SMD types) is very restricted. This limits both quiescent current and maximum output current to values below that required for best distortion performance and load driving capability. The package used for the OP1-BP can dissipate several Watts; this allows optimum definition of bias conditions and enables direct drive of very low impedance loads. 15 VCC R3 R4 I5 I2 I6 Q6 Q8 C2 Q9 Q10 Q11 ar y Q5 Q16 Q4 Q3 C1 R7 +IN Q1 Q14 Q2 GND L1 Q17 R2 Q7 D1 D2 -IN im in Q13 Q12 I1 OUT R8 V1 R1 Q15 I3 R5 R6 I4 I7 Figure 5.1: OP1-BP simplified schematic. Pr el Inductors of reasonable high value cannot be manufactured with current (and likely any future) IC technology. The use of inductors in the input stage of the OP1-BP however enable a unique combination of high slew-rate and very low noise. This is achieved without use of nonlinear slew-enhancement techniques (such as dynamic input stage current boosting) which typically result in excess high-frequency distortion. While resistors and capacitors manufactured on IC substrates can be designed to have excellent matching characteristics their absolute tolerance is typically quite poor (10 % or even worse), at least unless trimming techniques are used. Due to the exclusive use of precision resistors, inductors, capacitors and bias voltage reference elements the consistency of the OP1-BP is exemplary. In addition to this discrete passives offer lower noise, lower voltage coefficient and better stability over typical IC implementations. 5.2 Amplifier Architecture and Implementation The OP1-BP features an architecture and implementation with unique properties resulting in performance far superior to previously available operational amplifiers. Figure 5.1 shows a simplified schematic of the amplifier. The input stage (Q1, Q2) is designed to have frequency-dependent transconductance. At low and medium frequencies (up to about 50 kHz) the transconductance is high because L1 shorts the emitter degeneration resistors R1 and R2. This provides high open 16 VEE Pr el im in ar y loop gain and low voltage noise at these frequencies. At high frequencies (above 50 kHz) the degeneration resistors R1 and R2 become active and reduce the input stage transconductance. This allows the choice of low-value compensation capacitors (C1, C2) for very high slew-rate and excellent large signal bandwidth. The collectors of the input differential pair (Q1, Q2) are bootstrapped to the common-mode input voltage by means of cascode transistors Q3 and Q4. This benefits both CMRR and PSRR of the amplifier and minimises the thermal dissipation of Q1 and Q2 which in turn lowers voltage noise and sensitivity to thermal gradients. The bootstrapping cascode connection also greatly increases the common-mode input impedance of the amplifier, and reduces the voltage dependence of this parameter. The later is particularly important if the amplifier is used in a noninverting configuration and driven by a high source impedance. Significant voltage dependence of the common-mode input impedance results in considerable distortion as the amplifier input impedance forms a nonlinear voltage divider together with the source impedance. Further improvement of the common-mode performance is achieved by the use of a precision, very high impedance current generator I1 for the input stage. R3 and R4 are factory trimmed for lowest input offset voltage and drift. Input bias current compensation (not shown in the simplified schematic) is employed to reduce DC errors from bias currents flowing into source and feedback resistors. The conventional bias current compensation schemes typically used in operational amplifiers increase current noise and voltage dependence of the common-mode input impedance. Due to particular attention in the design of the OP1-BP these effects are effectively eliminated. The second stage (Q8–Q13) features a differential topology. The resulting fully balanced interface to the first stage enables very high CMRR along with high open loop gain and low drift. The Miller compensation with capacitor C2 is carried out with reference to the ground pin (note the ground connection of C1). In other words the output of the amplifier at high frequencies is referenced to the ground potential. For essentially all conventional amplifiers the output at high frequencies is referenced to one supply rail, resulting in poor high frequency power supply rejection. The PSRR of the OP1-BP is largely frequency independent within the audio frequency range. The Miller compensation loop formed by C2 includes the output stage; this reduces output impedance and distortion. The output stage (Q14–Q17) is a folded darlington type. It combines high output voltage swing with low output impedance, excellent distortion characteristics and good thermal stability. Bias is factory set such that for output currents up to ±30 mA class A operation is ensured; the user can adjust the class A output current to values from about ±10 mA to ±50 mA by means of a trimmer (see section 6.3). The output current limiting circuitry (not shown in the simplified schematic) features output voltage dependent current limiting (i.e. for output voltages near the supply voltage maximum output current is 17 5.3 ar y increased). In contrast to the typically used constant current limiting this greatly improves load driving capability and amplifier protection. Particular attention has been paid to the thermal management of the amplifier. The output stage can dissipate considerable power, which should not affect the operating conditions of the small-signal stages; this has been achieved by thermal isolation of the small-signal stages from the output stage transistors. The biasing circuit of the amplifier is designed to keep performance independent of ambient temperature. In particular slew-rate and output stage quiescent current are kept constant with temperature. Amongst other design techniques this is a result of the extensive use of dual matched transistors which ensure tight tracking of important parameters. Manufacturing Information Pr el im in The manufacturing process of the OP1-BP is targeted for best performance, consistency and reliability. After the four layer printed circuit board is assembled and soldered the output stage heatsink is attached with a high-performance adhesive for a reliable, low loss connection. The fully assembled amplifier circuit is now exposed to several thermal cycles. This burn-in procedure ensures very stable operation afterwards, particularly regarding DC precision and the various bias points. Subsequently offset voltage, input bias current and class A output current are trimmed with the amplifier fully warmed up. Extensive testing of each specimen is carried out for several critical parameters. 18 ar y Chapter 6 Applications Information Noise and Source Impedance Considerations im in 6.1 √ The very low voltage noise density of 1 nV/ Hz at 1 kHz is achieved by the use of input transistors with low base spreading resistance and high collector currents. Unlike typical operational amplifiers the current noise density is simultaneously √ kept low at 0.7 pA/ Hz (1 kHz).1 For optimum noise performance it is however important to consider the effects of source resistance and amplifier noise current. To calculate the total input-refered voltage noise density three contributions need to be considered: • Thermal noise density of the source resistance: √ 4kT · RS • Voltage noise density of the amplifier: eN el • Current noise density of the amplifier: iN · RS Pr p The overall amplifier noise contribution is then given by e2N + (iN · RS )2 p and the total noise by 4kT · RS + e2N + (iN · RS )2 . These two functions and thermal source resistance noise density are plotted in figure 6.1 and 6.2 for source resistances from 10 Ω to 100 kΩ. The graphs are valid for both balanced and unbalanced source resistance configurations as there is no significant commonmode current noise. It can be seen that opamp voltage noise density dominates for source resistances below 65 Ω only at both 1 kHz and 10 Hz. For source resistances above 33 kΩ opamp current noise density is the major contribution at 1 kHz; the according source resistance at 10 Hz is 8.3 kΩ. Reactive source impedances (capacitors and inductors) do not have an intrinsic thermal noise contribution. However, the amplifier current noise iN still contributes to total voltage noise. The OP1-BP is an optimum choice for low 1 The current noise density of a typical IC amplifier with a voltage noise performance similar √ to the OP1-BP is around 2 pA/ Hz at 1 kHz. 19 100 ar y voltage noise density [nV/√ Hz] total noise → 10 ← amplifier noise only 1 im in ← resistor noise only 0.1 10 100 1k source resistance [Ω] 10k 100k Figure 6.1: Input-refered voltage noise density vs. source resistance at 1 kHz. total noise → 10 Pr voltage noise density [nV/√ Hz] el 100 ← amplifier noise only 1 0.1 10 ← resistor noise only 100 1k source resistance [Ω] 10k 100k Figure 6.2: Input-refered voltage noise density vs. source resistance at 10 Hz. 20 noise provided the total source impedance (which includes the feedback network) is kept below about 20 kΩ (at 1 kHz) or 5 kΩ (at 10 Hz). 6.2 Low Distortion Implementation Pr el im in ar y The OP1-BP is particularly suited for low distortion applications. Unlike typical amplifiers its distortion performance is to a great extent independent of load impedance, source impedance and magnitude of common-mode AC input voltage. Implementations for low distortion often have involved compromises with respect to noise and/or complexity. This is not necessary with the OP1-BP, and high performance signal pathes result even with basic textbook circuits. For full benefit of the excellent opamp performance attention to the passive components of the feedback network is needed. Low-value feedback resistors can dissipate considerable power (e.g. 0.5 W peak for a 560 Ω resistor at full output swing of ±17 V). To avoid introduction of low-frequency distortion due to the temperature coefficient of these resistors the use of precision resistors with sufficient power rating and low temperature coefficient is necessary. Also of concern is the voltage coefficient of resistors. Metal film and wirewound resistors typically are axcellent with this respect; if in doubt the use of series-connected resistors instead of one single part should be considered to reduce the voltage swing across the resistor. Capacitors which experience considerable AC voltage swing at frequencies of interest (e.g. in equalising and filtering networks) should have low voltage coefficient. Suitable dielectrica include ceramic C0G/NP0, polypropylene film, R film. Again the use of multiple series-connected polystyrene film and Teflon capacitors instead of a single part may be considered to reduce voltage swing and hence distortion. Lowest amplifier distortion is achieved for output currents which operate the output stage in class A. Due to the high current gain of the output stage and the inclusive Miller compensation distortion is still notably low in class AB operation; however additional care must be given to the layout as the power supply traces now carry heavily distorted (essentially rectified) signal-dependent AC currents. These can induce into sensitive circuitry and cause distortion if left unchecked. Routing of the power supply traces carrying the distorted AC currents should be spaced away from sensitive (e.g. strongly inductive, high impedance or low level) nodes. Additionally negative and positive supply should be routed in close proximity as their added magnetic fields ideally result in an undistorted replica of the opamp output current. 6.3 Class A Output Current Adjustment The quiescent current of the output stage can be adjusted by a trimmer; this allows a user-defined trade-off between quiescent power dissipation and maximum 21 VQ = ar y class A output current. The typical trimming range for the class A output current is ±10 mA to ±50 mA. There are two trimmers on the OP1-BP printed circuit board. The one used to set the output stage quiescent current is located close to the power output transistors and not sealed. In the corner of the printed circuit board next to the output stage there are two test points which are used to measure the actual quiescent current. To achieve a class A peak output current IOU T the DC voltage across the two test points2 VQ must be set as follows: 4.1 Ω · IOU T + 7 mV (6.1) 6.4 im in During the measurement it is recommended that the operational amplifier is operated with zero output current and fully warmed up. Also the class A output current shows a slight dependence on power supply voltage; typically it decreases by about 18 % when going from ±5 V to ±18 V power supplies. Hence adjustment should be done at the correct power supply voltage. The operational amplifiers are factory preset to a class A peak output current of ±30 mA with ±15 V power supplies; this value will be sufficient for full class A operation in most cases. DC Precision Pr el There are three amplifier parameters which influence its DC precision at a given temperature: offset voltage, input bias current and input offset current. The offset voltage of the OP1-BP is trimmed to a very low value of typically ±10 µV with the amplifier fully warmed up. As the offset and drift contribution of the second amplifier stage have been kept low zeroing the amplifier offset voltage will also lead to very low offset voltage drift. As there is hence no need for further offst voltage trimming the according trimmer is sealed after adjustment to prevent inadverted readjustment. For configurations where the input terminals of the amplifier see a source resistance unbalance of more than 170 Ω input bias current will typically dominate DC precision. It is hence possible to further increase the DC precision by external input bias current cancellation. Figure 6.3 displays the suggested implementation for a noninverting amplifier (typically RS  R1 k R2 ) configuration; other amplifier configurations may use a similar bias cancellation scheme. To approximately track the temperature coefficient of the input bias current the cancellation current is derived from forward biased diodes. This also ensures low noise contribution. The input bias current cancellation scheme of the OP1-BP has been designed to contribute little to input offset current; only with well balanced source 2 The two test points are isolated by resistors, so accidentally shorting the test points will not damage the amplifier. 22 +15V R3 13k D1 1N4148 R6 10M R7 10M C1 ar y D2 1N4148 D3 1N4148 R5 100k GND D4 1N4148 D5 1N4148 R1 D6 1N4148 OUT R4 13k R2 im in RS -15V GND GND Figure 6.3: Input bias current cancellation. el resistances above 5 kΩ will the amplifier offset current dominate DC precision. In such cases the cancellation scheme of figure 6.4 may be used. Again the reference voltage is derived from forward biased diodes for low noise and suitable temperature coefficient. Shown is a differential amplifier configuration (R1 = R2 and R3 = R4 ), but a similar offset current cancellation scheme may be used for other amplifier configurations with matched source resistances at the input terminals. Ground Pin Connection Pr 6.5 The ground pin of the amplifier should be connected to a signal ground point with low high-frequency impedance; for proper operation the ground potential should be approximately in between the two supply rails, and needs to be able to supply a DC current of 10 µA. Operation with ground potentials as close as 2 V to the supply rails is possible but not recommended as it might adversely affect the internal thermal balance of the amplifier circuit. 6.6 Feedback Capacitor Selection Due to the frequency-dependent gain bandwith product of the OP1-BP simple resistive feedback results in gain peaking and overshoot. This is easily avoided 23 +15V R7 R5 13k 10M R6 1M R8 D1 1N4148 10M R3 ar y D2 1N4148 C1 D3 1N4148 R1 GND OUT R2 R4 GND im in GND C2 Figure 6.4: Input offset current cancellation. by the use of a suitable feedback capacitor. Figure 6.5 shows recommended minimum time constant values t for the RC feedback network. For a given feedback resistor value RFB the minimum feedback capacitor value CFB can be estimated as follows: t CFB = 2π · RFB Pr el If overshoot-free transient response is not necessary, the capacitor values can be chosen about 30 % lower for maximum bandwidth. This will still avoid gain peaking. In any case the time constant as shown in figure 6.5 should be considered an initial estimate only. Details of the exact implementation (e.g. feedback network impedance and layout stray capacitances) may affect the required feedback capacitor value and experimental verification is needed. 6.7 Power Supply Bypassing and Layout Considerations The OP1-BP includes a total of 2.4 µF of high quality, low impedance on-board decoupling capacitors. Together with the excellent power supply rejection of the amplifier this is in essentially all cases sufficient for stability and no external high-frequency bypassing is needed. With long power supply traces and low impedance loads it is nonetheless advisable to arrange for electrolytic bypass capacitors from the supply rails to load ground. Recommended values range from 47 µF to 220 µF. For best performance and stable operation care to layout is needed. It is recommended to place the feeback network below the amplifier for short traces 24 12 10 ar y time constant [µs] 8 6 4 im in 2 0 1 10 100 1k noise gain Figure 6.5: Minimum time constant of RC feedback network vs. noise gain for overshoot-free transient response. and minimum layout parasitics (particularly stray capacitance at the inverting input). Ground planes should be used. Driving Capacitive Loads el 6.8 Pr Due to its output stage with very low output impedance the OP1-BP is able to drive high capacitive loads directly, typically up to 1 nF. Higher or unknown capacitive loads (e.g. cables) should be isolated by a small resistor in series with the amplifier output. To be effective the feedback point must be taken before the isolation resistor. A value of 30 Ω for the isolation resistor will in most cases enable unlimited capacitive drive, however experimental verification is suggested and lower values might be suitable for certain conditions (e.g. if the capacitive load is limited to a known maximum value). If low output impedance at low frequencies is required the isolation resistor may be paralleled by an inductor. For low distortion this inductor should be air cored only; as initial value for experimental verification 3 µH or higher is recommended. 6.9 Sockets and Handling It is recommended to use sockets for the OP1-BP instead of direct soldering to the printed circuit board. Suitable sockets are available from Mill-Max as part no. 0344-2-19-15-34-27-10-0; other manufacturers offer compatible parts. 25 Pr el im in ar y When handling the amplifiers, particularly during insertion into the sockets, care should be applied in order to not bend or otherwise damage any amplifier part. It is recommended to hold the amplifier at the printed circuit board only; in particular any stress to the power output transistors, heatsink and trimmers should be avoided. 26 ar y Chapter 7 Pr el im in Outline Dimensions and Pinout 27