Transcript
PC925L0NSZ0F Series
PC925L0NSZ0F Series
High Speed, 2.5A Output, Gate Drive DIP 8 pin ∗OPIC Photocoupler
■ Description
■Agency approvals/Compliance
PC925L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Peak output current is 2.5A, Input-output isolation voltage(rms) is 5kV and High speed response (tPHL, tPLH : MAX. 0.5μs).
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC925L) 2. Package resin : UL flammability grade (94V-0) 3. Compliant with RoHS directive (2002/95/EC) 4. Content status of six substances specified in “ Management Methods for Control of Pollution Caused by Electronic Information Products Regulation ” (Chinese : 电子信息产品污染控制管理办法) (popular name : China RoHS) ; refer to page 16
■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO(peak) : 2.5A) 4. High speed response (tPHL, tPLH : MAX. 0.5μs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. −15kV/μs, CML : MIN. 15kV/μs) 7. Long creepage distance type (wide lead-form type only : MIN. 8mm) 8. High isolation voltage between input and output (Viso(rms) : 5kV) 9. RoHS directive compliant
■Applications 1. IGBT/MOSFET gate drive for inverter control
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
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Sheet No.: D4-A09302FEN Date Oct. 01. 2007 © SHARP Corporation
PC925L0NSZ0F Series
■ Internal Connection Diagram 8
7
6
Tr1
5
1 2
Tr2
3 Interface
4
N.C. Anode Cathode N.C.
GND VO VO VCC
5 6 7 8
Amp. 1
2
3
4
■ Truth table VO Terminal output High level Low level
Tr1 ON OFF
Tr2 OFF ON
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC925L0NSZ0F]
SHARP mark "S"
8
1.2±0.3
0.6±0.2
7
6
SHARP mark "S"
5
Rank mark
2.54±0.25
Rank mark 6.5±0.3
Date code
1
2
3
9.66±0.30
Factory identification mark
7.62±0.30 3.25±0.05 3.5±0.5
Primary side mark
4
5
Date code
4
Factory identification mark
Primary side mark
7.62±0.30 0.26±0.10
3
6
0.5
2
9.66±0.30
TYP.
1
7
PC925L
6.5±0.3
PC925L
8
0.6±0.2
Epoxy resin 0.26±0.10
0.5±0.1 θ
θ : 5˚ TYP.
2.54±0.25
3.5±0.5
1.2±0.3
2. SMT Gullwing Lead-Form [ex. PC925L0NIP0F]
1.0+0.4 −0
Epoxy resin
0.35±0.25
Input ON OFF
1.0+0.4 −0
10.0+0 −0.5
θ
Product mass : approx. 0.55g
Product mass : approx. 0.51g
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series (Unit : mm)
3. Wide SMT Gullwing Lead-Form [ex. PC925L0NUP0F] 1.2±0.3
0.6±0.2 7
8
5
Rank mark
PC925L 6.5±0.3
SHARP mark "S"
6
Date code 1
2
3
4
Primary side mark
Factory identification mark
9.66±0.30
0.26±0.10
0.25±0.25
3.5±0.5
7.62±0.30
2.54±0.25
Epoxy resin 0.75±0.25
10.16±0.50 12.0MAX.
0.75±0.25
Product mass : approx. 0.55g Plating material : Pd (Au flash)
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Date code (3 digit)
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
1st digit Year of production Mark A.D. A 2002 B 2003 C 2004 D 2005 E 2006 F 2007 H 2008 J 2009 K 2010 L 2011 M 2012 N :
2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D
Mark P R S T U V W X A B C :
3rd digit Week of production Week Mark 1st 1 2nd 2 3rd 3 4th 4 5, 6th 5
repeats in a 20 year cycle
Factory identification mark Factory identification Mark
Country of origin
no mark Japan or
Indonesia
or
China
* This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production.
Rank mark With or without.
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Absolute Maximum Ratings Parameter *1 Forward current Reverse voltage Input *2 Peak forward current Supply voltage *3 Peak output current Output Output voltage *4 Output power dissipation *5 Total power dissipation *6 Isolation voltage Operating temperature Storage temperature *7 Soldering temperature
Symbol Rating IF 25 VR 5 IFM 1 VCC 35 IO(PEAK) 2.5 VO VCC PO 250 Ptot 295 Viso(rms) 5 Topr −40 to +100 Tstg −55 to +125 Tsol 270
(Ta=25˚C) Unit mA V A V A V mW mW kV ˚C ˚C ˚C
*1 When ambient temperature goes above 70˚C, the power dissipation goes down at 0.3mA/˚C (Refer to Fig.10). *2 Pulse width≤1μs, 300pps *3 Pulse width≤10μs, Duty ratio : 0.002 *4 When ambient temperature goes above 70˚C, the power dissipation goes down at 4.8mA/˚C (Refer to Fig.11). *5 When ambient temperature goes above 70˚C, the power dissipation goes down at 5.4mA/˚C (Refer to Fig.12). *6 AC for 1min, 40 to 60%RH, f=60Hz *7 For 10s
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
(Unless otherwise specified : Ta=−+40 to +100˚C, IF(ON)=7 to 16mA, VCC=15 to 30V, VF(OFF)=−3V to 0.8V) Parameter Symbol Condition MIN. *13 TYP. MAX. Unit Forward voltage VF IF=10mA 1.2 1.8 V − Reverse current IR VR=5V 10 − − μA Terminal capacitance Ct 60 150 pF Ta=25˚C, V=0, f=1MHz − *8 VO=(VCC−4V), IF(ON) 0.5 1.5 A − High level output current IOH *9 VO=(VCC−15V), IF(ON) 2 A − − *8 VO=2.5V, VF(OFF) 0.5 2.0 A − Low level output current IOL *9 VO=15V, VF(OFF) 2 A − − High level output voltage VOH IO=−0.1A, IF(ON) VCC−4 VCC−3 V − Low level output voltage VOL IO=0.1A, VF(OFF) 0.1 0.5 V − *10 2.5 5 mA High level supply current ICCH IF(ON) − *10 Low level supply current ICCL VF(OFF) 2.5 5 mA − VUVLO+ 11 12.3 13.5 V UVLO threshold VUVLO− VO>5V, IF=10mA 9.5 10.7 12 V UVLO Hysteresis UVLOHYS 1.6 V − − *11 "Low→High" threshold input current IFLH VO>5V, IO=0 5 mA − − Isolation resistance RISO Ta=25˚C, DC=500V, 40 to 60%RH 5×1010 1011 − Ω 0.1 0.3 0.5 "Low→High" propagation time tPLH μs "High→Low" propagation time tPHL 0.1 0.3 0.5 μs *12 Distortion of pulse width RG=10Ω, CG=10nF, 0.3 ΔtW − − μs Propagation delay skew tPSK f=10kHz, Duty ratio 50% 0.35 −0.35 − μs Rise time tr 0.1 − − μs Fall time tf 0.1 − − μs UVLO Turn on delay tUVLO ON 0.8 VO>5V, IF=10mA − − μs UVLO Turn off delay tUVLO OFF 0.6 VO>5V, IF=10mA − − μs Instantaneous common mode rejection Ta=25˚C, VCM=1.5kV(p−p), |CMH| 15 kV/μs − − voltage (High level output) IF=10 to 16mA, VCC=30V, VOH>15V Ta=25˚C, VCM=1.5kV(p−p), Instantaneous common mode rejection − |CML| 15 kV/μs − voltage (Low level output) VF=0, VCC=30V, VOL<1V
Transfer characteristics Response time
Output
Input
■ Electro-optical Characteristics*8
*7 It shall connect a by-pass capacitor of 0.1μF or more between VCC (Pin No. 8) and GND (Pin No. 5) near the device, when it measures the transfer characteristics and the output side characteristics. *8 Pulse width≤50μs, Duty ratio : 0.005 *9 Pulse width≤10μs, Duty ratio : 0.002 *10 Output pin is open. *11 IFLH is the value of forward current when output becomes from "L" to "H" *12 Distortion of pulse width ΔtW=|tPHL-tPLH| *13 All typical values are at Ta=25˚C, VCC=30V
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Model Line-up Lead Form Package Model No.
Through-Hole Sleeve 50 pcs/sleeve PC925L0NSZ0F
SMT Gullwing
Wide SMT Gullwing Taping 1 000 pcs/reel
PC925L0NIP0F
PC925L0NUP0F
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Fig.1 Test Circuit for High Level Output Current
Fig.2 Test Circuit for Low Level Output Current
8
8
2
2 7 PC925L
IF
6
7
IOH A
3 5
5
Fig.3 Test Circuit for High Level Output Voltage
Fig.4 Test Circuit for Low Level Output Voltage
8 2 7
8 2
IO
PC925L
7 PC925L
VCC
VCC
6
6 VOH V
3
V VOL
3
5
8 2
Fig.6 Test Circuit for UVLO Threshold
A ICC
8 2
7 PC925L
IOL
5
Fig.5 Test Circuit for High Level / Low Level Supply Current
IF
VCC
A
6
3
IF
IOL
PC925L
VCC
7
VCC
PC925L
IF
6
6
3
V VO>5V
3 5
VCC Variable
5
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Fig.7 Test Circuit for "Low→High" Input Threshold Current
8 2 7 PC925L
IF Variable
VCC 6
V VO
3 5
Fig.8 Test Circuit for Response Time
50% 8
VIN wave form
2 VIN
7
10kHz Duty ratio 50%
PC925L 6 3
VOUT
tPHL
tPLH
VCC
RG
90%
CG
50% 10%
5 VOUT wave form tr
tf
Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage VCM (Peak) 8 A
SW B
VCM wave form
2
GND
7 PC925L
VCC 6 V VO
3 5 +
CMH, VO wave form SW at A, IF=10 to 16mA
−
CML, VO wave form SW at B, IF=0
VCM
VOH
VOL GND
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Fig.11 Power Dissipation vs. Ambient Temperature
30
300
25
250
Output power dissipation PO (mW)
Forward current IF (mA)
Fig.10 Forward Currenet vs. Ambient Temperature
20 15 10 5 0 −50 −40 −25
0
25
50
70 75
100
200 150 100 50 0 −50 −40 −25
125
Ambient temperature Ta (˚C)
25
50
70 75
100
125
Ambient temperature Ta (˚C)
Fig.12 Total Power Dissipation vs. Ambient Temperature
Fig.13 Forward Current vs. Forward Voltage 100
350 300 295
Ta=25˚C Forward current IF (mA)
Total power dissipation Ptot (mW)
0
250 200 150 100
Ta=0˚C
Ta=50˚C
10
Ta=100˚C
Ta=−40˚C
1
50 0 −50 −40 −25
0.1 0
25
50
70 75
100
125
1
1.2
1.4
Ambient temperature Ta (˚C)
Fig.14 High Level Output Voltage Drop vs. Ambient Temperature
High level output voltage drop VOH−VCC (V)
High level output voltage drop VOH−VCC (V)
2
0 IF=10mA, IO=0.1A, VCC=30V
−1 −1.5 −2 −2.5 −3 −3.5 −4 −40
1.8
Fig.15 High Level Output Voltage Drop vs. Supply Voltage
0 −0.5
1.6
Forward voltage VF (V)
−20
0
20
40
60
80
−0.5 −1 −1.5 −2 −2.5 −3 −3.5 −4 15
100
Ambient temperature Ta (˚C)
Ta=25˚C, IF=10mA, IO=0.1A
20
25
30
Supply voltage VCC (V) Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Fig.16 Low Level Output Voltage vs. Ambient Temperature
0.2
0.25
IF=0mA, IO=0.1A, VCC=30V
Low level output voltage VOL (V)
Low level output voltage VOL (V)
0.25
Fig.17 Low Level Output Voltage vs. Supply Voltage
0.15
0.1
0.05
0 −40
0
−20
20
40
60
80
0.2
Ta=25˚C, VF=0.8mA, IO=0.1A
0.15
0.1
0.05
0 15
100
20
Ambient temperature Ta (˚C)
Fig.19 High Level Supply Current vs. Supply Voltage 3.5
IF=16mA, VCC=30V High level supply current ICCH (mA)
High level supply current ICCH (mA)
3 2.5 2 1.5 1 0.5 0 −40
0
−20
20
40
60
80
3
Ta=25˚C, IF=16mA
2.5 2 1.5 1 0.5 0 15
100
20
Ambient temperature Ta (˚C)
3.5
IF=0mA, VCC=30V
2.5 2 1.5 1 0.5 0 −40
−20
0
20
40
60
30
Fig.21 Low Level Supply Current vs. Supply Voltage
Low level supply current ICCL (mA)
High level supply current ICCL (mA)
3
25
Supply voltage VCC (V)
Fig.20 Low Level Supply Current vs. Ambient Temperature 3.5
30
Supply voltage VCC (V)
Fig.18 High Level Supply Current vs. Ambient Temperature 3.5
25
80
3 2.5 2 1.5 1 0.5 0 15
100
Ambient temperature Ta (˚C)
Ta=25˚C, IF=0mA
20
25
30
Supply voltage VCC (V) Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
Fig.22 "Low→High" Relative Threshold Input Current vs. Ambient Temperature
Fig.23 "Low→High" Relative Threshold Input Current vs. Supply Voltage
140
140 Relative threshold input current (%)
Relative threshold input current (%)
130 120 110 100 90 80 −40
20
0
−20
40
60
80
130 120 110 100 90 80 −40
100
0
−20
Ambient temperature Ta (˚C)
20
40
60
80
100
Supply voltage VCC (V)
Fig.24 Output Voltage vs. Supply Voltage (UVLO Threshold)
Fig.25 Relative UVLO Threshold vs. Ambient Temperature 120
20 Ta=25˚C IF=10mA
18
115 Relative UVLO threshold (%)
16 Output voltage VO (V)
100% at VCC=30V
Ta=25˚C
100% at Ta=25˚C
VCC=30V
14 12 10 8 6 4
100% at Ta=25˚C
IF=10mA VO>5V
110 105 VUVLO+
100 95
VUVLO− 90 85
2
80 −40
0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Supply voltage VCC (V)
Fig.26 Propagation Delay Time vs. Ambient Temperature Propagation delay time tPLH, tPHL (μs)
0.5
VCC=30V RL=10Ω CG=10nF
0.45 0.4
tPHL Ta=−40˚C Ta=25˚C Ta=100˚C
0.35 0.3 Ta=−40˚C
0.25 tPLH
0.2
Ta=100˚C
0.15
Ta=25˚C
0.1 0.05
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
0 7
8
9
10
11
12
13
14
15
16
Forward current IF (mA) Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Design Considerations ● Recommended Operating Conditions Parameter Input current (ON) Input voltage (OFF) Supply voltage Operating temperature
Symbol IF(ON) VF(OFF) VCC Topr
MIN. 7 −3 15 −40
MAX. 16 0.8 30 100
Unit mA V V ˚C
● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics.
● Design guide In order to stabilize power supply line, please certainly connect a by-pass capacitor of 0.1μF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED.
● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFLH.
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
● Recommended Foot Print (reference) SMT Gullwing Lead-form
1.7
2.54
2.54
2.54
8.2
2.2
(Unit : mm)
Wide SMT Gullwing Lead-form
1.7
2.54
2.54
2.54
10.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Manufacturing Guidelines ● Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300
Terminal : 260˚C peak (package surface : 250˚C peak)
200
Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering : Due to SHARP’s double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please don’t solder more than twice.
Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 400̊C. Please don’t solder more than twice.
Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.
Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC etc. This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. • The RoHS directive (2002/95/EC) This product complies with the RoHS directive (2002/95/EC). Object substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) • Content of six substances specified in “ Management Methods for Control of Pollution Caused by Electronic Information Products Regulation ” (Chinese : 电子信息产品污染控制管理办法) Toxic and hazardous substances Category
Photocoupler
Hexavalent Polybrominated Polybrominated Lead Mercury Cadmium diphenyl ethers biphenyls chromium (Pb) (Hg) (Cd) (PBDE) (PBB) (Cr( VI))
✔
✔
✔
✔
✔
✔
✔: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard.
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
Sleeve outline dimensions 12
±2
5.8
10.8
520
(Unit : mm)
6.7
Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
● Tape and Reel package 1. SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions F
J
D E
G
MA
X.
H
H
A
B
C
I
5˚
K
Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.40±0.05
C 1.75±0.10 J 4.2±0.1
D 12.0±0.1 K 10.2±0.1
E 2.0±0.1
(Unit : mm) F G +0.1 4.0±0.1 φ1.5−0
Reel structure and Dimensions e
d
c
g
Dimensions List a b φ330 e φ23±1
f a
b
17.5±1.5 f 2.0±0.5
(Unit : mm) c d φ100±1 φ13.0±0.5 g 2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel] Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
● Tape and Reel package 2. Wide SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions F
J
D E
G
MA
X.
H
H
A
B
C
I
5˚
K
Dimensions List A B 24.0±0.3 11.5±0.1 H I ±0.1 12.4 0.40±0.05
C 1.75±0.10 J 4.05±0.10
D 12.0±0.1 K 10.0±0.1
E 2.0±0.1
(Unit : mm) F G +0.1 4.0±0.1 φ1.5−0
Reel structure and Dimensions e
d
c
g
a
Dimensions List a b φ330 25.5±1.5 e f ±1 φ23 2.0±0.5
f b
(Unit : mm) c d ±1 φ100 φ13.0±0.5 g 2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel] Sheet No.: D4-A09302FEN
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PC925L0NSZ0F Series
■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
· The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
[E251]
Sheet No.: D4-A09302FEN
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