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FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Course Introduction Lecture topics • Learning objectives from FYS4260 • Definitions of some basic terms • Course administrative details • Related reading: – Halbo&Ohlckers Chapter 1 FYS4260/FYS9260 2 About the lecturer • Siv.ing. (1994) and dr.ing (1998) in experimental material physics, NTNU • Employed at SINTEF ICT, Instrumentation Department since 1998 • Research – Packaging of MEMS sensors for high temperature applications – Research manager for the biomedical instrumentation group where we do research on wearable sensor devices and medical diagnostics devices. • Started as associate professor II at UiO on Jan 1st 2015. FYS4260/FYS9260 3 What you will learn from FYS4260 • Packaging and interconnection deals with the physical (hardware) realization of electronic systems – from schematics/diagram to finished product. • You will become aware of important concerns in design, manufacturing and use of electronics • You will learn how to build your own electronics circuit board • The course takes a practical engineering approach to the subject: – Will not demand extensive theory – Will not go into finer detail on e.g. integrated circuit design FYS4260/FYS9260 4 What are the packaging and interconnection challenges in order to realize a modern mobile phone? Packaging&interconnection tends to attract less attention than component developments and software apps, but is still important! Packaging and interconnection is a crucial engineering discipline in electronics development: • Key cost factor • Packaging/interconnection is the main source of failures in electronic systems FYS4260/FYS9260 5 Examples of packaging and interconnection challenges High definition display Marketed feature: • Retina HD display • 4.7-inch (diagonal) LED-backlit widescreen Multi-Touch display with IPS technology • 1334-by-750-pixel resolution at 326 ppi FYS4260/FYS9260 Packaging and interconnection challenges: • • • How do you connect 326 conductor lines per inch (13 per mm) for display control and additional ones for touch display sensing? On a minimal frame around a large display? While ensuring that nothing breaks? 6 Examples of packaging and interconnection challenges Processing capability Marketed feature: • A8 chip with 64-bit architecture • 20-nanometer process • Two billion transistors strong FYS4260/FYS9260 Packaging and interconnection challenges: • How do you package and connect a highly complex chip with a large number of I/O's (input/outputs) on a small area? • How do you ensure that two billion transistors do not overheat? 7 Examples of packaging and interconnection challenges Sensors capability Marketed feature: • • • • • • Touch ID Barometer Three-axis gyro Accelerometer Proximity sensor Ambient light sensor FYS4260/FYS9260 Packaging and interconnection challenges: • How do you package highly complex and miniaturized microelectromechanical components? 8 Examples of packaging and interconnection challenges Camera capability Marketed feature: • New 8-megapixel iSight camera with 1.5µ pixels • 1080p HD video recording (30 fps or 60 fps) FYS4260/FYS9260 Packaging and interconnection challenges: • How do you connect to the imaging CMOS chip (with 8 million pixels each 1.5µ x 1.5µ dimension)? 9 Examples of packaging and interconnection challenges Connectivity capability Marketed features: • GSM model: GSM/EDGE • UMTS/HSPA+ • DC-HSDPA • CDMA model: CDMA EV-DO Rev. A and Rev. B • LTE • 802.11a/b/g/n/ac Wi-Fi • Bluetooth 4.0 • NFC • GPS and GLONASS FYS4260/FYS9260 Packaging and interconnection challenges: • How do you integrate a wide range of GHz wireless antennas while limiting crosstalk? 10 Examples of packaging and interconnection challenges Size and dimensions Marketed features: • 138 mm high • 67 mm wide • 6.9 mm thick • 129 grams FYS4260/FYS9260 Packaging and interconnection challenges: • How do you find place for everything, and ensure that everything works reliably ? 11 Hardware Is The New Software Nest. GoPro. Beats. Jawbone. Oculus. All hardware companies and each of them accorded multi-billion-dollar valuations either in private investment transactions or acquisitions by some of the largest technology companies on the planet. When the deals first surfaced, more than a few people were puzzled. Hardware hasn’t exactly been sexy for the past decade or so. Until last year, VC and tech talent have been fawning over software companies, which attracted nearly $11 billion in venture capital and saw 1,523 deals in 2013. And how did consumer electronics makers do with VCs in 2013? A paltry $848 million and 31 deals. That’s because software, once expensive and complicated to make, has become relatively easy. Increased access to open-source services and the cloud mean that two guys in a garage can inexpensively create an application for accepting mobile payments at your new pop-up store or for finding a ride downtown. Access to massive global markets can be had almost overnight via iOS or Android app stores. No need for vast distribution networks. No need for a supply chain. Just extremely low overhead and high margins. But there’s just one thing missing from software. Before anyone can get to the bits, they must get through the atoms. Which means they need one thing: Hardware • TechCrunch July 2014: http://techcrunch.com/2014/07/12/hardware-is-the-new-software/ FYS4260/FYS9260 12 Definition of ELECTRONIC PACKAGING AND INTERCONNECTION TECHNOLOGY (Halbo/Ohlckers) • The realization of the physical, electronic system, starting from a block-/circuit diagram level • Involves choice of technology for implementation, choice of materials, detailed design in chosen technology, analysis of electrical and thermal properties, reliability et cetera. FYS4260/FYS9260 13 Packaging requires multiple skills: –Electronics –Materials properties and materials compatibility –Mechanics –Chemistry –Metallurgy –Production technology –Reliability, etc. • Product development should involve experts from the various fields, and the interdependence of the fields may be the most important to make a good product. FYS4260/FYS9260 14 MEMS - Micro-Electro-Mechanical Systems (Microsystems) MEMS can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. FYS4260/FYS9260 Interior chip assembly of the SA30 Crash Sensor, a microsystem from SensoNor, Norway 15 MEMS in automotive applications The cost of instrumentation in cars amounts to approximately half the price. FYS4260/FYS9260 16 MEMS in autonomous systems PD-100 BLACK HORNET PRS Personal Reconnaissance System • Rotor span 120 mm • Mass 18 g including cameras • Maximum speed 5 m/s • Endurance up to 25 minutes • Digital data link beyond 1500 m line-ofsight • GPS navigation or visual navigation through video • Autopilot with autonomous and directed modes • Hover & Stare, preplanned routes • Steerable EO cameras (pan/yaw and tilt) • Live video and snapshot images Manufactured by Prox Dynamics, Asker, Norway FYS4260/FYS9260 17 Where is the MEMS component closest to you right now? Step counter Pressure sensor (baro-/altimeter) Image stabilizer in camera lenses Microphone, acellerometer, gyroscope, magnetormeter, finger print sensor Digital Mirror Device in projectors NEMS – Nano-Electro-Mechanical Systems Nanoelectromechanical systems (NEMS) are a class of devices integrating electrical and mechanical functionality on the nanoscale. NEMS form the logical next miniaturization step from MEMS devices. NEMS typically integrate transistorlike nanoelectronics with mechanical actuators, pumps, or motors, and may thereby form physical, biological, and chemical sensors. FYS4260/FYS9260 IBM research test circuit: ring oscillator out of field-effect transistors (FETs) based on nanowires with diameters as small as 3 nanometers. The oscillator is composed of 25 inverters using negative- and positive-channel FETs http://spectrum.ieee.org/semiconductors/devices/ibmmakes-3nanometer-nanowire-silicon-circuits 19 Packaging and interconnection hierarchy FYS4260/FYS9260 20 0th level packaging: Wafer/chip level packaging The significant for 0th level is that packaging starts on wafer level and not after the wafer is cut into circuits (dice). This includes for example • Wafer level metallization and coating systems • Wafer-to-wafer joining • Flip chip or stud bumping preparation Flip chip soldered chip http://www.advotech.com/uimages/servic es/die-attach/die-attach-flip-chip.jpg 1st level packaging: Chip package and hybrid circuits MEMS + ASIC on leadframe (SA80 from Sensonor) Multichip module illustration from http://www.goldenaltos.com/packages.html 3D System in Package FYS4260/FYS9260 22 2nd level packaging: Components on printed circuit boards Illustration: http://en.wikipedia.org/wiki/Printed_circuit_board#mediaviewer/File:Testpad.JPG FYS4260/FYS9260 23 3rd level packaging Stacking circuit boards on a back plane A single board computer installed into a passive backplane. http://upload.wikimedia.org/wikipedia/commons/5/5b/SBC-Backplane.jpg FYS4260/FYS9260 24 Moore's law: Doubling of transistor count every second year http://en.wikipedia.org/wiki/Moore%27s_law FYS4260/FYS9260 25 More on Moore's law "Moore's law" is the observation that, over the history of computing hardware, the number of transistors in a dense integrated circuit doubles approximately every two years. The observation is named after Gordon E. Moore, co-founder of the Intel Corporation, who described the trend in his 1965 paper. His prediction has proven to be accurate, in part because the law now is used in the semiconductor industry to guide long-term planning and to set targets for research and development.[ The capabilities of many digital electronic devices are strongly linked to Moore's law: quality-adjusted microprocessor prices, memory capacity, sensors and even the number and size of pixels in digital cameras. All of these are improving at roughly exponential rates as well. This exponential improvement has dramatically enhanced the effect of digital electronics in nearly every segment of the world economy. Moore's law describes a driving force of technological and social change, productivity, and economic growth in the late twentieth and early twenty-first centuries. The period is often quoted as 18 months because of Intel executive David House, who predicted that chip performance would double every 18 months (being a combination of the effect of more transistors and their being faster). Although this trend has continued for more than half a century, "Moore's law" should be considered an observation or conjecture and not a physical or natural law. Sources in 2005 expected it to continue until at least 2015 or 2020. The 2010 update to the International Technology Roadmap for Semiconductors predicted that growth will slow at the end of 2013, however, when transistor counts and densities are to double only every three years. From: http://en.wikipedia.org/wiki/Moore's_law FYS4260/FYS9260 Development of typical transistor feature size as a function of time 26 Electronics packaging must also develop FYS4260/FYS9260 Frode Strisland 27 TYPES OF ELECTRONICS AND DEMANDS ON THEM - EXAMPLES • Satellite electronics Production volume: one unit, 20 years life required, no repair, very low weight and power, very high development cost acceptable Kongsberg Norspace Oven Controlled X-tal Oscillators (OCXO) • Medical device electronics Similar reliability/power demand, may be in harsh environment (body fluids), medium production volume. FYS4260/FYS9260 Axis-Shield Afinon Analyzer blood sample analyzer 28 Examples, cont • Military electronics Very high reliability demands, in very rough environments (vibrations, shock, humidity, wide temperature range). High development cost (and production cost) acceptable FYS4260/FYS9260 29 Examples, cont • Computers High performance and reliability required. Very short product life, high production volume for some, small volume for some products • Consumer products Extreme price pressure, very short product life, low weight, power, very big market. No repair. FYS4260/FYS9260 30 Electronics Development Development Phases Feasibility Study Market research ideas Prestudy Product idea Fig. 1.1: Product Development Phases Project Phase Specifications Development, main principle Product Laboratory recommend model -ation Detailed design s A-model Pilot production, industrialisation, marketing B-model Production, sales, service C-model Phases in the development of electronic systems. FYS4260/FYS9260 31 DEVELOPMENT PHASES, continued • Market research – Gives product idea • Pre-study – Gives product suggestion • Defining overall requirements specifications – Gives definition of product, simulation/lab model of critical parts • Prototype A – Main principles analyzed, important parts implemented, technology chosen. – Proof-of-concept verification of critical features FYS4260/FYS9260 32 DEVELOPMENT PHASES, continued • Prototype B – Detailed design, correct form and components. Ready for industrialization. • Industrialization – Prototype adapted to producability in available production equipment. New production line built if needed, pilot series made. – Marketing started, service planned – Full scale production – Product sale, maintenance, service FYS4260/FYS9260 33 FYS4260/FYS9260 administrative issues • FYS4260: Master level course • FYS9260: Ph.D. level course • Responsible for laboratory project work: ELAB • Common e-mail address for all involved in teaching: [email protected] FYS4260/FYS9260 34 Teaching material • Halbo & Ohlckers: Electronics Components, Packaging and Production (1995 - ISBN 82-992193-2-9) – Will be sold for 150,- to cover printing costs – The book is not up-to-date on all aspects, but still to the point • The book is also available for pdf download (chapter by chapter), see link below • Other valuable material can also be found here, including past exams and presentations: • And the link is: http://tid.uio.no/kurs/fys4260/ • THIS YEAR: Documents will be found on course home page FYS4260/FYS9260 Frode Strisland 35 Outline of teaching schedule • See handout paper FYS4260/FYS9260 36 Course curriculum Required course reading (preliminary) • • • Halbo and Ohlckers: Electronic components, packaging and production 1995 – The book could be more updated, but basic content is still valid. First of all get the overview understanding, then dive into the details, which sometimes are too much, for instance tables on material properties. Lecture presentations (uploaded on fronter) Handouts: – Rao R. Tummula: Fundamentals of Microsystems packaing, McGraw-Hill 2001 • • • Chapter 14: Fundamentals of microelectromechanical systems Chapter 18: Fundamentals of packaging, materials and processes Chapter 22: Fundamentals of microsystems reliability • Laboratory project (FYS4260 and FYS9260 students): – Design, assembly and testing of a surface mount printed circuit board. Graded with 20% weight based upon written report and oral presentation. • Revised list will follow later FYS4260/FYS9260 37 List of students enrolled • Will be collected FYS4260/FYS9260 38 END OF LECTURE Any questions? This presentation is made for FYS4260/FYS9260 teaching purposes, and is not intended for publication elsewhere.