Product Engineering Specification Tvh 0201 01 Sp0

Transcript

Part : Version : TVH020101SP0 A1 Page : 1/9 Product Engineering Specification TVH 0201 01 SP0  SCOPE TVH 0201 01 SP0 is a TVS diode designed to protect one power/control line or one signal line from overvoltage hazard of Electrostatic Discharge (ESD). 1. GENERAL DESCRIPTION TVH 0201 01 SP0 is a silicon base in ultra small Surface-Mounted Device (SMD) special packages. It is designed to protect sensitive electronics from damage or latch up due to Electrostatic Discharge (ESD), lightning, and other voltage induced transient events. 2. FEATURES ♦ Bi-directional ESD Protection of one line. ♦ Max ESD protection > 30 KV ♦ IEC 61000-4-2, level 4 (ESD) ♦ Low clamping voltage: VCL =8.5 V (1A, tp=8/20 us) ♦ Ultra small SMD special packages 3. APPLICATIONS ♦ Cellular handsets and accessories ♦ Audio and video equipment ♦ Communication systems ♦ Portable electronics ♦ Computers and peripherals Part : TVH020101SP0 Version : A1  EXPLANATION OF PART NUMBER TV H 0201 01 SP0 (1) (2) (3) (4) (5) (1) Product Type：TV=TVS Diode (2) Capacitance Code : H = High capacitance (3) Package Size Code (4) Channel Code：01=1 Channels (5) Specialized Specification Code  CIRCUIT DIAGRAM & DIMENSION Page : 2/9 Part : Version : TVH020101SP0 Page : A1 3/9  SPECIFICATIONS 1. ABSOLUTE MAXIMUM RATINGS PARAMETER Operating Supply Voltage PARAMETER VDC RATING 5 UNITS V Operating Temperature Range To -40 ~ +85 o Storage Temperature Range TS -55 ~ +125 o Lead Soldering Temperature TSOL 260 (10 sec.) o C C C 2. ESD standards compliance PARAMETER PARAMETER MINI RATING TYP MAX ±30 ESD per IEC 61000-4-2 (Contact) VESD ±8 ±20 ESD per IEC 61000-4-2 (Air) VESD ±15 ±25 UNITS kV kV 3. ELECTRICAL CHARACTERISTICS PARAMETER Reverse Stand-Off Voltage Reverse Leakage Current Reverse Breakdown Voltage Channel Input Capacitance Clamping Voltage Clamping Voltage SYMBOL VRWM ELECTRICAL CHARACTERISTICS CONDITIONS MINI TYP T=25 oC. o ILeak VRWM = 5V, T=25 C. VBV IBV = 1mA, T=25 oC. CIN VR = 0V, f = 1MHz, T=25 oC. VCL ITLP=5A, T=25 C VCL IPP=1A, tp=8/20us, T=25 C. 6 o o MAX UNITS 5 V 1 μA 7 V 30 pF 10 V 8.5 V Part : TVH020101SP0 Version : 4. TYPICAL CHARACTERISTICS A1 Page : 4/9 Part : Version : TVH020101SP0 Page : A1 5/9  TAPING PACKAGE AND LABEL MARKING 1. PACKAGING METHOD (Material: paper) Products shall be heat-sealed in the chip pocket, spacing pitch 4-mm of paper carrier tape with plastic cover tape, and the carrier tape shall be reeled to the reel. 2. CARRIER TAPE DIMENSIONS Unit: mm 0201 A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 0.69±0.03 W 0.39±0.03 T 0.42±0.03 Part : TVH020101SP0 Version : A1 Page : 6/9 3. TAPING REEL DIMENSIONS 4. TAPING SPECIFICATIONS There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 5. LABEL MARKING The label specified as follows shall be put on the side of reel. (1) Part No. (2)Quantity (3)Lot No. *Part No. And Quantity shall be marked on outer packaging. 6. QUANTITY OF PRODUCTS IN THE TAPING PACKAGE (1) Standard quantity：15,000pcs/Reel (2) Shipping quantity is a multiple of standard quantity. 7. STORAGE CONDITION WITH PACKAGE Storage Time: 12 months max Storage Temperature : 5 to 30℃ Relative Humidity: to 60 % Part : TVH020101SP0 Version : Page : A1 7/9  PRECAUTIONS FOR HANDLING 1. SOLDER CREAM IN REFLOW SOLDERING Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 80 to 100 μm. (2) Dimensions: millimeters Unit: mm Notes: This LAND LAYOUT is for reference purposes only. Please consult your manufacturing partners to ensure your company’s PCB design guidelines are met. 2. PRECAUTION FOR HANDLING OF SUBSTRATE Do not exceed to bend the board after soldering this product extremely. (Reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. break it. We recommend using the machine or the jig to 3. PRECAUTION FOR SOLDER ING Note that rapid heating, rapid cooling or local heating will easily damage this product. Do not give heat shock over 100C in the process of soldering. We recommend taking preheating and gradual cooling. Part : TVH020101SP0 Version : A1 Page : 4. RECOMMENDABLE REFLOW SOLDERING Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) Time maintained above: - Temperature (TL) - Time (tL) Peak Reference IPC-020c-5-1 Pb free Assembly 3 ℃/second max 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds Temperature (Tp) 260℃ +0/-5 ℃ Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature 20-40 seconds 6 ℃/second max. 8 minutes max 8/9 Part : TVH020101SP0 Version : A1 Page : 9/9 5. SOLDERING GUN PROCEDURE Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 350C for the period within 5 seconds by using soldering gun less than 30 W. (2) The soldering gun tip shall not touch this product directly. 6. SOLDERING VOLUME Note that excess of soldering volume will easily get crack the body of this product.