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RE L IA N C E Key Features
Reliance III Series Workstation
TQTower Chassis 250, 300 or 350 Watt Power Supply Intel® Celeron®, 1.7 - 2.0 GHz CPU Intel® Pentium® 4, 1.5 - 2.8 GHz CPU 400 or 533 MHz Front Side Bus (FSB) Intel® NetBurst™ Micro-architecture Intel® 845G Chipset Maximum 2 GB of DDR266 SDRAM memory 1.5V 4X AGP Connector for latest graphics technology Intel® Extreme Graphics Controller with up to 64 MB of memory Integrated ADI 1885 AC '97 Audio with SoundMAX USB 2.0, Ultra DMA/100 Optional Intel® PRO/100 Network Connection FCC DoC, UL Listed, EPA Energy Star Compliant DMI, ACPI, PC '99/99A Compliant
The Reliance III is designed to deliver across the board performance handling the Intel® 845G Chipset and cost-to-performance double data rate SDRAM memory to maximize the superior performance of the Intel® Pentium® 4 processor yet maintaining affordability. Its dynamic potent Pentium® 4 core, having a 533 MHz system bus and utilizing Intel® NetBurst™ micro-architecture, provides an astounding 4.2 GB per second data transfer rate. Other leading-edge technologies incorporated into the Reliance Series include AGP 4X, USB 2.0, Ultra ATA/100 hard disk support, integrated AC '97 digital audio, and advanced PC monitoring utilities. Its 350 Watt power supply is designed to accommodate the full expansion potential of the Reliance chassis which is capable of holding up to eleven storage devices. Indeed, the Reliance III Series not only offers versatility and "out-of-this-world" performance customers have come to expect but also a design path with a much lower overall system cost.
Model CQ1-I168
Integrated Video Integrated 32-bit Intel® Extreme Graphics Controller with VGA 32 Bits Per Pixel (bpp) Graphics Engine and 3D Graphics Visual and Texturing Enhancement Dynamic Video Memory Technology (DVMT) supporting up to 64 MB
Processor Socket mPGA478-pin 400 MHz or 533 MHz Front Side Bus (FSB) Intel® Netburst™ Micro-architecture Intel® Pentium® 4 Processors 1.5 GHz to 2.8 GHz CPUs Intel® Celeron® Processors 1.7 GHz to 2.0 GHz CPUs Chipset Intel® 845G Chipset Intel® 82845G Memory Controller Hub (MCH) with Accelerated Hub-Architecture (AHA) Bus Intel® 82801DB I/O Controller Hub (ICH4) with AHA Bus Intel® 82802AB Firmware Hub (FWH) PCI 2.2 Compliant & Concurrent PCI for Real Time I/O BIOS 4 Mbit Flash EEPROM Intel® AMI BIOS - DMI 2.0, Wfm 2.0, Green, Plug & Play, Wake-on-LAN IDE Drive Auto-Configure Intel® Rapid BIOS Boot Supports ZIP Drives Supports IDE CD-ROM and SCSI Bootup Enhanced Advanced Configuration and Power Interface (ACPI) v1.0b PC '01 Compliant Cache 12k µop Level 1 Execution Trace Cache 8 KB Level 1 Data Cache 128 KB, 256 KB, or 512 KB On-Die, Full Speed Level 2 Cache (ATC) System Memory Two 184-pin unbuffered DIMM Sockets for 2.5V DDR266 ECC/non-ECC Double Data Rate (DDR) SDRAM Memory 64 MB, 128 MB, 256 MB, 512 MB, or 1 GB DIMMs Maximum Memory Capacity of 2 GB Maximum Transfer Speed of 2.1 GB/sec System Management Fan Status/Temperature Monitoring and Alert Auto Throttling of CPU Fan in Suspend Mode to Save Power Auto Slow-Down of CPU When Overheating is Detected Power Supply Voltage Monitoring and Alert Chassis Intrusion Alarm and Logging Keyboard Power-on System Resources: Memory and Hard Disk Drive Utilization Monitoring and Alert Wake-on-LAN and Wake-on-Ring Support Message LED to Indicate Receipt of Data Through Modem Intel® Active Monitor System Management Integrated PCI IDE 2 Independent Channels - PCI Bus Master IDE Ports Supports 4 IDE and EIDE Devices Supports PIO Modes 3 & 4 (17 MB/sec maximum) Supports Bus Master DMA Mode 2 (22 MB/sec maximum) Supports Bus Master Ultra DMA/33 (33 MB/sec maximum) Supports Bus Master Ultra DMA/66 (66 MB/sec maximum) Supports Bus Master Ultra DMA/100 (100 MB/sec maximum) ATAPI CD-ROM Supported Integrated Audio ADI 1885 AC '97 Audio with SoundMAX with SPX and Microphone Pre-amplifier One Line-in, Line-out, and One Microphone-in Connector
N C S Te c h n o l o g i e s , I n c . 9490 Innovation Loop Manassas, VA 20110 www.ncst.com
Reliance III Series Workstation
Voice: (703) 621-1700 Toll-free: (888) RING-NCS Fax: (703) 621-1701
Integrated LAN (Optional) Intel® ICH4 (with Integrated LAN Media Access) Network Interface Controller Subsystem Intel® 82562ET Chipset complying with IEEE 802.3u Auto-Negotiation and IEEE 802.3x Full-Duplex Flow Control Standards Integrated Super I/O 1 Floppy Port for Two Drives (up to 2.88 MB drive type) 1 Serial Port (16550 Fast UART compatible) 1 ECP/EPP Parallel Port 1 PS/2 Mouse Port 1 PS/2 Keyboard Port 6 USB: 4 Back Panel and 2 Front Panel USB 2.0 Stacks Fast Infrared IrDA Compliant Interface Header to IR TX/RX (Optional) 1 RJ-45 Port (Optional) Expansion Slots Six 32-bit PCI, One CNR (Optional), and One AGP Slots Bus Architecture 32-bit PCI, 4X AGP, and Optional Communication and Network Riser (Shared) Housing Configuration TQ Tower Chassis Dimensions (d) x (w) x (h) cm/inches
46.5 x 22.6 x 52.8 / 18.3 x 8.9 x 20/8
Drive Bays 5.25 inch External 3.5 inch External 3.5 inch Internal (Standard/Optional)
4 2 5/0
Power Supply Features Input Voltage Input Frequency Input Currents Device Power Connectors Green PC Maximum Output Form Factor Soft Power Switch
100-120 VAC/200-240 VAC 50/60 Hz 10.0/5.5A 7 for 5.25" and 2 for 3.5" Devices EEF Energy Efficient PC 350 Watts Intel® ATX DC On/Off via TTL Signal
Environmental Operating Temperature Storage Temperature Relative Humidity Airflow Requirements
0º to 55º C/+32º to 131º F -40º to 70º C/-42º to 158º F 92% RH @ +36º C/+97º F 100 LFM
Regulatory & Product Certifications EMI/RFI FCC Declaration of Conformity (DoC) Safety Underwriter Laboratories 1950, 1st Edition EPA Energy Star Compliant Optional Items 6 cm Cooling Fan 8 cm Cooling Fan 3.5 inch Hard Drive Bracket
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