Transcript
Material Declaration Data Sheet Model:Product Servers, Boards, Accessories, RAID: EMC Corporation
Manufacturer: Intel
Note: This declaration applies to all associated product codes starting on Page 2
Lead Free (Pb) Product: Yes/RoHS6, 6/6
Date: March 23, 2012
Restriction on Hazardous Substances (RoHS) Compliance RoHS Definition
Quantity limit of 0.1% by mass (1000PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
Intel understands RoHS requires: Lead and other materials banned in the RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. (Note: RoHS implementing details are not fully defined and may change.) RoHS Declaration Lead as an alloying element in steel containing up to 0.35 % lead by weight.
6a 6b 6c 7a 7b
Lead as an alloying element in aluminum containing up to 0.4 % lead by weight. Lead as an alloying element in copper containing up to 4 % lead by weight. Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.
7c-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic 7c-II 7c-III 8b 11b 13b 15
devices, or in a glass or ceramic matrix compound. Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher. Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC. Cadmium and its compounds in electrical contacts. Lead used in other than C-press compliant pin connector systems. Cadmium and lead in filter glasses and glasses used for reflectance standards. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
20 21 24 25
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
31 33 34
Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic capacitors Lead oxide in surface conduction electron emitter displays (SED) used in structural elements: notably in the seal frit and frit ring. Lead in solders for the soldering of thin copper wires of 100um diameter and less in power transformers. Lead in cermet-based trimmer potentiometer elements. Other (Include exemption number)
Where the product is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we currently understand the requirements. Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and correct. INTEL ACCEPTS NO DUTY TO UPDATE THIS DECLARATION OR TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS DECLARATION THAT HAS BEEN UPDATED OR CHANGED.
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Product Code Information Product Code
Description
*RoHS Exemption #
ER1304BTLSHBN
INTEL 1U SIKA PLATFORM TPS
6a, 6b, 6,c, 7a, 7c1, 15
E1208GL4GC
Kylin - INTEL 1U COMPUTE PLATFORM TPS
6a, 6b, 6,c, 7a, 7c1, 15 6a, 6b, 6,c, 7a, 7c1, 15
H2216XXJR
Dragon24 - INTEL S2U-2.5 INCHES HDD STORAGE PLATFORM Dragon12 - INTEL S2U-3.5 INCHES HDD STORAGE PLATFORM Phoenix16 - Production Intel Server Chassis H2216XXJR
H2312XXJR
Phoenix12 - Production Intel® Server Chassis H2312XXJR
E2224GL4GC E2312GL4GC
HNS2600JF RMS25PB080 RMS25CB080 RES2SV240NC
Phoenix Node - Production Intel® Compute Module HNS2600JF Intel® Integrated RAID Module RMS25PB080, PCIe Slot, LSI2208 ROC, 8P Internal SAS/SATA Intel® Integrated RAID Module RMS25CB080, SIOM Connector, LSI2208 ROC, 8P Internal SAS, MegaRAID SWStack, 1GB DDR3, R0,1,10,5,50,6,60 24-port expander
AXX4P1GBPWLIOM Quad port 1GbE IO Module ,Intel® Ethernet Controller I350 AXX10GBTWLIOM Dual RJ-45 port 10GBASE-T IO module, Intel I350 Ethernet AXX10GBNIAIOM AXXRSBBU9 AXXRMFBU2
Dual SFP+ port 10GbE IO module,Intel® 82599 10 Gigabit Intel® RAID Smart Battery AXXRSBBU9 for mainstream RS25, RMS25, RT3 and RMT3 family RAID products. Maintenance Free Backup Unit,NAND Flash & Supercapacitor
AXXSATADVDROM SATA DVDROM Rail Kit EXX1U2URAILS
6a, 6b, 6,c, 7a, 7c1, 15 6a, 6b, 6,c, 7a, 7c1 6a, 6b, 6,c, 7a, 7c1 7a, 7c1, 15 7a, 7c1, 15 7a, 7c1, 15
7a, 7c1, 15 7a, 7c1, 15 7a, 7c1, 15 7a, 7c1, 15 6a, 7c1 6a, 7c1 6c, 7c1 Compliant without exemption
AXXRMM4LITE
Remote Management Module for upgrading to Remote KVM
7c1
AXXRMM4IOM
PCI Express x16 (164 pin) rIOM riser & rIOM carrier board kit
7c1
AXXRMS2AF040
Integrated Server RAID Module AXXRMS2AF040
7c1
* RoHS Exemption # corresponds with exemption #’s found on page 1.
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