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Semiconductors Mosfets Mosfets For Load Switch Mosfets For Load Switch Fc694309 Data Sheet

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Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER FC694309ER Dual N-channel MOSFET Unit : mm For switching circuits 1.6 0.2  Features 0.13 6 5 4 1 2 3  Marking Symbol : 1.2 1.6  Low drive voltage : 1.5 V drive  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL : Level 1 compliant) (0.6) X9 (0.5) (0.5) 1.0  Basic Part Number  Dual FK330309 (Individual)  Packaging Embossed type (Thermo-compression sealing) : 8 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25 C Parameter Drain to Source Voltage FET1 Gate to Source Voltage FET2 Drain Current Drain Current (Pulsed) *1 Total Power Dissipation Overall Channel Temperature Storage Temperature Range Symbol VDS VGS ID IDp PD Tch Tstg Rating 30 6 100 200 125 150 -55 to +150 Unit V V mA mA mW C C 1. Source(FET1) 4. Source(FET2) 2. Gate(FET1) 5. Gate(FET2) 3. Drain(FET2) 6. Drain(FET1) Panasonic JEITA Code SSMini6-F3-B SC-107C SOT-666 Internal Connection 6 5 4 FET 1 Note *1 Pulse test: Ensure that the channel temperature does not exceed 150 C FET 2 1 3 2 Pin Name 1. Source(FET1) 4. Source(FET2) 2. Gate(FET1) 5. Gate(FET2) 3. Drain(FET2) 6. Drain(FET1) Page 1 of 6 Established : 2013-02-19 Revised : 2013-02-27 Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER  Electrical Characteristics Ta = 25 C  3 C FET1, FET2 Parameter Drain-source Breakdown Voltage Zero Gate Voltage Drain Current Gate-source Leakage Current Gate-source Threshold Voltage Drain-source On-state Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time *1 Turn-off Delay Time *1 Symbol VDSS IDSS IGSS Vth Conditions ID = 1 mA, VGS = 0 V VDS = 30 V, VGS = 0 V VGS = 6 V, VDS = 0 V ID = 1 mA, VDS = 10 V RDS(on)1 ID = 10 mA, VGS = 2.5 V RDS(on)2 ID = 10 mA, VGS = 1.5 V Ciss VDS = 10 V, VGS = 0 V Coss f = 1 MHz Crss VDD = 3 V, VGS = 0 to 3 V ton ID = 10 mA, RL = 300  VDD = 3 V, VGS = 3 to 0 V toff ID = 10 mA, RL = 300  Min Typ Max 30 0.3 1 4 13 7 4 10 10 1.3 4 12 Unit V A A V  pF 20 ns 100 ns Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors. 2. *1 Measurement circuit for Turn-on Delay Time / Turn-off Delay Time Page 2 of 6 Established : 2013-02-19 Revised : 2013-02-27 Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER *1 Measurement circuit for Turn-on Delay Time / Turn-off Delay Time VDD = 3 V Vin ID = 10 mA RL = 300  3V PW = 10 s D.C.  1 % 0V Vout D Vin G 50  S 90 % Vin 10 % 10 % Vout 90 % ton toff Page 3 of 6 Established : 2013-02-19 Revised : 2013-02-27 Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER Technical Data ( reference ) ISD - VSD ID - VGS 1.E-02 Ta = 85 C Ta = 85 C 1.E-02 25 C Drain Current ID (A) Forward Drain Current ISD (A) 1.E-01 1.E-03 1.E-04 1.E-05 -30 C 1.E-06 1.E-07 0 0.2 0.4 0.6 0.8 1 1.E-03 25 C 1.E-04 1.E-05 -30 C 1.E-06 1.E-07 0.0 RDS(on) - VGS Drain source On-state Resistance RDS(on) () Drain source On-state Resistance RDS(on) () ID = 10 mA 1 0.1 2 0.4 0.8 1.0 4 10 VGS = 1.5 V 1 2.5 V 0.1 6 0 0.05 0.1 Drain Current ID (A) Gate-source Voltage VGS (V) Dynamic Input/Output Characteristics Capacitance - VDS 6 Gate-source Voltage VGS (V) 100 Capacitance C (pF) 0.6 RDS(on) - ID 10 0 0.2 Gate-source Voltage VGS (V) Body Diode Forward Voltage VSD (V) Ciss 10 Coss Crss 1 VDD = 3 V 5 4 3 2 1 0 0.1 1 10 Drain-source Voltage VDS (V) 100 0 0.5 1 1.5 2 Total Gate Charge Qg (nC) Page 4 of 6 Established : 2013-02-19 Revised : 2013-02-27 Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER Technical Data ( reference ) Vth - Ta RDS(on) - Ta Drain-source On-state Resistance RDS(on) () Gate-source Threshold Voltage Vth (V) 1.5 1 0.5 0 -50 0 50 100 5 VGS = 1.5 V 4 3 2 1 2.5 V 0 -50 150 Temperature Ta (C) 0 50 100 150 Temperature Ta (C) PD - Ta Total Power Dissipation PD (W) 0.15 0.1 0.05 0 0 50 100 150 Temperature Ta (C) Safe Operating Area Rth - tsw 1 IDp = 0.2 A Drain Current ID (A) Thermal Resistance Rth (C / W) 1000 100 10 1 0.001 0.01 0.1 1 10 Pulse Width tsw (s) 100 1000 0.1 Operation in this area is limited by RDS(on) 10 ms 100 ms 1s 0.01 0.001 0.01 Ta = 25 C, Glass epoxy board (25.4  25.4  0.8 mm) coated with copper foil, DC which has more than 300 mm2. 0.1 1 10 100 Drain-source Voltage VDS (V) Page 5 of 6 Established : 2013-02-19 Revised : 2013-02-27 Doc No. TT4-EA-14543 Revision. 2 Product Standards MOS FET FC694309ER SSMini6-F3-B Unit : mm 1.60±0.05 +0.05 0.13-0.02 5 4 1 2 3 0.20±0.05 (5°) 1.20±0.05 6 1.60±0.05 +0.05 0.20-0.02 (0.5) (0.5) 0 to 0.05 (5°) (0.27) 0.55±0.05 1.00±0.05  Land Pattern (Reference) (Unit : mm) 0.5 0.4 1.6 0.5 0.35 Page 6 of 6 Established : 2013-02-19 Revised : 2013-02-27 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 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At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. 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