Transcript
2015-11-12
High Power Infrared Emitter (940 nm) Version 1.4
SFH 4045N
Features: • High Power Infrared LED • Short switching time • small package: (WxDxH) 3 mm x 2.65 mm x 1.2mm • SMT Sidelooker Applications Interrupters, Lightcurtains • • Sensor technology • Proximity sensor • Touchscreen • Industrial electronics Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.
Ordering Information Type:
Radiant Intensity
Ordering Code
Ie [mW/sr] IF = 70 mA, tp= 20 ms SFH 4045N Note:
90 (≥ 40)
Q65111A3903
Measured at a solid angle of Ω = 0.01 sr
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Version 1.4
SFH 4045N
Maximum Ratings (TA = 25 °C) Parameter
Symbol
Values
Operation and storage temperature range
Top; Tstg
-40 ... 85
°C
Reverse voltage
VR
5
V
Forward current
IF
70
mA
Surge current (tp ≤ 100 µs, D = 0)
IFSM
0.7
A
Total power dissipation
Ptot
140
mW
ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2
Thermal resistance junction - ambient 1) page 12
RthJA
540
K/W
Thermal resistance junction - soldering point
RthJS
360
K/W
2) page 12
Unit
kV
Characteristics (TA = 25 °C) Parameter
Symbol
Values
Unit
Peak wavelength (IF = 70 mA, tp = 20 ms)
(typ)
λpeak
950
nm
Centroid wavelength (IF = 70 mA, tp = 20 ms)
(typ)
λcentroid
940
nm
Spectral bandwidth at 50% of Imax (IF = 70 mA, tp = 10 ms)
(typ)
∆λ
42
nm
Half angle
(typ)
ϕ
±9
°
Dimensions of active chip area
(typ)
LxW
Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 70 mA, RL = 50 Ω)
(typ)
tr, tf
Forward voltage (IF = 70 mA, tp = 20 ms) Forward voltage (IF = 700 mA, tp = 100 µs)
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mm x mm
12
ns
(typ (max)) VF
1.6 (≤ 2)
V
(typ (max)) VF
2.8
V
Reverse current (VR = 5 V) Total radiant flux (IF= 70 mA, tp=20 ms)
0.2 x 0.2
(typ)
2
IR
not designed for reverse operation
µA
Φe
40
mW
Version 1.4
SFH 4045N
Parameter
Symbol
Values
Unit
Temperature coefficient of Ie or Φe (IF = 70 mA, tp = 10 ms)
(typ)
TCI
-0.5
%/K
Temperature coefficient of VF (IF = 70 mA, tp = 10 ms)
(typ)
TCV
-1.3
mV / K
Temperature coefficient of wavelength (IF = 70 mA, tp = 10 ms)
(typ)
TCλ
0.3
nm / K
Grouping (TA = 25 °C) Group
Min Radiant Intensity
Max Radiant Intensity
Typ Radiant Intensity
IF = 70 mA, tp= 20 ms
IF = 70 mA, tp= 20 ms
IF = 700 mA, tp = 25 µs
Ie, min [mW / sr]
Ie, max [mW / sr]
Ie, typ [mW / sr]
SFH 4045N-U
40
80
420
SFH 4045N-V
63
125
660
SFH 4045N-AW
100
200
1050
Note:
measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1).
Relative Spectral Emission 3) page 12 Irel = f(λ), TA = 25°C
Radiant Intensity 3) page 12 Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 µs, TA= 25°C
OHF04134
100
OHF03827
101
I rel %
Ie
80
I e (70 mA)
60
100 5
40 10-1
20
0 800
5
850
900
950
nm 1025
10-2 0 10
λ
5 10 1
5 10 2
mA 10 3
IF
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Version 1.4
SFH 4045N Forward Current 3) page 12 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current IF, max = f(TA), RthJA = 540 K/W
IF
OHF04264
80 mA
IF
70
OHF03828
100 A
10-1
60
5 50
10-2
40
5 30
10-3
20
5 10 0
0
20
40
60
10-4
80 ˚C 100
0
0.5
1
1.5
2.5 V 3
2
TA
VF Permissible Pulse Handling Capability IF = f(tp), T A = 85 °C, duty cycle D = parameter
Permissible Pulse Handling Capability IF = f(tp), TA = 25 °C, duty cycle D = parameter 0.8 IF A 0.7 0.6 0.5 0.4 0.3 0.2
OHF04265
t
0.8 IF A 0.7
tP IF
D = TP
T
t
D = TP
IF T
0.6
D= 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.5 1
0.5 0.4 0.3 0.2
0.1
0.1
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
D= 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.5 1
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
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OHF04266
tP
tp
4
Version 1.4
SFH 4045N
Radiation Characteristics 3) page 12 Irel = f(ϕ), TA= 25°C 40˚
30˚
20˚
10˚ ϕ
0˚
OHF04388
1.0
50˚ 0.8 60˚
0.6
70˚
0.4
80˚
0.2 0
90˚
100˚
1.0
0.8
0.6
0.4
0˚
Package Outline
Dimensions in mm. Package Chipled
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5
20˚
40˚
60˚
80˚
100˚
120˚
Version 1.4
SFH 4045N
Approximate Weight: 0.1 mg Recommended Solder Pad
Dimensions in mm. Note: - metalization layer is thicker than the solder resist layer Note: - recommended solder thickness: 120 - 150 µm
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Version 1.4
SFH 4045N
Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 OHA04525
300 ˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C 200
tL
150
tS
100
50 25 ˚C 0
50
0
100
150
200
250
s 300
t OHA04612
Profile Feature Profil-Charakteristik
Symbol Symbol
Pb-Free (SnAgCu) Assembly Minimum
)
Ramp-up rate to preheat* 25 °C to 150 °C Time tS TSmin to TSmax
tS
60
Ramp-up rate to peak*) TSmax to TP
Recommendation
Maximum
2
3
100
120
2
3
Unit Einheit K/s s K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak temperature TP - 5 K
tP
20
30
s
3
6
K/s
10
Ramp-down rate* TP to 100 °C
480
Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2015-11-12
°C
7
s
Version 1.4
SFH 4045N
Taping
Dimensions in mm [inch].
Tape and Reel 8 mm tape with 2000 pcs. on ∅ 180 mm reel W1 D0
P0
A N
F W
E
13.0 ±0.25
P2
Label
P1 Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324
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Version 1.4
SFH 4045N
Tape dimensions [mm] Tape dim ensions in m m
W
P0
P1
P2
D0
E
F
8 + 0.3 / -0.1
4 ± 0.1
2 ± 0.05 or 4 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
3.5 ± 0.05
Reel dimensions [mm] Reel dim ensions in m m
A
W
Nmin
W1
W2max
180
8
60
8.4 + 2
14.4
Barcode-Product-Label (BPL) OSRAM Opto
EX A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
ML Temp ST X XXX °C X
(9D) D/C: 1234
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
Dry Packing Process and Materials
Moisture-sensitive label or print L VE el
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Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot
WET
If wet, examine units, if necessary bake units
15%
If wet, examine units, if necessary bake units
10% 5%
If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835
AM OSR
Desiccant
OHA00539
Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC.
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Version 1.4
SFH 4045N
Transportation Packing and Materials
Barcode label
D/
8
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R 18
-1 P -1 + Q
C:
99
D/
21 00
(9 D)
21 :
20 00
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14 2
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S S em R ic AM on du O p ct to or H NO s TC
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BA (6 P)
NO : 12
11 00
LO T (1 T)
NO :
TY : 20
(Q
)Q
: NO
M
RA
OS
(X
)
PR O
D
5 14 2 110 0
Packing Sealing label
Dimensions of transportation box in mm Width
Length
Height
200 ± 5
195 ± 5
30 ± 5
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OD PR ) (X
(G
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:
P
-1
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Muster
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2100
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Barcode label
10
OHA02044
Version 1.4
SFH 4045N
Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.
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Version 1.4
SFH 4045N
Glossary 1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2015-11-12
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Version 1.4
SFH 4045N
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.
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