Transcript
IRELESS I
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XENPAK-10GB-SR
10 Gigabit Ethernet XENPAK Transceiver
Product Features：
﹡XAUI Electrical Interface: 4 Lanes @ 3.125Gbit/s ﹡Hot pluggable XENPAK MSA 3.0 form factor ﹡Up to 300 meter on 50/125 µm MMF ﹡SC connector, multi-mode fiber ﹡MDIO, DOM Support ﹡Uncooled 850nm VCSEL laser ﹡PIN Photo-detector ﹡Operating Case Temperature: 0°C to 70°C ﹡Compliant to IEEE 802.3ae 10GBASE-SR Application
Applications：
﹡10GBASE-SR 10G Ethernet
DESCRIPTION:
10GBase XENPAK transceiver module XENPAK-10GB-SR is a hot pluggable in the Z-direction module that is usable in typical router line card applications, Storage, IP network and LAN and compliant to XENPAK MSA. The XENPAK-10GB-SR is a fully integrated 10.3Gbit/s optical transceiver module that consists of a 10.3Gbit/s optical transmitter and receiver, XAUI interface, Mux and Demux with clock and data recovery(CDR). Transceiver line uses an cooled 850nm VCSEL Laser Diode to achieve 300m over standard multi-mode fiber as 10GBASE-SR of the IEEE 802.3ae.
PERFORMANCE SPECIFICATIONS： Table 1. Optical Characteristics No. Parameters Symbols 1 Center Wavelength λC 2 Signaling speed Signaling speed 3 variation from nominal Optical modulation 4 OMA amplitude Optical Output 5 Pf Power 6 Optical Waveform Side Mode Sr 7 Suppression Ratio 8 Extinction Ratio Er 9 Off Transmit Power Poff Optical Output 10 TTX-OFF turn-off Time Receiver Sensitivity 11 OMArmin in OMA
Min. 840 -
Typ. Max. 850 860 10.3125 -
Unit nm Gbit/s
Remarks
-100
-
+100
ppm
-5.2
-
-
dBm
Note 1
-7.3
-
1.3
dBm
Average
-
-
-
dB
Average
30
-
-
3.5 -
-
-30
dB dBm
Average
-
-
100
µs
Figure10
-
-
-10.0
dBm
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Electrical Characteristics Absolute Maximum Ratings Rating
Conditions
Symbol
Min
Max
Units
-40
+85
℃
0
+75
℃
RH
8
80
％
VCC 3
-0.5
4.0
V
VCC1.8
-0.5
2.5
V
4.0
V
HBM human body model per JEDEC JESD22-A114-B
500
V
HBM human body model
2,000
V
Storage Ambient Temperature Range Powered case Temperature Range Operating Relative Humidity Supply Voltage Range @ 3.3V Supply Voltage Range @ 1.8V（optional） Open Drain VCC level
VOD
Static Discharge Voltage on XFI High Static Discharge Voltage excluding XFI High Speed Pins
EN61000-4-2 Criterion B: 15,000 V Air Discharge Direct Contact 8,000 V discharge Any stress beyond the maximum ratings can result in permanent damage. The device specifications are guaranteed only under the recommended operating conditions. Static Discharge Voltage on XFP Module
Recommend operating condition Parameter
Conditions
Operating Case Temperature Range Transceiver total Power Consumption Power Supply Voltage @ 3.3V Power Supply Voltage @ 1.8V (optional)
Symbol
Min
Typ
Max
Units
+70
℃
1.5
2.5
W
0
PTOT VCC 3
3.13
3.3
3.45
V
VCC1.8
1.65
1.8
1.95
V
VCC 3
I VCC 3
500
mA
VCC1.8
IVCC1.8
400
mA
Supply Current
@
Supply Current
@
High Speed Line Characteristics Parameter Baud Rate nominal Baud Rate Tolerance www.kyopto.com
Conditions
Symbol
Min 9.95 -100
Typ
PAGE 2 OF 9
Max 10.71 +100
Units Gbd ppm
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High Speed Line Output-DC Characteristics Parameter
Conditions
Single Ended Output Impedance Differential Output Impedance
Symbol
Min
Typ
Max
Units
Z SE
40
50
60
Ω
Z OD
80
100
120
Ω
High Speed Line Output-AC Characteristics Parameter
Conditions
Symbol
Min
Differential Output Amplitude
VOSPP
Output Common Mode Transition Time Low to High Transition Time High to Low
Max
Units
340
850
mV
VCM
0
3.6
V
tr tf
24
ps
24
ps
20 8 See1 )
dB dB
3
dB
0.05—0.1GHz 0.1—5.5GHz 5.5—12GHz
Differential Output Return Loss 2
Common Mode Output Return Loss )
0.1—15GHz
SCC 22
Typ
Dj
Total Peak-to-peak Jitter Output AC Common Mode Voltage 1) 2)
0.34
UI
15
mV (RMS)
SDD22(dB)=8-20.66 log10(f15.5) with fin GHz Common mode reference impedance is 25Ω. Common mode return loss helps absorb reflection and noise improving EMI.
High Speed Line Input-DC Characteristics Parameter Differential Output Impedance Input AC Common Mode Input Voltage Source to Sink DC Potential Difference
Conditions
Symbol
Min
Typ
Max
Units
R IND
80
100
120
Ω
0
25
mV (RMS)
0
3.6
V
VCM
High Speed Line Input-AC Characteristics
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Parameter
Conditions
Symbol
Differential input Voltage Swing Differential Return Loss Common Mode Return Loss
V ID 0.05—0.1GHz 0.1—5.5GHz 5.5—12GHz 0.1—15GHz
Total Jitter 1) 2)
Min 120 See 2) 20 8 See 1) 3
SDD11 SCC11
Typ
Max
Units mV dB dB
Tj
TBD
UI
Max
Units
SDD11(dB)=8-20.66 log10(f15.5) with f in GHz Beneath this level the signal can’t meet the specification
Parameter
Conditions
Operating Range
62.5/125μm MMF 50/125μm MMF 62.5/125μm MMF 50/125μm MMF 50/125μm MMF
Min Modal Bandwidth (MHz*Km) 160 400 200 500 2000
Symbol
Min
I OP
2 2 2 2 2
f OPT
9.95
Nominal Signalling Speed
Optical Characteristics
Typ
26 66 33 82 300 10.7 1
m
GBd
General parameters
Optical Transmitter Parameter
Conditions
Symbol
Min
Typ
Max
Units
Nominal Wavelength
λTRP
840
850
860
nm
Spectral Width
△λ
0.4
0.45
nm
PoptOMA
-2.8
Average Launch Power
Poptavg
-5
Extinction Ratio Relative Intensity Noise
ER RIN
3.5
Symbol
Min
Typ
Max
Units
λC
840
850
860
Nm
-13.5
-11.1
dBm
Launch Power
in OMA
-1.5
dBm -1
dBm
-128
dB dB/Hz
5.5
Optical Receiver Parameter
Conditions
Center Wavelength Receiver Sensitivity
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in OMA,
10
−12
BER 31
@ 2 -1
PIN
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Stressed Receiver Sensitivity
in OMA
Saturation Input Power
PIN
-7.5
dBm
PSAT
0.5
dBm
1) With ideal transmitter Note: The specified characteristics are met within the recommended range of operating conditions and under the default settings of output power and modulation amplitude. A change in setting of the optical output power influences especially the dynamic behavior of the output signal. Unless otherwise noted typical data are quoted at nominal voltages and +25℃ ambient temperature.
Hostboard Connector Pinout
Top View
Electrical Pin Definition PIN 1 2
Logic
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Symbol GND VEE5
Name I Description Module Ground Optional-5.2V Power Supply PAGE 5 OF 9
Note 1
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3
LVTTL-I
Mod_DeSel
4
LVTTL-O
Interrupt
5 6 7 8 9 10 11
LVTTL-I
LVTTL-I/O LVTTL-I/O
TX_DS VCC5 GND VCC3 VCC3 SCL SDA
12
LVTTL-O
Mod_Abs
13 14 15 16 17 18 19 20
LVTTL-O LVTTL-O
Mod_NR RX_LOS GND GND RDRD+ GND VCC2
21
LVTTL-O
CML-O CML-O
22 23 24
P-Down/RST
VCC2 GND PECL-I
RefCLK+
Mode De-select; When held low allows module to 2-wire serial interface commands Interrupt(inverted); Indicates Presence of an important condition which can be read over the 2-wire serial interface Transmitter Disable; Turns off transmitter laser output +5V Power Supply Module Ground +3.3VPower Supply +3.3VPower Supply 2-Wire Serial Interface Clock 2-Wire Serial Interface Data Line Indicates Module is not present. Grounded in the module Module Not Ready; Indicating module operational fault Receiver Loss Of Signal Indicator Module Ground Module Ground Receiver Inverted Data Output Receiver Non-Inverted Data Output Module Ground +1.8V Power Supply Power Down; When high; requires the module to limit power consumption to 1.5W or below. 2-Wire serial interface must be functional in the low Power mode Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface; equivalent to a power cycle +1.8V Power Supply Module Ground
2
1
2 2 2 2 2 1 1
1
1
Reference Clock Non-Inverted Input; AC coupled on the host board
Reference Clock Inverted Input; AC coupled on the host board 26 GND Module Ground 1 27 GND Module Ground 1 28 CML-I TDTransmitter Inverted Data Input 29 CML-I TD+ Transmitter Non-Inverted Data Input 30 GND Module Ground 1 1） Module ground pins GND are isolated from the module case and chassis ground within the module. 2） Shall be pulled up with 4.7kΩ-10 kΩ to a voltage between3.15V and 3.45V on the host board. 25
PECL-I
RefCLK-
Digital Diagnostic Functions XFP-10Gb-SR Small Form Factor 10Gb/s (XFP) transceivers are compliant with the current XFP Multi-Source Agreement (MSA) Specification Rev 4.5.
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As defined by the XFP MSA, 10Gb/s XFP transceivers provide digital diagnostic functions via a 2-wire serial interface, which allows real-time access to the following operating parameters: Transceiver temperature Laser bias current Transmitted optical power Received optical power Transceiver supply voltage It also provides a sophisticated system of alarm and warning flags, which may be used to alert end-users when particular operating parameters are outside of a factory-set normal range. The operating and diagnostics information is monitored and reported by a Digital Diagnostics Transceiver Controller inside the transceiver, which is accessed through the 2-wire serial interface. When the serial protocol is activated, the serial clock signal (SCL pin) is generated by the host. The positive edge clocks data into the XFP transceiver into those segments of its memory map that are not write-protected. The negative edge clocks data from the XFP transceiver. The serial data signal (SDA pin) is bi-directional for serial data transfer. The host uses SDA in conjunction with SCL to mark the start and end of serial protocol activation. The memories are organized as a series of 8-bit data words that can be addressed individually or sequentially. The 2-wire serial interface provides sequential or random access to the 8 bit parameters, addressed from 000h to the maximum address of the memory.
Mechanical Specifications XFP transceivers are compliant with the dimensions defined by the XFP Multi-Sourcing Agreement (MSA).
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Recommended Host Board Power Supply Circuit
Recommended High-speed Interface Circuit
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Thermal Management The transceiver is designed for operation within a temperature range between 0 to +70℃ at an altitude of <3km. The user needs to guarantee per system design to not exceed this temperature range. It has to be considered that in case of use of multiple modules on a single hostboard there is a temperature rise among the modules hosted side by side (see figure below). Airflow direction and air speed needs to be chosen accordingly. For further information it is referred to the MSA document
Inlet Air Temp (C)
Example of Module Temperature vs Air Flow 90 80 70 60 50 40 30 20 10 0
Module 1 Module 2 Module4 0.5
1
1.5
2
2.5
3
Airflow(m/s) Figure 1
Thermal be haviour of multiple modules vs. Inlet Air Temperature
Eye Safety This laser based multimode transceiver is a Class 1M product. It complies with IEC 60825-1 and FDA performance standards for laser products (21 CFR1040.10 and 1040.11) except for deviations pursuant to laser Notice 50.dated July 26.2001.
CLASS 1M LASER PRODUCT DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS To meet laser safety requirements the transceiver shall be operated within Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref.21 CFR 1040.10(1)).
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XENPAK-10GB-SR 10 Gigabit Ethernet XENPAK Transceiver
Product Features： ﹡XAUI Electrical Interface: 4 Lanes @ 3.125Gbit/s ﹡Hot pluggable XENPAK MSA 3.0 form factor ﹡Up to 300 meter on 50/125 µm MMF ﹡SC connector, multi-mode fiber ﹡MDIO, DOM Support ﹡Uncooled 850nm VCSEL laser ﹡PIN Photo-detector ﹡Operating Case Temperature: 0°C to 70°C ﹡Compliant to IEEE 802.3ae 10GBASE-SR Application
Applications： ﹡10GBASE-SR 10G Ethernet
DESCRIPTION: 10GBase XENPAK transceiver module XENPAK-10GB-SR is a hot pluggable in the Z-direction module that is usable in typical router line card applications, Storage, IP network and LAN and compliant to XENPAK MSA. The XENPAK-10GB-SR is a fully integrated 10.3Gbit/s optical transceiver module that consists of a 10.3Gbit/s optical transmitter and receiver, XAUI interface, Mux and Demux with clock and data recovery(CDR). Transceiver line uses an cooled 850nm VCSEL Laser Diode to achieve 300m over standard multi-mode fiber as 10GBASE-SR of the IEEE 802.3ae.
PERFORMANCE SPECIFICATIONS： Table 1. Optical Characteristics No. Parameters Symbols 1 Center Wavelength λC 2 Signaling speed Signaling speed 3 variation from nominal Optical modulation 4 OMA amplitude Optical Output 5 Pf Power 6 Optical Waveform Side Mode Sr 7 Suppression Ratio 8 Extinction Ratio Er 9 Off Transmit Power Poff Optical Output 10 TTX-OFF turn-off Time Receiver Sensitivity 11 OMArmin in OMA
Min. 840 -
Typ. Max. 850 860 10.3125 -
Unit nm Gbit/s
Remarks
-100
-
+100
ppm
-5.2
-
-
dBm
Note 1
-7.3
-
1.3
dBm
Average
-
-
-
dB
Average
30
-
-
3.5 -
-
-30
dB dBm
Average
-
-
100
µs
Figure10
-
-
-10.0
dBm
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12 13
Receiver Overload Receiver Return Loss
Rro RL
+0.5 12
-
-
dBm dB
Average Average
Electrical Performance： Table2. Power Supply Characteristics Symbol No. Parameter 1 Supply Voltage VCC1 2 Supply Voltage VCC2 3 Supply Current ICC1 4 Supply Current ICC2 Power 5 PDS Consumption Power supply 6 TDF stabilization time Initialization 7 TINIT Time RESET Assert 8 TRESET Time Hold Time after 9 rising edge of THOLD RESET
Min. 3.135 1.152 -
Typ. 3.300 1.200 -
Max. 3.465 1.248 1.4 1.7
Unit V V A A
-
-
3.0
W
-
-
500
ms
Figure 7
-
-
5
s
Figure 7
1
-
-
ms
Figure 9
500
-
-
ms
Figure 9
Table 3. XAUI Driver Characteristics Symbol No. Parameter 1 Baud Rate 2 Baud Rate Tolerance 3
Differential Amplitude
Table4. 1.2VCMOS Interface Characteristics Symbol No. Parameter 1 Baud Rate 2 Baud Rate Tolerance
Min. -100
Typ. 3.125 -
Max. +100
Unit Gbit/s ppm
800
-
1600
mVPP
Min. -100
Typ. 3.125 -
Max. +100
Unit Gbit/s ppm
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Remarks
+3.3 V APS
Remarks
AC, near-end value
Remarks
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3 No. 1 2 3 4 5 6 7 8
Differential Amplitude Parameter Input High Voltage Input Low Voltage Input Pull-down Current Output High Voltage Output Low Voltage Pull up Resistance Capacitance Load Capacitance
200 Symbol
VIH VIL IIn VOH VOL RLASI CLASI CLoad
Min. 0.84 -0.3 20 1.0 10 -
Typ. 40 -
Table5. MDIO Bidirectional Interface Characteristics Symbol No. Parameter Min. VIHM 1 Input High Voltage 0.84 VILM 2 Input Low Voltage -0.3 3 Output High Voltage VOHM 1.0 VOLM 4 Output Low Voltage -0.3 RMDIO 5 Pull up Resistance 200 6 7 8 9 10 12 13
MDC min high/low time MDC Frequency Setup time Hold time MDIO output delay after rising edge of MDC
-
1600 Max. 1.5 0.36 120 0.2 22 10 320
Unit V V µA V V k ohm pF pF
AC Remarks
Vih=1.2V Pull-up=10k ohm to 1.2V Figure 8 Figure 8 Figure 8
THM,TLM 1/TCK TDIS TDIH
160 TBD 10 10
-
Max. 1.5 0.36 1.5 0.2 Note 1 2.5 -
TPD
0
-
300
ns
Figure 4
Ci CL
-
-
10 470
pF pF
Figure 5 Figure 5
Input Capacitance
Bus Loading
Typ. -
mVpp
-
Unit V V V V
Remarks
Ohm
Figure 5
ns MHz ns ns
Figure 3 Figure 3 Figure 3
Note1：The maximum value of RMDIO depends on bus loading(CL),input capacitance(CI),and MDC frequency(1/TCK).
Electrical Pad Layout: Figure 1 XENPAK Pin Configuration
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Pin # 1 2 3 4 5 6 7 8 9
Symbol GND GND GND RESERVED 3.3 V 3.3 V APS APS LASI
I/O I I I I I I I O
Logic
Open Drain
10
RESET
I
1.2V CMOS
11
VEND SPECIFIC
-
-
12
TX ON/OFF
I
1.2V CMOS
13 14
RESERVED MOD DETECT
O
-
15
VEND SPECIFIC
-
-
Pin #
Symbol
I/O
Supply Supply Supply Supply Supply Supply Supply
Logic
Description Electrical ground Electrical ground Electrical ground Reserved Power Power Adaptive Power Supply Adaptive Power Supply Link Alarm Status Interrupt. 10-22k ohm pull up on host.
Notes
TX OFF when MDIO RESET Vendor Specific Pin. Leave unconnected. Transmitter ON/OFF Reserved Pulled low inside module through 1k ohm. Vendor Specific Pin. Leave unconnected. Description
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Notes
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16
VEND SPECIFIC
-
-
17 18 19 20 21 22 23 24
MDIO MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 VEND SPECIFIC
I/O I I I I I I -
Open Drain
25 26
APS SET RESERVED
O -
-
27 28 29 30 31 32 33 34 35
APS SENSE APS APS 3.3 V 3.3 V RESERVED GND GND GND
O I I I I I I I
Analog
Pin # 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Symbol GND GND RESERVED RESERVED GND RX LANE 0+ RX LANE 0GND RX LANE 1+ RX LANE 1GND RX LANE 2+ RX LANE 2GND RX LANE 3+
I/O I I I O O I O O I O O I O
51 52 53 54 55
RX LANE 3GND GND GND TX LANE 0+
O I I I I
1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS
-
Supply Supply Supply Supply Supply Supply Supply
Logic Supply Supply Supply AC AC Supply AC AC Supply AC AC Supply AC AC Supply Supply Supply AC
Vendor Specific Pin. Leave unconnected. Management Data IO Management Data Clock Port Address bit 4 (Low=0) Port Address bit 3 (Low=0) Port Address bit 2 (Low=0) Port Address bit 1 (Low=0) Port Address bit 0 (Low=0) Vendor Specific Pin. Leave unconnected. Feedback output for APS Reserved for Avalanche Photodiode use. APS Sense Connection Adaptive Power Supply Adaptive Power Supply Power Power Reserved Electrical Ground Electrical Ground Electrical Ground Description Electrical Ground Electrical Ground Reserved Reserved Electrical Ground Module XAUI Output Lane 0+ Module XAUI Output Lane 0Electrical Ground Module XAUI Output Lane 1+ Module XAUI Output Lane 1Electrical Ground Module XAUI Output Lane 2+ Module XAUI Output Lane 2Electrical Ground Module XAUI Output Lane 3+ Module XAUI Output Lane 3Electrical Ground Electrical Ground Electrical Ground Module XAUI Input Lane 0+
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Notes
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56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
TX LANE 0GND TX LANE 1+ TX LANE 1GND TX LANE 2+ TX LANE 2GND TX LANE 3+ TX LANE 3GND RESERVED RESERVED GND GND
I I I I I I I I I I I I I
AC Supply AC AC Supply AC AC Supply AC AC Supply Supply Supply
Module XAUI Input Lane 0Electrical Ground Module XAUI Input Lane 1+ Module XAUI Input Lane 1Electrical Ground Module XAUI Input Lane 2+ Module XAUI Input Lane 2Electrical Ground Module XAUI Input Lane 3+ Module XAUI Input Lane 3Electrical Ground Reserved Reserved Electrical Ground Electrical Ground
Note: Case is connected to electrical ground in the module.
Figure 2 Mechanical dimensions Refer to Table 10 for Dimensions
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DETAIL 1
Figure 3 Mechanical dimensions of End View of Transceiver
DETAIL 2
Figure4 Mechanical dimensions of Side Elevation Transceiver
Figure5 Orientation Keying of TX and RX Orientation Vs PCB Table 6 Package Dimensions Table11 Definition of Datums KEY A1
VALUE, mm / inch 51.3 2.020
TOLERANCE mm ±0.20
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COMMENTS Width of Bezel overall
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B1
22.4 0.882
±0.20
C1
45.5 1.791
BASIC
D1 E1 F1 G1 H1 J1
3.7 0.136 20.75 0.817 36.0 1.417 17.4 0.685 8.15 0.321 3.05 0.120
BASIC Maximum ±0.20 ±0.20 ±0.20 ±0.25
K1
(121.0) 4.764
REF
L1
5.00 0.197
±0.20
M1 N1
1.5 0.059 5.8 0.228
±0.20 ±0.20
P1
4.07 0.160
Minimum
Q1 R1
4.65 0.183 7.12 0.280
±0.20 ±0.20
S1
29.5 1.161
±0.20
T1 U1 V1 W1 Y1
5.42 0.213 (11.98) 0.472 7.92 0.312 11.10 0.437 102.20 4.024
BASIC REF ±0.20 ±0.20 ±0.20
Z1
4.0 0.157
±0.20
AA1
3.0 0.118
±0.50
BB1
(115.2) 4.535
REF
CC1
13.0 0.512
±0.50
DD1
13.96 0.550
BASIC
EE1 FF1 GG1 HH1 JJ1
10.0 0.394 10.48 0.422 20.0 0.787 0.25 0.01 29.2 1.150
Minimum ±0.50 Minimum BASIC ±0.10
KK1
3.0 0.118
N/A
LL1 RA1
25.8 1.016 1.25 0.049
Maximum Minimum
RB1
1.5 0.059
Maximum
DATUM A B C
Height of Bezel overall Distance between captive screws in ‘X’ axis (Horizontal) Datum ‘E’ to lower captive screw Extension of captive screw Width of Transceiver body Height of Transceiver body Datum ‘E’ to top of Over-hanging Ledge Datum ‘E’ to centerline of Transceiver PCB Length of Transceiver overall minus protruding captive screw heads Length of captive screw from Datum ‘D’ to end of threaded end Thickness of Over-hanging Ledge Datum ‘D’ to front of Transceiver Bezel Slot or channel formed by Interposer to accommodate Customers PCB range. Use of an Interposer spring is not a requirement of this specification. Protrusion of side flange on Transceiver Bezel Height of side flange on Transceiver Bezel Width of Transceiver slot to accommodate rail or Customers PCB Datum ‘E’ to bottom of Transceiver Datum ‘E’ to top of Transceiver Datum ‘E’ to bottom of Transceiver Bezel Datum ‘B’ to end of protruding Transceiver PCB Datum ‘D’ to Datum ‘B’ Datum ‘B’ to end of side protective shroud to mate with EMI/Conn. Shield Datum ‘B’ to end of 45° chamfer Length of Module from Datum ‘D’ to rear Over-hanging Ledge Datum ‘B’ to end of Over-hanging Ledge for EMI Plating Distance between captive screws in ‘Y’ axis (Vertical) Datum ‘B’ end of recess for insertion clearance Datum ‘E’ to top of recess for insertion clearance Length of Transceiver side wall for EMI plating Datum ‘A’ to Datum ‘E’ Width of Transceiver PCB Hole for 3mm screw Thumbscrew, tapped or clearance Length of Thumbscrew External radius or chamfer of Transceiver Internal radius or chamfer on exterior flange of Transceiver Bezel
DESCRIPTION TRANSCEIVER/LINECARD CUSTOMERS PCB TOP SURFACE PHYSICAL HARD STOP FOR TRANSCEIVER EDGE OF TRANSCEIVER SLOT
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D E F G H J K
BACK SURFACE OF TRANSCEIVER BEZEL, SAFETY HARD STOP TRANSCEIVER TOP SURFACE OF SLOT ‘P1’ FRONT SURFACE OF CUSTOMERS FACEPLATE EDGE OF TRANSCEIVER’S PCB LEADING EDGE OF TRANSCEIVER PCB EDGE OF CUT-OUT IN CUSTOMER’S PCB PHYSICAL HARD STOP ON CUSTOMER’S PCB
Optical Connector： No.
Parameter
Specifications
1
SC Duplex Receptacle
IEC61754-4
2
SC Duplex plug
IEC61754-4
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Remarks Optical bores 12.25/13.15mm Optical bores 12.25/13.15mm
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XENPAK-10GB-SR 10 Gigabit Ethernet XENPAK Transceiver
Product Features： ﹡XAUI Electrical Interface: 4 Lanes @ 3.125Gbit/s ﹡Hot pluggable XENPAK MSA 3.0 form factor ﹡Up to 300 meter on 50/125 µm MMF ﹡SC connector, multi-mode fiber ﹡MDIO, DOM Support ﹡Uncooled 850nm VCSEL laser ﹡PIN Photo-detector ﹡Operating Case Temperature: 0°C to 70°C ﹡Compliant to IEEE 802.3ae 10GBASE-SR Application
Applications： ﹡10GBASE-SR 10G Ethernet
DESCRIPTION: 10GBase XENPAK transceiver module XENPAK-10GB-SR is a hot pluggable in the Z-direction module that is usable in typical router line card applications, Storage, IP network and LAN and compliant to XENPAK MSA. The XENPAK-10GB-SR is a fully integrated 10.3Gbit/s optical transceiver module that consists of a 10.3Gbit/s optical transmitter and receiver, XAUI interface, Mux and Demux with clock and data recovery(CDR). Transceiver line uses an cooled 850nm VCSEL Laser Diode to achieve 300m over standard multi-mode fiber as 10GBASE-SR of the IEEE 802.3ae.
PERFORMANCE SPECIFICATIONS： Table 1. Optical Characteristics No. Parameters Symbols 1 Center Wavelength λC 2 Signaling speed Signaling speed 3 variation from nominal Optical modulation 4 OMA amplitude Optical Output 5 Pf Power 6 Optical Waveform Side Mode Sr 7 Suppression Ratio 8 Extinction Ratio Er 9 Off Transmit Power Poff Optical Output 10 TTX-OFF turn-off Time Receiver Sensitivity 11 OMArmin in OMA
Min. 840 -
Typ. Max. 850 860 10.3125 -
Unit nm Gbit/s
Remarks
-100
-
+100
ppm
-5.2
-
-
dBm
Note 1
-7.3
-
1.3
dBm
Average
-
-
-
dB
Average
30
-
-
3.5 -
-
-30
dB dBm
Average
-
-
100
µs
Figure10
-
-
-10.0
dBm
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12 13
Receiver Overload Receiver Return Loss
Rro RL
+0.5 12
-
-
dBm dB
Average Average
Electrical Performance： Table2. Power Supply Characteristics Symbol No. Parameter 1 Supply Voltage VCC1 2 Supply Voltage VCC2 3 Supply Current ICC1 4 Supply Current ICC2 Power 5 PDS Consumption Power supply 6 TDF stabilization time Initialization 7 TINIT Time RESET Assert 8 TRESET Time Hold Time after 9 rising edge of THOLD RESET
Min. 3.135 1.152 -
Typ. 3.300 1.200 -
Max. 3.465 1.248 1.4 1.7
Unit V V A A
-
-
3.0
W
-
-
500
ms
Figure 7
-
-
5
s
Figure 7
1
-
-
ms
Figure 9
500
-
-
ms
Figure 9
Table 3. XAUI Driver Characteristics Symbol No. Parameter 1 Baud Rate 2 Baud Rate Tolerance 3
Differential Amplitude
Table4. 1.2VCMOS Interface Characteristics Symbol No. Parameter 1 Baud Rate 2 Baud Rate Tolerance
Min. -100
Typ. 3.125 -
Max. +100
Unit Gbit/s ppm
800
-
1600
mVPP
Min. -100
Typ. 3.125 -
Max. +100
Unit Gbit/s ppm
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Remarks
+3.3 V APS
Remarks
AC, near-end value
Remarks
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3 No. 1 2 3 4 5 6 7 8
Differential Amplitude Parameter Input High Voltage Input Low Voltage Input Pull-down Current Output High Voltage Output Low Voltage Pull up Resistance Capacitance Load Capacitance
200 Symbol
VIH VIL IIn VOH VOL RLASI CLASI CLoad
Min. 0.84 -0.3 20 1.0 10 -
Typ. 40 -
Table5. MDIO Bidirectional Interface Characteristics Symbol No. Parameter Min. VIHM 1 Input High Voltage 0.84 VILM 2 Input Low Voltage -0.3 3 Output High Voltage VOHM 1.0 VOLM 4 Output Low Voltage -0.3 RMDIO 5 Pull up Resistance 200 6 7 8 9 10 12 13
MDC min high/low time MDC Frequency Setup time Hold time MDIO output delay after rising edge of MDC
-
1600 Max. 1.5 0.36 120 0.2 22 10 320
Unit V V µA V V k ohm pF pF
AC Remarks
Vih=1.2V Pull-up=10k ohm to 1.2V Figure 8 Figure 8 Figure 8
THM,TLM 1/TCK TDIS TDIH
160 TBD 10 10
-
Max. 1.5 0.36 1.5 0.2 Note 1 2.5 -
TPD
0
-
300
ns
Figure 4
Ci CL
-
-
10 470
pF pF
Figure 5 Figure 5
Input Capacitance
Bus Loading
Typ. -
mVpp
-
Unit V V V V
Remarks
Ohm
Figure 5
ns MHz ns ns
Figure 3 Figure 3 Figure 3
Note1：The maximum value of RMDIO depends on bus loading(CL),input capacitance(CI),and MDC frequency(1/TCK).
Electrical Pad Layout: Figure 1 XENPAK Pin Configuration
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Pin # 1 2 3 4 5 6 7 8 9
Symbol GND GND GND RESERVED 3.3 V 3.3 V APS APS LASI
I/O I I I I I I I O
Logic
Open Drain
10
RESET
I
1.2V CMOS
11
VEND SPECIFIC
-
-
12
TX ON/OFF
I
1.2V CMOS
13 14
RESERVED MOD DETECT
O
-
15
VEND SPECIFIC
-
-
Pin #
Symbol
I/O
Supply Supply Supply Supply Supply Supply Supply
Logic
Description Electrical ground Electrical ground Electrical ground Reserved Power Power Adaptive Power Supply Adaptive Power Supply Link Alarm Status Interrupt. 10-22k ohm pull up on host.
Notes
TX OFF when MDIO RESET Vendor Specific Pin. Leave unconnected. Transmitter ON/OFF Reserved Pulled low inside module through 1k ohm. Vendor Specific Pin. Leave unconnected. Description
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Notes
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16
VEND SPECIFIC
-
-
17 18 19 20 21 22 23 24
MDIO MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 VEND SPECIFIC
I/O I I I I I I -
Open Drain
25 26
APS SET RESERVED
O -
-
27 28 29 30 31 32 33 34 35
APS SENSE APS APS 3.3 V 3.3 V RESERVED GND GND GND
O I I I I I I I
Analog
Pin # 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Symbol GND GND RESERVED RESERVED GND RX LANE 0+ RX LANE 0GND RX LANE 1+ RX LANE 1GND RX LANE 2+ RX LANE 2GND RX LANE 3+
I/O I I I O O I O O I O O I O
51 52 53 54 55
RX LANE 3GND GND GND TX LANE 0+
O I I I I
1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS 1.2V CMOS
-
Supply Supply Supply Supply Supply Supply Supply
Logic Supply Supply Supply AC AC Supply AC AC Supply AC AC Supply AC AC Supply Supply Supply AC
Vendor Specific Pin. Leave unconnected. Management Data IO Management Data Clock Port Address bit 4 (Low=0) Port Address bit 3 (Low=0) Port Address bit 2 (Low=0) Port Address bit 1 (Low=0) Port Address bit 0 (Low=0) Vendor Specific Pin. Leave unconnected. Feedback output for APS Reserved for Avalanche Photodiode use. APS Sense Connection Adaptive Power Supply Adaptive Power Supply Power Power Reserved Electrical Ground Electrical Ground Electrical Ground Description Electrical Ground Electrical Ground Reserved Reserved Electrical Ground Module XAUI Output Lane 0+ Module XAUI Output Lane 0Electrical Ground Module XAUI Output Lane 1+ Module XAUI Output Lane 1Electrical Ground Module XAUI Output Lane 2+ Module XAUI Output Lane 2Electrical Ground Module XAUI Output Lane 3+ Module XAUI Output Lane 3Electrical Ground Electrical Ground Electrical Ground Module XAUI Input Lane 0+
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Notes
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56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
TX LANE 0GND TX LANE 1+ TX LANE 1GND TX LANE 2+ TX LANE 2GND TX LANE 3+ TX LANE 3GND RESERVED RESERVED GND GND
I I I I I I I I I I I I I
AC Supply AC AC Supply AC AC Supply AC AC Supply Supply Supply
Module XAUI Input Lane 0Electrical Ground Module XAUI Input Lane 1+ Module XAUI Input Lane 1Electrical Ground Module XAUI Input Lane 2+ Module XAUI Input Lane 2Electrical Ground Module XAUI Input Lane 3+ Module XAUI Input Lane 3Electrical Ground Reserved Reserved Electrical Ground Electrical Ground
Note: Case is connected to electrical ground in the module.
Figure 2 Mechanical dimensions Refer to Table 10 for Dimensions
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DETAIL 1
Figure 3 Mechanical dimensions of End View of Transceiver
DETAIL 2
Figure4 Mechanical dimensions of Side Elevation Transceiver
Figure5 Orientation Keying of TX and RX Orientation Vs PCB Table 6 Package Dimensions Table11 Definition of Datums KEY A1
VALUE, mm / inch 51.3 2.020
TOLERANCE mm ±0.20
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COMMENTS Width of Bezel overall
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B1
22.4 0.882
±0.20
C1
45.5 1.791
BASIC
D1 E1 F1 G1 H1 J1
3.7 0.136 20.75 0.817 36.0 1.417 17.4 0.685 8.15 0.321 3.05 0.120
BASIC Maximum ±0.20 ±0.20 ±0.20 ±0.25
K1
(121.0) 4.764
REF
L1
5.00 0.197
±0.20
M1 N1
1.5 0.059 5.8 0.228
±0.20 ±0.20
P1
4.07 0.160
Minimum
Q1 R1
4.65 0.183 7.12 0.280
±0.20 ±0.20
S1
29.5 1.161
±0.20
T1 U1 V1 W1 Y1
5.42 0.213 (11.98) 0.472 7.92 0.312 11.10 0.437 102.20 4.024
BASIC REF ±0.20 ±0.20 ±0.20
Z1
4.0 0.157
±0.20
AA1
3.0 0.118
±0.50
BB1
(115.2) 4.535
REF
CC1
13.0 0.512
±0.50
DD1
13.96 0.550
BASIC
EE1 FF1 GG1 HH1 JJ1
10.0 0.394 10.48 0.422 20.0 0.787 0.25 0.01 29.2 1.150
Minimum ±0.50 Minimum BASIC ±0.10
KK1
3.0 0.118
N/A
LL1 RA1
25.8 1.016 1.25 0.049
Maximum Minimum
RB1
1.5 0.059
Maximum
DATUM A B C
Height of Bezel overall Distance between captive screws in ‘X’ axis (Horizontal) Datum ‘E’ to lower captive screw Extension of captive screw Width of Transceiver body Height of Transceiver body Datum ‘E’ to top of Over-hanging Ledge Datum ‘E’ to centerline of Transceiver PCB Length of Transceiver overall minus protruding captive screw heads Length of captive screw from Datum ‘D’ to end of threaded end Thickness of Over-hanging Ledge Datum ‘D’ to front of Transceiver Bezel Slot or channel formed by Interposer to accommodate Customers PCB range. Use of an Interposer spring is not a requirement of this specification. Protrusion of side flange on Transceiver Bezel Height of side flange on Transceiver Bezel Width of Transceiver slot to accommodate rail or Customers PCB Datum ‘E’ to bottom of Transceiver Datum ‘E’ to top of Transceiver Datum ‘E’ to bottom of Transceiver Bezel Datum ‘B’ to end of protruding Transceiver PCB Datum ‘D’ to Datum ‘B’ Datum ‘B’ to end of side protective shroud to mate with EMI/Conn. Shield Datum ‘B’ to end of 45° chamfer Length of Module from Datum ‘D’ to rear Over-hanging Ledge Datum ‘B’ to end of Over-hanging Ledge for EMI Plating Distance between captive screws in ‘Y’ axis (Vertical) Datum ‘B’ end of recess for insertion clearance Datum ‘E’ to top of recess for insertion clearance Length of Transceiver side wall for EMI plating Datum ‘A’ to Datum ‘E’ Width of Transceiver PCB Hole for 3mm screw Thumbscrew, tapped or clearance Length of Thumbscrew External radius or chamfer of Transceiver Internal radius or chamfer on exterior flange of Transceiver Bezel
DESCRIPTION TRANSCEIVER/LINECARD CUSTOMERS PCB TOP SURFACE PHYSICAL HARD STOP FOR TRANSCEIVER EDGE OF TRANSCEIVER SLOT
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D E F G H J K
BACK SURFACE OF TRANSCEIVER BEZEL, SAFETY HARD STOP TRANSCEIVER TOP SURFACE OF SLOT ‘P1’ FRONT SURFACE OF CUSTOMERS FACEPLATE EDGE OF TRANSCEIVER’S PCB LEADING EDGE OF TRANSCEIVER PCB EDGE OF CUT-OUT IN CUSTOMER’S PCB PHYSICAL HARD STOP ON CUSTOMER’S PCB
Optical Connector： No.
Parameter
Specifications
1
SC Duplex Receptacle
IEC61754-4
2
SC Duplex plug
IEC61754-4
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Remarks Optical bores 12.25/13.15mm Optical bores 12.25/13.15mm
