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Neo_AM8X2 Smart Module Hardware User Guide Version 1.2 Neo_AM8X2 Android Module Hardware User Guide Copyright © Neoway Technology Co., Ltd 2015. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Shenzhen Neoway Technology Co., Ltd. is the trademark of Neoway Technology Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The information in this document is subject to change without notice due to product version update or other reasons. Every effort has been made in preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied. Neoway provides customers complete technical support. If you have any question, please contact your account manager or email to the following email addresses: [email protected] [email protected] Website: http://www.neoway.com Copyright © Neoway Technology Co., Ltd i Neo_AM8X2 Android Module Hardware User Guide Revision Record Issue Modified By Contents Date V1.0 Tian, Charles Initial draft 2014-08 V1.1 Tian Revised 2015-02 V1.2 Tian, Li Revised 2015-03 Copyright © Neoway Technology Co., Ltd ii Neo_AM8X2 Android Module Hardware User Guide Contents About This Document ......................................................................................................... 1 1 Introduction to AM8X2..................................................................................................... 1 1.1 Overview ............................................................................................................................................ 1 1.2 Block Diagram ................................................................................................................................... 1 1.3 Specifications ..................................................................................................................................... 2 1.4 Order Information ............................................................................................................................... 5 2 Pin Description and PCB Foot Print .............................................................................. 6 2.1 Specifications and Encapsulation ....................................................................................................... 6 2.2 Pin Definition ..................................................................................................................................... 8 2.3 PCB Foot Print ................................................................................................................................. 18 3 Power Supply Interfaces ................................................................................................ 20 3.1 Power Supply and Switch Interfaces ................................................................................................ 20 3.2 Power-On.......................................................................................................................................... 23 3.3 Hard Reset ........................................................................................................................................ 24 3.4 Hard Power-off ................................................................................................................................. 25 3.5 VRTC Power Supply ........................................................................................................................ 26 3.6 Battery Management ........................................................................................................................ 26 4 Video I/O Interfaces ........................................................................................................ 28 4.1 LCD Interfaces ................................................................................................................................. 28 4.1.1 WVGA .................................................................................................................................... 28 4.1.2 720P ........................................................................................................................................ 33 4.2 Touchscreen Interfaces ..................................................................................................................... 34 4.3 Camera Interfaces ............................................................................................................................. 35 4.3.1 Main Camera ........................................................................................................................... 35 4.3.2 Sub-Camera ............................................................................................................................. 36 4.3.3 Design Cautions ...................................................................................................................... 38 4.3.4 Camera Power Supply ............................................................................................................. 39 4.4 Design Cautions ............................................................................................................................... 40 5 Audio Interface ................................................................................................................ 41 5.1 Audio Input ....................................................................................................................................... 41 5.2 Audio Output .................................................................................................................................... 41 5.3 Headphone Interfaces ....................................................................................................................... 42 5.4 Audio Design Cautions ..................................................................................................................... 44 6 Peripheral Interfaces ....................................................................................................... 45 6.1 USB Interface ................................................................................................................................... 45 6.2 SIM Card Interface ........................................................................................................................... 46 6.3 SDIO................................................................................................................................................. 48 Copyright © Neoway Technology Co., Ltd iii Neo_AM8X2 Android Module Hardware User Guide 6.3.1 SD card .................................................................................................................................... 48 6.3.2 SD Peripheral Interface ........................................................................................................... 49 6.4 GPIO................................................................................................................................................. 49 6.4.1 UART ...................................................................................................................................... 49 6.4.2 I2C........................................................................................................................................... 50 6.4.3 SPI ........................................................................................................................................... 50 6.5 ADC .................................................................................................................................................. 51 6.6 Other Interfaces ................................................................................................................................ 51 6.6.1 Motor Driver Interface ............................................................................................................ 51 6.6.2 Key Backlight Driver .............................................................................................................. 52 7 RF Interface....................................................................................................................... 54 7.1 2G/3G RF Design and PCB Layout ................................................................................................. 54 7.2 WIFI/BT RF Design and PCB Layout .............................................................................................. 55 7.3 GPS RF Design and PCB Layout ..................................................................................................... 57 7.3.1 GPS Impedance ....................................................................................................................... 57 7.3.2 Active GPS Antenna Design.................................................................................................... 57 7.3.3 Passive GPS Antenna Design .................................................................................................. 58 7.4 FM RF Design and PCB Layout ....................................................................................................... 59 8 Commissioning Interface ............................................................................................... 60 8.1 Commissioning Log Print Interface ................................................................................................. 60 8.2 FORCE_USB_BOOT Interface........................................................................................................ 60 8.3 ADB Commissioning and Program Download & Update Interface ................................................. 60 8.4 JTAG Interface ................................................................................................................................. 61 9 Electric Features and Reliability ................................................................................... 63 9.1 Electric Feature................................................................................................................................. 63 9.2 Temperature ...................................................................................................................................... 63 9.3 Current .............................................................................................................................................. 63 9.4 ESD Protection ................................................................................................................................. 65 10 RF Features...................................................................................................................... 67 10.1 Work Band ...................................................................................................................................... 67 10.2 TX Power and RX Sensitivity ........................................................................................................ 67 11 Mounting the Module onto the Application Board................................................ 68 12 Package ............................................................................................................................ 68 13 Abbreviations ................................................................................................................. 69 Copyright © Neoway Technology Co., Ltd iv Neo_AM8X2 Android Module Hardware User Guide Table of Figures Figure 1-1 AM8X2 block diagram........................................................................................................... 2 Figure 2-1 TOP view of AM8X2 ............................................................................................................. 7 Figure 2-2 PCB foot print recommended for AM8X2 (unit: mm) ......................................................... 19 Figure 3-1 Current peaks and voltage drops .......................................................................................... 20 Figure 3-2 Capacitors used for the power supply .................................................................................. 21 Figure 3-3 Reference design of power supply control ........................................................................... 21 Figure 3-4 Reference design of power supply controlled by p-MOSFET ............................................. 22 Figure 3-5 Reference designs of separated power supply ...................................................................... 23 Figure 3-6 Push switch controlling ........................................................................................................ 23 Figure 3-7 MCU controlling .................................................................................................................. 24 Figure 3-8 AM8X2 power-on sequence ................................................................................................. 24 Figure 3-9 Reset controlled by button ................................................................................................... 24 Figure 3-10 Reset circuit with triode separating .................................................................................... 25 Figure 3-11 AM8X2 reset sequence....................................................................................................... 25 Figure 3-12 AM8X2 power-off sequence .............................................................................................. 26 Figure 3-13 VRTC design in the module ............................................................................................... 26 Figure 3-14 Battery connections ............................................................................................................ 27 Figure 4-1 Reference MIPI circuits with common mode chokes .......................................................... 29 Figure 4-2 AM8X2 LCD backlight chipset ........................................................................................... 30 Figure 4-3 Power supply of AM8X2 LCD driver .................................................................................. 31 Figure 4-4 Reference design of MOS switch circuit.............................................................................. 32 Figure 4-5 Reference design of LCD interface ...................................................................................... 33 Figure 4-6 Reference design of touchscreen interface ........................................................................... 35 Figure 4-7 Reference design of the main camera interface.................................................................... 36 Figure 4-8 Reference design of sub-camera interface ........................................................................... 37 Figure 4-9 Scan direction of 3264*2448 LCD ...................................................................................... 38 Figure 4-10 Reference design of customized camera ............................................................................ 38 Figure 4-11 Adjustment of camera sensor ............................................................................................. 39 Figure 4-12 Reference design of the camera power supply ................................................................... 39 Figure 4-13 Reference design of the main camera power supply .......................................................... 40 Figure 5-1 Reference design of MIC connection ................................................................................... 41 Copyright © Neoway Technology Co., Ltd v Neo_AM8X2 Android Module Hardware User Guide Figure 5-2 Reference design of EAR/SPK connections ........................................................................ 42 Figure 5-3 Reference design of headphone without FM ........................................................................ 43 Figure 5-4 Headphone interface ............................................................................................................ 43 Figure 6-1 USB circuit .......................................................................................................................... 45 Figure 6-2 USB OTG circuit ................................................................................................................. 46 Figure 6-3 Reference design of SIM card interface ............................................................................... 47 Figure 6-4 Reference design of TF card interface ................................................................................. 48 Figure 6-5 Reference design of the UART interface ............................................................................. 50 Figure 6-6 Reference design of I2C ....................................................................................................... 50 Figure 6-7 Reference design of the SPI ................................................................................................. 51 Figure 6-8 Reference design of motor circuit ........................................................................................ 52 Figure 6-9 Reference design of key backlight circuit ............................................................................ 53 Figure 7-1 Reference of antenna matching design ................................................................................ 54 Figure 7-2 Recommended RF PCB design ............................................................................................ 54 Figure 7-3 Encapsulation specifications of Murata RF connector ......................................................... 55 Figure 7-4 RF connections..................................................................................................................... 55 Figure 7-5 Antenna layout ..................................................................................................................... 56 Figure 7-6 Clearance around the antenna .............................................................................................. 56 Figure 7-7 GPS RF structure ................................................................................................................. 57 Figure 7-8 Power supply reference for active antenna .......................................................................... 58 Figure 7-9 Passive GPS Antenna Design ............................................................................................... 58 Figure 7-10 Reference design of the headphone circuit with FM function ........................................... 59 Figure 8-1 Reference design of the fastboot interface ........................................................................... 60 Figure 8-2 Reference design of JTAG commissioning interface ........................................................... 62 Copyright © Neoway Technology Co., Ltd vi Neo_AM8X2 Android Module Hardware User Guide Table of Tables Table 1-1 AM8X2 baseband and specifications ....................................................................................... 2 Table 2-1 AM8X2 dimensions ................................................................................................................. 6 Table 2-2 AM8X2 pin definition .............................................................................................................. 8 Table 3-1 Power supply pins .................................................................................................................. 20 Table 3-2 Battery pin description ........................................................................................................... 27 Table 4-1 WVGA LCD description........................................................................................................ 28 Table 4-2 Backlight driver pin ............................................................................................................... 30 Table 4-3 2.85V LDO pin ...................................................................................................................... 31 Table 4-4 Pin controlled by MOS switch ............................................................................................... 31 Table 4-5 720P LCD pins ....................................................................................................................... 33 Table 4-6 Touchscreen pins .................................................................................................................... 34 Table 4-7 Main camera pins .................................................................................................................. 35 Table 4-8 Sub-camera pins..................................................................................................................... 37 Table 4-9 1.2V LDO pin ........................................................................................................................ 40 Table 5-1 Audio input pins ..................................................................................................................... 41 Table 5-2 Audio output pins ................................................................................................................... 42 Table 5-3 Headphone pins ..................................................................................................................... 42 Table 5-4 Volume pins ........................................................................................................................... 44 Table 6-1 USB Device pins.................................................................................................................... 45 Table 6-2 USB-OTG pins ...................................................................................................................... 46 Table 6-3 SIM1 pins .............................................................................................................................. 47 Table 6-4 SIM2 pins .............................................................................................................................. 47 Table 6-5 TF card pins ........................................................................................................................... 49 Table 6-6 ADC pin ................................................................................................................................. 51 Table 6-7 Motor driver pin ..................................................................................................................... 52 Table 6-8 Key backlight pin ................................................................................................................... 52 Table 8-1 Commissioning UART .......................................................................................................... 60 Table 8-2 Fastboot (Enable) ................................................................................................................... 60 Table 8-3 USB commissioning interface, program download & update interface ................................. 60 Table 8-4 JTAG interface ....................................................................................................................... 61 Table 9-1 Electric feature of AM8X2 .................................................................................................... 63 Copyright © Neoway Technology Co., Ltd vii Neo_AM8X2 Android Module Hardware User Guide Table 9-2 AM8X2 temperature feature .................................................................................................. 63 Table 9-3 Current feature ....................................................................................................................... 63 Table 9-4 AM8X2 ESD feature .............................................................................................................. 65 Table 10-1 AM8X2 work band .............................................................................................................. 67 Table 10-2 AM8X2 RF power and RX sensitivity ................................................................................. 67 Copyright © Neoway Technology Co., Ltd viii Neo_AM8X2 Android Module Hardware User Guide About This Document This document details the features, indicators, and reference standards of the AM8X2 module and provides reference for the hardware design of each interface. This user guide can help you complete wireless communication application easily. For information about the AM8X2 RF band, inquiry our sales engineer. 1 Introduction to AM8X2 1.1 Overview AM8X2 is an industrial smart module that is developed on Qualcomm platform and supports Android OS. Its dimensions are 32 mm x 50 mm x 2.6 mm. It is well applicable to in-vehicle computers, multimedia terminals, smart homes, IoT terminals, etc, with the following features:  Quad-core ARM Cortex-A7 processors, 1.2 GHz main frequency, 1MB L2 cache, 28 nm  4Gb LPDDR2 RAM; 4GB Nand Flash, eMMC interface, supporting at most 32GB  GSM/WCDMA/HSPA+, CDMA2000/EV-DOrA, WiFi 802.11b/g/n, BT4.0, GPS/GLONASS/BEIDOU communications modes; FM radio  Android 4.3 OS  MIPI interface LCD, supporting at most 720P  MIPI interface dual-camera, among which the main camera supports at most 8MP  Multiple-channel audio I/O, supporting stereo headphone  USB2.0 high-speed serial port, SDIO3.0, 15-bit ADC, UART, SPI, I2C, PWM, GPIO, charging management, etc. 1.2 Block Diagram The following figure shows the block diagram of AM8X2. Copyright © Neoway Technology Co., Ltd 1 Neo_AM8X2 Android Module Hardware User Guide Figure 1-1 AM8X2 block diagram Power supply input RF section Power Management Analog interface Audio Baseband Digital single interface 1.3 Specifications Table 1-1 AM8X2 baseband and specifications Specifications Description Power supply VBAT 3.5V to 4.2V, typical value 3.9V Flight mode: 1.6 mA Current Sleeping mode: 4. 0mA Operating temperature -40℃ to +85℃ Baseband features Quad-core ARM Cortex-A7 processor Processor Main fr0equency: 1.2 GHz 1MB L2 cache Multimedia processor QDSP6 v5 core Operation frequency 700 MHz Copyright © Neoway Technology Co., Ltd 2 Neo_AM8X2 Android Module Hardware User Guide 256KB L2 cache 4Gb LPDDR2 SDRAM Memory 32bit bus Max. operation frequency 333MHz 4GB NAND Flash Storage Embedded EMMC Max. 32GB RF feature — AM812 Band Sensitivity Transmit power Protocol GSM850/EGSM900/DCS1800/PCS1900 WCDMA 2100 < -107 dBm  GSM850/EGSM900: +33dBm (Power Class 4)  DCS1800/PCS1900: +30dBm (Power Class 1)  EDGE 850M/900MHz: +27dBm (Power Class E2)  EDGE1800MHz/1900MHz: +26dBm (Power Class E2)  WCDMA/HSDPA: +23dBm (Power Class 3) GSM/GPRS/EGPRS WCDMA R99, Rel5 HSDPA, Rel6 HSUPA, Rel7 HSPA+ (21/5.67 Mbps) RF feature — AM862 Band Sensitivity Transmit power CDMA800/CDMA1900, EV-DO 800/1900 GSM850/EGSM900/DCS1800/PCS1900 < -107 dBm  CDMA 800/EV-DO 800: +24dBm (Power Class III)  CDMA 1900/EV-DO 1900: +24dBm (Power Class II)  GSM850/EGSM900: +33dBm (Power Class 4)  DCS1800/PCS1900: +30dBm (Power Class 1)  EDGE 850M/900MHz: +27dBm (Power Class E2)  EDGE1800MHz/1900MHz: +26dBm (Power Class E2) CDMA2000 1x, 1x Advanced Protocol 1xEV-DOr0, 1xEV-DOrA GSM/GPRS/EGPRS Common RF feature Satellite positioning GPS (default) /GPS+ BEIDOU/GPS+GLONASS Antenna feature 50Ω impedance Multimedia Display interface 4 groups of MIPI_DSI, each of which supports 1Gbps Copyright © Neoway Technology Co., Ltd 3 Neo_AM8X2 Android Module Hardware User Guide Support WVGA (two groups of MIPI_DSI), at most 720p (4 groups of MIPI_DSI) 24bit color depth MIPI_CSI, each group of which support at most 1 Gbps rate, supporting 2 cameras Camera interface Rear camera uses two groups of MIPI_CSI, supporting at most 8MP Front camera uses one group of MIPI_CSI, supporting at most 0.3MP Coding Video processing  30 fps 720p (MPEG-4/H.264 baseline)  30 fps FWVGA (H264/H263/MP4) Decoding  Graphics processing unit 30 fps 720p (MPEG-4/H.263/H.264 /DivX 4/5/6) 30 fps FWVGA(VP8/VC1) Adreno 302, at most 400MHz 3D graphics processing API supports OpenGL ES 1.x, 2.0, 3.0(Halti)w/GLSL, C2D, and OpenCL 1.1 Audio Voice encoding/decoding supports G711, Raw PCM, QCELP; EVRC, -B, -WB; AMR-NB, -WB; GSM-EFR, -FR, -HR Encoder/decoder Audio encoding/decoding supports MP3; AAC, AAC+, eAAC; AMR-NB, -WB, G.711, WMA 9/10 Pro Noise rejection Audio input 3 groups of analog MIC input, embedding internal bias Class-G headphone amplifier Audio output Class-G differential receiver amplifier Class-D speaker amplifier Connection feature UART At most 4 Mbps, 6 groups I2C Multiple groups of I2C devices SPI UIM USB SDIO Host mode At most 52Mbps 2 groups, 1.8V/2.85V dual-voltage adaptive 1 group of USB2.0 high-speed interface Only DEVIECE mode Supporting SD3.0 and SD/MMC cards Wireless connection 2.4G single band, supporting 802.11b/g/n, at most 72Mbps WLAN Wake-on-WLAN (WoWLAN) Ad-Hoc mode WAPI supports SMS4 hardware encryption Copyright © Neoway Technology Co., Ltd 4 Neo_AM8X2 Android Module Hardware User Guide AP mode Wi-Fi Direct Bluetooth FM BT4.0 LE Supporting Rx, 76 to 108MHz, channel spacing of 50 kHz RDS (Europe) RBDS (USA) Commissioning interfaces JTAG JTAG interface Fastboot mode Forcibly enable USB control 1.4 Order Information Specifications Description AM812-1-AAxx WCDMA 2100+ GSM900/DCS1800 AM862-1-AAxx CDMA 800/EV-DO 800 AM8X2-1- AAxx Customized software/hardware versions Copyright © Neoway Technology Co., Ltd 5 Neo_AM8X2 Android Module Hardware User Guide 2 Pin Description and PCB Foot Print 2.1 Specifications and Encapsulation Table 2-1 AM8X2 dimensions Specification AM8X2 Dimensions 32mm*50mm*2.6mm (H x W x D) Weight 5.0g Encapsulation 240 Pin LGA Copyright © Neoway Technology Co., Ltd 6 Neo_AM8X2 Android Module Hardware User Guide Figure 2-1 TOP view of AM8X2 Copyright © Neoway Technology Co., Ltd 7 Neo_AM8X2 Android Module Hardware User Guide 2.2 Pin Definition Table 2-2 AM8X2 pin definition Pin Name General Function Level Feature (V) 1 VBAT Battery 3.5~4.2 2 VCC_UIM1 UIM 1Power 1.8/2.85 3 UIM1_DATA UIM1_DATA 1.8/2.85 B-PD:nppukp 4 UIM1_CLK UIM1_CLK 1.8/2.85 B-PD:nppukp 5 UIM1_RESET UIM1_RESET 1.8/2.85 B-PD:nppukp 6 UIM1_DETEC UIM1_DETEC 1.8 B-PD:nppukp 7 VCC_USBIN USB Power 5 8 NC NC 9 GND GND 10 USB_DP USB_DP 11 USB_DN USB_DN 12 GND GND 13 MAINMIC_N Main MIC 14 GND GND 15 MIPI_DSI0_LANE3_M LCD 16 MIPI_DSI0_LANE2_M LCD Copyright © Neoway Technology Co., Ltd Interrupt Pull (default: options) SPI UART I2C I/O 39 8 Neo_AM8X2 Android Module Hardware User Guide 17 GND GND 18 MIPI_DSI0_CLK_M LCD 19 GND GND 20 MIPI_DSI0_LANE0_M LCD 21 MIPI_DSI0_LANE1_M LCD 22 GND GND 23 TS_RST_N Touchscreen 1.8 24 TS_INT_N Touchscreen 1.8 25 TS_I2C_SDA Touchscreen 26 TS_I2C_SCL Touchscreen 27 GND GND 28 SDC2_CLK SD Card 29 SDC2_CMD SD Card 30 SDC2_DATA0 SD Card 31 SDC2_DATA1 SD Card 32 SDC2_DATA2 SD Card 33 SDC2_DATA3 SD Card 34 GND GND 35 SD_CARD_DET_N SD Card 36 VIO_SD SD Card Power 1.8/2.95 37 VCC_SD SD Card Power 1.8/2.95 Copyright © Neoway Technology Co., Ltd B-PD:nppukp SPI1_MOSI BLSP1_UART_TX 0 B-PD:nppukp SPI1_MISO BLSP1_UART_RX 1 1.8 B-PD:nppukp SPI1_CS_N BLSP1_UART_CTS_N BLSP1_I2C_SDA_A 2 1.8 B-PD:nppukp SPI1_CLK BLSP1_UART_RFR_N BLSP1_I2C_SCL_A 3 ► ► B-PD:nppukp 42 9 Neo_AM8X2 Android Module Hardware User Guide 38 BLSP4 SPI4_CS_N 1.8 B-PD:nppukp SPI4_CS_N BLSP4_UART_CTS_N BLSP4_I2C_SDA_A 88 39 BLSP4 SPI4_CLK 1.8 B-PD:nppukp SPI4_CLK BLSP4_UART_RFR_N BLSP4_I2C_SCL_A 89 40 BLSP4 SPI4_MOSI 1.8 B-PD:nppukp SPI4_MOSI BLSP4_UART_TX BLSP3_I2C_SDA_B 86 41 BLSP4 SPI4_MISO 1.8 ► B-PD:nppukp SPI4_MISO BLSP4_UART_RX BLSP3_I2C_SCL_B 87 42 VIO_1P8V VIO_1P8V 1.8 43 VCC_2P85V VCC_2P85V 2.85 44 GND GND 45 MIPI_CSI0_LANE1_P Camera 46 GND GND 47 MIPI_CSI0_LANE2_P Camera 48 MIPI_CSI0_CLK_P Camera 49 GND GND 50 NC NC 51 NC NC 52 GND GND 53 MIPI_CSI1_LANE0_M Camera 54 MIPI_CSI1_CLK_P Camera 55 GND GND 56 SUBCAM_RESET Camera ► B-PD:nppukp 57 GND GND 58 RF_ANT_2G_3G Main ANT Copyright © Neoway Technology Co., Ltd 1.8 10 Neo_AM8X2 Android Module Hardware User Guide 59 GND GND 60 GND GND 61 CDC_HPH_L Headset 62 CDC_HPH_REF Headset 63 CDC_HPH_R Headset 64 HEADSET MIC_P Headset 65 GND GND 66 GND GND 67 FM_HEADSET Headset 68 GND GND 69 ANT_WIFI_BT ANT_WIFI_BT 70 GND GND 71 SUBMIC_GND SUB MIC 72 GND GND 73 NC NC 74 GND GND 75 NC NC 76 GND GND 77 RF_ANT_GPS GPS ANT 78 GND GND Copyright © Neoway Technology Co., Ltd 11 Neo_AM8X2 Android Module Hardware User Guide 79 BLSP2 UART1_TX// Commissioning UART 1.8 B-PD:nppukp SPI12_MOSI BLSP2_UART_TX BLSP1_I2C_SDA_B 4 80 BLSP2 UART1_RX//Commissi oning UART 1.8 B-PD:nppukp SPI12_MISO BLSP2_UART_RX BLSP1_I2C_SCL_B 5 81 BLSP2 GPIO6 1.8 B-PD:nppukp SPI12_CS_N BLSP2_UART_CTS_N BLSP2_I2C_SDA_A 6 82 BLSP2 GPIO7 1.8 B-PD:nppukp SPI12_CLK BLSP2_UART_RFR_N BLSP2_I2C_SCL_A 7 83 SENSORS_I2C_SCL IIC 1.8 B-PD:nppukp SPI13_CLK BLSP3_UART_RFR_N BLSP3_I2C_SCL_A 11 84 SENSORS_I2C_SDA IIC 1.8 B-PD:nppukp SPI13_CS_N BLSP3_UART_CTS_N BLSP3_I2C_SDA_A 10 85 BLSP3 UART2_TX 1.8 B-PD:nppukp SPI13_MOSI BLSP3_UART_TX BLSP2_I2C_SDA_B 8 86 BLSP3 UART2_RX 1.8 ► B-PD:nppukp SPI13_MISO BLSP3_UART_RX BLSP2_I2C_SCL_B 9 87 ACCL_INT2 Sensor 1.8 ► B-PD:nppukp SPI1_CS2_N 82 88 MAG_INT Sensor 1.8 ► B-PD:nppukp SPI12_CS2_N 83 89 ACCL_INT1 Sensor 1.8 ► B-PD:nppukp SPI4_CS1_N 81 90 ALSP_INT_N Sensor 1.8 ► B-PD:nppukp SPI13_CS1_N 80 91 VCC_2P85V VCC_2P85V 2.85 92 VIO_1P8V VIO_1P8V 1.8 93 NC NC 94 NC NC 95 BLSP5 UART3_TX 1.8 ► B-PD:nppukp BLSP5_UART_TX BLSP4_I2C_SDA_B 90 96 BLSP5 UART3_RX 1.8 ► B-PD:nppukp BLSP5_UART_RX BLSP4_I2C_SCL_B 91 97 NC NC 98 NC NC Copyright © Neoway Technology Co., Ltd ► 12 Neo_AM8X2 Android Module Hardware User Guide 99 GPIO/CLK1 N/A 100 GND GND 101 GND GND 102 GPIO/CLK2 GPIO97 103 NC NC 104 VOL_DOWN VOL + 1.8 ► B-PD:nppukp 105 VOL_UP VOL - 1.8 ► B-PD:nppukp 106 RESIN_N Reset 107 PWR_N Power on 108 BAT_THERM Battery 109 BAT_ID Battery 110 VBAT_SNS Battery 111 GND GND 112 GND GND 113 VCC_UIM2 VCC_UIM2 1.8/2.85 114 UIM2_DATA UIM2_DATA 1.8/2.85 ► B-PD:nppukp 115 UIM2_CLK UIM2_CLK 1.8/2.85 ► B-PD:nppukp 116 UIM2_RESET UIM2_RESET 1.8/2.85 ► B-PD:nppukp 117 UIM2_DETECT UIM2_DETECT 1.8 ► B-PD:nppukp 118 VCC_USBIN USB Power 5 119 GPIO N/A Copyright © Neoway Technology Co., Ltd 94 97 35 95 13 Neo_AM8X2 Android Module Hardware User Guide 120 GPIO N/A 96 121 GND GND 122 GND GND 123 GND GND 124 MAINMIC_P Main MIC 125 GND GND 126 MIPI_DSI0_LANE3_P LCD 127 MIPI_DSI0_LANE2_P LCD 128 GND GND 129 MIPI_DSI0_CLK_P LCD 130 GND GND 131 MIPI_DSI0_LANE0_P LCD 132 MIPI_DSI0_LANE1_P LCD 133 DSI_LCD_TE0 LCD 1.8 134 LCD_ID LCD 1.8 135 LCD_DIF LCD 1.8 136 WLED_PWM LCD 137 GND GND 143 DSI_RST_N LCD 1.8 144 CCI_I2C_SCL CAM 1.8 B-PD:nppukp ► 12 B-PD:nppukp B-PD:nppukp ~ 144 Copyright © Neoway Technology Co., Ltd ► B-PD:nppukp B-PD:nppukp BLSP6_I2C_SCL 14 Neo_AM8X2 Android Module Hardware User Guide 145 CCI_I2C_SDA CAM 1.8 B-PD:nppukp 146 STROBE_EN LED flash 1.8 B-PD:nppukp 147 FLASH_EN LED flash 1.8 B-PD:nppukp 148 MAINCAM_MCLK0 CAM 1.8 B-PD:nppukp 149 MAINCAM_RST_N CAM 1.8 B-PD:nppukp 150 EXT_CAM_1P2V_EN CAM 1.8 ► B-PD:nppukp 151 EXT_2P85V_EN CAM 1.8 ► B-PD:nppukp 152 SUBCAM_MCLK1 CAM 1.8 ► B-PD:nppukp 153 GND GND 154 MIPI_CSI0_LANE1_M CAM 155 GND GND 156 MIPI_CSI0_LANE2_M CAM 157 MIPI_CSI0_CLK_M CAM 158 GND GND 159 NC NC 160 NC NC 161 GND GND 162 MIPI_CSI1_LANE0_P CAM 163 MIPI_CSI1_CLK_M CAM 164 GND GND 165 GND GND Copyright © Neoway Technology Co., Ltd BLSP6_I2C_SDA BLSP6_UART_RX SPI4_CS2_N 14 15 Neo_AM8X2 Android Module Hardware User Guide 166 GND GND 167 CDC_HS_DET Headset 168 GND GND 169 GND GND 170 GND GND 171 GND GND 172 CDC_EAR_P Headphone 173 CDC_EAR_M Headphone 174 GND GND 175 GND GND 176 GND GND 177 GND GND 178 SUBMIC_P SUB MIC 179 GND GND 180 GND GND 181 GND GND 182 NC NC 183 GND GND 184 GND GND 185 NC NC 186 GPIO/EINT GPIO/EINT Copyright © Neoway Technology Co., Ltd 1.8 ► B-PD:nppukp 75 16 Neo_AM8X2 Android Module Hardware User Guide 187 GPIO/EINT GPIO/EINT 1.8 ► B-PD:nppukp 188 GPIO/EINT GPIO/EINT 1.8 ► B-PD:nppukp 189 GPIO/EINT GPIO/EINT 1.8 ► B-PD:nppukp 190 GPIO/EINT GPIO/EINT 1.8 ► B-PD:nppukp 191 VDEBUG_1P8V Power for USB Boot 1.8 192 JTAG_TDO JTAG 193 JTAG_TDI JTAG 194 JTAG_TMS JTAG 195 JTAG_TCK JTAG 196 JTAG_TRST_N JTAG 197 JTAG_SRST_N JTAG 198 JTAG_PS_HOLD JTAG 199 FORCE_USB_BOOT USB Boot ► B-PD:nppukp 200 GPIO USB_ID ► B-PD:nppukp 201 NC NC 202 NC NC 203 NC NC 204 GND GND 205 SPKR_DRV_M Speaker 206 SPKR_DRV_P Speaker 207 GND GND Copyright © Neoway Technology Co., Ltd 1.8 SPI1_CS1_N 78 77 SPI13_CS2_N 84 74 SPI13_CS3_N BLSP6_UART_TX 92 17 Neo_AM8X2 Android Module Hardware User Guide 208 VIB_DRV_N Motor 209 LED_SINK Current for LED 210 ADC_IN N/A 211 LED Indication LED 212 PM_GPIO N/A 213 GPIO_101 OTG_PWR_EN 214 GPIO_PWR_FET MOSFET control 215 GND GND 1.8 ► B-PD:nppukp SPI12_CS1_N 79 101 1.8 ► B-PD:nppukp SPI12_CS3_N 99 ~ 240 You can select the closer power supply pins based on your peripherals design layout because the 43/91 (VCC_2P85V) pins and 42/92 (VIO_1P8V) are connected internally. If you use only the general function of each pin, the commissioning workload will be the least. If you need to use custom functions of the pins, please contact our technical support engineers. Please refer to Neo_AM8X2 Smart Module Using Cautions and Manufacturing Recommendations when you perform PCB design, make stencils, and inspect the incoming materials. Please reserve commissioning interfaces when you design your product using our AM8X2 module. For details, see Chapter 8 Commissioning Interface. 2.3 PCB Foot Print LGA packaging is adopted to package the pins of AM8X2. Figure 2-2 shows the recommended PCB foot print. Copyright © Neoway Technology Co., Ltd 18 Neo_AM8X2 Android Module Hardware User Guide Figure 2-2 PCB foot print recommended for AM8X2 (unit: mm) Copyright © Neoway Technology Co., Ltd 19 Neo_AM8X2 Smart Module Hardware User Guide 3 Power Supply Interfaces Table 3-1 Power supply pins I/O Function RESIN_N I Reset PWR_N I Power on Pin Signal 1 VBAT 106 107 Remarks 3.1 Power Supply and Switch Interfaces VBAT is the main power supply of the module. Its input voltage ranges from 3.5 V to 4.3 V and the preferable value is 3.9V. It supplies power for baseband controller and RF power amplifier. The performance of the VBAT power supply is a critical path to module's performance and stability. The peak input current at the VBAT pin can be up to 3 A when the signal is weak and the module works at the maximum transmitting power. The voltage will encounter a drop in such a situation. The module might restart if the voltage drops lower than 3.5 V. Ensure that the trace between the VBAT pin and the power supply on PCB board is wide enough to ease the voltage drop in a burst. Figure 3-1 Current peaks and voltage drops 3A Current 3.9 V Voltage 3.5 V Keep above 3.5 V 0 ms 3.7 ms 7.4 ms 10.7 ms T Figure 3-2 shows a recommended power supply design for the module. Copyright © Neoway Technology Co., Ltd 20 Neo_AM8X2 Smart Module Hardware User Guide Figure 3-2 Capacitors used for the power supply Test point VBAT I_max Power supply AM8X2 D1 C1 C2 C3 C4 C5 Close to the module In the circuit, you can use TVS at D1 to enhance the performance of the module during a burst. SMF5.0AG (Vrwm=5V&Pppm=200W) is recommended. A large bypass tantalum capacitor (220 μF or 100 μF) or aluminum capacitor (470 μF or 1000 μF) is expected at C1 to reduce voltage drops during bursts together with C2 (10 μF capacitor). In addition, you need to add 0.1 μF, 100 pF, and 33 pF filter capacitors to enhance the stability of the power supply. A controllable power supply is preferable if used in harsh conditions. The module might fail to reset in remote or unattended applications, or in an environment with great electromagnetic interference (EMI). You can use the EN pin on the LDO or DC/DC chipset to control the switch of the power supply as shown in Figure 3-3. MIC29302WU in the following figure is an LDO and outputs 3 A current to ensure the performance of the module. Figure 3-3 Reference design of power supply control VBAT PWR_EN EN VOUT MIC29302WU 10K VCC_IN_5V VIN ADJ 4.75K 100 uF TAN TVS 5V 470uF 10 uF 0.1 uF 100pF 33pF TAN 0.1 uF The alternative way is to use a p-MOSFET to control the module's power, as shown in Figure 3-4. When the external MCU detects the exceptions such as no response from the module or disconnection, power off/on can rectify the module exceptions. In Figure 3-4, the module is powered on when PWR_EN is set to high level. Copyright © Neoway Technology Co., Ltd 21 Neo_AM8X2 Smart Module Hardware User Guide Figure 3-4 Reference design of power supply controlled by p-MOSFET Q1 VCC_IN_3.9V S VBAT D C3 C1 C2 10 uF 0.1 uF R4 G R3 PWR_EN TVS 5V 100K C4 C5 C6 470 uF 10 uF 0.1 uF 100pF C7 33 pF 10K R1 Q2 2K R2 10K Q2 is added to eliminate the need for a high enough voltage level of the host GPIO. In case that the GPIO can output a high voltage greater than VCC_IN_3.9V - |VGS(th)|, where VGS(th) is the Gate Threshold Voltage, Q2 is not needed. Reference components:  Q1 can be IRML6401 or Rds(on) p-MOSFET which has higher withstand voltage and drain current.  Q2: a common NPN transistor, e.g. MMBT3904; or a digital NPN transistor, e.g. DTC123. If digital transistor is used, delete R1 and R2.  C3: 470 μF tantalum capacitor rated at 6.3V; or 1000 μF aluminum capacitor. If lithium battery is used to supply power, C3 can be 220 μF tantalum capacitor. Protection Place a TVS diode (VRWM=5 V) on the VBAT power supply to ground, especially in automobile applications. For some stable power supplies, zener diodes can decrease the power supply overshoot. MMSZ5231B1T1G from ONSEMI and PZ3D4V2 from Prisemi are options. Trace The trace width of primary loop lines for VBAT on PCB must be able to support the safe transmission of 2A current and ensure no obvious loop voltage decrease. Therefore, the trace width of VBAT loop line is required 2 mm and the ground should be as complete as possible. Separation The module works in burst mode that generates voltage drops on power supply. And furthermore this results in a 217 Hz TDD noise through power (One of the way generating noise. Another way is through RF radiation). Analog parts, especially the audio circuits, are subjected to this noise, known as a "buzz noise" in GSM systems. To prevent other parts from being affected, it's better to use separated power supplies. The module shall be supplied by an independent power, like a DC/DC or LDO. See Figure 3-5. Copyright © Neoway Technology Co., Ltd 22 Neo_AM8X2 Smart Module Hardware User Guide DC/DC or LDO should output rated peak current larger than 2 A. The inductor used in Reference Design (b), should be a power inductor and have a very low resistance. 10 μH with average current ability greater than 1.2A and low DC resistance is recommended. Figure 3-5 Reference designs of separated power supply DC-DC/LDO Other circuit Power Input DC-DC/LDO Power Input DC-DC/LDO Other circuit 10 uF AM8x2 AM8X2 Reference design (a) Reference design (b) Never use a diode to make the drop voltage between a higher input and module power. Otherwise, Neoway will not provide warranty for product issues caused by this. In this situation, the diode will obviously decrease the module performances, or result in unexpected restarts, due to the forward voltage of diode will vary greatly in different temperature and current. EMC Considerations Place transient overvoltage protection components like TVS diode on power supply, to absorb the power surges. SMAJ5.0A/C could be a choice. 3.2 Power-On After powering on the VBAT pin, you can use PWR_N to start the module by inputting low-level pulse for 3 seconds. This pin is pulled up internally. Its typical high-level voltage is 1.8 V. Do not leave this pin disconnected. The following circuit is recommended to control PWR_N. Figure 3-6 Push switch controlling S1 Copyright © Neoway Technology Co., Ltd R1 PWR_N 23 Neo_AM8X2 Smart Module Hardware User Guide Figure 3-7 MCU controlling PWR_N User_on R3 R2 If the module is powered on but the power-on sequence has not been completed, the states of each pin are uncertain. The power-on sequence of the module is shown as the following figure. Figure 3-8 AM8X2 power-on sequence VBAT 30s 3s PWR_N OTHERS Not defined 3.3 Hard Reset The RESIN_N pin is used to reset the module. It triggers module reset when you input low-level pulse for 3 seconds. This pin is pulled up internally. Its typical high-level voltage is 1.8 V. Leave this pin disconnected if you do not use it. If you use a 2.8V/3.3V IO system, it is recommended that you add a triode to separate it. Refer to the following design. Figure 3-9 Reset controlled by button S1 Copyright © Neoway Technology Co., Ltd R1 RESIN_N 24 Neo_AM8X2 Smart Module Hardware User Guide Figure 3-10 Reset circuit with triode separating VDD_EXT R2 2V8/3V3 R3 Q1 0V RESIN_N In a circuit shown above, VDD_EXT=2.8V/3.3V/3.0V, R2=4.7K, R3=47K. Figure 3-11 shows the reset sequence. Figure 3-11 AM8X2 reset sequence VBAT 3s RESIN_IN 40s OTHERS Not defined 3.4 Hard Power-off The PWR_N input pin can be used to hard power off the module. Low-level pulse input for 13 seconds can trigger the power-off of the module. This pin is pulled up internally. Its typical high-level voltage is 1.8 V. Leave this pin disconnected if you do not use it. If you use a 2.8V/3.3V IO system, it is recommended that you add a triode to separate it. Refer to 3.3 Hard Reset. Figure 3-12 shows the hard power-off sequence. Copyright © Neoway Technology Co., Ltd 25 Neo_AM8X2 Smart Module Hardware User Guide Figure 3-12 AM8X2 power-off sequence VBAT 13s PWR_N OTHERS Not defined 3.5 VRTC Power Supply VRTC is the pin that supplies power for the internal RTC. A 22 μF capacitor is connected to VRTC internally to make it invalid when you replace the power supply (battery) of the module. The module will update the RTC clock after it is powered on and connected to the network. Figure 3-13 shows the internal design of the VRTC pin. Figure 3-13 VRTC design in the module AM8X2 RTC + 22uF 3.6 Battery Management Our AM8X2 module supports battery charging. For information about how to select proper battery, refer to GB /T18287-2000 Chinese National Standard for Lithium Ion batteries for mobile phones. Available voltages range between 3.5V to 4.2V. AM8X2 supports at most 1A charging current. Therefore, it is recommended that you connect ESD and capacitors to VBAT and BAT_THERM in parallel in case that abnormal electrical signals might damage the module. Copyright © Neoway Technology Co., Ltd 26 Neo_AM8X2 Smart Module Hardware User Guide PDA, mobile POS and other mobile devices all use battery as power supply. For different batteries, you need to modify the charging/discharging curve in the software. AMX2 provides 4 pins for battery. Table 3-2 Battery pin description Pin Signal 1 I/O Function Remarks VBAT Power supply input 3.5V~4.2V 108 BAT_THERM Battery temperature check Default NTC=10K 109 BAT_ID Battery ID Pulled down to ground by 47K 110 BAT_SNS Battery SNS Battery voltage check, battery Ensure that the BAT_THERM pin is connected. Otherwise, the battery might fail to charge or the remaining power is displayed incorrectly. Figure 3-14 shows the connection of the battery pins. Figure 3-14 Battery connections VBAT_SNS VBAT TVS C1 C2 VREF_BAT_THM R1 R3 R_TH VBAT_THERM R2 R_ID BAT_ID GND PMIC Battery Module AM8X2 Ensure that the power consumption/current is lower than 8 mA (the value the software read) in standby mode if you use li-Ion battery for power supply and use module power supply pins (43/91 and 42/92) in your design. Otherwise, the remaining power might not be displayed accurately. Add DCDC/LDO compatible power supply design if you use external 1.8V and 2.85V power supply. Copyright © Neoway Technology Co., Ltd 27 Neo_AM8X2 Smart Module Hardware User Guide 4 Video I/O Interfaces AM8X2 video I/O interfaces are developed based on Mobile Industry Processor Interface (MIPI) standard to transmit high-speed digital signals. This standard is widely supported by main device manufacturers. So it is easy to get video devices that support this standard. For information about the peripherals that AM8X2 supports, contact our technical engineers. 4.1 LCD Interfaces LCD interfaces are the video output interfaces of the AM8X2 module, developed based on the MIPI_DSI standard. They support 4 groups of high-speed differential data transmission, each of which can achieve a rate of at most 1Gbps. You can configure different quantity of MIPI_DSI as required. The following sections will describe the hardware configuration of WVGA and 720P display. 4.1.1 WVGA The resolution of WVGA display is 800 x 480, which requires two groups of MIPI_DSI. LCD design is generally to connect FPC to the connector. Table 4-1 shows describes the LCD pin. Table 4-1 WVGA LCD description Pin Signal I/O Function 135 LCD_DIF DI ID 134 LCD_ID DI ID 133 DSI_LCD_TE0 DO 143 DSI_RST_N DO 129 MIPI_DSI0_CLK_P DO MIPI 18 MIPI_DSI0_CLK_M DO MIPI 132 MIPI_DSI0_LANE1_P DO MIPI 21 MIPI_DSI0_LANE1_M DO MIPI 127 MIPI_DSI0_LANE2_P DO MIPI 16 MIPI_DSI0_LANE2_M DO MIPI 43 VREG_L19_2P85V AO AO 42 VREG_L14_1P8V AO AO / LED_K AI Anode of backlight boost converter / LED_A AO Cathode of backlight boost converter / VEXT_2P85V AO LDO output 23 TS_RST_N DO Reset touchscreen Copyright © Neoway Technology Co., Ltd Remarks Touchscreen interface 28 Neo_AM8X2 Smart Module Hardware User Guide 26 TS_I2C_SCL DO I2C clock of the touchscreen Touchscreen interface 25 TS_I2C_SDA DIO I2C data of the touchscreen Touchscreen interface 24 TS_INT_N DI Touchscreen interrupt Touchscreen interface In your design, add common mode chokes to the MIPI circuit to reduce the electromagnetic interference. Figure 4-1 shows the reference circuits with common mode choked. Please refer to 4.4 Design Cautions. Figure 4-1 Reference MIPI circuits with common mode chokes FL1 MIPI_DSI0_LANE1_M MIPI_DSI0_D1_M_LCD MIPI_DSI0_LANE1_P MIPI_DSI0_D1_P_LCD FL1 MIPI_DSI0_CLK_M MIPI_DSI0_CLK_M_LCD MIPI_DSI0_CLK_P_LCD MIPI_DSI0_CLK_P FL1 MIPI_DSI0_LANE2_M MIPI_DSI0_D2_M_LCD MIPI_DSI0_LANE2_P MIPI_DSI0_D2_P_LCD Copyright © Neoway Technology Co., Ltd 29 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-2 shows the backlight driver circuit. Figure 4-2 AM8X2 LCD backlight chipset 22uH VBATT_FET 6 2 WLED_PWM_MPP_3 4 10uF VIN GND EN 120Ω±25%（@100MHz） LED_A LX OVP FB 1 1 uF 5 120Ω±25%（@100MHz） 3 APW7209 LED_K 12Ω 100K Table 4-2 lists the pin used in the backlight driver circuit. Table 4-2 Backlight driver pin Pin Signal I/O Function 136 WLED_PWM DI Use PWM to control the LCD backlight Remarks DCDC is used to drive LCD backlight and powered by external power supply. The brightness is controlled by the PWM wave that the module outputs. It is recommended that you use independent LDO to supply power for the backlight to get the complete control of the power supply and reduce the standby power consumption. 2.85V LDO circuit is recommended to drive IC inside LCD. Copyright © Neoway Technology Co., Ltd 30 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-3 Power supply of AM8X2 LCD driver DNI-0Ω VREG_L19_2P85V RP100K281D-TR VBATT_FET 4 VOUT VDD VEXT_2P85V 1 2.2uF EXT_2P85V_EN 3 CE GND GND 2 5 100K 1 uF Table 4-3 shows the 2.85V LDO control pin. Table 4-3 2.85V LDO pin Pin Signal I/O Function Remarks 151 EXT_2P85V_EN DI Control the switch of the external 2.85V LDO Control the switch of the external 1.8V LDO In Figure 4-4, an MOS is used to turn off the power supply forcibly to prevent leakage current from some peripherals. If there is no concern of leakage current in your design, you can delete this MOS switch circuit. Table 4-4 lists the pin controlled by MOS control. Table 4-4 Pin controlled by MOS switch Pin Signal 214 GPIO_PWR_FET I/O Copyright © Neoway Technology Co., Ltd Function Remarks Pin controlled by MOS switch 31 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-4 Reference design of MOS switch circuit Q1 VBAT S VBATT_FET D C4 C1 C2 10 uF 0.1 uF R4 G R3 GPIO_PWR_FET TVS 5V 100K C5 10 uF 0.1 uF 10K R1 Q2 2K R2 10K Figure 4-5 shows the reference design of the customized 4.5' LCD interface.  4.5' QHD  NT35516 driver IC  540*960  240 dpi  Capacitive multi-touch Copyright © Neoway Technology Co., Ltd 32 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-5 Reference design of LCD interface LCD connector DSI_LCD_TE0 220Ω±25%（@100MHz） LED_K TS_RST_N MIPI_DSI0_D1_P_LCD VREG_L19_2P85 LED_A VEXT_2P85V TS_I2C_SCL TS_INT_N V 1uF MIPI_DSI0_CLK_M_LCD 1uF 0.1uF 1uF 0.1uF AVL-5.5V-100PF V 0.1uF 9 3 2 1 FV1 AVL-5.5V-100PF 5 4 TS_I2C_SDA MIPI_DSI0_D2_P_LCD 26 MIPI_DSIO_D1_M_LCD LCD_DIF DSI_RST_N 11 13 15 17 19 21 23 25 27 MIPI_DSIO_D2_M_LCD MIPI_DSIO_CLK_M_LCD VREG_L14_1P8V 1 3 5 7 2 4 6 8 10 12 14 16 18 20 22 24 LCD_ID 4.1.2 720P The 720p format requires 4 groups of MIPI_DSI. You can refer to the WVGA design. Table 4-5 shows the LCD pins required in the 720p design. Table 4-5 720P LCD pins Pin Signal I/O Function 135 LCD_DIF DI ID 134 LCD_ID DI ID 133 DSI_RST_N DO 129 MIPI_DSI0_CLK_P DO MIPI 18 MIPI_DSI0_CLK_M DO MIPI 131 MIPI_DSI0_LANE0_P DO MIPI 20 MIPI_DSI0_LANE0_M DO MIPI 132 MIPI_DSI0_LANE1_P DO MIPI 21 MIPI_DSI0_LANE1_M DO MIPI Copyright © Neoway Technology Co., Ltd Remarks 33 Neo_AM8X2 Smart Module Hardware User Guide 127 MIPI_DSI0_LANE2_P DO MIPI 16 MIPI_DSI0_LANE2_M DO MIPI 126 MIPI_DSI0_LANE3_P DO MIPI 15 MIPI_DSI0_LANE3_M DO MIPI 43 VREG_L19_2P85V AO AO 42 VREG_L14_1P8V AO AO / LED_K AI Anode of backlight boost converter / LED_A AO Cathode of backlight boost converter / VEXT_2P85V AO LDO output 23 TS_RST_N DO Reset touchscreen 26 TS_I2C_SCL DO 25 TS_I2C_SDA DIO I2C data of the touchscreen 24 TS_INT_N DI Touchscreen interrupt I2C clock of the touchscreen 4.2 Touchscreen Interfaces Touchscreen and LCD cannot be the FPC interface. Table 4-6 lists the touchscreen pins. Figure 4-6 shows the reference design of customized 4.5' touchscreen interfaces, in which ESD protection array is added. The recommended ESD models include NZQA5V6AXV5T1G, CESDLC3V0L4, PESD3V3V4UW, etc. Table 4-6 Touchscreen pins Pin Signal I/O Function / CAM_1P8V AO Power output / VEXT_2P85V AO LDO output 23 TS_RST_N DO Reset touchscreen 26 TS_I2C_SCL DO I2C clock 25 TS_I2C_SDA DIO I2C data 24 TS_INT_N DI Touchscreen interrupt Copyright © Neoway Technology Co., Ltd Remarks 34 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-6 Reference design of touchscreen interface VEXT_2P85V V V AVL-5.5V-100PF 1uF 0.1uF 1uF 0.1uF CAM_1P8V 47KΩ DNI-47KΩ TS_RST_N TS_I2C_SCL TS_I2C_SDA TS_INT_N 5 10 9 1 2 3 4 5 6 7 8 4 TP连接座 AVL-5.5V-100PF CAM_1P8V 3 2 1 FV1 4.3 Camera Interfaces The video input interfaces of the module is developed based on the MIPI_CSI standard, and support two cameras, among which the pixel can be at most 8MP. The quality of video and photo is dependent on the camera sensor, the camera specifications, and other factors. You can select cameras compliant with your application scenarios based on the list of camera specifications that we have commissioned. 4.3.1 Main Camera The main camera transmits data and is controlled through FPC and connector. It uses two groups of MIPI_CSI differential data interfaces, and support at most 8MP. Table 4-7 lists pins of the main camera. Table 4-7 Main camera pins Pin Signal I/O 45 MIPI_CSI0_LANE1_P MIPI 154 MIPI_CSI0_LANE1_M MIPI 47 MIPI_CSI0_LANE2_P MIPI 156 MIPI_CSI0_LANE2_M MIPI 48 MIPI_CSI0_CLK_P MIPI Copyright © Neoway Technology Co., Ltd Function Remarks 35 Neo_AM8X2 Smart Module Hardware User Guide 157 MIPI_CSI0_CLK_M MIPI 149 MAINCAM_RST_N Reset 148 MAINCAM_MCLK0 Clock 145 CCI_I2C_SDA I2C data 144 CCI_I2C_SCL I2C clock / VEXT_2P85 LDO output / VEXT_CAM_1P2V LDO output / VEXT_CAM_1P8V LDO output LDO supplies power for VEXT_2P85, VEXT_CAM_1P2V, and VEXT_CAM_1P8V. The recommended LDO models are respectively: RP100K281B5-TR, RP100K281D5-TR, RP100K281D-TR, XC6221A282GR, XC6221B282GR; RP100K121B-TR, TK68112AMFG0L-C, XC6221A122GR, XC6221B122GR; RP100K181D-TR, TK64118AMFGOL-C, XC6221A182GR, RP100K181B-TR, XC6221B182GR. Figure 4-7 shows the reference design of the 8MP main camera. Figure 4-7 Reference design of the main camera interface 220Ω±25%（@100MHz） VEXT_2P85V Main camera connector 0.1uF STROBE CAM_MCLK0 MIPI_CSI0_LANE2_P MIPI_CSI0_CLK_M MIPI_CSI0_LANE1_P 0.1uF 1uF CCI_I2C_SDA SDA VEXT_CAM_1P8V AGND VPP 1uF 17 15 RESET DGND 13 DGND 11 9 AVDD DVDD SIRPBE MCLK MDP1 CAM1_RST_N MIPI_CSI0_LANE2_M MDN1 DGND MCP MCN DGND MDP0 MDN0 DGND DGND 7 5 3 1 MIPI_CSI0_CLK_P MIPI_CSI0_LANE1_P 1uF 0.1uF 26 220Ω±25%（@100MHz） VEXT_CAM_1P2V 25 23 AF_VCC 21 DOVDD SCL 19 DGND AF_GND 27 CCI_I2C_SCL 24 22 20 18 16 14 12 10 8 6 4 2 4.3.2 Sub-Camera Sub-camera uses one group of MIPI_CSI differential signal, and supports 0.3MP and 5MP cameras. Table 4-8 lists sub-camera pins. Copyright © Neoway Technology Co., Ltd 36 Neo_AM8X2 Smart Module Hardware User Guide Table 4-8 Sub-camera pins Pin Signal I/O Function 162 MIPI_CSI1_LANE0_P DO MIPI 53 MIPI_CSI1_LANE0_M DO MIPI 54 MIPI_CSI1_CLK_P DO MIPI 163 MIPI_CSI1_CLK_M DO MIPI 56 SUBCAM_RESET DO Reset 144 CCI_I2C_SCL O I2C clock 145 CCI_I2C_SDA IO I2C data 152 SUBCAM_MCLK1 O Clock / VEXT_2P85V O LDO output / VEXT_CAM_1P8V O LDO output Remarks VEXT_2P85V and VEXT_CAM_1P8V are powered by LDO. For information about how to select the proper model, see 4.3.1 Main Camera. Figure 4-8 shows the reference design of 0.3MP and 5MP cameras. Figure 4-8 Reference design of sub-camera interface 0.1uF 1uF 0.1uF 1uF 220Ω±25%（@100MHz） VEXT_2P85V CAM_1P8V SUBCAM_RESET CCI_I2C_SDA CCI_I2C_SCL SUBCAM_MCLK1 MIPI_CSI1_LANE0_M MIPI_CSI1_LANE0_P MIPI_CSI1_CLK_M MIPI_CSI1_CLK_P 13 12 11 10 9 8 7 6 5 4 3 2 1 14 15 Sub-camera connector Copyright © Neoway Technology Co., Ltd 37 Neo_AM8X2 Smart Module Hardware User Guide 4.3.3 Design Cautions Please note the scanning direction of the camera, the aiming direction and angle of the camera lens, the scanning method of the LCD when it reads data. LCD is generally designed in two ways: vertical scan and horizontal scan. Figure 4-9 Scan direction of 3264*2448 LCD Generally, our customized LCD supports horizontal scan. Figure 4-10 shows the reference design of our customized camera. Figure 4-10 Reference design of customized camera Copyright © Neoway Technology Co., Ltd 38 Neo_AM8X2 Smart Module Hardware User Guide Images from the camera to the LCD can be adjusted in only four ways: Figure 4-11 Adjustment of camera sensor Images can be displayed correctly only when the camera sensor and the LCD scan in the same direction. If the camera sensor and LCD scan in different directions, the image will be mirrored. 4.3.4 Camera Power Supply LDO supply power for cameras separately. For the recommended models, see 4.3.1 Main Camera. The 1.8V LDO circuit is used for the reference IC level inside the camera, and use the same pin as the 2.85V LDO.Figure 4-12 shows the reference design of the camera power supply. Figure 4-12 Reference design of the camera power supply RP100K181D-TR VBATT_FET 4 VOUT VDD 1 VEXT_CAM_1P8V 2.2uF EXT_2P85V_EN 3 CE GND GND 2 5 DNI-100K 1 uF 1.2V level input is required for main camera. Figure 4-13 shows the reference design. Copyright © Neoway Technology Co., Ltd 39 Neo_AM8X2 Smart Module Hardware User Guide Figure 4-13 Reference design of the main camera power supply RP100K121B-TR VIO_1P8V 4 VOUT VDD 1 VEXT_CAM_1P2V 2.2uF EXT_CAM_1P2V_EN 3 CE GND GND 2 5 DNI-100K 1 uF Table 4-9 lists the 1.2V LDO pin. Table 4-9 1.2V LDO pin Pin Signal I/O Function 150 EXT_CAM_1P2V_EN DI 1.2V LDO enable pin Remarks AM8X2 has specific enable control pins for each LDO circuit. The voltage varies with the cameras. For details, see the reference design. 4.4 Design Cautions Please note the definition of the video interfaces and ensure the correct connection between the connector and components. The MIPI transmission rate can reach 1Gbps (500MHz). Use 50Ω design rules to achieve a differential impedance of 100 Ω for the differential pair of traces, which must be routed on the inner layer to isolate from other signal traces. Keep length matching for the MIPI traces of one video component. Reserve 1.5 times of trace width between MIPI traces. It is recommended that you lay all MIPI traces on the same layer. Copyright © Neoway Technology Co., Ltd 40 Neo_AM8X2 Smart Module Hardware User Guide 5 Audio Interface AM8X2 provides a few groups of audio input/output interfaces to meet your requirements in different applications. 5.1 Audio Input Table 5-1 list the three groups of audio input pins. Table 5-1 Audio input pins Pin Signal I/O Function Remarks 13 MAINMIC_N AI Negative electrode of MIC1 output Main MIC 124 MAINMIC_P AI Positive electrode of MIC1 output Main MIC 71 SUBMIC_GND AI Negative electrode of MIC3 output Supplement MIC 178 SUBMIC_P AI Positive electrode of MIC3 output Supplement MIC Figure 5-1 shows the differential connection of the peripheral. A bias circuit is embedded for the audio input pins. TVS in the following figure can be replaced by AVLC5S02100 and SDV1005E5R5C800NPTF. Figure 5-1 Reference design of MIC connection 33 pF 1800Ω±25%（@100MHz） MICP 33 pF AM8X2 1800Ω±25%（@100MHz） MIC MICN 33 pF TVS TVS 5.2 Audio Output AM8X2 provides a few groups of audio output interfaces, including speaker, receiver, and headphone. Table 5-2 lists the audio output pins. Copyright © Neoway Technology Co., Ltd 41 Neo_AM8X2 Smart Module Hardware User Guide Table 5-2 Audio output pins Pin Signal I/O Function Remarks 172 CDC_EAR_P AO Positive electrode of receiver output 173 CDC_EAR_M AO Negative electrode of receiver output 205 SPKR_DRV_M AO Negative electrode of speaker output 206 SPKR_DRV_P AO Positive electrode of speaker output The receiver pins support Class G amplifier and differential output. The speaker pins support Class D amplifier and differential output. The typical speaker output power is 1.4W/0.9W@8Ωwhen the battery supplier 5V/4.2V. Figure 5-2 shows the reference design of the audio output pins. Figure 5-2 Reference design of EAR/SPK connections 33 pF 1800Ω±25%（@100MHz） EAR/SPK+ 33 pF EAR/SPK EAR/SPK- AM8X2 1800Ω±25%（@100MHz） 33 pF TVS TVS 5.3 Headphone Interfaces The module provides fixed pins to achieve the headphone function. AM8X2 supports class G headphone amplifier and three headphone control buttons. Table 5-3 lists the headphone pins. Table 5-3 Headphone pins Pin Signal I/O Function 61 CDC_HPH_L AO Left sound channel of the earphone output 62 CDC_HPH_REF 63 CDC_HPH_R AO Right sound channel of the earphone output 64 HEADSET MIC_P AI Audio input of MIC2, used for single-end headphone input 167 CDC_HS_DET DI Headphone detection Remarks Headphone output level Copyright © Neoway Technology Co., Ltd 42 Neo_AM8X2 Smart Module Hardware User Guide Figure 5-3 shows the reference design of the headphone circuit. Figure 5-3 Reference design of headphone without FM 1000Ω±25%（@100MHz） PESD5V0S1BL HEADSETMIC_P 33pF Headphone connector 1 3 4 1000Ω±25%（@100MHz） CDC_HPH_R CDC_HPH_L V AVL-5.5V-100PF 5 2 V AVL-5.5V-100PF 1000Ω±25%（@100MHz） 10K 10K 470pF 470pF 1000Ω±25%（@100MHz） CDC_HS_DET 1000Ω±25%（@100MHz） V 1000Ω±25%（@100MHz） DNI-33pF AVL-5.5V-100PF CDC_HPH_REF Figure 5-4 shows the circuits of headphone out of position and in position. Figure 5-4 Headphone interface Copyright © Neoway Technology Co., Ltd 43 Neo_AM8X2 Smart Module Hardware User Guide Please note if headphone you select is CTIA or OMTP. The connections of ①and ② are reverse for the two type of headphones. The CDC_HS_DET pin (⑤ in the above figure) is left disconnected (pulled up internally) if the headphone is not plugged. After the headphone is plugged, this pin is connected to GND through the left channel (8/16/32 Ω) loudspeaker of the headphone. The volume buttons of the AM8X2 module are used in the similar way to the power and reset buttons. Table 5-4 lists the volume pins. Table 5-4 Volume pins Pin Signal I/O Function 104 VOL_DOWN I Volume- 105 VOL_UP I Volume+ Remarks 5.4 Audio Design Cautions The audio signal traces should be wide enough on the PCB to bear large current when the module output audios at the highest volume. The traces should be isolated from digital signals and clock as well as other analog signal traces. No signal trace crossing is allowed. Reserve enough grounding holes and ground protection. Do not connect the audio output pins to GND. Copyright © Neoway Technology Co., Ltd 44 Neo_AM8X2 Smart Module Hardware User Guide 6 Peripheral Interfaces AM8X2 also supports USB, SIM, SDIO, GPIO and other peripheral interfaces. 6.1 USB Interface You can download programs for AM8X2 and establish data connections through the USB interface. If the module is used only as USB Device, the recommended USB circuit is shown in Figure 6-1. PESD5V0S1BL Figure 6-1 USB circuit DNI-22PF VBUS_USBIN Micro USB 0Ω USB_DM 0Ω USB_DP ESD9X5VU ESD9X5VU DNI-18PF GND Parallel a 1μF and 22pF filter capacitors to the VBUS_USBIN pin as close to the pin as possible. TVS components are required for the VBUS power line. The junction capacitance of the TVS protection diodes for USB_DP and USB_DM should be lower than 12pF as possible. USB data lines adopt differential trace design, in which the differential impedance is limited to 90 Ω characteristics impedance. Isolate the traces from other signal traces. Table 6-1 lists the pins used in the above circuit. Table 6-1 USB Device pins Pin Signal I/O Function 7 VCC_USBIN PWR USB Power 188 VCC_USBIN PWR USB Power 10 USB_DP USB data 11 USB_DM USB data Remarks GND Copyright © Neoway Technology Co., Ltd 45 Neo_AM8X2 Smart Module Hardware User Guide The recommended voltage of VCC_USBIN is 5V (cannot exceed 6V). Otherwise the internal protection components for the power supply will be damaged. AM8X2 supports USB OTG. You can refer to the following circuit if you need the USB OTG function. Figure 6-2 USB OTG circuit 10UF 10UF GND Battery PESD5V0S1BL DCDC DNI-22PF VIN VBAT EN GPIO VOUT V_USB 0Ω Micro USB OTG USB_DM DNI-18PF AM8X2 USB_DP USB_ID(EINT) ESD9X5VU ESD9X5VU 0Ω GND Table 6-2 lists pins used for the USB-OTG function in addition to the USB pins. Table 6-2 USB-OTG pins Pin Signal I/O Function 200 USB_ID I USB_ID, Device detection, external interrupt 213 OTG_PWR_EN O DCDC pin, Remarks The DCDC is enabled after device is plugged into the AM8X2 USB interface You can select the DCDC model based on your requirements. 6.2 SIM Card Interface AM8X2 supports 1.8V/3.0V SIM cards. AM812 allows dual SIM cards and only one works for 3G communications while the other one is recognized as 2G automatically among the two SIM card connectors. For example, you put two 3G SIM cards at the same time, SIM1 will be identified as 3G and SIM2 will be 2G.AM862 allows only one SIM card. VSIM is the SIM card power supply pin and its maximum load is 30 mA.An internal pull-up resistor is embedded for the SIM_DATA pin. You do not need to add any external pull-up resistor. SIM_CLK is the clock signal pin, supporting 3.25 GHz of clock frequency. Figure 6-3 shows the reference design of the SIM card interface. Copyright © Neoway Technology Co., Ltd 46 Neo_AM8X2 Smart Module Hardware User Guide Figure 6-3 Reference design of SIM card interface SIM_DATA SIM_CLK CLK DATA SIM_RST RST VPP VSIM VCC GND SIM-Det GND SIM-Det SIM card AM8X2 1 uF Table 6-3 and Table 6-4 list SIM pins. Table 6-3 SIM1 pins Pin Signal I/O Function 2 VCC_UIM1 PWR SIM1 power supply 3 UIM1_DATA IO SIM1 data 4 UIM1_CLK O SIM1 clock 5 UIM1_RESET O SIM1 reset 6 UIM1_DETEC I SIM1 detection Remarks Table 6-4 SIM2 pins Pin Signal I/O Function 113 VCC_UIM2 PWR SIM2 power supply 114 UIM2_DATA IO SIM2 data 115 UIM2_CLK O SIM2 clock 116 UIM2_RESET O SIM2 reset 117 UIM2_DETECT I SIM2 detection Remarks ESD protectors, such as ESD diodes or ESD varistors (with a junction capacitance of less than 33 pF), are recommended on the SIM signals, especially in automotive electronics or other applications with badly ESD. Replace the ESD diodes with 27 pF to 33 pF capacitors connecting to GND in common applications. The ESD diodes or small capacitors should be close to SIM card. AM8X2 supports SIM card detection. UIM1_DETECT/ UIM2_DETECT are 1.8V interrupt pins. Low level means SIM card detected while high level mean no SIM card detected. Copyright © Neoway Technology Co., Ltd 47 Neo_AM8X2 Smart Module Hardware User Guide SIM card is sensitive to GSM TDD noise and RF interference. So, the PCB design should meet the following requirements: The antenna should be installed far away from the SIM card and SIM card traces, especially to the build-in antenna. The SIM traces on the PCB should be as short as possible and shielded with GND copper. The ESD protection diodes or small capacitors should be closed to SIM card on the PCB. 6.3 SDIO AM8X2 supports SD/MMC cards of 4-bit mode, or devices based on the SDIO protocol and the latest SDIO 3.0 protocol. 6.3.1 SD card Figure 6-4 shows the reference design of the SD card circuit. You can SD/TF card detection function and hot swapping functions. The module supports TF/SD card of at most 32 GB. Figure 6-4 Reference design of TF card interface GND GND SW1B SW1A 4.7uF 0.1uF DNI-47K DNI-47K DAT2 CD/DAT3 CMD VDD CLK VSS DAT0 DAT1 DNI-47K DNI-47K DNI-47K VREG_L21_2P95V SDC2_DATA2 SDC2_DATA3 SDC2_CMD VREG_L18_2P95V SCD2_CLK SCD2_DATA0 SCD2_DATA1 3 1 3 2 1 2 FV2 FV1 Copyright © Neoway Technology Co., Ltd 5 4 5 4 TF connector 48 Neo_AM8X2 Smart Module Hardware User Guide Table 6-5 lists TF card pins. Table 6-5 TF card pins Pin Signal I/O Function Remarks 36 VIO_SD PWR I/O power supply (pull-up reserved) 37 VCC_SD PWR SDIO driver power supply, supporting dual voltage of 1.8V and 2.95V, maximum current 500 mA VDD 29 SDC2_CMD O Command line, impedance line recommended CMD 28 SDC2_CLK O High-speed digital clock CLK 30 SDC2_DATA0 IO High-speed data line DATA0 31 SDC2_DATA1 IO High-speed data line DATA1 32 SDC2_DATA2 IO High-speed data line DATA2 33 SDC2_DATA3 IO High-speed data line DATA3 35 SD_CARD_DET_N I SD card detection, low-level interrupt / VCC_SD is the power supply pin of the SD card. It supports a maximum current of 500mA and dual-voltage of 1.8V/2.95V. The recommended trace width is 0.5 mm. Parallel 0.1 uF and 4.7 uF capacitors to the SD card. Reserve pull-up resistors that will be connected to VIO_SD in you SD card design. CMD, CLK, DATA0, DATA1, DATA2 and DATA3 are high-speed signal line. Limit their characteristics impedance to 50Ω and do not let them cross any other traces. Keep length matching for CMD, DATA0, DATA1, DATA2 and DATA3 traces. CLK trace should be ground separately. 6.3.2 SD Peripheral Interface SDIO interface can connect other peripherals. Refer to the SD card connection design, and connect the module pin to the peripheral pin directly. PCB layout is similar to the SD card design. 6.4 GPIO In addition to the default pin functions descript in previous sections, AM8X2 supports various configurations of the BLSP and other pins to meet customer requirement for UART, IIC, SPI, GPIO, and EINT. For the configurable information, see the pin definition section. For the open and usage of multi-function GPIO interface, please inquiry our technical support engineers. 6.4.1 UART AM8X2 provides three groups of UART interfaces, which support 4Mbps at most. The reference high level is 1.8V. Figure 6-5 shows the reference design of the UART interface. Copyright © Neoway Technology Co., Ltd 49 Neo_AM8X2 Smart Module Hardware User Guide Figure 6-5 Reference design of the UART interface Client AM8X2 URXD UTXD UTXD URXD 6.4.2 I2C AM8X2 provides one group of I2C interfaces (Version 2.1), which support the host mode only. The I2C interfaces are open-drain driven (pull-up resistor is mandatory for the external circuit). They support a maximum rate of 3.4 Mbps and their reference high level is 1.8V. Figure 6-6 shows the reference design of the I2C interfaces. Figure 6-6 Reference design of I2C 1.8V 2.2K 2.2K I2C-SCL I2C-SCL I2C-SDA I2C-SDA 6.4.3 SPI AM8X2 provides a group of SPI interfaces, which support the host mode only. The maximum rate is 52MHz, and the reference high level is 1.8V. Figure 6-7 shows the reference design of SPI interfaces. Copyright © Neoway Technology Co., Ltd 50 Neo_AM8X2 Smart Module Hardware User Guide Figure 6-7 Reference design of the SPI AM8X2 SCLK SCLK MOSI MOSI MISO MISO SS SS GND GND slave master Do not connect interfaces of different level standards directly. Otherwise, the module might be damaged. TXS0104E or NLSX4373MUTAG is recommended if you need level shifter to shift the level of the UART, IIC, SPI, etc. 6.5 ADC AM8X2 provides only ADC pins for battery level check and BAT_ID, but also one channel of open ADC. Table 6-6 lists the ADC pin. Table 6-6 ADC pin Pin Signal I/O Function Remarks 210 ADC_IN_MPP_04 AI ADC pin Open for customized requirements ADC pin supports highest precision of 15-bit and its maximum input voltage is 2.85V. 6.6 Other Interfaces AM8X2 also provides motor driver interface and key backlight driver interface to meet the requirements for mobile device applications. 6.6.1 Motor Driver Interface Motor is driven by specific circuit. Figure 6-8 shows the reference design of the motor circuit. Copyright © Neoway Technology Co., Ltd 51 Neo_AM8X2 Smart Module Hardware User Guide Figure 6-8 Reference design of motor circuit 2.2pF VBATT_FET 0Ω 33pF 0.1uF 0Ω VIB_DRV_N + 33pF Motor interface Table 6-7 lists the motor driven pin that AM8X2 opens for the motor. Table 6-7 Motor driver pin Pin Signal 208 VIB_DRV_N I/O Function Remarks Negative electrode of the motor driver The diode loop can release the electricity on the motor to protect the component when the VIB_DRV_N stops driving. 6.6.2 Key Backlight Driver AM8X2 provides a constant current driver interface to connect an LED, which supplies backlight for three keys at the bottom of the touchscreen. Figure 6-9 shows the reference design of the key backlight circuit. Table 6-8 Key backlight pin Pin Signal 211 LED I/O Function Remarks Negative electrode of the key backlight driver Copyright © Neoway Technology Co., Ltd 52 Neo_AM8X2 Smart Module Hardware User Guide Figure 6-9 Reference design of key backlight circuit 33pF 33pF 33pF VBATT-FET LED_SINK 33pF 33pF 33pF LED_SINK provides constant current, which is to be adjusted together with the key backlight. Copyright © Neoway Technology Co., Ltd 53 Neo_AM8X2 Smart Module Hardware User Guide 7 RF Interface 7.1 2G/3G RF Design and PCB Layout RF_ANT_TRX is the antenna pin of AM8X2. A 50 Ω antenna is required. VSWR ranges from 1.1 to 1.5. The antenna should be well matched to achieve best performance. It should be installed far away from high speed logic circuits, DC/DC power, or any other strong disturbing sources. For multiple-layer PCB, the trace between the antenna pad of module and the antenna connector, should have a 50 Ω characteristic impedance, and be as short as possible. The trace should be surrounded by ground copper. Place plenty of via holes to connect this ground copper to main ground plane, at the copper edge. If the trace between the module and connector has to be longer, or built-in antenna is used, a π-type matching circuit is needed, as shown in Figure 7-1. Figure 7-1 Reference of antenna matching design Big RF solder pad can result in great parasitic capacitance, which will affect the antenna performance. Remove the copper on the first and second layers under the RF solder pad. Figure 7-2 Recommended RF PCB design If you adopts RF antenna connections, the GSC RF connector MM9329-2700RA1 from Murata is recommended. Figure 7-3 shows the encapsulation specifications. Copyright © Neoway Technology Co., Ltd 54 Neo_AM8X2 Smart Module Hardware User Guide Figure 7-3 Encapsulation specifications of Murata RF connector RF antenna can also be connected to the module by soldering. In this manner, you must ensure proper soldering in case of damage that lowers RF performance. Figure 7-4 shows the pictures of these two connections. Figure 7-4 RF connections 7.2 WIFI/BT RF Design and PCB Layout On AM8X2, WiFi and BT share the same antenna interface, which requires an antenna with 50Ω impedance. The antenna can be 2.4GHz PCB trace antenna, ceramic chip antennas, or Magnetic Antenna. It should be installed far away from high speed logic circuits, DC/DC power, or any other strong disturbing sources if you use RF cable to connect. It is recommended that you add an ESD protection diode to the antenna interface in an environment with great electromagnetic interference and other applications with badly ESD.The ESD protection diode must have ultra-low capacitance (lower than 0.5 pF). Otherwise, it will affect the impedance of the RF loop or result in attenuation of RF signals. RCLAMP0521P from Semtech or ESD5V3U1U from Infineon is recommended. In PCB design, the RF trace between the antenna pad of module and the antenna connector, should have a 50 Ω characteristic impedance, and be as short as possible. The trace should be surrounded by ground copper. The distance between the RF traces and ground copper should be twice of the RF trace width. Dig as many ground holes as possible on the copper to ensure lowest grounding impedance. It is recommended that you set the matching circuit before installing the antenna. You can select any type of circuits shown in Figure 7-1. T1 is an ESD protection diode, which is optional. You can use PCB trace antenna or ceramic chip antennas for the WiFi/BT RF. For the detailed design of the 2.4G antenna, refer to TI's Antenna Selection Quick Guide. For how to use 2.4G ceramic chip antenna, refer to Application Note AN048 Bluetooth, 802.11b/g WLAN Chip Antenna. You can also select SLDA52-2R540G-S1TF from Sunlord. Copyright © Neoway Technology Co., Ltd 55 Neo_AM8X2 Smart Module Hardware User Guide Figure 7-5 shows the layout of the 2.4G ceramic chip antenna. SLDA52-2R540G-S1TF is used as an example. Figure 7-5 Antenna layout If your PCB is large enough, you can adopt the layout shown in Figure 7-5 (a). 4 50Ω transmission line (calculated using Si9000 or APPCAD 1 Chip antenna 2 Feeder 3 Pad of the matching circuit Number 5 in Figure 7-5shows the area between the antenna and the ground. Figure 7-6 shows the clearance if this area. Figure 7-6 Clearance around the antenna For more details, refer to the antenna manufacturers’ product documents. On the PCB, keep the RF signals and RF components away from high-speed circuits, power supplies, transformers, great inductors, the clock circuit of single-chip host, etc. Copyright © Neoway Technology Co., Ltd 56 Neo_AM8X2 Smart Module Hardware User Guide 7.3 GPS RF Design and PCB Layout 7.3.1 GPS Impedance The 77th pin is the GPS interface of the module, which also requires a 50 Ω¸.The PCB layout for GPS is similar to that for GPRS. For details, refer to the previous section. Figure 7-7 shows the internal structure of the GPS RF. Figure 7-7 GPS RF structure In addition to the basic rules, the GPS routing has higher requirements because the air wireless GPS signal has lower strength, which results in weaker electrical signal after the antenna receives. Weaker signals are more susceptible to interference. Therefore, active antenna are commonly used for GPS. The active GPS antenna amplifies the weak signals received to stronger signals through the low-noise amplifier (LNA) and then transmits the signals through the feeder. If the antenna and layout are not designed reasonably, the GPS will be insensitive, resulting in long time on positioning or inaccurate position. Keep the GPRS and GPS far away from each other in layout and antenna layout. 7.3.2 Active GPS Antenna Design Ceramic GPS chip antenna are commonly used. In general, it is recommended that you use the active ceramic antenna. After the antenna receives GPS satellite signals, the LNA amplifies them first and then they are transmitted to the 74th pin (ANT_GPS) through the feeder and PCB traces. 50Ω¸resistance is required for both the feeder and PCB traces and the traces should be as short as possible. The power supply of the active antenna is fed by the 100 nH inductance through the signal traces. Common active antenna requires 3.3V to 5V power supply. Though the active antenna has a low power consumption, it requires stable and clean power supply. You are advised to use high-performance LDO to supply power for the antenna through a 100 nH inductance, as shown in Power supply reference for active antenna Figure 7-8. Copyright © Neoway Technology Co., Ltd 57 Neo_AM8X2 Smart Module Hardware User Guide Figure 7-8 Power supply reference for active antenna 50Ω impedance line 33pF AM8X2 LNA Active Antenna PWR_input 100nH LDO 22uF 33pF You need to add coupling capacitors if you use the active antenna because no coupling capacitor is designed for 77th pin (GPS_ANT) inside the module. 7.3.3 Passive GPS Antenna Design If you use a multiple-layer PCB and are experienced in RF design, use a passive ceramic ship antenna or other types of GPS antenna design. This method might reduce the BOM cost but require high skills to produce a reliable working board. Figure 7-9 shows a reference design of the passive GPS circuit (the 33 pF capacitor can be omitted). Figure 7-9 Passive GPS Antenna Design LNA 50Ω impedance line 33pF AM8X2 Passive Antenna Copyright © Neoway Technology Co., Ltd 58 Neo_AM8X2 Smart Module Hardware User Guide It is recommended that you add an ESD protection diode to the antenna interface in an environment with great electromagnetic interference and other applications with badly ESD. The ESD protection diode must have ultra-low capacitance (lower than 0.5 pF). Otherwise, it will affect the impedance of the RF loop or result in attenuation of RF signals. RCLAMP0521P from Semtech or ESD5V3U1U from Infineon is recommended. On the PCB, keep the RF signals and RF components away from high-speed circuits, power supplies, transformers, great inductors, the clock circuit of single-chip host, etc. 7.4 FM RF Design and PCB Layout FM antenna has been matched inside the module. Connect the FM antenna pin to the FM antenna through a 50Ω RF impedance line. For the antenna layout, refer to the design manual of the component. FM signal can be received through the headphone cable, which is used as the FM antenna. Connect the FM antenna to the headphone GND pin. Figure 7-10 shows the reference design of the headphone circuit that supports FM function. Figure 7-10 Reference design of the headphone circuit with FM function 1000Ω±25%（@100MHz） PESD5V0S1B L HEADSETMIC_P 33pF Headphone connector 1 3 4 1000Ω±25%（@100MHz） CDC_HPH_R CDC_HPH_L V AVL-5.5V-100PF 5 2 V AVL-5.5V-100PF 1000Ω±25%（@100MHz） 10K 10K 470pF 470pF 1000Ω±25%（@100MHz） CDC_HS_DET FM_HEADSET 4700pF CDC_HPH_REF V 1000Ω±25%（@100MHz） Copyright © Neoway Technology Co., Ltd DNI-33pF AVL-5.5V-100PF 1000Ω±25%（@100MHz） 59 Neo_AM8X2 Smart Module Hardware User Guide 8 Commissioning Interface Commissioning interface is reserved to facilitate design commissioning and software update. The following commissioning interfaces are mandatory for using the AM8X2. 8.1 Commissioning Log Print Interface UART port is usually used to print commissioning log and is a common interface in commissioning. After connecting the following UART pins to a level shifter, you can print the commissioning log through the COM port on a computer. Table 8-1 Commissioning UART Pin Signal I/O Function Remarks 79 BLSP O UART1_TX//Commissioning UART 80 BLSP I UART1_RX//Commissioning UART 8.2 FORCE_USB_BOOT Interface You can make the module enter the fastboot mode by short connecting the FORCE_USB_BOOT pin and VREG_L6_1P8V during the startup. Then you can download and update the module software through the USB port. This is the last method to troubleshoot the abnormality that the module cannot start or operation properly. Table 8-2 Fastboot (Enable) Pin Signal I/O Function Remarks 191 VDEBUG_1P8V PWR Power supply 199 FORCE_USB_BOOT I Fastboot interface (enable) Figure 8-1 Reference design of the fastboot interface S1 VREG_L16_1P8V FORCE_USB_BOOT 8.3 ADB Commissioning and Program Download & Update Interface USB interface is the most common commissioning interface, which is used for ADB commissioning, program download & update, etc. Table 8-3 USB commissioning interface, program download & update interface Pin Signal I/O Function 7 VCC_USBIN PWR USB Power Copyright © Neoway Technology Co., Ltd Remarks 60 Neo_AM8X2 Smart Module Hardware User Guide 188 VCC_USBIN PWR USB Power 10 USB_DP I/O USB data 11 USB_DM I/O USB data 200 USB_ID I USB_ID, Device detection, external interrupt GND 8.4 JTAG Interface JTAG interface is used to erase the program if the program encounter abnormalities during software commissioning, update, and download and FORCE_USB_BOOT cannot be used to enter the emergency download mode. Table 8-4 JTAG interface Pin Signal Function 191 VDEBUG_1P8V Reference voltage 192 JTAG_TDO Testing data output 193 JTAG_TDI Testing data input 194 JTAG_TMS Test mode selection 195 JTAG_TCK Test clock input 196 JTAG_TRST_N Test reset 197 JTAG_SRST_N System reset 198 JTAG_PS_HOLD Hold Copyright © Neoway Technology Co., Ltd 61 Neo_AM8X2 Smart Module Hardware User Guide Figure 8-2 Reference design of JTAG commissioning interface Copyright © Neoway Technology Co., Ltd 62 Neo_AM8X2 Smart Module Hardware User Guide 9 Electric Features and Reliability 9.1 Electric Feature Table 9-1 Electric feature of AM8X2 Parameter Minimum Value Typical Value Maximum Value VBAT Vin 3.5V 3.9V 4.2V Iin / / 4A If the voltage is too low, the module might fail to start. If the voltage is too high or there is a voltage burst during the startup, the module might be damaged permanently. If you use LDO or DC-DC to supply power for the module, ensure that it output at least 2 A current. 9.2 Temperature Table 9-2 AM8X2 temperature feature Module Status Minimum Value Typical Value Maximum Value Working -40℃ 25℃ 85℃ Storage -45℃ 90℃ If the module works in temperature exceeding the thresholds, its RF performance (e.g. frequency deviation or phase deviation) might be worse but it can still work properly. 9.3 Current Table 9-3 Current feature Parameter Testing Conditions Testing Result (Average Current) Testing voltage 3.9 V Agilent power supply / Idle mode Set the instrument and power on the module. 4.6 Off leakage Power on the module or use AT command to shut the 0.036 Copyright © Neoway Technology Co., Ltd 63 Neo_AM8X2 Smart Module Hardware User Guide current Voice service module down. Maximum power level in full rate mode GSM850 167.00 EGSM900 150.00 DCS1800 144.00 PCS1900 152.00 WCDMA2100 359.00 The results were obtained in a three-minute test after the screen turned off 1.6 Current in typical mode Flight mode Single SIM card Dual-SIM card FM play Camera Data service Bluetooth WiFi WIFI hotspot 2.2 Played through the headphone 57.0 Played through the speaker 61.7 Preview mode of the rear camera Brightest, the rear camera entering the preview mode 514.0 Rear camera taking photo Brightest, flash on, fixed 649.0 Rear camera taking photo Brightest, flash off, fixed 625.0 Preview mode of the rear camera Brightest, the rear camera entering the preview mode 537.0 2G download Use EGPRS to download 127.0 3G download Use HSDPA to download 167.0 Enable the Bluetooth Enable the Bluetooth 9.7 Connecting to another phone Connecting to another phone through the Bluetooth 12.7 Data transferring through the Bluetooth with the screen off Connecting to another phone and transferring data 118.0 Call through the Bluetooth Use the Bluetooth to make a call 91.2 Enable the WIFI Enable the WiFi 8.7 Connecting to WiFi, sleep mode Connecting to the WiFi, set the WiFi, screen off, sleep mode 17.6 Download data when the screen off Use the WiFi to download data 147.5 Enable Enable the WiFi hotspot 76.0 Copyright © Neoway Technology Co., Ltd 64 Neo_AM8X2 Smart Module Hardware User Guide Another phone connecting to the hotspot and downloading data Another phone connecting to the hotspot and downloading data 175.0 Played through the speaker Playing pink noise through the speaker, maximum volume 54.0 Played through the headphone Playing pink noise through the headphone 50.0 Played through the speaker Brightest, maximum volume, through the speaker 393.0 Played through the headphone Brightest, maximum volume, through the headphone 331.0 Record Recording Brightest, recording 300.0 Flashlight VBAT=3.6V 3.6V, flashlight on 72.0 VBAT=4.2V 4.2V, flashlight on 81.0 Alarm clock Alarm clock working Brightest, alarm clock on 476.0 GPS Enable GPS Enable GPS 8.9 Motor vibration Brightest, vibrating for 1 second, stop for one second 298 Touchscreen wor king Brightest, standby screen, continuously tapping the screen 340 Music Video The data in the above table is typical values obtained during tests in lab. It might be a little bit different in manufacturing. Also, the test results might be various due to different settings or testing methods. 9.4 ESD Protection Electronics need to pass sever ESD tests. The following table shows the ESD capability of key pins of our module. It is recommended that you add ESD protection to those pins in accordance to the application to ensure your product quality when designing your products. Humility: 45% Temperature: 25℃ Table 9-4 AM8X2 ESD feature Testing Point Contact Discharge Air Discharge VBAT ±8KV ±15KV GND ±8KV ±15KV ANT ±8KV ±15KV Copyright © Neoway Technology Co., Ltd 65 Neo_AM8X2 Smart Module Hardware User Guide Cover ±8KV ±15KV USB ±4KV ±8KV MIC/SPK/REC/RAR ±4KV ±8KV Others ±4KV ±8KV Copyright © Neoway Technology Co., Ltd 66 Neo_AM8X2 Smart Module Hardware User Guide 10 RF Features 10.1 Work Band Table 10-1 AM8X2 work band Work Band Uplink Downlink GSM850 824~849MHz 869~894MHz EGSM900 880~915MHz 925~960MHz DCS1800 1710~1785MHz 1805~1880MHz PCS1900 1850~1910MHz 1930~1990MHz WCDMA2100 1920~1980MHz 2110~2170MHz 10.2 TX Power and RX Sensitivity Table 10-2 AM8X2 RF power and RX sensitivity Band TX Power RX Sensitivity GSM850 32.5dBm ±2dBm <-107dBm EGSM900 30.2dBm ±2dBm <-107dBm DCS1800 32.5dBm ±2dBm <-107dBm PCS1900 30.2dBm ±2dBm <-107dBm WCDMA2100 22.6dBm ±1dBm <-107dBm The data in the above tables is obtained by connecting the module to RF test instrument (e.g. CMU200, CWM500, or Agilent8960) in lab tests. It is for reference only. Copyright © Neoway Technology Co., Ltd 67 Neo_AM8X2 Smart Module Hardware User Guide 11 Mounting the Module onto the Application Board AM8X2 is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is process dependent, so the following recommendation is just a start point guideline:  Only one flow is supported.  Quality of the solder joint depends on the solder volume. Minimum of 0.15mm stencil thickness is recommended.  Use bigger aperture size of the stencil than actual pad size.  Use a low-residue, no-clean type solder paste. AM8X2 is big and use multi-layer HDI board so that it is difficult to solder. For information about cautions in AM8X2 storage and mounting, refer to Neo_AM8X2 Smart Module Usage Cautions and Manufacturing Recommendations. When you maintain and manually solder it, use two heat guns with great opening, adjust the temperature to 250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is melt. The remove the module using tweezers. Do not shake the module in high temperature when you remove it. Otherwise, the components inside the module might be misplaced. 12 Package AM8X2 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules again in case of opening for any reasons. If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%, the baking procedure is also required. The baking should last for at least 12 hours at 90℃. Do not bake modules with the package tray directly. Copyright © Neoway Technology Co., Ltd 68 Neo_AM8X2 Smart Module Hardware User Guide 13 Abbreviations ADC Analog-Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control AMR Acknowledged multirate (speech coder) CSD Circuit Switched Data CPU Central Processing Unit DAI Digital Audio interface DAC Digital-to-Analog Converter DCE Data Communication Equipment DSP Digital Signal Processor DTE Data Terminal Equipment DTMF Dual Tone Multi-Frequency DTR Data Terminal Ready EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Electro Magnetic Interference ESD Electronic Static Discharge ETS European Telecommunication Standard FDMA Frequency Division Multiple Access FR Full Rate GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate IC Integrated Circuit IMEI International Mobile Equipment Identity LCD Liquid Crystal Display LED Light Emitting Diode MS Mobile Station PCB Printed Circuit Board PCS Personal Communication System Copyright © Neoway Technology Co., Ltd 69 Neo_AM8X2 Smart Module Hardware User Guide RAM Random Access Memory RF Radio Frequency ROM Read-only Memory RMS Root Mean Square RTC Real Time Clock SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory TA Terminal adapter TDMA Time Division Multiple Access UART Universal asynchronous receiver-transmitter USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Copyright © Neoway Technology Co., Ltd 70

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