Transcript
CPC1150N
Single-Pole, Normally Closed 4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max)
Rating 350 120 50
Units VP mArms / mADC
Description The CPC1150N is a miniature single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Its optically coupled output, which uses the patented OptoMOS architecture, is controlled by a highly efficient GaAIAs infrared LED.
Features • 1500Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Small 4-Pin SOP Package • Machine Insertable, Wave Solderable • Tape & Reel Version Available
State of the art double-molded vertical construction packaging enables the CPC1150N to be one of the world’s smallest 4-pin solid state relays. It offers board space savings over the competitor’s larger 4-pin SOP relay.
Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls
Approvals • UL 1577 Approved Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN 60950 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC1150N CPC1150NTR
Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel)
Pin Configuration + Control
– Control
1
4
3
2
Load
Load
Switching Characteristics of Normally Closed Devices Form-B IF ILOAD
90% 10% toff
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INTEGRATED CIRCUITS DIVISION
CPC1150N
Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1
Ratings 350 5 50 1 70 400 1500 -40 to +85 -40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
Units VP V mA A mW mW Vrms °C °C
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2
2
Conditions
Symbol
Min
Typ
Max
Units
t =10ms IL=120mA IF=2mA , VL=350VP
IL ILPK RON ILEAK
-
-
120 ±350 50 5
mArms / mADC mAP µA
IF=2mA, VL=50V, f=1MHz
ton toff COUT
-
25
1 2 -
IL=120mA IF=5mA VR=5V
IF IF VF IR
0.3 0.9 -
0.6 0.55 1.2 -
2 1.4 10
mA mA V µA
1
-
pF
IF=5mA, VL=10V
CI/O Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC. For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended.
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ms pF
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INTEGRATED CIRCUITS DIVISION
CPC1150N
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
25 20 15 10 5 0
20
20
15 10 5
1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V)
Typical IF for Switch Operation (N=50, IL=90mA)
20
25
15 10 5
0.22
0.23
0.24
0.25
0.26
0.45
0.50
0.55 0.60 0.65 0.70 LED Current (mA)
5
0.50
0.60
0.70
0.80
0.90
1.00
1.10
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Dropout (N=50, IL=90mA)
Typical On-Resistance Distribution (N=50, IL=90mA)
35 30
20 15 10 5
25 20 15 10 5 0
0.45
0.75
10
0.27
0
0
15
0 0.21
Device Count (N)
Device Count (N)
25
0 1.17
25
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Typical Turn-Off Time (N=50, IF=5mA, IL=90mA)
Device Count (N)
35
Typical Turn-On Time (N=50, IL=90mA, IF=5mA)
Typical LED Forward Voltage Drop (N=50, IF=5mA)
0.50
0.55 0.60 0.65 0.70 LED Current (mA)
0.75
38.5
39
39.5
40
40.5
41
41.5
On-Resistance (:)
Typical Blocking Voltage Distribution (N=50) 35
Device Count (N)
30 25 20 15 10 5 0 377.5 388.5 399.5 410.5 421.5 432.5 443.5 Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09
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INTEGRATED CIRCUITS DIVISION
CPC1150N
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical Turn-On Time vs. LED Forward Current (IL=100mA)
0.7
1.8 1.6 1.4
IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA
1.2 1.0
0.5 0.4 0.3 0.2 0.1 0
0
20 40 60 80 Temperature (ºC)
100
0
120
Typical IF for Switch Operation vs. Temperature (IL=50mA)
3.0
Turn-On Time (ms)
2.0 1.5 1.0 0.5 0 -40
-20
0
20 40 60 Temperature (ºC)
80
100
150 Load Current (mA)
50 On-Resistance (:)
15
20
25
30
35
40
45
40 30 20 10
50
0
10 15 20 25 30 35 40 LED Forward Current (mA)
Typical Turn-On Time vs. Temperature (IL=50mA)
Typical Turn-Off Time vs. Temperature (IL=50mA)
IF=5mA 0
20
40
60
80
100
Typical Load Current vs. Load Voltage (IF=0mA)
0 0
20
40
60
80
50 0 -50
100
-2
0
2
4
Load Voltage (V)
Typical Blocking Voltage vs. Temperature
Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=350V)
0.014
420
0.012
Leakage (µA)
425
415 410 405
20
40
60
Temperature (ºC)
0
80
100
20 40 60 Temperature (ºC)
80
100
100
120
Maximum Load Current vs. Temperature (IF=0mA)
120 100 80 60 40
0.010 0.008 0.006
0 -40
-40
-20
0
20 40 60 Temperature (ºC)
80
-20
0
20 40 60 80 Temperature (ºC)
Energy Rating Curve
0.002
395 0
-20
140
6
0.004
400 -20
IF=10mA
0 -4
Temperature (ºC)
0.016
-40
IF=5mA
20 -6
430
50
45
160
100
-150 -20
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40
5
180
-100 -40
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0
LED Forward Current (mA)
IF=10mA
-20
Typical Turn-Off Time vs. LED Forward Current (IL=100mA)
Temperature (ºC)
Typical On-Resistance vs. Temperature (IF=0mA, IL=Max Rated)
60
10
Load Current (A)
LED Current (mA)
2.5
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40
5
Load Current (mA)
-20
Turn-Off Time (ms)
0.8 -40
Blocking Voltage (VP)
Turn-Off Time (ms)
0.6 Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop vs. Temperature
100
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC1150N
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device
Moisture Sensitivity Level (MSL) Rating
CPC1150N
MSL 3
ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device
Maximum Temperature x Time
CPC1150N
260ºC for 30 seconds
Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1150N Mechanical Dimensions
CPC1150N 4.089 ± 0.203 (0.161 ± 0.008)
Recommended PCB Land Pattern 0.200 ± 0.025 (0.008 ± 0.001)
0.60 (0.0217)
6.096 ± 0.102 (0.240 ± 0.004)
3.810 ± 0.076 (0.150 ± 0.003)
0.432 ± 0.127 (0.017 ± 0.005)
5.60 (0.2205)
1.02 ± 0.025 (0.040 ± 0.001)
Pin 1 2.54 Typ (0.100 Typ)
1.30 (0.0512)
2.184 Max (0.086 Max)
2.54 (0.10) Lead to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015)
0.762 ± 0.102 (0.030 ± 0.004)
Dimensions mm (inches)
0.381 TYP. (0.015 TYP.)
CPC1150NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max)
W=12.00 (0.472)
B0=4.70 (0.185)
K0=2.70 (0.106) K1=2.30 (0.091)
P=8.00 (0.315)
A0=6.50 (0.256)
User Direction of Feed Dimensions mm (inches)
Embossed Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC1150N-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012
