Transcript
TO-3535XWNQ -350 Surface Mount Device LED Chip Lens Color
Part Number TO-3535XWNQ-350
Material
Source Color
InGaN
Ultra White
Yellow Diffused
Features ● PLCC-2 Package. ● Extremely wide viewing angle ●Suitable for all SMT assembly and solder process ● Available on tape and reel ● Moisture sensitivity level:Level 4 ● RoHS compliant.
Description ●The White LED which was fabricated using a blue chip and the phosphor
Applications ● Channel letter ● Portable lighting ● Decorative lighting ●Backlighting of full color LCD ●OA equipment ●Bulbs and fluorescent lamps
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 1/10
Dimensions
Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.1mm unless otherwise noted.
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 2/10
Absolute Maximum Rating @ Ta=25°C Parameter
Maximum Rating
Unit
Power Dissipation
3000
mW
Continuous Forward Current
780
mA
Electrostatic Discharge(HBM)
8000
V
Operating Temperature Range
-40°C to +80°C
Storage Temperature Range
-40°C to +100°C
IR Reflow Soldering Profile For Lead Free Soldering
260°C
Electrical / Optical Characteristic @ Ta=25°C Parameter
Symbol
Min.
Total Flux
ΦV
135
Viewing Angle
2θ1/2
Forward Voltage
IR
Color Temperature
Tc
Color Rendering Index
CRI
Max.
Unit
Test Condition
150
lm
IF=150mA
deg
IF=150mA
V
IF=150mA
uA
Vr=5V
K
IF=150mA
Ra
IF=150mA
120
VF
Back leakage current
Typ.
2.8
3.2 --
10
70
Bin Code List for Reference Forward voltage
VF
Min.(V)
Max.(V)
A
2.8
3.0
B
3.0
3.2
Luminous flux
Ф
Min.(Lm)
Max.(Lm)
ED
135
150
E4
140
150
Tolerance of Luminous Intensity on each bin is ±11％ Tolerance for each Forward Voltage Bin is ±0.05V
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 3/10
Color Bins
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 4/10
Typical Electrical / Optical Character Curves
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 5/10
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 6/10
Package Description
Notes: 1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted. 2.Specifications are subject to change without notice.
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 7/10
Reliability Test Items and Condition Testing items
Testing conditions
Test Hours/Cycles
Sample Qty’
Ac/Re
3 times
50pcs
0/1
1 times
50pcs
0/1
260℃,10sec,2Reflows Reflow soldering Precondition:30℃,70%RH,168h Solderability
Tsld=245℃+5℃,5sec,
(Reflow Soldering)
Lead-free Solder(Sn-3.0Ag-0.5Cu)
DC Operating Life
IF=150mA(Ta=25℃)
1000 hours
50pcs
0/1
HighTemperature Storage
100℃
1000 hours
50pcs
0/1
LowTemperature Storage
-35℃
1000 hours
50pcs
0/1
Temperature cycle
-35℃(30min)~25℃(5min)~100℃ (30min)~25℃(5min)
100 cycles
50pcs
0℃ to 100℃,15sec dwell
100 cycles
50pcs
0/1
85℃/85%RH
1000hours
50pcs
0/1
Thermal shock
High Temperature/ High Humudity
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
0/1 0/1
Doc No :GS1512007
Page 8/10
Storage conditions Package:Each reel (4000pcs) will be packed into an individual antistatic bag. Related model No. andproducts’ number will be marked on the label.
Before opening the package:The LEDs can be preserved for 1 year in condition of temperature no more than 30℃ and humidity no more than 80%RH. The LEDs should be advised to be kept in dampproof bags with desiccants.
After opening the package:The SMD LEDs should be run out with 24hours in condition of temperature no more than 30℃ and humidity no more than 70%RH. The rest products should be pressurized in vacuum condition with desiccants.
Recommend reflow soldering profile Surface mounting condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.
Soldering reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for reflow soldering. -In the reflow soldering, too high temperature and
too large temperature gradient such as rapid
heating/cooling may cause electrical & optical failures and damages of the devices. -Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method.
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
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＊ Lead solder
＊ Lead-free solder
Manual soldering. - Lead solder Max. 300℃ for max. 3sec, and only one time. - Lead-free solder Max. 350℃ for max. 3sec, and only one time. - There is possibility that the brightness of LEDs
is decreased, which is influenced by heat or ambient
atmosphere during reflow. It is recommended to use
the nitrogen reflow method use the nitrogen reflow
method. - After LEDs have been soldered, repairs should not be done. As repairs is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. -Reflow soldering should not be done more than two times.
REV.: A-1 Notes:
Prepared byD.O.Luo(22907) Released Date: 2015/12/01 Above specification may be changed without notice.
Doc No :GS1512007
Page 10/10
