Transcript
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP36 EP CASE 940AB ISSUE A DATE 19 JAN 2016
SCALE 1:1 0.20 C A-B
D
DETAIL B
A 36
X
19
X = A or B
E1
ÉÉÉ ÉÉÉ ÉÉÉ
PIN 1 REFERENCE
1
e/2
E DETAIL B 36X
0.25 C 18
e
36X
B
b 0.25
M
T A
S
B
S
NOTE 6
TOP VIEW A
H
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE b DIMENSION AT MMC. 4. DIMENSION b SHALL BE MEASURED BETWEEN 0.10 AND 0.25 FROM THE TIP. 5. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. DIMENSIONS D AND E1 SHALL BE DETERMINED AT DATUM H. 6. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, A PIN ONE IDENTIFIER MUST BE LOACATED WITHIN THE INDICATED AREA.
D
4X
h
A2
DETAIL A
c h 0.10 C 36X
A1
SIDE VIEW
SEATING PLANE
C
END VIEW
D2 M1
DIM A A1 A2 b c D D2 E E1 E2 e h L L2 M M1
MILLIMETERS MIN MAX --2.65 --0.10 2.15 2.60 0.18 0.30 0.23 0.32 10.30 BSC 5.70 5.90 10.30 BSC 7.50 BSC 3.90 4.10 0.50 BSC 0.25 0.75 0.50 0.90 0.25 BSC 0_ 8_ 5_ 15 _
GENERIC MARKING DIAGRAM* M
GAUGE PLANE
E2 L2
C
SEATING PLANE
36X
XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX AWLYYWWG
L
DETAIL A BOTTOM VIEW
SOLDERING FOOTPRINT 5.90
36X
1.06
4.10
10.76
XXXX A WL YY WW G
= Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
1 0.50 PITCH
36X
0.36
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER: STATUS:
98AON46215E ON SEMICONDUCTOR STANDARD 1
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION: 2002 − Rev. 0
http://onsemi.com SSOP36 EXPOSED PAD 1
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2
DOCUMENT NUMBER: 98AON46215E PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. LETTERMAN.
05 NOV 2009
A
MODIFIED DIMENSION A2 MIN VALUE AND DIMENSION B MAX VALUE. REQ. BY B. MARQUIS.
19 JAN 2016
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. A
Case Outline Number: 940AB
