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GRUNDTECHNICALS OLUTIONS
Genus Probe Card and Matrix System Genus Wafer Level Testing Automate ESD and TLP Probing Genus is a Probe Card with an integrated Switching Matrix for Automated Wafer Level Device Testing on semi-automatic probe stations. Genus Probing uses “quick change” replaceable probe needle core assemblies for flexibility in pad arrangement and probe material. Genus can combine ESD pulse testing with DC and AC parametric testing using switching matrices. This allows stress testing followed by evaluation of DUT for damage. As simple leakage is not always a complete test for damage, Genus provides 50 Ω traces for AC testing using equipment such as Vector Network Analyzers. The user can change and expand relay configurations with a variety of relay daughter boards with different “personalities”. Specialized daughter boards for HBM, TLP, signal grounding and matched termination. Optional Maestro Software is available to control the relay matrix and coordinate prober stepping with stress and measurement equipment. The GTS Olympus controller can run Maestro software or a PC with USB and GTS drivers can also be used.
Genus Advantages Automate HBM, MM, TLP, and Latch-up testing Full compliance ESD testing (HBM to 4kV and/or MM to 400V) TLP and Latch-up using various pulse sources
Customizable Probe Cards for semi-automatic probe
stations Mother-Daughter board configuration provides flexible setups Mother board custom for your probe stations
Integrated high frequency Relay Switching Matrix Automatic switching of pulse and ground needles Configuration flexibility using stackable daughter boards 1 GHz 50 Ω signal paths for maintaining pulse quality
Combine ESD with DC and high frequency Parametric
Testing Needles are not lifted when switching between stress pulsing and device damage testing Extend capabilities of conventional leakage measurement with biased leakage measurements and curve tracing Use 8 channel DC parameter analyzer Use HF testers such as VNA, PIV, CV and HF CV using 50 ohm connection from tester to DUT Pulses from separate 50Ω pulsers applied to different pads Apply Bias voltages to sets of pins
Add Automation to ESD wafer level testing G R U N D T E C H N I C AL S O L U T I O N S
[email protected] www.grundtech.com © 2012 Grund Technical Solutions, LLC All rights reserved Specifications and Prices subject to change
Replaceable probe needle assemblies can test
different structures Change probes for different pad-spaced test structures, different product pad layouts, scribe line elements, or TEG (Test Element Group) structures 200 MHz needles or 1 GHz 50 Ω blade or coaxial needles
Measurement capabilities Current and voltage pulse measurements 4 wire DC measurements separate Force and Sense probing Kelvin differential voltage pulse measurements
Genus Probe Card and Matrix System F L E X A B I L I T Y TO M E E T Y O U R M E A S U R E M E N T N E E D S G E N U S P R O B E C AR D S
C AN C O N N E C T A W I D E VAR I E T Y O F T E S T E Q U I P M E N T T O M E AS U R E Y O U R WAF E R D E V I C E S Personality Daughter Boards Plug-in for different test measurements, including: TLP HMM HBM Latch-up MM Transient LU Curve Trace Kelvin, 4-wire 16 to 50-Pad Replaceable Needle Card Assembly
DC Parametric Analyzer Low Frequency Relay Matrix
Genus Probe Card System
GTS HBM Pulse Generator
Source Meter Units
GTS 500 MHz Signal Matrix
Network Analyzer
Pulse Generator Semi-Automatic Probe Station
Oscilloscope Monitoring of Pulse Waveforms
SPECIFICATIONS Channel Configuration: Path Impedance Channel Bandwidth: Channel Leakage: Maximum Signal Voltage: Maximum Signal Current:
Up to 25 channels for 4 wire, or 50 single-ended channels 50 ohm Up to 1 GHz bandwidth to the DUT 100 pA from signal line to ground 25 V continuous; 500 V pulsed for TLP; 4 kV HBM applications 500 mA continuous; 10 A pulsed for TLP, HBM, MM and HMM
OPTIONS ESD: Measurement Capability: Custom Matrix Configurations:
HBM, MM, HMM TLP with GTS Olympus Controller and Pulsers Kelvin and quasi-Kelvin configurations Available upon request
Genus Probe Card Systems
The heart of a Precise, Flexible Wafer Testing Solution
Increase throughput: eliminates continual reconfiguration of 2-Probe Needle configuration Automated testing with Prober Stepping: little operator time required ESD testing on 16 to 50-pad patterns with any combination of pins possible www.grundtech.com
[email protected] © 2012 Grund Technical Solutions, LLC All rights reserved. Specifications and Prices subject to change
