Transcript
SKKD 701 THYRISTOR BRIDGE,SCR,BRIDGE
SEMIPACK®5
*+,-
*++-
* 1!22 1622 1<22
* 1#22 1 22 1722
#!22
##22
Symbol
Conditions
.($* .(,?
Rectifier Diode Modules SKKD 701
!"!#
Typical Applications* $%&$% 1)
.($* 0 621 $ 3 1728 9% 0 122 :%5 ,;;) 621&1# ,;;) 621&1 ,;;) 621&17 ,;;) 621&## =
Values
Units
1728 9 0 122 37"5 :%
621 37#25
$
9'> 0 #" :%8 12 9'> 0 1 2 :%8 12 9'> 0 #" :%8 7 ! 12
#"222 ##"22 !1#"222
$ $ $?
9'> 0 1 2 :%8 7 ! 12
#"!1#"2
$?
*( *39@5 9
9'> 0 #" :%8 .( 0 #222 $ 9'> 0 1 2 :% 9'> 0 1 2 :%
4 1 #" 4 2 6 4 2 #7
* * A
.+)
9'> 0 1 2 :%8 *+) 0 *++-
+ 3>B5
8 & 1728 & 1#28 & &
+ 3B 5 9'>
Features
.(+-, 0 1122 $ 34 ' 5
9 * * - -
"2 8 1 & 1 "2 8 1 & 1 ,;; = F
4
%
4 !2
$
2 2 < & 2 2!= 2 26# & 2 2! 2 266 & 2 2!7 2 2# & 2 21 B =2 D 1 2
;&C ;&C ;&C ;&C :%
B =2 D 1#"
:%
! 22 & !222 =722 & =222 " G 1" H15 1# G 1" H " J < 71
*E *E I I & ?
1=22
$ 6"
' $% ( )%
SKKD
1
18-03-2011 STM
© by SEMIKRON
RECTIFIER,DIODE,THYRISTOR,MODULE
Fig. 11L Power dissipation per diode vs. forward current
Fig. 11R Power dissipation per diode vs. ambient temperature
Fig. 12L Power dissipation of two modules vs. direct current
Fig. 12R Power dissipation of two modules vs. case temperature
Fig. 13L Power dissipation of three modules vs. direct current
Fig. 13R Power dissipation of three modules vs. case temperature
2
18-03-2011 STM
© by SEMIKRON
SKKD 701 THYRISTOR BRIDGE,SCR,BRIDGE
Fig. 14 Transient thermal impedance vs. time
Fig. 15 Forward characteristics
Fig. 16 Surge overload current vs. time
3
18-03-2011 STM
© by SEMIKRON
RECTIFIER,DIODE,THYRISTOR,MODULE Dimensions in mm
% $ 6" 3,;;)5
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
4
18-03-2011 STM
© by SEMIKRON
