Transcript
DATA SHEET
SKY65338-21: 450-470 MHz Transmit/Receive Front-End Module Applications
Description
x Tetra radio
Skyworks SKY65338-21 is a high-efficiency Front-End Module (FEM) that incorporates a transmit and receive path, and an antenna transmit/receive (T/R) switch.
x Remote metering x GSM
The transmit path consists of a high efficiency Power Amplifier (PA) followed by an harmonic filter for rejection of harmonic frequencies.
x WLL transmitters
The PA is implemented using Skyworks high reliability Heterojunction Bipolar Transistor (HBT) process and is Class AB biased to provide maximum efficiency with a low spurious output.
Features x Transmit output power > +25 dBm x High gain in transmit path: 32 dB
A high linearity and high isolation Single-Pole Double-Throw (SPDT) switch is used at the common antenna interface between the transmit and receive paths. The receive path is a low insertion loss through-path with input and output ports internally matched to 50 Ω.
x High transmit/receive isolation > 30 dB x Internal RF match and bias circuits x All RF ports internally DC blocked x Single DC supply = +3.6 V x Small footprint, MCM (12-pin, 8 x 8 mm) SMT package (MSL3, 260 qC per JEDEC J-STD-020) Skyworks offers lead (Pb)-free RoHS (Restriction of Hazardous Substances) compliant packaging.
Transmit Port
Receive Port
The device is mounted in a 12-pin, 8 x 8 mm Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low-cost solution. A block diagram of the SKY65338-21 is shown in Figure 1. The device package and pinout for the 12-pin MCM are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
SPDT Switch PA Harmonic Filter
Antenna Port
S1346
Figure 1. SKY65338-21 Block Diagram
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VCC1
PA_EN
VCC2
DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
12
11
10
V1
GND
2
8
V2
RX_OUT
3
7
ANT
4
5
6
VREF2
9
VREF1
1
VC_BIAS
TX_IN
S1347
Figure 2. SKY65338-21 Pinout – 12-Pin MCM (Top View)
Table 1. SKY65338-21 Signal Descriptions Pin # 1
Name TX_IN
Description
Pin #
Transmit RF input
7
Name ANT
Description Antenna
2
GND
Ground
8
V2
Switch logic (see Table 1)
3
RX_OUT
Receive RF output
9
V1
Switch logic (see Table 1)
4
VC_BIAS
+3.6 V DC supply
10
VCC2
+3.6 V DC supply
5
VREF1
+3.6 V DC supply
11
PA_EN
PA enable switch (On = 2.5-3.6 V; Off = 0-0.2 V)
6
VREF2
+3.6 V DC supply
12
VCC1
+3.6 V DC supply
Technical Description
Operational Modes
The SKY65338-21 provides input and output amplifier stages, and is internally matched for optimum efficiency. An active bias circuit provides the input and output stages with excellent gain tracking over temperature and voltage variations. The module operates with positive DC voltages, and maintains high efficiency and good linearity. The nominal operating voltage is 3.6 V for maximum power, but the device can be operated at slightly lower voltages for other mobile applications.
The module’s receive and transmit modes are configured using the V1 and V2 control signals (pins 9 and 8, respectively). The transmit path provides an harmonic filter and high efficiency PA. The receive path provides a low loss <1 dB bypass between the antenna port and the receive port.
The SKY65338-21 is internally matched for optimum linearity and efficiency. The input and output stages are independently supplied using the VCC1 and VCC2 supply lines (pins 12 and 10, respectively). The bias reference voltages for stages 1 and 2 are supplied using common lines VREF1 and VREF2 (pins 5 and 6, respectively). The DC control voltage that sets the bias for stages 1 and 2 is supplied by the VC_BIAS signal, pin 4.
The absolute maximum ratings of the SKY65338-21 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4.
Electrical and Mechanical Specifications
Typical performance characteristics of the SKY65338-21 are illustrated in Figures 3 through 10. The state of the SKY65338-21 is determiend by the logic provided in Table 5.
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Package and Handling Information
additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.
Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
The SKY65338-21 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 qC. It can be used for lead or lead-free soldering. For Table 2. SKY65338-21 Absolute Maximum Ratings (Note 1) Parameter
Symbol
Minimum
Maximum
Units
Supply voltage
VCC
4.4
V
Input power
PIN
+5
dBm
Supply current
ICC
800
mA
Case operating temperature
TC
–40
+85
qC
Storage temperature
TST
–65
+125
qC
Junction temperature
TJ
150
qC
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65338-21 Recommended Operating Conditions Parameter
Symbol
Minimum
Typical
Maximum
Units
Supply voltage
VCC1, VCC2, VREF1, VREF2, VC_BIAS
3.0
3.6
4.0
V
Case operating temperature
TC
–40
+85
qC
Storage temperature
TST
–55
+125
qC
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Table 4. SKY65338-21 Electrical Specifications (Note 1) (Frequency = 460 MHz, VCC1 = VCC2 = VREF1 = VREF2 = VC_BIAS = 3.6 V, TC = +25 °C, Unless Otherwise Noted) Parameter
Symbol
Test Condition
Min
Typical
450
Max
Units
470
MHz
Operating frequency range
f
Transmit path small signal gain
G
CW, PIN = –30 dBm
30
32
dB
Transmit saturated output power
PSAT
CW, PIN = –4 dBm
+25
+27
dBm
Transmit path Noise Figure
NF
Transmit path harmonics (2nd to 10th)
Pf2 to Pf10
CW, POUT = +25 dBm
55
5.5
Power Added Efficiency
PAE
CW, POUT = +27 dBm
30
Receive path insertion loss
RX_LOSS
Transmit/receive path isolation
ISOL
6.5
36
%
0.6 CW
dB dBc
27
1.0
dB
30
dB
Input return loss
S11
15
19
dB
Output return loss
S22
9
14
dB
Quiescent current
IQ
No RF
45
55
mA
Operating current
IOP
POUT = +25 dBm
315
350
mA
Leakage current
ILEAK
No RF input, module in standby mode
Maximum VSWR for stable operation
VSWRMAX
CW
μA
2 8:1
–
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated temperatures may reduce reliability of the device.
40
30
550
28
500
35
26
450
30
24
400
22
350
20
300
18
250
16
200
Output Power, POUT Operating Current, IOP
14 12 10 –20
150
–16
–14
–12
–10
–8
–6
–4
–2
0
20 15 10 5
100 50
–18
25
PAE (%)
Operating Current (mA)
POUT (dBm)
Typical Performance Characteristics (VCC = 3.6 V, Tc = 25 °C, Unless Otherwise Noted)
+2
PIN (dBm)
Figure 3. Output Power and Operating Current vs Input Power Voltage
0 +10
+12
+14
+16
+18
+20
+22
+24
+28
Figure 4. Power-Added Efficiency vs Output Power
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+26
POUT (dBm)
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+30
DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
34
34
32
32 30
Gain (dB)
Gain (dB)
30
28
–40 °C +25 °C +85 °C
26
24
28
2.8 V 3.0 V 3.6 V 4.0 V
26 24 22
22 +10
+12
+14
+16
+18
+20
+22
+24
+26
+28
20 +10
+30
+12
+14
+16
+18
+20
POUT (dBm)
+22
+24
+26
+28
+30
POUT (dBm)
Figure 5. Gain vs Output Power Over Temperature
Figure 6. Gain vs Output Power Over Supply Voltage
600 32.0
500 31.5
–40 °C +25 °C +85 °C
31.0
30.5
Operating Current (mA)
Transmit Path Small Signal Gain (dB)
32.5
400
300
200
–40 °C +25 °C +85 °C
100
30.0
0 +10
29.5 450
460
470
+12
+14
+16
+18
+20
+22
+24
+26
+28
+30
POUT (dBm)
Frequency (MHz)
Figure 8. Operating Current vs Output Power Over Temperature
Figure 7. Gain vs Frequency Over Temperature
0.62
100
Receive Path Insertion Loss (dB)
Harmonics Suppression (dBc)
95 90 85 80 75 70 65 60
0.60
0.58
–40 °C +25 °C +85 °C
0.56
0.54
0.52
55
0.50
50 F2
F3
F4
F5
F6
F7
Harmonic Order
Figure 9. Harmonics
F8
F9
F10
450
460
470
Frequency (MHz)
Figure 10. Receive Insertion Loss vs Frequency Over Temperature
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Table 5. SKY65338-21 SPDT Switch Control Logic Mode
V1 Signal (Pin 9)
V2 Signal (Pin 8)
Transmit
1
0
Receive
0
1
Note:
Logic level 0: 0 V to 0.2 V Logic level 1: 2.0 V to 5.0 V
Evaluation Board Description The SKY65338-21 Evaluation Board is used to test the performance of the SKY65338-21 FEM. The Evaluation Board schematic diagram is shown in Figure 11. An assembly drawing for the Evaluation Board is shown in Figure 12 and the layer detail is provided in Figure 13. The layer detail physical characteristics are noted in Figure 14. Table 6 provides the Bill of Materials (BOM) list for Evaluation Board components.
acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device.
Circuit Design Considerations The following design considerations are general in nature and must be followed regadless of final use or configuration:
Package Dimensions The phone board layout footprint for the SKY65338-21 is shown in Figure 15. Package dimensions for the 12-pin MCM are shown in Figure 16, and tape and reel dimensions are provided in Figure 17.
1. Paths to ground should be made as short as possible. 2. The ground pad of the SKY65338-21 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board
1
TX_IN
2
GND
50 Ω Transmission Line
Switch Logic (V2)
7
8
Voltage Reference 1
6
Voltage Reference 2
5
Switch Logic (V1)
4
PA Enable
DC Supply 1
Voltage Bias
DC Supply 2
PA Enable
3
9
10
VCC2
J2 SMA
11
PA_EN
DC Supply 1
VCC1
12
2
DC Supply 2
9-Header 1
V1
SKY65338
V2
9
8
Switch Logic
Switch Logic J4 SMA
Voltage Bias
VREF2
4
ANT
5
6
7 50 Ω Transmission Line
Voltage Reference 2
RX_OUT
VREF1
50 Ω Transmission Line
Voltage Reference 1
3
VC_BIAS
J3 SMA
S1348
Figure 11. SKY65338-21 Evaluation Board Schematic
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
S1520
Figure 12. SKY65338-21 Evaluation Board Assembly Drawing
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane S1349
Figure 13. SKY65338-21 Evaluation Board Layer Detail
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Cross Section
Name Thickness (mm) Material Tmask
0.010
Solder Resist
L1
0.035
Cu, 1 oz.
Dielectric
0.300
Rogers 4003
L2
0.035
Cu, 1 oz
Dielectric
0.100
FR4
L3
0.035
Cu, 1 oz
Dielectric
0.300
FR4
L4
0.035
Cu, 1 oz
Bmask
0.010
Solder resist S1366
Figure 14. Layer Detail Physical Characteristics
Table 6. SKY65338-21 Evaluation Board Bill of Materials Component J2, J3, J4
Quantity 3
Part Number 615R54-021
SC1, SC2, SC3, SC4
4
92196A052
Backframe
1
1056-101
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
8.685 Stencil aperture 60-80% of module/pkg solder mask area
2X 1.65
12X 0.81
12X 1.043
2X 1.91 CL
8.685
Component Outline
CL
Stencil Aperture Top View
8.685 6X 0.81
Pin 12 8.785
Pin 12
1.65 Typ
1.65
∅5.080 Solder
12X 1.143
Mask Opening
11X 1.043 Pin 1
Pin 1
12X 0.91
CL
CL
8.685
8.785
1.91 Typ
1.91 Typ
0.25
Thermal Via Array ∅0.3 mm on 1.0 mm pitch. Additional vias in common ground pad will improve thermal performance. NOTE: It is recommended that thermal vias should be filled with 30-35 μm Cu plating.
CL
Metallization Top View
CL
Component Outline
Solder Mask Opening Top View
S1357
All measurements are in millimeters
Figure 15. SKY65338-21 Phone Board Layout Footprint
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Component Outline
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8.385
6x 4.093
DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
B
Pin 1 Indicator
C
0.3 Solder Mask Opening 0.15 Metal Pad Pin 1 Indicator
(3.4) Pin 12
Top
(2.7)
0
8.385
Pin 1
A
4x 1.91
6x 4.093
0.05 A B C
0 0.1
12x SMT Pad
5.08 Solder Mask Opening
4x 1.65
A
1.35 ± 0.1
0.15 A B C
0.15 A B C
Side View
Top View 0.793 ± 0.1
Bottom View
(0.1) Metal Pad Edge 0.81 ± 0.05
Detail A 3x - This rotationo 3x - Rotated 180o 3x - Rotated 90o 3x - Rotated 90 Dimensioning and tolerancing according to ASME Y14.5M-1994. All measurements are in millimeters
S1354
Figure 16. SKY65338-21 12-Pin MCM Package Dimensions
12.00 ± 0.10 ∅1.50± 0.10 Pin #1
A
5o Max
8.88 ± 0.10
4.00 ± 0.10 2.00 ± 0.10
B
1.75 ± 0.10
A
7.50 ± 0.10
16.00 +0.30/–0.10
2.14 ± 0.10
B
B
∅1.50 ± 0.25
8o Max 8.89 ± 0.10
A Notes: 1. Carrier tape: black conductive poly carbonate or polystyrene. 2. Cover tape material: transparent conductive PSA. 3. Cover tape size: 13.3 mm width. 4. All measurements are in millimeters.
S1252
Figure 17. SKY65338-21 12-Pin MCM Tape and Reel Dimensions
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DATA SHEET • SKY65338-21 TRANSMIT/RECEIVE FRONT-END MODULE
Ordering Information Model Name SKY65338-21 450-470 MHz Front-End Module
Manufacturing Part Number SKY65338-21 (Pb-free package)
Evaluation Kit Part Number TW17-D315-003
Copyright © 2009 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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