Transcript
SOP FINEPLACER “PICO”
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By Ana Sanchez
Fine Pitch SMD/ Flip Chip Placement and Bonding Equipment System FINEPLACER SOP
SOP FINEPLACER “PICO” Index
System Start up ……………………………………………………………………...p.3 Settings……………………………………………………………….….........….......p.4 Loading Samples………………………………………………………………..........p.5&6 Bonding……………………………………………………………………………....p.6&7 Shutting Down……………………………………………………………………….p.8
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SOP FINEPLACER “PICO”
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SYSTEM START UP
Starting up the System: -Open lab air valve -Power on the Placer Control Box*(1) (switch power button to “Line” and switch Pipete mode button to “EXT”) -Power on the Chip Contact Heating Module Control Box and the Ultrasonic Module*(2) -Power on the Heating plate Control Box and the ACF Module*(3)
-Start up the Computer, log in without a password, and just click cancel on the logon window. Open the “WINFLIPCHIP” software (icon on desktop), you will be asked to open a file, open the recipe file for your bonding process. -You will be asked if you want to keep light values, say yes
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SETTINGS
Loading a chip sample to be bonded: -Clear the chuck*(4) area.
Look through the microscope, and locate the center of the chuck, go to a maximum magnification and focus on the center vacuum hole of the chuck by rotating the z-axis knob* (5) (this way you set up the chuck height).
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LOADING SAMPLES
-If collet is not on:
Take the aluminum block and situate it just below where the right pivot arm*(6) is going to rest when is lowered.
Lower the right pivot arm just about enough to insert the collet and let the collet rest on the chuck while you tighten the screw (the aluminum block should be supporting the
arm). Connect the vacuum line *(18) to collet
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LOADING SAMPLES & BONDING
Lift up the right-arm and remove the aluminum block from the chuck
-Place the top part of your chip sample face down at the center of the chuck.Place the aluminum block where the pivot arm is going to rest when is down.
-Lower the right pivot arm and the collet should almost touch the chip, loosen up the screw so the collet rests on the chip, lower the left pivot arm*(8), then tighten the screw securely. Turn on the vacuum by pressing the right pedal situated on the floor and your chip should be attached to the base of the collet.
-Raise the left pivot arm back up and also leave the right pivot arm in the raised position. -Look through the microscope and focus on the chip (which is on the collet). You should be able to see the pattern on it (if any). Note that you can switch views from the microscope to the PC screen, by using the switch*(9) on the left side of the microscope. However it is preferable to use the microscope view for alignment precision.
-Now you can place the bottom part of your chip at the center of the chuck, face up. Apply vacuum by clicking the vacuum button*(14) showing on the WINFLIPCHIP main screen.
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LOADING SAMPLES & BONDING
-Again you need to adjust the height of the chuck, according to the thickness of your bottom chip: Look through the microscope and you will see the reflection of both upper and bottom parts of your sample. To adjust the height move the zaxis knob until the bottom part of your chip image is in focus. -Do rough alignment by looking through the microscope and pressing the left pedal on the floor* while you rotate the chuck. Any rotation misalignment should be corrected when you do this step.
-After rotation, align the x and y-axis by adjusting the x-axis and y-axis knobs. -Once your sample features on the bottom part of the sample is aligned to the features on the upper part of your sample you are ready for bonding. -Bring the top sample down with the “right arm” -Move “left arm” down -Select your recipe and click on play*(15) button on the WINFLIPCHIP main screen. -When recipe is done processing, move “left arm” up -Turn collet vacuum off -Raise right arm -Turn off chuck vacuum to remove sample
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SHUTTING DOWN
-Start by exiting the WINFLIPCHIP -Shut down the computer -Remove collet from right pivot arm -Turn off the Heating plate Control Box and the ACF Module*(3) (You may need to hold down the right pivot arm while you turn off the switch -Turn off the Chip Contact Heating Module Control Box and the Ultrasonic Module*(2) -Turn off the Placer Control Box*(1)
