Preview only show first 10 pages with watermark. For full document please download

Starpower Igbt Gd400hft120c2s_g8

   EMBED


Share

Transcript

GD400HFT120C2S_G8 IGBT Module STARPOWER IGBT SEMICONDUCTOR GD400HFT120C2S_G8 1200V/400A 2 in one-package General Description STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as general inverters and UPS. Features        Low VCE(sat) Trench IGBT technology 10μs short circuit capability VCE(sat) with positive temperature coefficient Maximum junction temperature 175oC Low inductance case Fast & soft reverse recovery anti-parallel FWD Isolated copper baseplate using DBC technology Typical Applications    Inverter for motor drive AC and DC servo drive amplifier Uninterruptible power supply Equivalent Circuit Schematic ©2015 STARPOWER Semiconductor Ltd. 1/14/2015 1/9 RY0A GD400HFT120C2S_G8 IGBT Module Absolute Maximum Ratings TC=25oC unless otherwise noted IGBT Symbol VCES VGES IC ICM PD Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current @ TC=25oC @ TC=100oC Pulsed Collector Current tp=1ms Maximum Power Dissipation @ Tj=175oC Value 1200 ±30 630 400 800 2083 Unit V V Description Repetitive Peak Reverse Voltage Diode Continuous Forward Current Diode Maximum Forward Current tp=1ms Value 1200 400 800 Unit V A A Value 175 -40 to +150 -40 to +125 4000 Unit o C o C o C V A A W Diode Symbol VRRM IF IFM Module Symbol Tjmax Tjop TSTG VISO Description Maximum Junction Temperature Operating Junction Temperature Storage Temperature Range Isolation Voltage RMS,f=50Hz,t=1min ©2015 STARPOWER Semiconductor Ltd. 1/14/2015 2/9 RY0A GD400HFT120C2S_G8 IGBT Module IGBT Characteristics TC=25oC unless otherwise noted Symbol VCE(sat) VGE(th) ICES IGES RGint Cies Cres QG td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff ISC Parameter Collector to Emitter Saturation Voltage Gate-Emitter Threshold Voltage Collector Cut-Off Current Gate-Emitter Leakage Current Internal Gate Resistance Input Capacitance Reverse Transfer Capacitance Gate Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss SC Data Test Conditions IC=400A,VGE=15V, Tj=25oC IC=400A,VGE=15V, Tj=125oC IC=400A,VGE=15V, Tj=150oC IC=16.0mA,VCE=VGE, Tj=25oC VCE=VCES,VGE=0V, Tj=25oC VGE=VGES,VCE=0V, Tj=25oC Min. Max. 1.70 2.15 1.95 Unit V 2.00 5.0 VCE=30V,f=1MHz, VGE=0V VGE=15V VCC=600V,IC=400A, RG=2.0Ω,VGE=±15V, Tj=25oC VCC=600V,IC=400A, RG=2.0Ω,VGE=±15V, Tj=125oC VCC=600V,IC=400A, RG=2.0Ω,VGE=±15V, Tj=150oC tP≤10μs,VGE=15V, Tj=150oC,VCC=900V, VCEM≤1200V ©2015 STARPOWER Semiconductor Ltd. Typ. 1/14/2015 5.7 6.5 V 5.0 mA 400 nA 0.5 39.6 Ω nF 1.20 nF 2.40 408 119 573 135 μC ns ns ns ns 10.5 mJ 36.2 mJ 409 120 632 188 ns ns ns ns 13.2 mJ 53.6 mJ 410 123 638 198 ns ns ns ns 14.4 mJ 56.1 mJ 1600 A 3/9 RY0A GD400HFT120C2S_G8 IGBT Module Diode Characteristics TC=25oC unless otherwise noted Symbol VF Qr IRM Erec Qr IRM Erec Qr IRM Erec Parameter Diode Forward Voltage Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Test Conditions IF=400A,VGE=0V,Tj=25oC IF=400A,VGE=0V,Tj=125oC IF=400A,VGE=0V,Tj=150oC Min. Typ. 1.80 1.85 1.85 40.5 VR=600V,IF=400A, -di/dt=3350A/μs,VGE=-15V Tj=25oC VR=600V,IF=400A, -di/dt=3350A/μs,VGE=-15V Tj=125oC VR=600V,IF=400A, -di/dt=3350A/μs,VGE=-15V Tj=150oC Max. 2.25 Unit V μC 259 A 19.7 mJ 67.9 μC 323 A 32.6 mJ 77.7 μC 342 A 38.3 mJ Module Characteristics TC=25oC unless otherwise noted Symbol LCE RCC’+EE’ RθJC RθCS RθCS M G Parameter Stray Inductance Module Lead Resistance, Terminal to Chip Junction-to-Case (per IGBT) Junction-to-Case (per Diode) Case-to-Sink (per IGBT) Case-to-Sink (per Diode) Case-to-Sink Terminal Connection Torque, Screw M6 Mounting Torque, Screw M6 Weight of Module ©2015 STARPOWER Semiconductor Ltd. Min. Typ. 0.35 2.5 3.0 1/14/2015 0.123 0.162 0.035 300 4/9 Max. 20 0.072 0.095 Unit nH mΩ K/W K/W 5.0 5.0 K/W N.m g RY0A GD400HFT120C2S_G8 IGBT Module 800 800 VGE=15V 700 600 600 500 25oC 400 IC [A] IC [A] 500 150oC 300 200 200 100 100 0 0.5 1 1.5 2 2.5 VCE [V] 3 0 3.5 Fig 1. IGBT Output Characteristics 5 6 7 25oC 8 9 10 11 12 13 VGE [V] Fig 2. IGBT Transfer Characteristics 100 150 125 150oC 400 300 0 VCE=20V 700 VCC=600V RG=2.0Ω VGE=±15V Tj=150oC 90 Eoff 80 70 100 75 E [mJ] E [mJ] 60 Eoff Eon 40 50 25 50 30 Eon VCC=600V IC=400A VGE=±15V Tj=150oC 20 10 0 0 100 200 300 400 500 600 700 800 IC [A] Fig 3. IGBT Switching Loss vs. IC ©2015 STARPOWER Semiconductor Ltd. 0 0 2 4 6 8 10 12 14 16 18 20 22 RG [Ω] Fig 4. IGBT Switching Loss vs. RG 1/14/2015 5/9 RY0A GD400HFT120C2S_G8 900 IGBT Module 0.1 Module 800 IGBT 700 ZthJC [K/W] IC [A] 600 500 400 0.01 300 200 RG=2.0Ω VGE=±15V Tj=150oC 100 0 0 350 700 VCE [V] i: 1 2 3 4 ri[K/W]: 0.0042 0.0239 0.0230 0.0209 0.01 0.02 0.05 0.1 τi[s]: 1050 0.001 0.001 1400 Fig 5. RBSOA 1 10 50 45 700 Erec 40 600 35 500 30 E [mJ] IF [A] 0.1 t [s] Fig 6. IGBT Transient Thermal Impedance 800 400 300 25 20 150oC 200 VCC=600V RG=2.0Ω VGE=-15V Tj=150oC 15 25oC 10 100 0 0.01 5 0 0.5 1 1.5 VF [V] 2 2.5 Fig 7. Diode Forward Characteristics ©2015 STARPOWER Semiconductor Ltd. 0 0 100 200 300 400 500 600 700 800 IF [A] Fig 8. Diode Switching Loss vs. IF 1/14/2015 6/9 RY0A GD400HFT120C2S_G8 IGBT Module 0.1 40 E [mJ] 36 Erec 32 ZthJC [K/W] 38 34 Diode VCC=600V IF=400A VGE=-15V Tj=150oC 0.01 30 i: 1 2 3 4 ri[K/W]: 0.0057 0.0313 0.0304 0.0276 τi[s]: 0.01 0.02 0.05 0.1 28 26 0 2 4 6 8 10 12 14 16 18 20 22 RG [Ω] Fig 9. Diode Switching Loss vs. RG ©2015 STARPOWER Semiconductor Ltd. 0.001 0.001 0.01 0.1 t [s] 1 10 Fig 10. Diode Transient Thermal Impedance 1/14/2015 7/9 RY0A GD400HFT120C2S_G8 IGBT Module Circuit Schematic Package Dimensions Dimensions in Millimeters ©2015 STARPOWER Semiconductor Ltd. 1/14/2015 8/9 RY0A GD400HFT120C2S_G8 IGBT Module Terms and Conditions of Usage The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. ©2015 STARPOWER Semiconductor Ltd. 1/14/2015 9/9 RY0A