Transcript
STPS140Z
®
POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF
1A
VRRM
40 V
VF (max)
0.49 V
Tj (max)
150°C
FEATURES AND BENEFITS ■
■
■
VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING
SOD-123
DESCRIPTION Single Schottky rectifier suited for Switchmode Power Supplies and high frequency DC to DC converters. Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fit GSM and PCMCIA requirements. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF
Repetitive peak reverse voltage
Value
Unit
40
V
1
A
Continuous forward current
Tamb = 60 °C
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
5.5
A
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1kHz
0.5
A
IRSM
Non repetitive peak reverse current
tp = 100µs
1
A
Tstg
Storage temperature range
- 65 to + 150
°C
square
Tj
Maximum operating junction temperature *
150
TL
Maximum temperature for soldering during 10s
260
°C
10000
V/µs
dV/dt * :
Parameter
Critical rate of rise of reverse voltage
1 dPtot thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a )
January 2002 - Ed: 1B
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STPS140Z THERMAL RESISTANCES Symbol Rth (j-a)
Parameter Junction to ambient *
Value
Unit
175
°C/W
2 * with 50 mm copper area (e=35µm)
STATIC ELECTRICAL CHARACTERISTICS Symbol
Tests Conditions
IR *
Reverse leakage current
Tests Conditions
Min.
Forward voltage drop
Unit
VR = 5V
10
µA
Tj = 25°C
VR = 40V
40
µA
5
mA
0.55
V
Tj = 25°C
1.5 IF = 1 A
Tj = 100°C Pulse test :
Max.
Tj = 25°C
Tj = 100°C VF **
Typ.
0.45
0.51
* tp = 5 ms, δ < 2 % ** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation : P = 0.2 x IF(AV) + 0.3 x IF2(RMS) at Tj = 150°C
Fig. 1: Average forward power dissipation versus average forward current.
Fig. 2: Average forward current versus ambient temperature (δ=1).
PF(av)(W) 0.6 0.5 0.4
IF(av)(A) δ = 0.1
δ = 0.2
1.2
δ = 0.5
δ = 0.05
1.0 δ=1
0.6
0.3 0.2
0.8
T
0.4
0.1
0.2
IF(av) (A) tp δ=tp/T 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
0.0
2/5
T
δ=tp/T
0
25
Tamb(°C)
tp
50
75
100
125
150
STPS140Z Fig. 3: Non repetive surge peak forward current versus overload duration (maximum values).
Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board FR4 with recommended pad layout). Zth(j-a)/Rth(j-a)
IM(A)
1E+0
5
δ = 0.5
4 3
δ = 0.2
Ta=25°C
1E-1 2
δ = 0.1
Ta=60°C
T IM
1
Single pulse t
t(s)
δ=0.5
0 1E-3
1E-2
δ=tp/T
tp(s) 1E-1
1E+0
Fig. 5: Reverse leakage current versus reverse voltage applied (typical value).
1E-2 1E-2
1E-1
1E+0
1E+1
tp
5E+1
Fig. 6: Reverse leakage current versus junction temperature (typical value). IR[Tj] / IR[Tj=25°C]
IR(mA)
5E+3
5E+1
VR=40V
1E+1
Tj=150°C
1E+0
1E+3
Tj=100°C
1E+2 Tj=70°C
1E-1
1E+1 1E-2 1E-3
1E+0
Tj=25°C
VR(V) 1E-4
0
5
10
15
Tj(°C)
20
25
30
35
40
Fig. 7: Junction capacitance versus reverse voltage applied (typical value).
1E-1
0
25
50
75
100
125
150
Fig. 8-1: Forward voltage drop versus forward current (high level, maximum values).
C(pF)
IFM(A)
200
5E+0
F=1MHz Tj=25°C
100
1E+0 Tj=150°C
50 Tj=25°C
1E-1
Tj=100°C
20 VR(V) 10
1
2
5
10
20
50
VFM(V) 1E-2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
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STPS140Z Fig. 8-2: Forward voltage drop versus forward current (low level, maximum values).
Fig. 9: Thermal resistance junction to ambient versus copper surface (epoxy printed circuit board FR4, copper thickness: 35µm).
IFM(A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0
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Rth(j-a) (°C/W) 300 280 260 240 220 200 180 160 140 120 100
Tj=25°C Tj=150°C Tj=100°C
VFM(V) 0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
IF=1A
S(Cu) (mm²) 0
10
20
30
40
50
60
70
80
90
100
STPS140Z PACKAGE MECHANICAL DATA SOD-123 Plastic DIMENSIONS H
A2
REF.
Millimeters
Inches
A1
b
Min. A
E
A
D c
G
Max.
Min.
1.45
Max. 0.057
A1
0
0.1
0
0.004
A2
0.85
1.35
0.033
0.053
b
0.55 Typ.
0.022 Typ.
c
0.15 Typ.
0.039 Typ.
D
2.55
2.85
0.1
0.112
E
1.4
1.7
0.055
0.067
G
0.25
H
3.55
0.01 3.95
0.14
0.156
FOOTPRINT (in millimeters)
4.45
0.65
0.97
2.51
0.97
MARKING
■
■
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS140Z
Z54
SOD-123
0.01 g
3000
Tape & reel
Epoxy meets UL94, V0 Band indicates cathode
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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