Transcript
STPS2L40 Low drop power Schottky rectifier Features A
■
Very small conduction losses
■
Negligible switching losses
■
Low forward voltage drop
■
Surface mount miniature package
■
Avalanche capability specified
■
ECOPACK2® halogen-free component (SMAflat and SMBflat)
K
SMB STPS2L40U
A
A K
K
Description SMAflat STPS2L40AF
Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, low profile SMB and low profile SMA, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications.
September 2008
Table 1.
Rev 4
SMBflat STPS2L40UF
Device summary IF(AV)
2A
VRRM
40 V
Tj (max)
150 °C
VF(max)
0.34 V
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Characteristics
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STPS2L40
Characteristics Table 2.
Absolute ratings (limiting values)
Symbol VRRM IF(AV)
Value
Unit
40
V
2
A
Repetitive peak reverse voltage Average forward current
SMB
TL = 130 °C δ = 0.5
SMBflat
TL = 140 °C δ = 0.5
SMAflat
TL = 130 °C δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
75
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
2200
W
-65 to + 150
°C
150
°C
Value
Unit
Tstg dPtot --------------dTj
Storage temperature range Operating junction temperature (1)
Tj 1.
Parameter
<
Table 3.
1 -------------------------Rth ( j – a )
condition to avoid thermal runaway for a diode on its own heatsink
Thermal resistances
Symbol
Rth (j-l)
Table 4.
Parameter
Junction to lead
SMB
20
SMBflat
10
SMAflat
20
Static electrical characteristics
Symbol
Tests conditions
Min.
Typ.
Tj = 25 °C
IR(1)
Reverse leakage current
Tj = 100 °C
VR = 40 V
Tj = 125 °C Tj = 25 °C Tj = 125 °C
VF
(1)
Forward voltage drop
Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C
38
IF = 1 A
Max.
Unit
220
µA
20
mA
80
mA
0.39 0.25
0.28 V
IF = 2 A IF = 4 A
1. Pulse test: tp = 380 µs, δ < 2
To evaluate the conduction losses use the following equation: P = 0.22 x IF(AV) + 0.06 IF2(RMS)
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°C/W
0.43 0.31
0.34 0.5 V
0.39
0.45
STPS2L40
Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current
Average forward current versus ambient temperature (δ = 0.5) SMB
IF(AV)(A)
PF(AV)(W) 2.2
1.2
δ = 0.1
δ = 0.2
Rth(j-a)=Rth(j-l)
δ = 0.5
δ = 0.05
1.0
SMB
2.0 1.8 Rth(j-a)=100°C/W
1.6 0.8
δ=1
1.4 1.2
0.6 1.0 0.8
0.4
0.6
T
T 0.4
0.2
IF(AV)(A) 0.0
0.2
0.4
Figure 3.
0.6
0.8
1.0
1.2
1.4
1.6
0.2
δ=tp/T
0.0 1.8
2.0
2.2
δ=tp/T
tp 0.0
2.4
2.6
2.8
Average forward current versus ambient temperature (δ = 0.5) SMBflat
0
25
Figure 4.
IF(AV)(A)
Tamb(°C)
tp 50
75
100
125
150
Average forward current versus ambient temperature (δ = 0.5) SMAflat
IF(AV)(A)
2.2
2.2 Rth(j-a)=Rth(j-l)
SMBflat
2.0
SMAflat
Rth(j-a)=Rth(j-l)
2.0
1.8
1.8 Rth(j-a)=100°C/W
1.6
1.6
1.4
1.4
1.2
1.2
1.0
1.0
0.8
0.8
0.6
Rth(j-a)=200 °C/W
0.6
T
T
0.4
0.4 0.2
δ=tp/T
0.0 0
δ=tp/T
0.2
Tamb(°C)
tp
Tamb(°C)
tp
0.0 25
Figure 5.
50
75
100
125
0
150
Non repetitive surge peak forward current versus overload duration (maximum values) SMB
25
Figure 6.
50
75
100
125
150
Non repetitive surge peak forward current versus overload duration (maximum values) SMBflat
IM(A)
IM(A)
30
12
SMBflat
SMB
11
25
10 9
20
8 Ta=25°C
7
TL=25°C
15
6 Ta=75°C
5
TL=75°C
10
4 3 2 1
Ta=125°C IM
t(s)
δ=0.5
IM t
t(s)
δ=0.5
0 1.E-03
TL=125°C
5 t
0 1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
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Characteristics
Figure 7.
STPS2L40
Non repetitive surge peak forward current versus overload duration (maximum values) SMAflat
Figure 8.
IM(A)
Normalized avalanche power derating versus pulse duration
PARM(tp) PARM(1µs)
8 SMAflat
1
7 6 5
0.1
Ta=25 °C
4 Ta=75 °C
3 0.01
2
Ta=125 °C IM
1
t
t(s)
δ =0.5
0 1.E-03
tp(µs)
0.001 0.01
1.E-02
Figure 9.
1.E-01
0.1
1
10
100
1000
1.E+00
Normalized avalanche power derating versus junction temperature
Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - SMB Zth(j-a)/Rth(j-a)
PARM(Tj) PARM(25°C)
1.0 SMB
0.9
1.2
0.8
1 0.7
0.8
0.6 0.5
0.6
0.4
0.4
0.3
T
0.2
0.2
Single pulse
Tj(°C)
0.1
tp(s)
0 25
50
75
100
125
150
1.E-02
Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration - SMBflat
1.E-01
1.E+00
1.E+01
1.E+02
tp 1.E+03
Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration - SMAflat
Zth(j-l)/Rth(j-l)
Zth(j-a)/Rth(j-a)
1.0 0.9
δ=tp/T
0.0
1.0 SMAflat
SMBflat
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4 0.3
0.3
T
0.2
0.2
Single pulse
0.1
0.1
tp(s)
δ=tp/T
0.0 1.E-04
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1.E-03
1.E-02
1.E-01
1.E+00
tp 1.E+01
Single pulse
tp(s)
0.0 1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
STPS2L40
Characteristics
Figure 13. Reverse leakage current versus reverse voltage applied (typical values)
Figure 14. Junction capacitance versus reverse voltage applied (typical values)
IR(mA)
C(pF)
1.E+02
1000 F=1MHz VOSC=30mVRMS Tj=25°C
Tj=125°C
1.E+01
1.E+00 100
1.E-01 Tj=25°C
1.E-02
VR(V)
VR(V) 10
1.E-03 0
5
10
15
20
25
30
35
1
40
Figure 15. Forward voltage drop versus forward current (high level)
10
100
Figure 16. Forward voltage drop versus forward current (low level)
IFM(A)
IFM(A)
10.0
3.0 Tj=125°C (typical values)
2.5
2.0
Tj=25°C (maximum values)
Tj=125°C (maxmimum values)
Tj=125°C (typical values)
Tj=25°C (maximum values)
1.0
1.5
Tj=125°C (maxmimum values)
1.0
0.5
VFM(V)
VFM(V)
0.1
0.0 0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead, SMB, SMBflat (epoxy printed board FR4, copper thickness = 35 µm)
0.0
0.2
0.3
0.4
0.5
0.6
Figure 18. Thermal resistance junction to ambient versus copper surface under each lead, SMAflat (epoxy printed board FR4, copper thickness = 35 µm)
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
110
200
100
180
90
0.1
SMAflat
160
SMB
80
140
70
120
60
100 50
SMBflat
80
40
60
30
40
20 10
20
SCU(cm²) 0.0
0.5
1.0
1.5
2.0
2.5
3.0
SCU(cm²)
0
0 3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
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Package Information
2
STPS2L40
Package Information ●
Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5.
SMB dimensions Dimensions Ref.
Millimeters
Inches
E1
D
E
A1
A2
C L
b
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.50
0.030
0.059
Figure 19. SMB footprint dimensions in Figure 20. Marking information millimeters (inches)
1.62 2.60 (0.064) (0.102)
1.62 (0.064)
Cathode bar (unidirectional devices only )
2.18 (0.086)
5.84 (0.300)
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e3
x x x z y ww
e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week
STPS2L40
Package Information Table 6.
SMBflat dimensions Dimensions Ref.
D L L2 E E1 L L1 b
Inches
Min. Typ. Max.
Min.
A
0.90
1.10
0.035
0.043
b(1)
1.95
2.20
0.077
0.087
c(1)
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
A c
Millimeters
Typ.
L1
0.40
0.016
L2
0.60
0.024
Max.
1. Applies to plated leads
Figure 21. SMBflat footprint dimensions Figure 22. Marking information optimized for SMBflat(1) 5.84 (0.230) Cathode bar (unidirectional devices only )
2.07 (0.082)
1.20 (0.047)
3.44 (0.136)
1.20 (0.047)
e3
x x x z y ww
e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week
millimeters (inches)
1. SMB footprint may also be used.
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Package Information Table 7.
STPS2L40 SMAflat dimensions Dimensions Ref. A
L 2x L1 2x E E1 L L2 2x b
Inches
Min. Typ. Max.
Min.
A
0.90
1.10
0.035
0.043
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.95
0.088
0.116
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
c D
Millimeters
Typ.
L1
0.50
0.019
L2
0.50
0.019
Max.
Figure 23. SMAflat footprint dimensions Figure 24. Marking information optimized for SMAflat(1)
5.52 (0.217) Cathode bar (unidirectional devices only )
1.52 (0.060)
1.20 (0.047)
3.12 (0.123)
1.20 (0.047)
millimeters (inches)
1. SMA footprint may also be used.
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e3
x x x z y ww
e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week
STPS2L40
3
Ordering Information
Ordering Information Table 8.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS2L40U
GD4
SMB
0.107 g
2500
Tape and reel
STPS2L40UF
FGD4
SMBflat
0.50 g
5000
Tape and reel
STPS2L40AF
F2L4
SMAflat
0.35 g
10000
Tape and reel
Revision history Table 9.
Document revision history
Date
Revision
Description of changes
Jul-2003
2A
31-Jan-2007
3
Reformatted to current standard. Added ECOPACK statement. Added SMBflat package.
18-Sep-2008
4
Reformatted to current standard. Updated ECOPACK statement. Added SMAflat package.
Last update.
9/10
STPS2L40
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