Transcript
INPAQ TECHNOLOGY CO., LTD.
TEA10201V15A0 Engineering Specification 1. Scope This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. It can apply to HDMI, USB3.0, Display port, Thunderbolt, etc. For RoHS Compliance.
Feature z z z z z z
Protection against ESD voltages and currents (IEC61000-4-2 Level 4) Extremely quick response time (<1ns) present ideal ESD protection Extremely low capacitance (0.05pF typical) Bi-directional device SMD (Surface Mount Device) Zero signal distortion
2. Explanation of Part Number
T E A
1
1
2
0
2
0
1
V
1
5
4
3
0
A 5
1：Thin Film ESD gauard (air gap type) 2：Single element 3：Chip size, EIA 0201 4：Max rated Voltage , VDC 5：”A0” ：Model Code
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 1 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 3. Circuit symbol
4. Construction & Dimensions 4.1. Substrate : Ceramic (Alumina) 4.2. End termination: Ni/Sn 4.3. Construction & Dimension :
W
L
H
B
Unit: mm L
W
H
B
0.63±0.05
0.3±0.03
0.24±0.03
0.165±0.05
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 2 of 9
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INPAQ TECHNOLOGY CO., LTD. 5. Performance Characteristics Symbol
Unit
Min.
Typical
Rated voltage
VDC
V
Trigger voltage
Vt
V
300
Clamping voltage
Vc
V
20
Capacitance, @1MHz
Cp
pF
0.05
15
Response time
ns
ESD voltage capability, Contact discharge mode
kV
8
ESD voltage capability, Air discharge mode
kV
15
ESD pulse withstand
Max.
1
pulses
1,000
Vt – measurement by using Transmission Line Pulse (TLP) Vc –measurement by using Transmission Line Pulse (TLP) Cp – Device capacitance measured with 0Vrms
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 3 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 6. General specifications 6.1. Temperature Specifications Operating Temperature range : -55℃ to +85℃ 6.2. Environmental Specifications
Item
Thermal Shock
Specifications
IL ≦ 10 µA
High Temperature load voltage
IL ≦ 10 µA
Solder leach resistance
IL ≦ 10 µA
Test condition
Reference
-40℃ to 85℃, 30
JIS C 0025 (1998)Test Na
min. cycle, 5 cycles
Rated voltage, 85℃, 1000 hrs
260℃, 10s
MIL-STD-202G Method 108
MIL-STD-202G Method 210F
IL – Leakage current at rated voltage, the maximum leakage current was measured after reliability test.
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 4 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 7. Taping Package and Label Marking 7.1. Packaging method 7.1.1 Products shall be heat-sealed in the chip pocket, spacing pitch 2-mm of paper carrier tape with cover tape, and the carrier tape shall be reeled to the reel. 7.1.2 Tape material to be paper. Tape thickness to be 0.42 ± 0.03 mm. 7.1.3 Cover tape adhesion to be 40 ± 15 grams. 7.2. Carrier tape dimensions
E
F C B
A
L
W
D
T
0201 A
8.00±0.30
B
3.50±0.05
C
1.75±0.10
D
2.00±0.05
E
4.00±0.10
F
1.50±0.10
L
0.69±0.03
W
0.39±0.03
T
0.42±0.03
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 5 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 7.3. Taping reel dimensions
7.4. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping.
7.5. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.6. Quantity of products in the taping package (1) Standard quantity：15,000pcs/Reel (2)
Shipping quantity is a multiple of standard quantity.
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 6 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 8. Precautions for Handling 8.1. Solder cream in reflow soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 0.1 to 0.15 mm.
A
C
B Unit : mm
A
0.35±0.05
B
0.5±0.05
C
0.35±0.05
8.2. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples) • Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. • Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely. • Do not break the board by hand. We recommend to use the machine or the jig to break it.
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 7 of 9
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INPAQ TECHNOLOGY CO., LTD. 8.3. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling. 8.4. Recommendable reflow soldering
Reference IPC-020c-5-1
Profile Feature
Pb free Assembly 3 ℃/second max
Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin)
150℃ 200℃
Time maintained above: - Temperature (TL) - Time (tL)
217℃ 60-150 seconds
Peak
260℃ +0/-5 ℃
60-180 seconds
Temperature (Tp)
Time within 5 ℃ of actual Peak 20-40 seconds Temperature (Tp) 6 ℃/second max. Ramp-Down Rate Time 25℃ to Peak Temperature 8 minutes max
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 8 of 9
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I-FM-04-40
INPAQ TECHNOLOGY CO., LTD. 8.5. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.6. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.7.
Taping Package Storage Condition Storage Temperature: 5 to 40 ℃ Relative Humidity: < 65%RH Storage Time: 12 months max
TITLE : TEA10201V15A0 Engineering Specification
DOCUMENT NO. ENS000051850
● All Specifications are subject to change without notice.
B
SPEC REV.: A0
Page 9 of 9
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I-FM-04-40
