The Atp Product Brochure

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ATP Electronics, Inc. INDUSTRIAL GRADE Flash products & DRAM modules DRAM Modules Memory Cards 2.5” SSDs Embedded Modules Product Catalog 2017 Product Longevity & Stability Testing Capabilities Advanced Technologies & Enginerring Support Targeted Product Portfolio, Engineered Specifically for Your Mission Critical Applications ATP Product Catalog 2017 ATP Celebrates 25th Anniversary ATP started out in a 2 desk business suite in the Silicon Valley with the initial objective to build the world's highest quality small outline DRAM modules. A lot has happened and changed in 25 years, but ATP's continues to be based off the same core value: Build and deliver the highest quality memory solutions to its customers. Although this value is literally manifested from ATP products, supporting services, and testing capability, the fundamental strategy is based on alignment with long-term partnerships to our supply and customer base. Our supply base continues to consolidate, which inherently drives their focus on larger consumption areas. This, in turn, creates opportunities for ATP to address specialty applications and special service requirements; these specialty requirements areas include embedded and industrial applications, which are growing dynamically in diversity and volume. ATP has built a strong foundation to address these requirements by leveraging partnerships to create stability while adding value with technology. With 25 years of memory experience, ATP will continue to strive for excellence in delivering high quality Flash & DRAM Modules to our worldwide customers. On behalf of the company, I want to thank all our customers and partners for the 25 years, and we look forward to standing with you in the next 25. ATP TAIWAN ATP USA ATP EUROPE ATP JAPAN ATP CHINA TEL: +886-2-2659-6368 FAX: +886-2-2659-4982 [email protected] 10F, No. 185, Tiding Blvd. Sec. 2, Neihu, Taipei, Taiwan 11493 TEL: +1-408-732-5000 FAX: +1-408-732-5055 [email protected] 2590 North First Street, Suite #150 , San Jose, CA 95131, USA TEL: +49-89-374-9999-0 FAX: +49-89-374-9999-29 [email protected] Max-Planck-Str. 3, D-85716 Unterschleißheim, Germany TEL: +81-3-6206-8097 FAX: +81-3-6206-8098 [email protected] #1007, 10F 1-8-4 Kandasakuma-cho, Chiyoda-ku, Tokyo, Japan TEL: +86-21-5080-2220 FAX: +86-21-9687-0000-026 [email protected] 2F, Building 15, No. 115, Lane 572, Bibo Road, Zhangjiang High-Tech Park Pudong, Shanghai, China 201203 Headquarter 1 ATP President ATP 2 About ATP Founded in Silicon Valley, ATP Electronics is a global industrial memory solution provider and manufacturer of high performance, reliable and durable NAND Flash and DRAM memory modules. A technology driven company at heart, ATP strives on providing reliable storage solutions to mission-critical applications; with our core competencies on premium manufacturing quality, cutting-edge memory technologies and industry-validated product portfolio, ATP services on deploying reliable memory solutions to the Automotive, Industrial automation, Enterprise Mobility, Telecom, Healthcare and IoT Industries. As a true memory manufacturer, ATP offers in-house memory design, testing, product tuning and validation from system to component level. In addition, ATP service strengthes lie in supply chain support with controlled/fixed BOMs, long-term product life cycle management and worldwide agile support in engineering and sales. ATP Electronics is a certified Eco/ Green partner of tier 1 OEMs, our NAND flash / DRAM modules are fully RoHS and China RoHS compliant. As an industrial memory pioneer for over 20 years, ATP is now headquartered in Taiwan, with offices in USA, Europe, Asia and continues to expand our memory services across the world. Industry Association and Compliance 3 ATP ATP Product Catalog 2017 ATP Core Competencies Product Longevity and Stability Long-term relationships with supply chain commitments ATP’s key partnership with Micron’s PLP (Product Longevity Program) offers long-term BOM stability for DRAM/NAND flash module solutions; this helps our clients have a competitive adaptable edge in the ever changing market industry and immensely reduces the frequency of painful redesign and requalification. Proactive supply chain disaster recovery planning with dual sourcing strategy on ATP products. Controlled BOM Quality and engineering documentation provided. Long product life cycle with buffer inventory support and advance PCN/EOL notice. Compliance with Industry certificates and requirements CE, FCC certifications RoHS Testing Capabilities IC level validation & storage device/module level test. Tailored testing criteria environmental setup & joint validation compliant with applications/ industry standards and usage models. Mass production level RDT ( Reliability Demonstration Test .) Cutting Edge Memory Technology & Engineering Support ATP Unique Memory Features Power failure protection (ATP patented technology) secures consistent flash operation and protect data integrity during unstable power supply conditions. AutoRefresh (read centric operation) for read disturbance aversion & Dynamic Data Refresh (non-access areas) for data retention. SecureErase eliminates trace of the original data and offers a rigid/diverse variety of military and industrial protocols, including USA-AF AFSSI 5020, USA-Army 380-19, NAVSO P-5239-26, etc. Industry Leading Engineering Support Capabilities Product customization & development. Responsive QA/FA support during the Mass Production phase. OEM joint validation programs available: “Our lab is your lab.” ATP 4 ATP Market Focus and Applications NETWORKING/TELECOM Networking/telecommunication applications typically have the greatest memory demand for performance, reliability, and capacity. To deliver memory solutions to networking/telecommunication clients, ATP’s industrial grade DRAM products offer industry leading production level TDBI (Test During Burn In) capability and utilizes a unique in-house testing solution to ensure long-term memory reliability, quality for operating under extreme networking/telecommunication temperature conditions. Generating massive traffic along with multiple concurrent transactions is the nature of networking/telecommunication usage environments; ATP develops industrial grade SSDs, embedded SSDs modules featuring a wide range of capacities and robust IOPS performance with power failure protection technologies. Applications WAN Optimization Appliances VPN/ Firewall Appliances/ Next-Gen Firewalls Advanced TCA System Small Cell Routers/Gateways/Servers ATP commits to customers by implementing technological advancement, in conjunction with extensive processor/chipset compatibility (for DRAM products), supply chain longevity, logistic flexibility, and strong engineering support. AUTOMOTIVE ATP’s Automotive memory solution is endorsed by worldwide OEM, tier 1 & 2 automotive product/service providers for our capability to support automotive product lifecycle from start to end. To ensure reliable memory solution for automotive product lifecycle, ATP’s NAND flash products are developed, tested & validated; this process includes a streamline of ATP’s NAND flash IC level test, application usage specific test, industry standard test (AEC-Q100, MIL-STD, JEDEC,etc.) and power cycling test during product development phase. ATP’s unique SiP (System-in-Package) technology offers greater memory reliability with extreme endurance against shock, vibration, high/low temperature, ESD, dust and humidity in on the road hosting environments. In the mass production phase, ATP conducts 100% production level burn-in test to sort out manufacturing/component defects prior shipping memory products to customers. Applications Automotive IVI Systems ADAS, DMS Event Data Recorder, Tachograph Navigation System In-Vehicle Infotainment/Rear Seat/ Entertainment System Fleet Surveillance Management In-Vehicle Computer Automotive Telematics Surveillance Systems Drive Recorders ATP’s automotive memory products and technologies are fully compliant with automotive application’s quality standards. THE INTERNET OF THINGS ( IoT ) As a member of the Intel IoT Solution Alliance, ATP is recognized as one of the leading IoT hardware platforms and manufacturers. ATP is committed to providing memory solutions that would aid IoT clients in creating a better, connected world. IoT gateway application with Linux OS frequently writes small log files from sensors/ recorders; this results in high writing amplification (WAI) that would gradually ill-affect the endurance and lower the life expectancy of the memory device. Thanks to ATP’s Advanced Wear Leveling and block management algorithms; this optimizes writing files allocations to prevent excessive wears to NAND flash, prolonging the memory’s operational duration in IoT systems. In addition, ATP’s SD Life Monitor/ S.M.A.R.T Tool provides real-time health check-ups by monitoring “spare utilization rate”, an early warning mechanism tool to avoid wear out and spare block exhaustion before the device expires. ATP’s SD/microSD cards are ruggedized built with System-in-Package (SiP), which makes our cards IEC/EN 60529 IP67/IP57 compliant. In addition, 100% production level burn-in tests are conducted to ensure product quality and long-term reliability for the internet of things. 5 ATP Applications Gateways Surveillance & Security Smart Industrial Application Cloud Computing Connected Devices/ IPCs/ Embedded Systems Drones ATP Product Catalog 2017 ENTERPRISE MOBILITY The memory unit for enterprise mobility devices requires more than physical durability attributes but also needs assurance from reliable memory storage processes while under unstable power supply and frequent rewriting usage conditions. Specialized in providing enterprise mobility memory solutions, ATP’s industrial grade memory cards have been previously tested and certified by Motorola Solution IHV. ATP’s industrial grade memory cards are built with SiP (System-in-Package technology); this manufacturing technology offers robust protection against water, dust, and ESD. In addition, ATP developed a series of “Data Integrity” technologies to secure dependable data storage in enterprise mobility environment. Applications Mobility ERP Barcode Scanning and Data Collection Mobile Payment Rugged and Field Handheld-Computing Mobile Healthcare INDUSTRIAL PC/ EMBEDDED Implementation of the storage unit in embedded systems / industrial PC requires top-notch engineering expertise and product usage technicality that only an experienced memory solutions provider like ATP can offer. For industrial PC and embedded system intended application, while it is fundamental for the memory device to have faster data transfer and higher bandwidth; the storage unit also needs to be extremely durable, compact in form factor and power conservative. Applications Industrial Control System Industrial PC/Embedded System Industrial Automation Factory Machinery Data Logging With full control of the BOM, ATP designs and supports DRAM and industrial SSDs intended for IPC / embedded application. ATP’s memory products are anti-vibrational, shock resistant and wide temperature range operable. ATP can customize build, fine-tune storage/memory solution for the most demanding and unique embedded application. AUTOMATION Industry 4.0 for automation marks the integration between cyber-physical systems, intended for the computerization of manufacturing. This poses challenges for memory devices, given that the automation network is intertwined with a plethora of factory-level equipment to enterpriselevel control systems in need for real-time data storage and transmission requirements. Naturally, memory attributes with power failure protection, data consistency/retention, and operating temperature becomes key factors to consider in realizing the “smart factory” for reliable automation acceleration. Applications HMI Robotics Industrial Control System Home/ Building Automation Industrial Instrument ATP’s memory device is designed for endurance, reliability and optimized for intensive read/write operations; in addition, extensive platform/device validation combined with 100% burn-in testing to ensure memory reliability on automation applications. HEALTHCARE Data integrity, reliability, and performance are crucial memory checklist for medical operations in the healthcare industry. To meet the intense usage condition from healthcare environments, ATP is committed to manufacturing premium levels of performance, reliability, and quality memory products. ATP’s DRAM and NAND flash memory modules in a variety of form factors and densities have been utilized in hospitals, clinical and diagnostic machines for system boot-up, image capturing and data logging functions. ATP offers TCO (Total cost of ownership) for long product life cycle, patented PowerProtector technology, SiP (System-in-Package) manufacturing technology, in-house DRAM module testing service, strong quality assurance (QA) and BOM support capabilities for the healthcare industry. Applications Life support/Data Logging Bedside Infotainment Terminal Point-of-Care Mobile Device Patient Monitoring Device ECG /EEG/EMG* Monitor Sonogram/Ultra Sound Endoscopy System Diagnostic Imaging System *ECG- Electrocardiogram EEG - Electroencephalography EMG- Electromyography ATP 6 ATP Technology Industrial Temperature AutoRefresh / Dynamic Data Refresh Wide temperature operable product (-40°C to 85°C) for industrial temperature hosting environments. AutoRefresh technology reduces read disturb and lower the risk of data loss in frequent read Dynamic Data Refresh offers long term data retention technology for non-frequent active areas. Conformal Coating Secure Erase A protective coating of parylene (chemical compound) applied on electronic circuits to protect against dust, chemicals, extreme temperature, moisture, and corrosion. Systematical deletion of information from original data. Gold Finger SiP (System - in - Package) 30µ“ thickness of gold finger plating that optimizes signal transmission quality between the connector and DRAM modules. Unique manufacturing process that fully encapsulates all exposed components to protect against harsh hosting environments. SD Life Monitor/ S.M.A.R.T. PowerProtector A real-time flash storage device monitor tool that detects flash health status and provides product life expectancy to the host. ATP patented hardware-based technology designed to secure data integrity and data transmission during unexpected power failure. Advanced Wear Leveling An algorithm that evens the erase count to prolong product life expectancy. 7 ATP ESD Resistance Memory devices that are electrostatic discharge (ESD) resistant. ATP DRAM Modules for Networking & Embedded Applications. Tested by Next Generation TDBI and ATE with Increased Flexibility, Efficiency and Scalability. DRAM Solutions The Ultimate DDR3L-1866 ECC SODIMM Solution for Intel Apollo Lake based IoT and Embedded Platforms ATP ‘s new DDR3L ECC SODIMM are to address the need for low voltage (1.35V) DDR3 memory running at 1866 MHz to maximize the system performance in conjunction with the Intel Apollo-Lake processors. Available in Commercial Temp (CT 0°C to 85°C) and Industrial Temp (IT -40°C to 95°C) range to meet the various operating conditions of any IoT system ,including industrial IoT and automation devices, telecommunication systems, healthcare devices and outdoor data collection systems. Features Industrial Temperature A cost-effective solution, with a wide temperature range from -40°C to 95°C, ideally suited for industrial applications in mission critical environments. Power Efficient & High Performance With 1.35V Low Power Voltage and operating at 1866 MT/s, it can maximize the system performance. Supports large-scale operations without placing a heavy burden on power bills. Reliability Designed, tuned, fully tested and validated without any system degradation or side effects. 100% tested through ATP rigid testing methods (ATE/TDBI) to ensure long-term product reliability. Product Information Part numbers Speed Voltage Temperature XW1818E4GMPP-IT Rank PCB Height Gold Finger Density 1 4GB 2 8GB 0°C to 85°C Commercial Temp. XW1828E8GMPP-IT 1866 MHz XW1818E4GMPWP-IT XW1828E8GMPWP-IT STD 30mm 1.35V -40°C to 95°C Industrial Temp. 30u'' 1 4GB 2 8GB DRAM Solutions 8 Legacy (SDR/DDR) DRAM Module Micron endorses ATP as a partner to support selected SDR/DDR DRAM Modules ATP has instituted an agreement with Micron to continue to manufacture Legacy(SDR/ DDR) DRAM modules specifically for the existing customer base that cannot migrate. ATP will offer these modules in selected SODIMM, UDIMM and RDIMM form factors/densities, and continue to provide long-tern support and related product roadmaps. Guarantee : Each module will be manufactured to the equivalent specifications and test processes of the corresponding Micron part number License agreement with Micron 100% follow Micron’s design 100% follow Micron’s BOM selection, including key/passive components selection. 100% follow Micron’s firmware setting Equivalent specification & test processes Together with ATP extended support to minimize customer’s effort on (re)qualification! Endorsement “Micron is committed to supporting legacy application requirements. By partnering with ATP we’re able to provide stability for our customers who are unable to transition their existing platforms,” said Bruce Franklin, Product Marketing Director of the Embedded Business Unit for Micron. “Embedded applications require a long life cycle, which is why AMD is pleased to collaborate with ATP and Micron to support the extended life of AMD’s Geode platform,” said Colin Cureton, Product Marketing Manager, AMD Embedded Solution. “ATP’s legacy SDR/DDR SODIMM module solutions utilizing Micron memory are a critical component to industrial control and automation, industrial PCs, HMI panels, point of sales and communication applications.” Product Information Standard Solution Module Type DDR SO-DIMM DDR SO-DIMM (Industrial Grade) Capacity 128MB/256MB/512MB/1GB 256MB/512MB/1GB Function Unbuffered Non-ECC Unbuffered Non-ECC Frequency 400MHz 400MHz Pin Number 200pin 200pin PCB Height 1.25" 1.25" Build To Order (BTO) 9 Module Type DDR DIMM DDR DIMM DDR SO-DIMM SDRAM SODIMM Capacity 1GB/2GB 256MB/512MB 256MB/512MB/1GB 64MB/128MB/256MB/512MB Function Registered ECC Unbuffered ECC/ Unbuffered Non ECC Unbuffered ECC Unbuffered Non ECC Frequency 400MHz 400MHz 400MHz PC100 Pin Number 184pin 184pin 200pin 144pin PCB Height 1.125"/1.2" 1.25" 1.25" 1.0"/1.25" DRAM Solutions ATP Product Catalog 2017 ATP Unique Features and Testing Systems ATP has successfully integrated the DRAM ATE and TDBI tests and the SCADA system into one mass-productionscale burn-in system. ATP focuses on maximizing the ATE testing coverage and accelerating the TDBI testing cycle. A traceable record from IC level testing (from DRAM module level ATE production data to field product usage) has been built, collected, and analyzed via the SCADA system. The entire system is designed to (1) build a system for quality data acquisition, and (2) implement a system for improving the process, based on quality and reliability driven industrial and server environments. The new system provides a wide testing temperature, ranging from -40°to 85°C, which few other TDBI systems can provide. The combined tests have proven to effectively lower the field return rates from major ATP OEM customers. The system has demonstrated ATP’s value added and its commitments to industrial grade quality and reliability. The Next Generation Test During Burn In – ATP TDBI System The ATP TDBI system features a unique chamber design allowing for flexibility in customer specific temperature profiles and also features a flexible monitoring/control system. The elevated temperature burn in process reduces field failures due to fringe manufacturing defects and IC infant mortality. The design of the thermal chamber allows for a higher level of production level efficiency, scalability, and flexibility. The ATP New Automatic Test Equipment Test-ATE Test ATE provides electrical testing patterns with various parameters, such as marginal voltage, signal frequency, clock, command timing and data timing under continuous thermal cycles. For specific weaknesses of some ICs, ATE can provide specific testing patterns to stress the screening of the potential defects during the testing. Also, based on customers’ requests, tailor-made electrical testing patterns can be programmed and implemented into the ATE testing process. The ATE testing system is also able to pinpoint individual defective ICs and defective DRAM PCB boards, providing a much more efficient failure analysis method for both new product development and mass production stages. The SCADA (Supervisory Control and Data Acquisition) The SCADA (Supervisory Control and Data Acquisition) feature of the TDBI system allows for true flexibility in application/customer specific temperature profiles and data patterns (customer specific software/ scripts). SCADA also offers real‐time monitoring and production lot logging for QA traceability.  emote monitoring and control over thermal burn-in testing array R Real-time monitoring of testing cycle status on all systems Database containing all profiles, test cycles, and production logs for QA traceability DRAM Solutions 10 ATP Unique Features and Testing Systems Industrial Temperature Conformal Coating A cost‐effective solution, with a wide temperature range from -40°C to 85°C, ideally suited for telecom, industrial and military/ aerospace applications. AT P o ffe rs t wo te st i n g Te c h n o l o g i e s fo r t h e W i d e Temperature DRAM Solution: 1. Advanced IC Level Testing and 2. The Enhanced Module Level TDBI and ATE Testing Compared to other competitor’s WT DRAM solutions, the ATP-exclusive IC level and system level testing on DRAM ICs has made ATP WT DRAM modules more reliable in the long run, based on user data in the field. ATP WT DRAM solution has also provided a superior overall system-wide stability over typical commercial temperature DRAM modules. Conformal Coating is a process in which a protective layer of Parylene is applied to electronic circuits and modules to protect against dust, chemicals, extreme temperatures, moisture, and corrosion. Uncoated surfaces are prone to damage and malfunction, hence the added protection becomes necessary for harsh environments. In contrast to dipping and spraying techniques, the chemical vapor deposition (CVD) provides a vacuum‐like environment in which the Parylene particles coat all components and points of failure. ATP can also support special requirements calling for antisulfuric components upon request Increased Thickness, Increased Strength 30μ” In order to ensure the quality of the signal transmission between the connector and ATP DRAM module, ATP utilizes gold finger plating with 30μ” thickness, compared to competitors’ DRAM modules thickness typically at less than 10 μ”. 11 DRAM Solutions E lectrical reliability requires clean power and lowimpedance grounding. Traces must be laid out to minimize crosstalk and clock skew. Appropriate shielding is needed to block interference and prevent logic glitches. ATP’s PCB design can 100% fulfill above conditions and also improve signal quality of high speed. ATP Product Catalog 2017 Complete DRAM Product Line Product Category Speed (MT/s) DDR4 Features 2133 2400 2666 • Density: 4GB to 64GB • Low profile • Increased performance and bandwidth • Very Low Profile (VLP) options (up to 3200 MT/s) (VLP: 0.74" height) • Decreased voltage for better power consumption • Ultra Low Profile (ULP) options • Provides better reliability, availability and serviceability (ULP: 0.7"~0.72” height) (RAS) and improves data integrity. LRDIMM/RDIMM UDIMM/UDIMM ECC SO-RDIMM SO-DIMM/SO-DIMM ECC mini-RDIMM mini-UDIMM ECC 1866 1600 1333 1066 • Density: 1GB to 32GB 32GB to 64GB(LRDIMM) • Low profile • Chipkill support • Very Low Profile (VLP) options • Fly-by command/address/control bus with (VLP: 0.74" height) on-DIMM termination. • Ultra Low Profile (ULP) options • Higher bandwidth performance, effectively up to (ULP: 0.7"~0.72” height) 1866 MT/s • Better performance at low power; 1.5V (Normal) and 1.35V(Low Voltage) RDIMM UDIMM/UDIMM ECC SO-RDIMM SO-CDIMM SO-DIMM mini-RDIMM FB-UDIMM* 800 667 533 400 UDIMM/UDIMM ECC SO-CDIMM SO-DIMM 400 333 266 LRDIMM/RDIMM UDIMM/UDIMM ECC SO-DIMM/SO-DIMM ECC Mini-RDIMM Mini-UDIMM ECC DDR3 DDR2 Form Factor • Density: 1GB to 8GB • Chipkill support • Low Profile • Very Low Profile (VLP) options FB-DIMM (VLP:0.72"~0.74" height) • Low power and low voltage options • Apple FB-DIMM DDR* • Low Profile • Chipkill support • Very Low Profile (VLP) options • Legacy system support (VLP:0.72"~0.74" height) SDRAM* SO-DIMM Product Portfolio Industrial Grade Family Category SO-DIMM UDIMM RDIMM mini-DIMM PC 133 • Low Profile PC 100 Product DDR4 DDR3 DDR2 DDR* SDRAM* • Legacy system support Features • Extended temperature: -40°C ~ +95°C • Controlled BOM and SPD • For mission critical industrial applications • conformal coating * Available on a project basis. DRAM Solutions 12 Flash Solutions in ATP Packaging As planar NAND shrinkage faces difficulties in increasing cell density, 3D NAND is the next generation of technology for the flash memory industry and has been the focal development for all major NAND flash makers. The intuitive concept of design by stacking more layers vertically can expand the capacity from limited die size. Stacking up vertically instead of shrinking planarly allows larger NAND cells with better performance and endurance. ATP has utilized our own innovative 3D NAND packaging for different configurations, such as SDP, DDP, QDP, and ODP, to achieve the market’s demand of large NAND flash capacity products. Starting from wafer procurement, IC level testing to final 3D NAND packaging, ATP owns the advantage of production process management, BOM stability and control in NAND supply with better LTB/LTS over product life cycle, not to mention the cost effectiveness for avoiding a big market price premium and the flexibility of providing custom made packaging for meeting customers’ mission critical applications. Features 2D NAND & 3D NAND Larger density in single die Higher performance Better endurance Product 2D NAND 3D NAND Image ATP 3D MLC NAND SSD Product Lines Product Density Capacity 2.5” SSD MV 128GB to 2TB Material mSATA MO-300A 128GB to 512GB Endurance (P/E Cycles) SlimSATA MO-297 128GB to 512GB Performance M.2 SATA 2280/2260/2242 13 Flash Solutions 128GB to 1TB Overall power Limited Not cost effective - Shrinking node for density expansion Increased by layers Expected to ↑ 10x Floating Gate (Conductor) Floating Gate(Conductor) or Charge Trap(Insulator) Low High [ More cells in less space → ↑ interference with adjacent cell → ↓ Endurance ] Slower Faster Complex program algorithms Simple algorithms High Low [ ↓# of programming steps →↓Power Consumption ] ATP Product Catalog 2017 ATP Prominent Technology Industrial Temperature The need for higher capacity points is dictating the embedded market, so is product ability to function in harsh conditions. SLC NAND is faster and reliable in performance; however, the price may be expensive and consumers are either forced to spend extra money on SLC NAND or buy MLC NAND which bears the risk not being able to operate at extreme environments. To overcome environmental asperity, ATP has successfully developed an iTemp (Industrial Temperature) MLC solution, best suited for IIoT/industrial applications. Temp. Temperature Cycle Chamber 85°C 25°C -40°C RDT +85°C RDT -40°C ATP NAND Flash Product Level RDT By conducting stringent iTemp validation testing technologies in both IC/NAND Flash level screening processes and high/low temperature tests, MLC type NAND Flash reliability is ensured and uncompromised in extreme temperature environments (-40°C~+85°C), placing itself in the market segment where normally SLC type NAND competes. ATP’s stringent advanced RDT (see Figure 1) is conducted for the entire storage drives (IC/NAND Flash/signal of SATA interface) with high/low temperatures as acceleration factors to detect infant mortality and defective modules, delivering enhanced reliability and prolonged product life span. The new iTemp MLC solution strikes a great balance between the demand of better total cost ownership (TCO) and NAND flash reliability. AutoRefresh and Dynamic Data Refresh ATP AutoRefresh and Dynamic Data Refresh checks not only error bits but also reads counts in both frequent and seldom read areas. Once reaching the error bit or read count threshold, the data will be moved to another healthy blocks to prevent data corruption. Without affecting read/write operation, Dynamic Data Refresh runs automatically in the background and sequentially scans the user area with flag record. Therefore, the risk of data loss owing to read disturb and data retention is mitigated and the product life is extended. Access Frequency High Map Zone 1 Frequently Read Map Zone 2 Seldom Read Spare Block Low ECC is automatically checked before uncorrectable failure occurs in every read operation. PowerProtector PowerProtector 10ms Power (V) Power (V) ATP PowerProtector, an advanced power protection mechanism integrating hardware designs and firmware algorithm, is designed for supplying sufficient power and sustaining data integrity during power failure in missioncritical applications. ATP PowerProtector stops receiving commands from host device after detecting the power failure and leverages the protection from DRAM cache to NAND flash to finish the last operation. Time (ms) Time (ms) Without PowerProtector With PowerProtector Data Protection Under Power Glitch Flash Solutions 14 Flash Solutions SD Life Monitor/S.M.A.R.T. ATP SD Life Monitor, an early warning to prevent wear out/ spare block exhaustion, activates real-time health check and provides storage identification information at a glance. A useful tool, with detailed SD/microSD information for engineering and QA inspection reference, is easy to install and user-friendly. Moreover, it also supports a wide array of customer’s operating systems/software integration. Note : The compatibility and support of Life Monitor may vary on different platform / operating systems New Feature: Enhanced SD Life Monitor Tool ATP SD Life Monitor with remaining life rate, spare block count, CID/CSD and so on. ATP S.M.A.R.T., a flash storage device health status monitoring tool, reliably detects the remaining life of the device and is available to be integrated into host systems. It is seen as an early warning command tool to prevent wear out and spare block exhaustion and furthermore allows users sufficient time for safe storage retirement and replacement. One practical example is frequent write operation required in automation applications; ATP S.M.A.R.T. is the optimal solution for sustaining endurance and service life of memory possibly impacted by high write amplification while small-file data are being frequently written. SMART tool Interface for SATA III product lines: (Windows version) ATP SMART tool is designed for real- time health checks of the storage device, such as device temperature, firmware version, capacity and so on. Secure Erase ATP Secure Erase initiates a block-by-block data pattern write operation to systematically eliminate any trace of the original data. ATP Secure Erase ensures all data are completely removed, so they can’t be recovered. Therefore, it ’s best suited for Corporate Business (assets management), Government Agency and Military applications. New Secure Erase Tool for all ATP Products. 15 Flash Solutions ATP Product Catalog 2017 ATP Prominent Technology System-in-Package (SiP) ATP System-in-Package (SiP) fully encapsulates all exposed components and points of failure to protect against water(IPX7)/humidity, dust(IP5X/IP6X), electrostatic discharge, shock/vibration, and extreme temperatures. ATP SiP vs Other Brands aMLC(advancedMLC) • Advanced Wear Leveling Algorithm • Bad Block Management • Read Disturb Protector - AutoRefresh to ensure data integrity during read operation • Enhanced F/W algorithm to minimize the risk of a sudden power-off • Waterproof, Dustproof and ESD resistant • Highly reliable and environmental testing passed (Bend/Torque/Salt Spray/Solar radiation) • Life Monitor (Note: The compatibility and support of Life Monitor may vary on different platforms / operating systems) Target Applications • Write-Intensive: Data logging for surveillance, medical imaging, transportation ticketing systems, and drive recorders which requires high P/E cycles for frequent data writing. • Read-Intensive: Boot-up for OS/application drive in the system for POS, ATM, Kiosk, and automation Applications. Performance Endurance 13Y ~ 15Y (2.7K P/E cycles @ 55C) 3X ~ 5X 5Z 3Y X MLC 0.8X eMLC ATP aMLC Y MLC Z eMLC ATP aMLC MLC 0.25Z eMLC ATP aMLC Endurance/Price Comparisons of MLC/eMLC/aMLC Flash Solutions 16 Complete Flash Product Line Product Dimensions (L x W x H mm) Flash Type Densities Operating Temp. Data Transfer Rate (MB/s)(max.) TBW** (max.) -40°C~+85°C Read: 530 MB/s Write: 440 MB/s 21,333 TB SATA Velocity SII Pro 2.5" SSD Velocity MV 2280 D2-B-M M.2 2260 D2-B-M 2242 D2-B-M mSATA MO-300A SlimSATA MO-297 CFast 17 Flash Solutions 100.0 x 69.85 x 9.2 8GB~128GB SLC 100.0 x 69.85 x 9.5 100.0 x 69.85 x 9.2 256GB iTemp MLC 64GB~2TB -40°C~+85°C 4,267 TB Read: 530 MB/s Write: 420 MB/s 100.0 x 69.85x 9.5 (1.5TB~2TB) MLC 64GB~2TB 0°C~+70°C 5,120 TB iTemp MLC 128GB~1TB -40°C~+85°C Read: 550 MB/s Write: 450 MB/s 2,133 TB MLC 128GB~1TB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 2,560 TB SLC 32GB~128GB -40°C~+85°C Read: 530 MB/s Write: 430 MB/s 10,667 TB iTemp MLC 64GB~512GB -40°C~+85°C Read: 550 MB/s Write: 450 MB/s 1,067 TB MLC 64GB~512GB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 1,280 TB SLC 8GB~64GB -40°C~+85°C Read: 530 MB/s Write: 400 MB/s 5,333 TB iTemp MLC 32GB~128GB -40°C~+85°C Read: 520 MB/s Write: 150 MB/s 267 TB MLC 32GB~128GB 0°C~+70°C Read: 520 MB/s Write: 150 MB/s 320 TB SLC 8GB~128GB -40°C~+85°C Read: 530 MB/s Write: 430 MB/s 10,667 TB iTemp MLC 16GB~512GB -40°C~+85°C Read: 550 MB/s Write: 450 MB/s 1,067 TB MLC 16GB~512GB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 1,280 TB SLC 8GB~128GB -40°C~+85°C Read: 530MB/s Write: 430 MB/s 10,667 TB iTemp MLC 16GB~512GB -40°C~+85°C Read: 550 MB/s Write: 450 MB/s 1,067 TB MLC 16GB~512GB 0°C~+70°C Read: 550 MB/s Write: 450 MB/s 1,280 TB SLC 8GB~32GB -40°C~+85°C Read: 500 MB/s Write: 300 MB/s 2,667 TB iTemp MLC 16GB~128GB -40°C~+85°C Read: 445 MB/s Write: 160 MB/s 267 TB MLC 16GB~128GB 0°C~+70°C Read: 445 MB/s Write: 160 MB/s 320 TB 80.0 x 22.0 x 3.5 60.0 x 22.0 x 3.5 42.0 x 22.0 x 3.5 50.8 x 29.85 x 3.4 54.0 x 39.0 x 4.0 36.4 x 42.8 x 3.6 PowerProtector (H/W) Life Secure Erase Monitor (S/W)*** (S/W)*** ATP Product Catalog 2017 Product Dimensions (L x W x H mm) Operating Temp. Data Transfer Rate (MB/s)(max.) TBW** PowerProtector (H/W) (max.) 512MB~32GB -40°C~+85°C Read: 61 MB/s Write: 55 MB/s 1,280 TB aMLC 4GB~16GB 0°C~+70°C Read: 110 MB/s Write: 80 MB/s 128 TB - MLC 8GB~32GB 0°C~+70°C Read: 110 MB/s Write: 46 MB/s 38 TB - Flash Type Densities SLC Secure Life Erase Monitor (S/W)*** (S/W)*** PATA/IDE Compact Flash 36.4 x 42.8 x 3.3 USB Drive eUSB NANODURA 2.54mm 36.9 x 26.6 x 11.5 2.00mm 36.9 x 26.6 x 8.4 SLC 1GB~32GB -40°C~+85°C Read: 30 MB/s Write: 27 MB/s 640 TB MLC 8GB~32GB 0°C~+70°C Read: 22 MB/s Write: 15 MB/s 19 TB 34 x 12.2 x 4.5 SLC 512MB~8GB -40°C~+85°C Read: 21 MB/s Write: 16 MB/s 96 TB SLC 512MB~8GB -40°C~+85°C Read: 69 MB/s Write: 38 MB/s 192 TB Read: 95 MB/s Write: 79 MB/s 512 TB Read: 91 MB/s Write: 59 MB/s 153 TB Read: 82 MB/s Write: 39 MB/s 192 TB Read: 88 MB/s Write: 78 MB/s 256 TB Read: 74 MB/s Write: 75 MB/s 77 TB - - SD aMLC SD/SDHC/SDXC 32.0 x 24.0 x 2.1 iTemp aMLC -25°C~+85°C 4GB~64GB -40°C~+85°C MLC iTemp MLC SLC microSD/ microSDHC/ microSDXC -25°C~+85°C 8GB~128GB -40°C~+85°C 512MB~8GB aMLC 15.0 x 11.0 x 1.0 iTemp aMLC -25°C~+85°C 4GB~32GB -40°C~+85°C MLC iTemp MLC -40°C~+85°C -25°C~+85°C 8GB~64GB -40°C~+85°C - - * Available on a project basis. ** All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. *** ATP software support for demo use only. Flash Solutions 18 Memory Cards SD/SDHC/SDXC microSD/microSDHC/microSDXC To meet the various and stringent industry requirements, ATP flash products are developed and pass a series of qualification process and testing for reliability, durability, data integrity, and better TCO under extreme environmental conditions. ATP Industrial Grade SD/microSD cards, with built-in SLC (Single Level Cell) and iTemp MLC/aMLC type NAND flash, are perfect fit for high demanding industrial applications such as automation, internet of things (IoT), healthcare, handheld devices, military, and aviation. ATP’s memory cards are with versatile purpose-built features and a complete portfolio of validation processes. ATP implements AutoRefresh/Dynamic Data Refresh technology activates data integrity protection in both read intensive applications and seldom accessed area. To conquer the unstable power issue, ATP initiates SPOR (Sudden-Power-Off Recovery) FW backup mechanism to trace previous valid data effectively. In terms of real time health check of SD products, ATP SD life Monitor/single command enables to detect the remaining life and to provide details. Following the industry trend of Software Integration, ATP is able to grant software support using vendor command to avoid interrupting in multitasking OS environment. The comprehensive validation process starts from its in-house NAND flash IC level test, specific industry standard test (AEC-Q100, MIL-STD, JEDEC… etc), power cycling test to 100% mass production burn in test. Moreover, ATP environmental testing and SiP (System-in-Package) technology guarantee the long-time reliability and consistent performance. Key Features • Advanced Wear Leveling Algorithm • Bad Block Management / Error Handling Mechanism • Read Disturb Protector - AutoRefresh to ensure data integrity during read operation • Data Retention – Dynamic Data Refresh to mitigate the risk of data retention especially for non-read area • Power failure Protection • SiP (System-in-Package) Technology - IP57/IP67 Waterproof/Dustproof test (IEC 60529); ESD resistant • Highly reliable and passes environmental testing (Bend/Torque/Salt Spray/Solar radiation) • SD Life Monitor (Note : The compatibility and support of Life Monitor may vary on different platforms/operating systems) 19 Memory Cards ATP Product Catalog 2017 Specifications Product Name SD/SDHC/SDXC Flash Type SLC aMLC / iTemp aMLC Density 512MB to 8GB 4GB to 64GB MLC/ iTemp MLC 8GB to 128GB Sequential Read up to 91 MB/s Sequential Write up to 59 MB/s Sequential Read up to 69 MB/s Sequential Read up to 95 MB/s Sequential Write up to 38 MB/s Sequential Write up to 79 MB/s Interface High Speed Mode Class 6 (512MB to 2GB) Class 10 (4GB to 8GB) Ultra High Speed Mode UHS-I, U3 (4GB to 8GB) Ultra High Speed Mode UHS-I , U3 Ultra High Speed Mode UHS-I, U1 (8GB to 16GB) UHS-I, U3 (32GB to 128GB) Operating Temperature -40°C to 85°C -25°C to 85°C ; -40°C to 85°C -25°C to 85°C ; -40°C to 85°C Performance Storage Temperature -55°C to 90°C Advanced Static/Dynamic Wear-Leveling/ AutoRefresh & Dynamic Data Refresh** Reliability TBW*(max.) : 192 TB TBW*(max.) : 512 TB TBW*(max.) : 153 TB MTBF@25C: >5,000,000 hours MTBF@25C: >3,000,000 hours MTBF@25C: >2,000,000 hours Number of Insertions: 10,000 minimum Dimensions: LxWxH (mm) 32.0 x 24.0 x 2.1 Product Name microSD/microSDHC/microSDXC Flash Type SLC aMLC / iTemp aMLC MLC/ iTemp MLC Density 512MB to 8GB 4GB to 32GB 8GB to 64GB Sequential Read up to 82 MB/s Sequential Read up to 88 MB/s Sequential Read up to 74 MB/s Sequential Write up to 39 MB/s Sequential Write up to 78 MB/s Sequential Write up to 75 MB/s Interface High Speed Mode Class 6 (512MB to 2GB) Class 10 (4GB to 8GB) Ultra High Speed Mode UHS-I, U3 (4GB to 8GB) Ultra High Speed Mode UHS-I , U3 Ultra High Speed Mode UHS-I, U1 (8GB) UHS-I, U3 (16GB to 64GB) Operating Temperature -40°C to 85°C -25°C to 85°C ; -40°C to 85°C -25°C to 85°C ; -40°C to 85°C Performance Storage Temperature -55°C to 90°C Advanced Static/Dynamic Wear-Leveling/ AutoRefresh & Dynamic Data Refresh** Reliability TBW* (max.) : 192 TB TBW* (max.) : 256 TB TBW*(max.) : 77 TB MTBF@25°C: >5,000,000 hours MTBF@25°C: >3,000,000 hours MTBF@25°C: >2,000,000 hours Number of Insertions: 10,000 minimum Dimensions: LxWxH (mm) 15.0 x 11.0 x 1.0 *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. **Available on a project basis. Memory Cards 20 Memory Cards CFast Card With the more advanced SATA interface, the ATP Industrial Grade CFast is the ideal replacement for CompactFlash. The CFast is fully compliant with CFA's CFast specification version 2.0 with a SATA III 6 Gb/s interface. The ATP CFast with PowerProtector guarantees a reliable controller and lasting NAND flash operations with a backup power circuit during a power failure. By utilizing SLC NAND flash memory and Advanced Wear Leveling technology, the ATP Industrial Grade CFast has a higher program/write endurance and a longer product lifespan. Key Features • SLC (Single Level Cell) NAND Flash with a longer lifespan • MLC (Multi Level Cell) NAND Flash with higher capacity • iTemp MLC (Multi Level Cell) NAND Flash- Industrial Temperature operable • Enhanced endurance with Advanced Wear Leveling algorithm • Bad Block Management • Read Disturb Protector - AutoRefresh to ensure data integrity during read operation • Built-in hardware-based data protection technology during power failure – PowerProtector • Supports S.M.A.R.T. ATA feature set • RoHS compliant and CE/FCC certification Specifications Product Name CFast Card Flash Type SLC iTemp MLC MLC Density 8GB to 32GB 16GB to 128GB 16GB to 128GB Sequential Read up to 500MB/s Sequential Read up to 445MB/s Sequential Read up to 445MB/s Sequential Write up to 300MB/s Sequential Write up to 160MB/s Sequential Write up to 160MB/s Performance Interface Operation Temperature SATA III 6 Gb/s -40°C to +85°C -40°C to +85°C 0°C to 70°C AutoRefresh, PowerProtector, Advanced Wear Leveling Reliability TBW* (max.) : 2,667 TB TBW* (max.) : 267 TB MTBF @25°C: >2,000,000 hours Number of Insertions: 10,000 minimum Dimensions: LxWxH (mm) 36.4 x 42.8 x 3.6 *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. 21 Memory Cards TBW* (max.) : 320 TB ATP Product Catalog 2017 CompactFlash Card The ATP Industrial Grade CompactFlash Card has enhanced endurance levels for an extended product life cycle by utilizing SLC NAND flash and the Advanced Wear Leveling technology. Moreover, AutoRefresh technology monitors the error bit levels during each read operation to ensure better data integrity. Key Features • SLC (Single Level Cell) NAND Flash with a longer lifespan • MLC (Multi Level Cell) NAND Flash with higher capacity • aMLC (advancedMLC) NAND flash and Global Wear Leveling technology with a longer lifespan • Enhanced endurance with Advanced Wear Leveling algorithm • Bad Block Management • Read Disturb Protector - AutoRefresh to ensure data integrity during read operation • Built-in hardware-based data protection technology during power failure – PowerProtector • Supports S.M.A.R.T. ATA feature set • RoHS compliant and CE/FCC certification Specifications Product Name CompactFlash Card Flash Type SLC aMLC MLC Density 512MB to 32GB 4GB to 16GB 8GB to 32GB Sequential Read up to 61MB/s Sequential Read up to 110MB/s Sequential Read up to 110MB/s Sequential Write up to 55MB/s Sequential Write up to 80MB/s Sequential Write up to 46MB/s Performance Interface UDMA 0~4 Operation Temperature -40°C to 85°C UDMA 0~6 0°C to 70°C 0°C to 70°C Advanced Wear Leveling Algorithm & Bad Block Management Algorithm Reliability TBW* (max.) : 1,280 TB TBW* (max.) : 128 TB TBW* (max.) : 38 TB MTBF @25°C: >5,000,000 hours MTBF @25°C: >2,000,000 hours MTBF @25°C: >2,000,000 hours Number of Insertions: 10,000 minimum Dimensions: LxWxH (mm) 36.4 x 42.8 x 3.3 *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. Memory Cards 22 2.5’’ SATA SSDs Velocity SII Pro The ATP Velocity SII Pro 2.5” SSD with SATA III interface is the best-in-class widetemp industrial grade SLC SSD solution with enterprise-class features. SII Pro SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements (ATP PowerProtector technology), suited for POS, industrial computers, data center and industrial applications in mission- critical, high shock and vibration environments. Key Features • Ideal for heavy program/erase applications • High Performance with SATA III interface • Enhanced endurance with Advanced Wear Leveling algorithm • Built-in hardware-based data protection technology during power failurePowerProtector • NSA Compliant Secure Erase • Supports S.M.A.R.T. ATA feature set • MIL-STD-810G compliant • RoHS compliant and CE/FCC certification Specifications Product Name Velocity SII Pro SSD 2.5” Flash Type SLC Density 8GB to 256GB Sequential Read up to 530 MB/s Performance Sequential Write up to 440 MB/s Random Read IOPS up to 78,000 Interface SATA III 6 Gb/s Operating Temperature -40°C to +85°C Advanced Wear Leveling, PowerProtector, AutoRefresh Reliability TBW* (max.) : 21,333 TB MTBF @ 25°C : >2,000,000 hours Dimensions: LxWxH (mm) 100.0 x 69.85 x 9.2 (8GB to 128GB) 100.0 x 69.85 x 9.5 (256GB) *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. 23 SSDs ATP Product Catalog 2017 Velocity M V Utilizing MLC NAND flash components, the ATP Velocity M V Enterprise Grade SSD is the best-in-class MLC SSD solution with enterprise-class features for costsensitive clients. M V SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements, suitable for POS, industrial computers, data center and industrial applications exposed to high shock and vibration environments. Key Features • Designed for enterprise applications requiring high endurance on MLC technology • High performance with SATA III Interface • Enhanced endurance with Advanced Wear Leveling algorithm • Built-in hardware-based data protection technology during power failure – PowerProtector • NSA Compliant SecureErase • Supports S.M.A.R.T. ATA feature set • MIL-STD-810G Shock/Vibration compliant • RoHS compliant and CE/FCC certification Specifications Product Name Velocity M V 2.5” SSD Flash Type iTemp MLC MLC Density 64GB to 2TB 64GB to 2TB* Sequential Read up to 530MB/s Sequential Read up to 530MB/s Sequential Write up to 420MB/s Sequential Write up to 420MB/s Performance Random Read IOPS up to 70,000 Interface Operating Temperature SATA III 6 Gb/s -40°C to +85°C 0°C to +70°C Advanced Wear Leveling, PowerProtector, AutoRefresh Reliability TBW** (max.) : 4,267 TB TBW** (max.) : 5,120 TB MTBF @25°C: >2,000,000 hours Dimensions: LxWxH (mm) 100.0 x 69.85 x 9.2 (64GB to 1TB) 100.0 x 69.85 x 9.5 (1.5TB to 2TB)* * 1.5TB & 2TB available on a project basis. **All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. SSDs 24 Embedded Modules M.2 The ATP M.2 2242/2260/2280 Embedded SSD is the Next Generation Form Factor (NGFF) storage solution. It provides outstanding performance and proven reliability for product operation,which is perfect for networking and thin clients, also suitable for enterprise storage systems consistent data integrity requirement such as POS, industrial computers, and data center applications. Key Features • Adheres to M.2 specification v1.0 defined by PCI-SIG • Built-in hardware-based data protection technology during power failure - PowerProtector • Ultra high performance solution for small form factor embedded and industrial applications • Supports S.M.A.R.T. ATA feature set • RoHS compliant and CE/FCC certification Specifications M.2 Product Name 2242 SATAIII Flash Type SLC Density 8GB to 64GB Performance iTemp MLC 2260 SATAIII MLC Reliability iTemp MLC iTemp MLC MLC 128GB to 1TB 128GB to 1TB Sequential Read up to 530MB/s Sequential Read up to 520MB/s Sequential Read up to 530MB/s Sequential Read up to 550MB/s Sequential Read up to 550MB/s Sequential Write up to 400MB/s Sequential Write up to 150MB/s Sequential Write up to 430MB/s Sequential Write up to 450MB/s Sequential Write up to 450MB/s Random Read IOPS up to 76,000 Random Read IOPS up to 67,800 Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 70,000 SATA III 6 Gb/s -40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C -40°C to +85°C 0°C to 70°C -40°C to +85°C 0°C to 70°C TBW* (max.) : 5,333 TB TBW* (max.) : 267 TB TBW* (max.) : 320 TB TBW* (max.) : 10,667 TB TBW* (max.) : 1,067 TB TBW* (max.) : 1,280 TB TBW* (max.): 2,133 TB TBW*(max.): 2,560 TB Dimensions: LxWxH (mm) MTBF @ 25°C: >2,000,000 hours 42.0 X 22.0 X 3.5 60.0 X 22.0 X 3.5 *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. 25 MLC 32GB to 128GB 32GB to 128GB 32GB to 128GB 64GB to 512GB 64GB to 512GB Interface Operating Temperature SLC 2280 SATAIII Embedded Modules 80.0 X 22.0 X 3.5 ATP Product Catalog 2017 mSATA The mSATA Industrial Grade Embedded Module is designed for small form factor embedded and networking applications with space constraints and high performance requirements. To further ensure data integrity, the ATP PowerProtector technology allows the ATP mSATA to intelligently manage the read and write process under a sudden power failure, thus surpassing the technical and space limitations offered by existing power failure protection solutions. PowerProtector’s leaner requirements for board footprint allows for support in smaller form factors such as mSATA. Key Features • Adheres to the JEDEC mechanical specification MO-300A • Built-in hardware-based data protection technology during power failure - PowerProtector • Ultra high performance solution for small form factor in embedded and industrial applications • Supports S.M.A.R.T. ATA feature set • RoHS compliant and CE/FCC certification Specifications Product Name mSATA Flash Type SLC iTemp MLC MLC Density 8GB to 128GB 16GB to 512GB 16GB to 512GB Sequential Read up to 530MB/s Sequential Read up to 550MB/s Sequential Read up to 550MB/s Sequential Write up to 430MB/s Sequential Write up to 450MB/s Sequential Write up to 450MB/s Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 70,000 Performance Interface Operating Temperature SATA III 6 Gb/s -40°C to +85°C -40°C to +85°C 0°C to 70°C AutoRefresh, PowerProtector, Advanced Wear Leveling Reliability TBW* (max.) : 10,667 TB TBW* (max.) : 1,067 TB MTBF @ 25°C: >5,000,000 hours Dimensions : LxWxH (mm) TBW* (max.) : 1,280 TB MTBF @ 25°C: >2,000,000 hours 50.8 x 29.85 x 3.4 *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. Embedded Modules 26 Embedded Modules SlimSATA With its small size and JEDEC MO-297 standard compliant, the ATP SlimSATA with PowerProtector is an ideal solution for business-critical embedded and networking applications. Featuring a standard SATA interface and premium grade NAND flash components, ATP SlimSATA offers ultra-fast read performance of up to 550 MB/s and write performance of up to 450 MB/s. The ATP SlimSATA ofers an alternatie solutionfor embedded applications such as IPC, AdvancedTCA, single board computers, surveillance & security and networking, which have space constraints and require high performance and reliability. Key Features • JEDEC standard: MO-297(SlimSATA) compliant • Enhanced endurance with Advanced Wear Leveling algorithm • Built-in hardware-based data protection technology during power failure - PowerProtector • Supports S.M.A.R.T. ATA feature set • RoHS compliant and CE/FCC certification Specifications Product Name SlimSATA Flash Type SLC iTemp MLC MLC Density 8GB to 128GB 16GB to 512GB 16GB to 512GB Sequential Read up to 530MB/s Sequential Read up to 550MB/s Sequential Read up to 550MB/s Performance Sequential Write up to 430MB/s Sequential Write up to 450MB/s Sequential Write up to 450MB/s Random Read IOPS up to 76,000 Random Read IOPS up to 70,000 Random Read IOPS up to 70,000 Interface Operating Temperature SATA III 6 Gb/s -40°C to +85°C -40°C to +85°C 0°C to 70°C Advanced Wear Leveling, AutoRefresh, PowerProtector Reliability TBW* (max.) : 10,667 TB MTBF @25°C: >5,000,000 hours Dimensions: LxWxH (mm) *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. 27 Embedded Modules TBW* (max.) : 1,067 TB TBW* (max.) : 1,280 TB MTBF @25°C: >2,000,000 hours 54.0 x 39.0 x 4.0 ATP Product Catalog 2017 eUSB SSD Pin-Pin Replacement for Intel ® Z-U130 Value SSD The ATP eUSB SSD is specifically designed to support applications that previously used Intel's Z-U130 Value SSD such as networking, embedded, and medical applications. In addition, utilizing PowerProtector technology ensures a reliable controller and lasting NAND flash operation with a backup power circuit during a sudden power failure. Key Features • Product flexibility as a boot drive • Enhanced endurance with Advanced Wear Leveling algorithm • Built-in hardware-based data protection technology during power failure - PowerProtector • RoHS compliant and CE/FCC certification Specifications Product Name eUSB SSD Flash Type SLC MLC Density 1GB to 32GB 8GB to 32GB Sequential Read up to 30MB/s Sequential Read up to 22MB/s Sequential Write up to 27MB/s Sequential Write up to 15MB/s Performance Connector Pin Operating Temperature 9 Pins Internal USB (USB 2.0 & 1.1 compliant) -40°C to +85°C 0°C to +70°C Advanced Wear Leveling Reliability TBW* (max.) : 640 TB TBW* (max.) : 19 TB MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >2,000,000 hours Profile Standard Profile Low Profile Dimensions : LxWxH (mm) 36.9 x 26.6 x 11.5 36.9 x 26.6 x 8.4 Connector Pin Pitch 2.54 mm 2.00 mm *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. Embedded Modules 28 Embedded Modules NANODURA ATP Industrial Grade USB Drives are designed for mission-critical embedded applications with space constraints, high performance and high data retention requirements. The drives have extraordinary endurance of 60,000 program/ erase cycles, while most MLC-based USB drives on the market have less than 3,000 program/erase cycles. The Industrial Grade USB Drive is ideal for industrial applications such as medical, IPC and automation. Key Features • Enhanced endurance with Advanced Wear Leveling algorithm • 10 years of data retention for SLC-based ATP Industrial Grade USB Drive • System in Package (SIP) Technology: extreme operating temperature: -40°C to 85°C; water/moisture, vibration, shock and electrostatic discharge resistant • NSA Compliant SecureErase • RoHS compliant and CE/FCC certification Specifications Product Name USB Drive - NANODURA Flash Type SLC Density 512MB to 8GB Performance Sequential Read up to 21MB/s Sequential Write up to 16MB/s Interface Compatible with USB 2.0 (480Mbps) Operating Temperature -40°C to +85°C Advanced Wear Leveling Reliability TBW* (max.) : 96 TB MTBF @25°C: >5,000,000 hours Number of Insertions: 10,000 minimum Dimensions: LxWxH (mm) *All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications. 29 Embedded Modules 34.0 x 12.2 x 4.5 ATP Product Catalog 2017 eUSB 39.0 mm 42.0 mm 50.8 mm 22.0 mm M.2 2260 29.85 mm 22.0 mm mSATA 54.0 mm M.2 2242 32.0 mm 36.4 mm 36.4 mm 36.9 mm 26.6 mm 22.0 mm M.2 2280 SlimSATA 11.0 mm 69.85 mm 2.5’’ SATA SSD 60.0 mm 80.0 mm 100.0 mm Product Dimension (Size) Comparison 42.8 mm 42.8 mm 24.0 mm CF CFast SD/ SDHC/ SDXC 15.0 mm microSD/ microSDHC/ microSDXC Flash Solutions 30 ATP Product Catalog 2017 ATP TAIWAN(HQ) ATP USA ATP EUROPE ATP JAPAN ATP CHINA TEL: +886-2-2659-6368 FAX: +886-2-2659-4982 [email protected] TEL: +1-408-732-5000 FAX: +1-408-732-5055 [email protected] TEL: +49-89-374-9999-0 FAX: +49-89-374-9999-29 [email protected] TEL: +81-3-6206-8097 FAX: +81-3-6206-8098 [email protected] TEL: +86-21-5080-2220 FAX: +86-21-9687-0000-026 [email protected] © Copyright 2017 ATP Electronics, Inc. All rights reserved.