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Table of Contents Table of Contents About ADLINK A Global Company .................................................................................................................................................................. Design and Manufacturing Services ...................................................................................................................................... P2 P4 Technology IoT Solutions ......................................................................................................................................................................... SEMA ..................................................................................................................................................................................... SEMA Cloud ............................................................................................................................................................................. Designed for Extreme Ruggedness ....................................................................................................................................... P7 P 10 P 12 P 16 Applications Medical .................................................................................................................................................................................... Industrial Automation ............................................................................................................................................................ Transportation ........................................................................................................................................................................ Infotainment ........................................................................................................................................................................... Defense ................................................................................................................................................................................... P 20 P 22 P 24 P 26 P 27 Product Introduction and Selection Guides Computer-on-Modules COM Express .......................................................................................................................................................................................................... Type 7 Basic size: Express-BD7, Carrier Board and Starter Kit .......................................................................................... Type 6 Basic size: Express-SL/SLE, Express-BL, Express-BE ............................................................................................... Type 6 Basic size: Express-HL/HLE, Express-IB .................................................................................................................. Type 6 Compact size: cExpress-SL, cExpress-BL, cExpress-HL ........................................................................................... Type 6 Compact size: cExpress-AL, cExpress-BW, cExpress-BT ......................................................................................... Type 6 Carrier Board and Starter Kit .................................................................................................................................. Type 10 Mini size: nanoX-AL, nanoX-BT, nanoX-TC, nanoX-TCR ......................................................................................... Type 10 Carrier Board and Starter Kit ............................................................................................................................... Type 2 Basic size: Express-HL2, Express-IBE2, cExpress-BT2, Express-CVC ...................................................................... Type 2 Carrier Board and Starter Kit ................................................................................................................................. Engineering Test Tools ....................................................................................................................................................... SMARC ................................................................................................................................................................................................................... SMARC x85-based: LEC-BW, LEC-BTS, LEC-BT .................................................................................................................... SMARC ARM-based LEC-iMX6, LEC-iMX6-2G ...................................................................................................................... SMARC Starter Kits ............................................................................................................................................................. Qseven .................................................................................................................................................................................................................... Qseven Standard size: Q7-BW, Q7-BT and Carrier Board ................................................................................................... ETX ........................................................................................................................................................................................................................... ETX Module: ETX-BT and Carrier Board ............................................................................................................................. P 28 P 32 P 34 P 35 P 36 P 37 P 38 P 39 P 40 P 41 P 42 P 43 P 44 P 45 P 46 P 47 P 48 P 49 P 50 P 51 Small Form Factor Single Board Computers PC/104 ................................................................................................................................................................................................................... PCI/104 SBCs: CM3-BT4-E3845, CM3-BT1-E3815 .............................................................................................................. PCI/104-Express SBC: CM-920 and PC/104-Plus SBC: CM2-BT2-E3825 ............................................................................. PC/104 SBCs: CM1-BT1, CM1-86DX3, CM1-86DX2, CM-430 .............................................................................................. Mini-ITX .................................................................................................................................................................................................................. High Performance Mini-ITX Embedded Boards: AmITX-SL-G, AmITX-HL-G, AmITX-BE-G ................................................. Low Power Consumption Mini-ITX Embedded Boards: AmITX-BW-I, AmITX-BT-I, AmITX-IB-I .......................................... P 52 P 53 P 54 P 55 P 56 P 58 P 59 P1 A Global Company ADLINK, a manufacturer of embedded computing technology, leads the field with integration of computing power, rugged design, high availability, and industrial I/O. Dedicated to test & measurement, industrial automation, defense and aerospace, gaming, communications, medical, and transportation applications, ADLINK has made a name for itself providing reliable products of superior quality for cost-effective solutions, allowing our customers around the world to significantly reduce time-to-market burdens while increasing their competitive edge. By providing leading-edge application-ready platforms and industrial building blocks, ADLINK empowers our customers, allowing them to minimize total cost of ownership (TOC) with customization and system integration advantages, keeping manufacturing costs low and extending product lifecycles. ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including the PCI Industrial Computer Manufacturers Group (PICMG), the PXI Systems Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET). ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).ADLINK products are currently available in over 40 countries across 5 continents, supported by worldwide distribution networks and offices and over 1600 employees. P2 About ADLINK Products and Services Computer on Modules Embedded Computing With the combined experience and technical knowledge of ADLINK, Ampro Computers and LiPPERT Embedded Computers, ADLINK is able to provide a wide range of Computer-on-Modules and Small Form Factor (SFF) Single Board Computers. Our Extreme Rugged product lines have wide operating temperature ranges and meet MIL-STD shock and vibration specifications. ADLINK works closely with Intel® to ensure that we develop and introduce innovative computing technologies by implementing embedded computing roadmaps and selecting computer solutions that best fit our target markets. This enables ADLINK to provide the highest quality and performance products with the long life cycles required by our embedded computing customers. ADLINK offers Extreme Rugged COM Express modules in Basic, Compact and Mini sizes that are suited for highend graphics applications, military computers, high speed communications and other embedded applications. Computer-on-Modules COM Express SMARC Qseven ETX Network Appliances Outdoor Rugged Servers  Media Cloud Servers AdvancedTCA  6U/3U CompactPCI Platforms  VPX Blades and Development Kits Extreme Rugged Systems Embedded Flash Storage SFF Single Board Computers Measurement and Automation ADLINK's single board computers (SBCs) encompass a variety of form factors (e.g., PC/104 and Mini-ITX), processors, clock speeds, memory configurations, I/O options and operating systems. These diverse options service the IoT's varied design and budget requirements. ADLINK’s is dedicated to providing reliable, top quality products for industrial I/O control, motion control, digital imaging, data acquisition, and modular instrument applications. Our comprehensive portfolio of measurement and automation products, application ready platforms, and easy-to-use software packages, with integrated value-added service, continually meet and exceed customer requirements for industrial automation systems, machine vision systems, and automated test and measurement equipment. SFF Single Board Computers PC/104 family Mini-ITX PXI & Modular Instruments Data Acquisition GPIB & Bus Expansion Machine Vision Motion Control Distributed I/O Intelligent Computing Platforms Handheld computers SEMA and SEMA Cloud Mobile and Panel Computing ADLINK's Smart Embedded Management Agent (SEMA) and SEMA Cloud offer users the entire infrastructure required. for an industrial grade end-to-end IoT solution connecting embedded devices to the cloud. Customers do not need to develop their own cloud solution, avoiding laborious checking of hardware compatibility, finding a suitable cloud server, implementing data encryption or developing proprietary communication protocols. In addition to individual devices, SEMA Cloud includes encrypted data transfer to our cloud infrastructure and an intuitive graphical user interface (GUI) to monitor and/or control devices from any location at any time via the Internet. ADLINK is dedicated to providing rugged mobile and panel computing products for industrial applications, including industrial automation, logistics management and medical. We specialize in meeting the needs of harsh and demanding environments, as well as mobile deployments in industrial settings. Tablet PCs Industrial Monitors and Panel Computers Medical Monitors and Panel Computers Industrial Grade Cloud Solution SEMA and SEMA Cloud P3 Design and Manufacturing Services To fulfill your requirement of high quality, cost-effective products, with quick time to market in product development, ADLINK has established and assembled an Design and Manufacturing Services team to cater to the specific demands that off-the-shelf products could not meet. From embedded computers, data acquisition cards, and CompactPCI systems to related software packages, our DMS design team has the expertise to rapidly prototype upon the approval of finalized specifications. In addition, the winning of ISO-9001 certification ensures the exactitude of our research and development procedures with the highest product quality. ADLINK owns and operates the manufacturing facilities in our Asia headquarters. Complete capabilities include our own PCB layout teams, SMT lines, system integration, and test capabilities. In short, ADLINK controls the whole manufacturing process, from layout and design to prototyping and volume production. Customer Services ADLINK is not only devoted to providing local service worldwide, but also to providing convenient online service, The following services are available around the clock on the Internet. eRMA ADLINK customers can send their RMA requests via our eRMA system. After obtaining an RMA number, you can track your RMA status online at any time. Partner Center The ADLINK Partner Center is specifically designed for worldwide sales and marketing support to allow our global sales representatives and distributors access to real-time product and marketing information and materials as soon as they are released at ADLINK headquarters. More than a resource database, the ADLINK Partner Center will also facilitate your business in serving customers. Ask An Expert This is the place to get help for ADLINK products. 'Ask an Expert' provides answers to commonly asked questions, or you can click on the 'Ask a Question' tab to contact ADLINK's knowledgeable staff about a specific product or issue. ADLINK AAE (Ask an Expert) is available 24/7 online and is staffed by dedicated professionals who are available to address customers' needs and answers question. All issues and comments are recorded into a database and can be tracked/reviewed at anytime. ADLINK customers are invited to access the AAE system at: http://www.adlinktech.com/AAE P4 About ADLINK Environmental Protection Policy ADLINK implemented a Green Product Policy in May 2004 to align the purchasing and use of green products meeting requirements from international environment protection statutes. Environmental protection is a top priority for the management at ADLINK. Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless process, the affect on the environment of components and raw materials will also be reduced. The Green Product concept has been built into our new product development system to ensure protection of the environment and continued business success. RoHS Compliant Computing ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive, which restricts the use of harmful substances such as lead, mercury and cadmium in new equipment. Most end-user applications in which ADLINK products are used do not require RoHS compliance. However, ADLINK will actively work with customers whose products are not RoHS exempt under category 8 or category 9 classifications. Our lead-free production line and process, including solder paste, solder bar and process control parameters, has been developed and standardized in our manufacturing system. Conflict Free Minerals Policy ADLINK will not knowingly procure material supplies and components that contain minerals that directly or indirectly finance or benefit armed groups in the Democratic Republic of Congo (DRC) or an adjoining country. We urge our suppliers to support this policy in their own procurement guidelines and provide us with accurate country of origin information. ADLINK shall: Comply fully with requests from EICC-GeSI. Conduct a reasonable country of origin inquiry to clarify the origins of the Gold, Tantalum, Tungsten and Tin used in our products. Establish reasonable objectives and targets with a goal of ascertaining and minimizing ADLINK's risk. With a goal of continuous improvement for our Conflict Free Minerals Program, develop a means to measure objectives and targets. ADLINK will also review, revise and report these measures, and overall program updates, on an annual basis. Empower all employees, suppliers, vendors and contractors to take ownership in complying with the Conflict Free Minerals Policy and to escalate risks in the supply chain to management's attention. Effectively communicate to all employees this Conflict Free Minerals Policy and our Conflict Free Minerals Program. Management Flow The management flow of ADLINK's Green Policy begins during the development stage of a product. Only parts and raw materials that meet RoHS requirements are sourced. Our engineers specifically design products using only qualified components. A lead-free process ensures that manufactured products are "green." Green products do not contain environmentally hazardous elements and can easily be recycled. REACH Declaration The Registration, Evaluation, Authorization and Restriction of Chemicals Regulation 1907/2006, commonly referred to as "REACH", is Europe's new chemicals legislation. The products that we supply are non-chemical products and under normal and reasonable use, they will not release harmful substance. Furthermore, we will immediately inform you in correspondence to REACH-Article 33 if any substance of content (as from a content of >0.1%) in our products will be classified alarming by the European Agency for Chemicals ECHA. P5 IoT Solutions IoT Solutions with Proven Building Blocks, Intelligent Gateways, and Cloud-Based Remote Management Embedded platforms are in transformation, evolving from standalone compute systems to becoming part of the Internet of Things (IoT). More than just Internet-enabled, these intelligent systems are networked and communicating, gathering and sharing information that enables insight and solves problems. Improving healthcare, enabling intelligent transportation systems, and modernizing manufacturing, intelligent IoT devices are delivering benefits to a wide range of industries, empowering business transformation all over the world. While the concept of sharing and analyzing business information is not new, the IoT leapfrogs piecemeal, proprietary data applications by enabling time-sensitive data capture, access, analytics and action with standards-based third-party vendor solutions. Software, hardware and end-user applications work together in real-time to expand network access, functionality and intelligent performance to unlock data that was previously hidden. Now capitalizing on the business value of real-time data analytics is no longer limited to enterprises with the resources to develop their own proprietary systems. Through proven, standardized system components, today's IoT is flexible, widely deployable, and already enabling intelligent data applications in the mainstream business world. ADLINK's standards-based building blocks enable compact, rugged devices for non-stop data gathering; high performance gateways for securely connecting devices and systems for effective real-time communication of data; and secure cloud services for ensuring system health and performance. End-to-end solutions to build your IoT ADLINK offers a full range of products for the IoT ecosystem from edge devices to cloud control centers, including I/O modules, embedded modules, embedded systems based on industry standard form factors, mobile computers, network infrastructure, and cloud services to help you to create your own IoT. We provide Application Ready Intelligent Platforms and services to support and distinguish you with fast time-to-market and reduce development efforts of new applications. ADLINK also works closely with our customers to understand their unique requirements for individual devices or end-to-end solutions, and helps customers to solve the development challenges of their particular market. Create business value with intelligent and central management ADLINK's embedded building blocks and systems have ADLINK's Smart Embedded Management Agent (SEMA) and SEMA Cloud capabilities built-in to enable those devices for remote management and the data exchange to and from the cloud. SEMA Cloud allows you to securely and remotely monitor system status, diagnose problems and handle system management tasks from anywhere at any time over the Internet. With the convenience of integrated remote monitoring, control and configuration using SEMA Cloud, you can collect and analyze all the data on a unified platform and transform it into business insights to drive operational efficiency. High bandwidth network infrastructure for big data processes The network infrastructure plays a critical role as the connectivity platform for control and operational systems, sensors, machines, and devices in the Industrial IoT. It must provide secure and high bandwidth pathways able to support billions of connected devices, people, processes. ADLINK's industrial networking products for network infrastructure offer the outstanding communications capabilities that are necessary to handle the needs of big data for today and into the future. P6 Technology Remote Management Has Broad Business Value Remote management through the SEMA Cloud delivers broad business value; ready access to system health is now available to all industries, and can be implemented in nearly any embedded arena. For example, a telecommunications base station can be serviced prior to failure or key parts to refrigeration equipment can be replaced upon prediction of performance issues. Likewise, HVAC maintenance can be scheduled according to the actual system usage, rather than being performed on a fixed schedule. System monitoring and management services also add a revenue-generating opportunity to the IoT. Instead of end-users handling system management in-house, IoT providers can outsource monitoring, management and maintenance of devices and systems to provide greater convenience and higher efficiency for their customers. IoT value extends even further as data can be used to improve business operations beyond equipment maintenance. With real-time data, operators understand how machines are used and can apply appropriate actions. Machines can be shut down during periods of low of user activity, rerouted to support increased demand, or restocked quickly to meet customer preferences. Centralized Cloud Access Adds Business Value Intelligent middleware and web-based services, such as ADLINK’s Smart Embedded Management Agent (SEMA) remote management interface working together with the SEMA Cloud, facilitate the pushing and pulling of data in real-time for anytime, anywhere access. Pushing data to the cloud enables operators to verify, monitor and manage system performance from a single, central location improving reliability and reducing management costs. For example, the M2M stack in SEMA Cloud pushes system data to the cloud server via any kind of TCP/IP connection. System managers have easy and secure access to data and analytics through any commercial cloud portal, using any device (e.g., PC, tablet, smart phone). Cloud-based remote management furthers system management by enabling observation anytime, anywhere. Embedded management agents continuously upload data through an encrypted Transport Layer Security (TLS, the successor protocol of Secure Sockets Layer or SSL) connection. This information can be displayed on the user's information dashboard, for example temperature and power consumption for different parts of the embedded system. SEMA Cloud and the always-on IoT framework together enable a new level of system reliability, preventing downtime more effectively than previously possible for offline devices. Operators can proactively interact with the system, detecting potential issues in advance, as well as responding quickly to system failures. P7 IoT Enables More Intelligent Application of Data The Internet of Things is enabling devices and systems to collect and share data to enable real-time business value. Yet, the IoT’s complexity and cost have been daunting enough to restrict deployments to only those firms who can afford to develop their own proprietary systems for data analytics. To date, the market has remained fragmented, costly and without standardsbased solutions. Connected systems can do more by using the intelligence produced by embedded processing in realtime. With centralized data and sophisticated analytics, volumes of previously unused or archived data can now add immediate business value. IoT end-user data can fuel modern applications like smart cities, automated factories, in-vehicle safety systems, intelligent transportation, energy grid automation, and connected health services. Using ADLINK’s comprehensive framework for standards-based IoT functionality, more industries can embrace IoT business advantages. IoT development and deployment are much simpler, devices and systems get to market much more quickly, and risk is removed from the equation. Allied with Intel and supported by both a rugged design pedigree and real-world IoT experience, ADLINK is superbly poised to help developers and OEMs innovate high performance IoT designs. Standards-based Technology Enables Mainstream IoT Intelligent data-gathering devices are enabled by small, high performance building block components; intelligent gateways provide ready-made platforms to ensure connectivity that effectively moves the data; and innovative cloud services optimize non-stop data access and system health analytics. IoT Gateways The IoT requires effective communication between distributed intelligent devices and the network or cloud infrastructure. ADLINK’s gateway solutions provide a pre-validated hardware and software platform for sharing data from device-to-cloud - enabling device security, smart connectivity, rich network options, and powerful device management. ADLINK’s embedded IoT gateway platforms provide an extremely compact footprint, with options based on the Intel® Quark™ SoC X1000 Series and Atom™ SoC E3800 processors. Communications options are flexible, and ADLINK’s platform supports a spectrum of options such as Wi-Fi, 3G and LTE. Integration with McAfee Embedded Control provides complete protection from unwanted applications, including comprehensive change policy enforcement and compliance management. This simple, lightweight software technology is essential to securing IoT and also makes IoT devices resilient to malware infections and attacks. Combined with ADLINK’s Smart Embedded Management Agent (SEMA) Cloud, system operators have both the remote manageability and security critical to IoT deployments. ADLINK’s new family of intelligent gateway solutions supports Intel® Gateway Solutions for IoT, a family of platforms designed to connect a wide range of devices. What makes them intelligent? ADLINK’s gateway solutions are built on open architecture to ensure interoperability between systems, enable wide application development, and allow easy services deployment. These platforms include scalable Intel-based microprocessors for low power performance, and integrate a Wind River operating system and middleware that provides all critical elements to manage and communicate with IoT devices. Developers are enabled with a sustainable and secure software development environment based on the Wind River Intelligent Device Platform XT. This development tool features preintegrated components that are fully tested Factory Performance Optimization and Process Control Monitoring and ready-to-use in securing, managing and ADLINK's embedded IoT gateway platform with rich IO interfaces, allowing connection to a wide variety of devices connecting intelligent gateways. for automated data collection and analysis enables active early warning systems to avoid unexpected downtime in industrial automation. P8 Technology Enabling IoT Devices with Proven Building Blocks More than a standalone system or typical handheld device, IoT systems and devices function as part of a larger application. These smart devices gather data through sensors and user applications and can vary dramatically in terms of form and function. A handheld device used to track fleet management activities, an intelligent safety system within a smart vehicle, a computerintegrated manufacturing (CIM) solution capturing production data on a factory assembly line - these “things” and many more like them all have a potential role in bringing IoT value to global business. An IoT device does not have to be handheld or mobile, and is essentially any computing engine in an endpoint solution that enables that solution to be intelligent and connected. An IoT device can be the hardware/software solution inside the dashboard of a car that enables automation via a mobile app. A device can live inside a pharmaceutical vending machine, accessing a cloud database to retrieve secure patient data required to dispense prescriptions. For developers, the challenge depends on the application. IoT devices and systems may need to be low power or high performance. For cost effectiveness, they consistently need to be flexible, upgradable, rugged, manageable, and standards-based. Computer-on-Modules Small IoT devices are often based on Computer-on-Modules (COMs), enabling performance and versatility in a very small footprint. ADLINK’s COMs address a spectrum of power and performance options in standards that include COM Express®, Qseven® and SMARC® (Smart Mobility ARChitecture). These solutions provide solid options for graphics-intensive, mobile, applications, such as medical imaging and emergency response. PC/104 Single Boards Computers and Mini-ITX Embedded Boards ADLINK’s single board computers (SBCs) encompass a variety of form factors (e.g., PC/104 and Mini-ITX), processors, clock speeds, memory configurations, I/O options and operating systems. These diverse options service the IoT’s varied design and budget requirements, bringing field-proven reliability and performance to connected, intelligent platforms such as in-vehicle and infrastructure applications in transportation applications. Processor Blades ADLINK offers rugged, blade-based technology in multiple form factors to serve a variety of industries: CompactPCI® for intelligent transportation applications such as networked security and safety, or vehicle control and diagnostics; AdvancedTCA® for next-generation telecom and datacom applications such as video transcoding, packet processing and 4G/LTE backup; and a VPX product line to meet the demands of rugged environments in military applications where size, weight, and power (SWaP) matter. Industrial I/O and Control Systems ADLINK has extensive field experience and works closely with customers to understand their requirements in industrial automation design. The IoT data acquired by ADLINK’s various I/O modules and systems, including data acquisition (DAQ) cards, remote I/O modules, and digital imaging, are designed for all manner of industrial settings and keep production running smoothly and safely. Industrial Tablets ADLINK's industrial tablets enable faster time-to-market and reduced development costs for system integrators. With integrated WWAN or WLAN capability, real-time IoT data can be accessed easily anywhere to monitor and control equipment and optimize operation performance in factories, asset tracking and building automation. P9 SEMA Intelligent Middleware to Monitor and Control your devices Downtime of devices or systems is not acceptable in today's industries. To help customers to analyze their systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded Management Agent (SEMA). SEMA Overview Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every ADLINK computer-on-module (COM), single board computer (SBC) and MiniITX product is equipped with a Board Management Controller (BMC) device supporting SEMA. Selection of SEMA Board Controller Functions Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features throughout the years. Measuring system voltages and currents, controlling fan speed, accessing GPIOs and I2C bus are only a few examples of these new capabilities. Being compatible with the latest PICMG Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA to nearly zero! On top of that SEMA provides an extended set of functions e.g. to show and control CPU Operation Mode, to read out HDD S.M.A.R.T. data or to read out a comprehensive set of system data. Functional Overview Providing the interface from the hardware to the operating system is one of SEMA's most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the I2C driver and the Extended EAPI the application layer fetches the data and presents it to the user. The application can be a local customer specific implementation or the SEMA Dashboard which can access the Extended EAPI also remotely and which shows the data in userfriendly graphic interfaces, suitable for supervision and troubleshooting. Application Layer Your Application Extended EAPI Extended EAPI Library Driver Layer I2C Protocol Hardware / Firmware Layer BMC Controller P 10 SEMA Application (Dashboard) I2C-bus Chipset Technology SEMA Features At the heart of SEMA is the Board Management Controller (BMC) supporting SEMA functions. The SEMA Extended EAPI provides access to all functions then. And a webbased Dashboard allows to monitor remotely one or multiple devices / computer modules. So SEMA comprises: SEMA Board Management Controller HW and FW SEMA Extended EAPI Library SEMA Dashboard SEMA supports the following functions and information: CPU Operation Modes User Area Access Memory Information Alerts for Power and Temperature Consumption Network Information I2C Bus Control ACPI Power Management Temperatures(CPU and Board) HDD S.M.A.R.T Bios Updates Board Information (Serial Number, Part Number, Firmware Version...) Heartbeat Fan Control Power Consumption GPIO Control Forensic information is available after system or module failures includes minimum and maximum temperature of the CPU and system, as well as HDD S.M.A.R.T information - all of which can be used to analyze system or module failure. SEMA is available for Linux and Windows operating systems and for various HW platforms. Intelligent Middleware Online Portal MXE-500i-9245 iMX6-9365 TLS/SSL TR50 HTTPS Custom Data P 11 SEMA Cloud The End-to-End Iot Application Enablement Platform Downtime of devices or systems is not acceptable in today’s industries. To help customers to analyze their systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded Management Agent (SEMA). By combining SEMA intelligent middleware with cloud connectivity, ADLINK takes remote management technology a step further than previous generations. By employing full connectivity, from edge to cloud to end application, SEMA-enabled embedded devices can connect to the cloud without additional design requirements. Pushing data to the cloud enables operators to verify, monitor and control system performance from a single, central location – improving reliability and reducing management costs. Manage and control all devices with one click Avoid system downtime by predictive maintenance Integration of operational device data to business processes Reducing the Total Cost of Ownership Manage and control all devices with one click Integrate an unlimited number of devices into the SEMA Cloud service Monitoring and control all devices from anywhere at anytime Reduce downtime and increase system reliability Avoid system downtime with Predictive Maintenance Proactively respond as irregularities are identified Automatic event processing avoids system downtime Assign threshold to any kind of data Assign alerts when thresholds are crossed Stay informed about irregularities by SMS and email Notifications Integration of operational device data to business processes vertical networked/ integration of embedded systems with business processes -> interface to ERP systems (e.g. SAP, SQL) Reducing Total Cost of Ownership Concurrently run common tasks for predefined groups of devices Remotely apply Software and Firmware updates to devices Save costs by avoiding on-site maintenance. Being a holistic solution, ADLINK’s SEMA Cloud is an IoT Application Eablement Platform offering users the entire infrastructure required. Customers do not need to develop their own cloud solution, avoiding laborious checking of hardware compatibility, finding a suitable cloud server, implementing data encryption or developing proprietary communication protocols. SEMA Cloud is based on ADLINK products. In addition to individual devices, it includes encrypted data transfer to our cloud infrastructure and an intuitive graphical user interface (GUI) to monitor and/ or control devices from any location at any time via the Internet. P 12 Technology ADLINK devices All SEMA-enabled ADLINK products feature a Board Management Controller (BMC). The BMC collects all relevant data from the chipset and other sources and provides it to a software layer, which prepares the data and transfers it to the cloud via encrypted communication (TLS). Devices transmit data via Ethernet , Wireless LAN or / cellular network to the cloud Integrate external sensors using a Software Development Kit (SDK) Integrate exernal devices via MQTT/TR50 protocol using an easy to use web application programming interface (WebAPI) Additional customer data can be transferred While Embedded Computing and Measurement and Automation Solutions form ADLINK’s core offerings for many vertical markets, ADLINK is also focused on developing gateways to implement the Internetof-Things (IoT). Smart gateways collect data from sensors, which are not capable of autonomously transferring information to the cloud. These gateways require a wide range of different interfaces and the relevant communication protocols to provide the connection between sensors and the cloud infrastructure. So that legacy devices can be included, rarely used and uncommon may need to be accommodated. Intelligent filtering of data by gateways reduces the bandwidth required. ADLINK´s Global Cloud Server Infrastructure ADLINK’s cloud services meet the highest safety standards and the highest demands on reliability. ADLINK´s cloud services are hosted in Germany. Other locations in USA and Japan can be offered on request. Customers have the following key functions at their disposal: ADLINK´s SEMA Cloud Gateway/Agent The SEMA Cloud Gateway offers the ability of a device to interwork with the Cloud Server. The SEMA Cloud Gateway provides an Operation Rule Processor and a local data base, so it is possible to execute rules and analysis of data and to take action locally on device already before data is transferred to the cloud. If the devices lose the connection to the cloud, it will recognize the lost connection and will store all data until the connection is reestablished. The contact of the devices for transmitting data can be planned. At pre-defined times the device establishes a connection to the cloud and sends or receives data. That is possible for 2G/3G/4G connections. ADLINK´s Cloud agent is running on the most popular embedded OSes. It is available for Windows, Linux and Android in 32/64Bit and it is usable on x86 and ARM architectures. Operation Rule Processor: executes rules and analysis locally on the devicen the device Not-always connected mode (2G/3G/4G) Device Management Manage connected devices with unique ID Monitor data connection for quality and reliability Re-establish connection and collect buffered data if connection has been lost Store the data from field clients (optional) SDK for customer specific data connect your own sensors to devices push your own data from device to the cloud Data Management Store the data from field clients in cloud database Connection Management, including server availability and traffic control Interface to ERP systems (e.g. SAP, SQL) Download of any kind of files to one or multiple devices, e.g. to perform Firmware upgrades Event Processing Analyze device and sensor data using defined rules for device and data type Trigger SEMA calls when preset threshold values are exceeded (e.g. send SMS or email notification, initiate system shutdown) Operation Rule Processor: rules can be processed on cloud platform and locally on device level. P 13 The Architecture of SEMA Cloud Use Case: Vending Machines The following scenario demonstrates the various functions of ADLINK’s SEMA Cloud services, highlights potential savings and illustrates its benefits. Use Case: Vending Machines Vending machines have been in use by retailers for many years as self-serve solutions to sell beverages, snacks, and tickets to consumers. In recent years, vending machines have proliferated both in numbers and diversity. They can be found in many public locations as well as private facilities, selling different types of goods and services. They are also becoming more and more intelligent, supporting better user interfaces and offering more selection. Situation High cost of maintenance and support (software updates, troubleshooting and repairs) Revenue loss when a vending machine goes out of order These challenges can be met with an Internet of Things (IoT) solution enabled through two-way communication between vending machines and a cloud server. In the machine-to-cloud direction, hardware status information and business data are periodically sent to the cloud server. Hardware status information is processed in real-time for health assessment and failure detection. Data is stored in a database for further analysis and modeling. In the cloud-to-machine direction, commands and data can be sent to manage, control, and configure the vending machines. This includes performing remote diagnostics as well as pushing software updates to all devices as required. Solution Architecture Shown below is the end-to-end architecture of the Vending Machine Management and Analytics solution based on hardware, software, and cloud technologies from ADLINK. In this solution, new and/or legacy vending machines are connected to the internet via broadband or wireless connection. Data from vending machines are then aggregated and stored on the cloud. From there, the data can be accessed via web-based dashboard, or retrieved by external applications for analytics purposes. Commands and data can also be sent from the cloud to remotely manage and control the vending machines. The key building blocks of the solution are: Intelligent vending machines based on an ADLINK board/module or custom solution, collecting device data and supporting remote management, control and configuration. ADLINK IoT Gateways, aggregating data from multiple vending machines and connecting securely to the cloud. ADLINK SEMA Cloud solution, enabling edge-to-cloud integration and supporting cloud-based management of vending machines and real-time monitoring of machine data. ADLINK SEMA Cloud WebAPI IoT Solution Benefits Retailers have the most to benefit from this IoT solution for vending machine management and analytics. Operational expenses are significantly lowered due to reduced resources directed at on-site care, maintenance and repairs. Moreover, Internet based monitoring helps to optimize delivery schedules and streamline logistics. Business performance will also greatly benefit from an increase in vending machine uptime. Pricing of sold goods can be dynamically adjusted and simplified inventory tracking helps optimize the range of available goods. Last but not least, increased transparency improves business insights into the entire sales process. P 14 Remote Monitoring, Control and Diagnosis Report Business Data Firmware Updates Technology Environmental Protection Policy ADLINK implemented a Green Product Policy in May 2004 to align the purchasing and use of green products meeting requirements from international environment protection statutes. Environmental protection is a top priority for the management at ADLINK. Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless process, the affect on the environment of components and raw materials will also be reduced. The Green Product concept has been built into our new product development system to ensure protection of the environment and continued business success. P 15 Designed for Extreme Ruggedness Introduction By merging with Ampro in 2008, a wider selection of products and services is provided to ADLINK customers, as well as the opportunity for ADLINK to develop more rugged devices aimed at new markets. The addition of Ampro enables ADLINK to offer Extreme Rugged products and services for applications that must endure the extremes of temperature, shock, and vibration encountered in harsh environments. For a quarter century Ampro was a leading global provider of modular embedded computing solutions for rugged and extreme rugged applications. Ampro's mission was to provide time saving solutions for embedded systems designers that accelerate the product deployment process. Applications ADLINK has Extreme Rugged™ and rugged grade embedded solutions for extended temperature range operation and high shock & vibration environments in a wide variety of markets. Medical ADLINK boards and systems are utilized in a variety of medical applications and delicate procedures. Our products adhere to the strictest of medical standards and provide unsurpassed reliability. Defense Extreme Rugged™ boards withstand intensities of military environments. With the ability to endure temperatures from -40°C to +85°C, our boards are able to perform precisely in harsh conditions experienced all over the world. Industrial ADLINK’s broad range of form factors provide scalability in performance, connectivity, size and energy requirements along with modular flexibility, longevity and ruggedness to ensure our products meet customer needs. With designs based upon open standards, ADLINK boards and systems are easy to maintain and upgrade. Aviation ADLINK single board computers (SBCs) and computer-on-modules (COMs) easily perform under the extreme conditions of flight. Able to operate at temperatures from -40°C to +85°C, our Extreme Rugged™ boards easily withstand the conditions experienced at high altitudes. Transportation Moving people and goods from one place to another is a critical part of every society. One mistake can cause a ripple effect through an entire economy. In both public and private transportation, ADLINK boards provide rugged quality and comprehensive data processing. P 16 Technology Design Methodology True Ruggedness by Design Many manufacturers claim to offer ruggedized products that give the impression of durability under tough conditions. The term ruggedized often refers to desktop grade designs which are screened at high temperatures with high yield fallout. At ADLINK, we believe that ruggedness should be inherent in the design. Our products are designed for industrial use, unlike many competitors who make commercial-grade products and target the industrial market. Our Extreme Rugged boards and systems are designed for harsh environments from the ground up. Extreme Rugged Development Guidelines and Design Rules are incorporated into ADLINK products to "design in" the ability to withstand wide temperature range operation and extreme shock & vibration. Special attention and care is given to component selection; circuit design; PCB thickness, layout and materials; thermal solutions; enclosure design; and manufacturing process. Robust testing, including the Highly Accelerated Life Test (HALT), ensures that products meet the rugged design requirements to allow them to satisfy the demands for which Extreme Rugged products are intended. All products with the Extended Temperature option are then burned in with the ETT Production Screening process to ensure long term reliability over the full Extreme Rugged temperature range Highly Accelerated Life Test – HALT ADLINK rugged designs are verified using HALT during the product development process. The process consists of progressively increased extremes of temperature (both high and low), rapid thermal transition, six-axis vibration, and finally, combined temperature and vibration stress. During each test, stress is progressively increased while key subsystems are exercised, such as the CPU, I/O ports, disk controllers and video. If a failure is detected, the failure is evaluated and immediate fixes are made. Testing continues until destruct limits are reached. Failures and the physical damage found at the destruct limits provide data which is used to improve the ruggedness of the product design. HALT test reports for the final product are available for customers to review. These reports are very useful for demonstrating the design reliability of ADLINK products to customers with wide temperature range requirements and high shock & vibration applications. P 17 Shock & Vibration ADLINK Extreme Rugged boards implement the following to meet shock and vibration requirements: Thicker circuit boards High retention capability sockets Test fastening of all high mass components Epoxy reinforced bonding of vulnerable components (if required) Immersion silver plating Extreme Rugged board products are shock and vibration tested to meet the MIL-STD-202G standard. This includes subjecting the product to multiple 50 G shocks and 11.95 Grms of random vibration between 100 Hz and 1000 Hz along each axis. The units under test are operational during vibration testing, with functional diagnostics performed on all hardware subsystems. After shock stresses have been applied, the products are tested for functionality. Extreme Rugged systems are subjected to MIL-STD-810G vibration tests for operational service in ground vehicles and functional shock tests. Voltage and Temperature Margin Test The Voltage and Temperature Margin Test suite is used during the product development process to subject the product to temperatures well outside the intended operating temperature range (-40°C to +85°C for Extreme Rugged products†). The product is simultaneously subjected to minimum and maximum rated voltages (±5%). This process verifies products are functional and stable over combined extremes of both temperature and voltage, and ensures wide design margins resulting in long-term reliability under all specified operating conditions. Extended Temperature Testing Assures your product will function in extreme temperatures ADLINK Extreme Rugged products are designed for operation over an extended temperature range. To ensure optimal performance and reliability of our products, Extended Temperature Testing (ETT) procedures are implemented over the entire product development cycle. The following table outlines the ETT procedures followed during design, engineering verification and pilot run. Design Check Verify that the board can function over and beyond the full extended temperature range by performing Functional and Burn-In tests at lower and upper temperature extremes. Engineering Verification Verify that the board design meets extended temperature range and voltage margin specification (perform Functional, Burn-In & Boot Up Tests over full extended temperature range), apply Thermal Shock Test. Pilot Run Verify that the board is ready for production (perform functional tests and burn in, determine ETT yield) ETT Production Screening Step 5 Step 4 Step 7 Step 6 ‒ 85°C ‒ 1.2 °C/min 1.7 °C/min 1.5 °C/min ‒ 25°C ‒ ‒ 0°C ‒ ‒ -40°C ‒ Duration (minutes) 2 mins 40 mins 25°C 25°C → - 40°C Power On 10 mins 20 mins – 40°C Power Off Initial Check Temp Drop P 18 Step 3 Step 2 Temperature ( °C ) ADLINK boards and systems are sold with a "Standard" or "Extended" temperature rating. To obtain the "Extended" temperature rating (-40°C to +85°C for most Extreme Rugged board products), customers must order the optional Extended Temperature Testing (ETT) service. Each "ETT" unit will be tested in production to verify that it will operate over the specified temperature range. A label is applied to the product to indicate that it has met the "Extended" temperature rating and the test results are entered into a database. The data collected is used for internal quality assurance audits and customers may request summarized test results of their product. The screening profile used for this test is shown in the graph below. Step 1 Soak Power On Burn In 70 mins 10 mins Power Off Temp Rise 20 mins 85°C – 40°C → 85°C Power On Soak Burn In 50 mins 10 mins Power Off Temp Drop 20 mins 25°C 85°C → 25°C Soak Power On Burn In Technology Conformal Coating Prevents short circuits, corrosion, dendritic growth and electromigration Industrial, military, naval and airborne applications often expose boards to corrosive conditions including humidity, salt spray, fungus and other contaminants. Conformal coating, a protective material applied over electronic circuitry, can prevent short circuits, corrosion, dendritic growth and electromigration of metals between conductors. Based on Ampro’s proven heritage, ADLINK’s conformal coating process has provided enhanced reliability and corrosion protection for over 20 years. The coating is applied by spraying, dipping or flow coating the circuit board assembly. This coating is typically three mils (0.003”) thick. ADLINK generally uses HumiSeal 1B31 Acrylic coating, although epoxy, urethane, paraxylylene and silicone based coatings are also available upon request. Acrylic coatings are fast drying and offer high moisture resistance, excellent flexibility and superior dielectric properties. The coating is also easy to repair, and usually contains a UV safety tracer for ease of inspection under a black light. Extended Life Cycle To support your ongoing production needs, the Lifecycle SolutionsSM program has been created for ADLINK products. From component selection to strategic partnerships to component lifecycle management, ADLINK goes the extra mile to ensure that standard, semi-custom and custom boards can be produced with no more than minor changes for years to come. When changes are necessary, ADLINK provides advance notification and guidance through the transition to new hardware or BIOS extensions. And our dedication to industry standards enables us to provide new products and product roadmaps that enable smooth resolution of end-oflife (EOL) migration issues. The Lifecycle SolutionsSM program offers numerous long-term benefits, including: ADLINK strives for a 7-year lifecycle for standard and semi-custom boards and systems. During that period, ADLINK builds boards with the same components. ADLINK provides 60-day written notice of necessary changes that affect form, fit or function of the board. For End of Life (EOL) products, ADLINK gives you as much notice as possible to place orders and up to one full year to receive shipments. ADLINK secures long-term commitments from component suppliers before components are designed in, and works closely with manufacturers and distributors to ensure long-term availability. When suppliers notify us about upcoming component obsolescence, we determine migration alternatives and work with you early on rather than delaying notification that can result in higher costs and inconvenience to you. MIL-STD MIL-STD is an abbreviation for United States Military Standard. These standards are used to help achieve standardization objectives by the U.S. Department of Defense. Each standard has a number and a revision denoted by a letter of the alphabet (e.g. A, B, C, …). Boards: Extreme Rugged board products are tested in accordance with MIL-STD-202G, the Department of Defense Test Method Standard for Electronic and Electrical Component Parts: Vibration: MIL-STD-202G, Method 214A, Table 214-I, Condition D (Operating: 11.95 Grms, 50-2000 Hz, each axis) Shock: MIL-STD-202G, Method 213B, Table 213-1, Condition A (Non-operating: 50 G peak value, 11 ms duration, half-sine) Systems: Extreme Rugged system products are tested in accordance with MIL-STD-810G, the Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests: Vibration: MIL-STD-810G, Method 514.6, Procedure I, Category 20 – Ground Vehicles Shock: MIL-STD-810G, Method 516.6, Procedure I – Functional Shock (Operating: 40 G, 11 ms) P 19 Medical Optimized Patient Treatment Powered By Computeron-Modules ADLINK’s intelligent platforms and Rugged by Design technologies are purpose-built for healthcare settings, improving patient diagnosis and treatment options, and giving designers a competitive edge with scalable, reliable solutions optimized for the rigors of modern medicine. For medical device developers and manufacturers, ADLINK is your complete supplier of intelligent embedded products. Development time is reduced, and medical device manufacturers can focus on their core competencies in creating competitive, high performance healthcare applications. Applications Ultrasound Operating room Ambulance-based telemedicine Patient’s Information System Mobile medical devices Bed-side care and entertainment Benefits Saving lives in real-time Flexible and robust Long lifecycle support Accelerate time-to-market Related Products P 20 Express-SL cExpress-SL nanoX-AL COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™ and Celeron® Processors COM Express Compact Size Type 6 Module with 6th Gen Intel® Core® and Celeron® Processors COM Express Mini Size Type 10 Module with Next Generation Processors Applications Enabling Longevity with Extended Product Lifecycles and Predictable Roadmaps Medical designers are driven by the need for rapid product development that includes well-defined products that also offer extended lifecycles. Medical design expertise and industry knowledge are key factors in achieving such product attributes. Trusted partnerships support the competitive designs through shared engineering knowledge and expertise. The extended lifecycles are achieved by combining careful component selection, BOM screening and, if necessary, our supply chain manages the end-of-life (EOL) materials to meet product needs. Our in-house design and development capabilities expertly support engineers in long-life solutions, including product planning and managing EOL transitions. Product lifecycles of seven years are typical for most products, and event longer on a case-by-case basis. Flexible, Robust Platforms Create Medical Market Advantage With a strong understanding of how to design for patient safety, ADLINK's medical industry offerings range from low power, batterydriven, portable diagnostic systems to fixed-installation systems delivering extreme processing for high-definition imaging. ADLINK's market advantage is our ability to facilitate the right solution at the right level of performance, including design and development expertise. Our customers are expertly supported by our highly skilled team of hardware and software engineers, trained and knowledgeable in the applications and concerns facing medical designers.Our SMARC modules are designed for portable or small stationary systems with application scenarios especially for medical diagnoses and are especially designed suited for medical systems requiring high performance graphics. COM-based Mobile Platforms Enable Healthcare Anywhere Advancements in medical imaging are broadly improving diagnosis and treatment options, with particular value in mobile healthcare applications. As performance-to-power ratios advance with processor improvements, a wider range of mobile and visual applications can capitalize on advanced graphics in portable devices, enabling better real-time analysis and diagnostics. ADLINK’s latest COM Express products incorporate the latest processors, enabling significant improvements over previous processor generations. Advanced power capabilities allow designers to customize power-to-performance ratios to suit specific applications. New low power states extend battery life and improve cooling options for mobile applications, allowing passive cooling with no venting or fans. Quality through Certifications ADLINK employs a state-of-the-art quality assurance system and all facilities are ISO-9001 certified. Many of the products have received 60601-1 as well as UL, FCC, CSA and CE certifications. In addition, ADLINK's own manufacturing site is ISO 13485 certified, providing the necessary documentation and processes for medical products. Related Products LEC-BW LEC-iMX6 AmITX-SL-G SMARC® Short Size Module with Intel® Pentium® and Celeron® Processor N3000 Series SoC SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor Mini-ITX Embedded Board with 6th Gen Intel® Core™ i7/i5/i3 Desktop Processor P 21 Industrial Automation Intelligent Platforms for Rugged Industrial Systems Industrial automation applications rely on efficient, rugged embedded platforms. By utilizing ADLINK’s embedded systems based on the optimum microprocessor architecture and the inter communication between automated processes and embedded computers, the requirements for industrial automation applications can be effectively fulfilled. Robotics, Test and Measurement, Manufacturing Control and Visual applications all require real-time capability, image recognition, and a networked infrastructure. ADLINK's computer-on-modules meet these requirements, include standard interfaces such as Ethernet, PCI, PCIe, UART and USB, that are brought out through standardized connectors to a custom carrier board which is designed for the specific automation application ADLINK’s wide ranging product portfolio offers a complete solution ideal for your specific industrial automation applications. Applications Welding Robots Machine Automation Textile Manufacturing Test, Measurement and Control Signal Acquisition and Generation Factory Automation and Environmental Intelligent Building Automation Benefits Easily integrated with standard IPC and motion, vision control boards Industrial quality with high performance to cost Validation for hard environment Fast time to market Best price/performance Long life support P 22 Applications Going to Extremes to Ensure Industrial Performance Development of Rugged by Design embedded computing solutions is at the core of ADLINK’s long company history, strengthened by the integration of industry leader Ampro Computers. ADLINK’s Rugged by Design process subjects all rugged and Extreme Rugged™ products to MIL-STD shock, vibration and temperature testing during the product development process, rather than requalification after the fact. ADLINK’s Extreme Rugged™ boards and systems surpass industrial performance requirements vand meet or exceed MIL specifications. Component selection, circuit design, printed circuit board (PCB) layout and materials, thermal solutions, enclosure design and ISO- and TUV-certified development processes are handled with precision and validated by robust test methods including MIL-STD-810 or MIL-STD-202 shock and vibration testing, as well as Highly Accelerated Life Testing (HALT). Combining Power and Data for Streamlined Deployment ADLINK's computer-on-modules are ideal for a wide spectrum manufacturing environments, and are deployed in severe computing settings such as coal mining, materials handling, wafer processing, scanning and printing, 3D vision and robotics guidance and a broad range of machine vision implementations. By offering innovative single cable solutions that deliver power over the data or communication cable, ADLINK simplifies installation, diminishes maintenance requirements and reduces total cost-of-ownership (TCO) for a broad range of industrial end-users. Cloud-based Remote System Monitoring and Maintenance ADLINK’s proprietary Smart Embedded Management Agent (SEMA) was developed to address the need for better housekeeping tasks in the context of systems based on complex processors and chipsets. At the box-level, SEMA monitors BIOS, power, temperature, watchdog and board information, and is distinguished by being able to manage systems that are standalone, connected or remote. ADLINK’s sophisticated preventive maintenance features add significant value for industrial customers, enabling advanced functionality in contrast to typical third party toolkits or utilities. SEMA allows users to monitor their systems in real-time, stores important data such as up-times and maximum temperatures, can call for help when needed, and can be easily managed and monitored from a cloud-based interface. Compact Vision Systems Enable 3D Guided Robotics Advancements in 3D robot guidance have improved accuracy and speed in automated assembly and pick-and-place operations. 3D calibration is the essential first step, establishing the relationship between the robot, camera and object coordinates. Pattern matching follows, allowing the robot to acquire object position and orientation, and then determine trajectory based on the collected 3D data. Industrial Design Leadership and Expertise For industrial contractors and integrators, ADLINK is your complete supplier of Rugged by Design products, including systems that provide robust, fault-free connectivity, as well as the wide, high speed I/O required to support the broad and growing spectrum of industrial automation. Related Products Express-SL/SLE cExpress-SL Q7-BW COM Express Basic Size Type6 Module with 6th Gen Intel® Xeon®, Core™ and Celeron® Processors support ECC/non-ECC support COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ and Celeron™ Processors Qseven Standard Size Module with Intel® Pentium® and Celeron® Processor N3000 Series SoC P 23 Transportation Flexible System Solutions for Intelligent Transportation Systems ADLINK delivers specialized embedded systems for railways, public transportation, heavy vehicles and marine applications. Besides delivering hardware solutions, ADLINK supports specific software environments that the transportation field requires such as: WEC 7/8, WES 7/8, VxWorks, QNX, and RealTime Linux and Windows NT/2000. Applications Advanced Public Transportation Systems (APTS) Wireless Communications Systems based on GPS and GSM Traffic Light Synchronization Platform Synchronization Management Passenger Information Systems Benefits Guaranteed long-life product availability and system compatibility Fast integration of the traditional IBIS bus with the latest GPS and RF communication systems in a limited space High reliability against shock and vibration Easy management of remote boot by Intel® Pre-boot Execution Environment (PXE) System development cycle is significantly reduced and facilitates later system upgrades and maintenance P 24 Applications Remote Monitoring Solution with Reliability, Scalability and Manageability Achieving robust and reliable connections between devices in a real-time monitoring & control system to ensure undisrupted and accurate data transmission to and from the moving and vibrating railway environment is of supreme importance and poses a challenge for engineers or system developers. Considering the particularities of the operating environment of rolling stock, all devices onboard must be capable of withstanding harsh and constant shock and vibrations and extreme temperatures in widely varying geographic locations. Systems used for rail transport need to be particularly rugged to deliver higher reliability and stability to maintain non-stop operations. ADLINK’s computer-on-modules meet the connectivity, ruggedness, manageability, longevity and scalability needs of rail transportation applications. ADLINK’s modules provide high speed serial buses supporting Control Area Network (CAN) protocol, an industrial standard developed for internal networking of automotive and other vehicles to deliver a high degree of data consistency with error detection mechanisms. Extending Deployments with Planned Product Lifecycles and Predictable Roadmaps ADLINK, as one of the most active players in the computer-on-modules market, provides continuing support for the form factor by revamping our product range with upgraded performance and new features enabled by the latest technologies. System developers can use any of our new modules as a drop-in replacement to easily upgrade older systems at minimum cost and maximum scalability to extend service life longevity. The modules deliver the newest newest available connectivity features, such as two SATA 3Gb/s ports via onboard connectors and ADLINK's Smart Embedded Management Agent (SEMA) to provide remote monitoring and management. Comprised of a hardware board controller and a software suite, SEMA's remote hardware monitoring and control capabilities allow administrators or engineers in the control center to remotely implement real-time management. Versatile Computer-on-Modules Enable Intelligent Transportation Networks ADLINK’s COM Express products enable transit agencies to communicate with customers and dispatch, maintain fleets and collect and analyze operating data. Intelligent bus networks rely on smart COM-based onboard systems, controlling vehicle run switches, front and rear doors, wheelchair ramps, stop requests, odometers, emergency alarms and more. Integrated GPS enables recording of driving data and supports both wireless and cellular transmission, and Class A-certified devices allow testing against SAE International standards. Intelligent transportation networks combine an ADLINK rugged COM Express module, incorporating the latest processors, with a custom baseboard. These systems are proven to be tolerant to higher levels of shock and vibration, and integrated Mini PCI Express slots support 802.11 a/b/g/n and cellular modems for robust connectivity. Many of ADLINK’s COM Express products are further validated Extreme Rugged™. Flexible, Robust Platforms Enhance ITS Development ADLINK’s rugged technologies are optimized for mission-critical train control and operation, networked security and safety, and high performance passenger infotainment. Our extensive roster of Rugged by Design board-level, box-level and user interface solutions provide reliability and flexibility across the spectrum of intelligent transportation systems - enabling high performance, faster timeto-market and reduced development costs for transportation system developers. ADLINK’s customers are further supported with ongoing access to our team of highly skilled customer hardware and software support engineers, expertly trained and knowledgeable in the applications and concerns facing transportation customers. Related Products cExpress-SL cExpress-AL LEC-BW COM Express Compact Size Type 6 Module with 6th Gen Intel® Core and Celeron Processors COM Express Compact Size Type 6 Module with Next Generation Processors SMARC® Short Size Module with Intel® Pentium® and Celeron® Processor N3000 Series SoC P 25 Infotainment Efficient Data Collection and Processing Worldwide growth of the retail and gaming industry fueled by increased numbers of entertainments and diverse lives along with advancements in technologies has opened up windows of opportunity for system and service providers. New user interfaces such as self-service kiosks have refreshed the user experience and helped create a more efficient and profitable business model for the betting industry by reducing the number of ticketing counters and operating staff, shortening customer waiting times, and maximizing end users’ requested information that can be issued in a limited time period. Applications Benefits Kiosks (e.g. ATM, POS) Betting machines Reduced maintenance cost Vending machines Lottery terminals Increased customer satisfaction Digital signage Slot machines Customer information collection and sharing Connecting Digital with Real Lives ADLINK Infotainment solution for Gaming and Retail services include ATMs, floor plan guides, lottery & slot machines and supermarket self-service kiosks. ADLINK computer-on-modules a nd Mini-TX embedded boards provide flexible connection possibilities for system integrators to link and manage multiple peripherals to meet application needs. Video lottery terminal and slot machines must sustain continuous operation; thus, hardware stability and ease of maintenance become essential. ADLINK's extensive and capabilities in hardware design and software development combined with our self-owned manufacturing base allows us to provide reliable products of superior quality for cost-effective solutions. Providing Personalized Corresponding Services In the retail environment, multimedia digital signage that combines entertainment and information is one of the best ways to communicate with consumers. Intelligent display panels powered by ADLINK products can be installed above checkout counters or in other suitable locations. Supermarket self-service kiosks are stand-alone terminals that integrate environment information, promotional products, membership management and other relevant data through interactive multimedia communication. Analyzed Big Data Turns to Revenue ADLINK's SEMA-equipped computer-on-modules connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available any place, at any time via encrypted data connection. With SEMA Cloud, managers of the infotainment services can monitor the status of their machines from any location and react promptly to events and incidents. The necessity for on-site visits is minimized and mean-time-to-repair is significantly reduced. SEMA Cloud brings a business value-add by allowing the collection and analysis of “big data” from devices like betting kiosks in the system. Vendors, operators and service providers will be able to acquire valuable information about consumer behavior, helping them to develop a more profound insight into their business and increase their competitive edge. Related Products P 26 AmITX-BW-I AmITX-SL-G Express-SL/SLE Mini-ITX Motherboard with Intel® Pentium® and Celeron® Processors Mini-ITX Embedded Board with 6th Gen Intel® Core™ i7/i5/i3 Desktop Processor COM Express Basic Size Type6 Module with 6th Gen Intel® Xeon®, Core™ and Celeron® Processors with ECC/non-ECC support Defense Applications Extreme Rugged Computing for Defense and Aviation Capitalizing on a rugged design pedigree spanning more than 25 years of military design advancements and leadership, ADLINK’s Extreme Rugged™ systems, platforms and products meet the rigors and technology readiness level (TRL) of military deployments, providing optimal Size, Weight, Power and Cost (SWaP-C), high bandwidth and proven rugged performance in open architecture COTS-based solutions. Originating Rugged by Design ADLINK‘s Rugged by Design process means all Extreme Rugged products are subjected to MIL-STD shock, vibration, and temperature testing during the product development process and not simply re-qualified after the fact. This unique purpose-built approach ensures performance, availability and reliability optimized for the rigors of mission-critical embedded environments. ADLINK‘s Extreme Rugged boards and systems meet or exceed MIL specifications, incorporate thoughtful design decisions regarding component selection, circuit board (PCB) layout and materials, thermal solutions, enclosure design and manufacturing process, all supported by an industry leading testing process. Extensive voltage and temperature margin tests validate ADLINK‘s Extreme Rugged products during the development process, in addition to full MIL-STD-810 or MIL-STD-202 shock and vibration testing. ADLINK‘s ISO- and TUV-certified development process features Highly Accelerated Life Testing (HALT), and all Extreme Rugged products are available wiht conformal coating. Long-Term Military Design Success Our mandate is to solve rugged design challenges, maintaining high responsiveness to military customer needs while enabling value, performance, flexibility and longevity for extended deployments. By offering in-house design with manufacturing — a service combination as valuable as it is rare in our industry — we maximize rugged design capabilities and capitalize on smart design principles such as Application Ready Intelligent Platforms (ARIPs) that integrate both hardware and software to facilitate better performance, faster time-to-market and reduced risk and cost of ownership. Committed Standards Leadership ADLINK supports COTS technology and open systems, offering flexible technologies and platforms. Deployable as system imgredients or fully formed systems that ensure right-sized rugged performance, ADLINK products blend hardware and software elements into intelligent platforms that enable a tangible competitive edge in time-to-market. Innovative Embedded Products and Capabilities Signal processing is a critical element in today‘s mil/aero platforms, whether the computing application is handling command and control, intelligence, surveillance or reconnaissance (C4ISR). Systems must provide robust, fault-free connectivity, as well as the wide, high-speed I/O required to support visible spectrum and infrared (IR) cameras, radar and other fast, high-definition sensors. ADLINK offers the latest Intel® Core™ i7/i5/i3-based computing solutions, including multiprocessor SBCs as well as multiprocessor plus GPGPUs and computing sub-systems, which enable and optimize mission-critical digital signal processing, acceleration and compression. Related Products CM1-86DX3 CM2-BT2 CM-920 PC/104 Single Board Computer with Vortex86DX3 SoC Extreme Rugged™ PC/104-Plus Single Board Computer with Intel® Atom™ Processor SoC Extreme Rugged™ PCI/104Express Single Board Computer with 3rd Generation Intel® Core™ Processor P 27 Computer-on-Modules COM Express A computer-on-module (COM) is a complete computer built on a single circuit board. However, unlike a single-board computer, the COM lacks the standard interfaces for input/output and connection to peripherals. These signals are brought out through standardized connectors to a custom carrier board which is designed for the specific embedded application. The COM on carrier board concept: Reduces development time by eliminating the need to design core components of the system Developer can focus on core competency in the design of the custom carrier board Allows easy upgrades without a complete board redesign Lowers the threshold for total project quantities Reduces time-to-market for the final product Right Size for the Right Jobs The COM Express standard (PICMG COM.0) is based on serial interfaces including PCI Express, SATA, USB, LVDS, and SDVO, allowing designers to utilize the latest technologies for future applications. ADLINK offers Extreme Rugged™ COM Express modules in Basic (125 x 95 mm), Compact (95 x 95 mm) and Mini (84 x 55 mm) sizes that are suited for high-end graphics applications, military computers, high speed communications and other embedded applications. We Know COM Express Although many companies develop COM Express modules, most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in the development and maintenance of the PICMG COM Express specification since its creation. ADLINK was chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 2.0. specification update As a leading participant in the creation of the specification, ADLINK is in a unique position to influence its direction. By doing so, ADLINK has a deep understanding of the meaning and intention of the specification and applies this knowledge in the design of our COM Express products. Comparison of Type 2, 6 and 10 Pinouts The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 10 pinout is based on the Type 1 pinout with only the A-B connector that is used in the “Mini” form factor. The Type 10 pinout provides additional flexibility for developers by freeing up pins reserved for SATA and PCIe for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both Type 6 and Type 10 pinouts support the SPI Interface, which was unavailable in COM.0 Rev. 1.0. P 28 COM Express New COM Express 3.0, Type 7* *COM Express Type 7 pinout is still under reviewing in PICMG, please refer to ADLINK website for the updated specification. 125 mm AB Connector CD Connector One Gigabit Ethernet port Parallel ATA, IDE port Alternatedefinition assigns this to two additional Gigabit Ethernet ports LPC interface Four Serial ATA channels Eight USB 2.0 ports Six PCI Express® Lanes x1 Dual 24-bit LVDS channels Analog VGA TV-out ports (SDTV/HDTV) Eight GPIO pins Keyboard 95 mm High Definition Audio 32-bit PCI™ v2.3 bus Alternate definition assigns this to ten additional PCI Express® x1 lanes PCI Express® x16 for Graphics These pins can also be assigned to two SDVO extensions (multiplexed) SMB and I2C bus +12 V primary power input Power / Thermal control +5 V standby and 3.3 V RTC +12 V primary power input Above connector assignments comply with PICMG® COM.0 COM Express® Module, Basic Form Factor P 29 COM Express® Type 7 Modules Basic Size Product Name Express-BD7 CPU Intel® Xeon® Processor D Family SoC Xeon® D-1548 2.0GHz 12MB, 45W (8C) Xeon® D-1537 1.7GHz 12MB, 35W (8C) Xeon® D-1528 1.9GHz 9MB, 35W (6C) Xeon® D-1527 2.2GHz 6MB, 35W (4C) Note: Other SKUs (including extended temp.) will be released later, please check ADLINK website Main Chipset - Memory Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2400/2133 MHz Cache Up to 12MB, dependent on SoC SKUs BIOS Type AMI EFI with Intel® AMT support TPM support (opt) TPM 1.2/2.0 Integrated Graphics Support - Graphics Features - LAN 10G: 2x 10GBASE-KR (from SOC) 2x 10GBASE-KR (from IC, option) GbE: Intel® i219LM USB 4x USB 1.1/2.0/3.0 Serial ATA 4x SATA 6Gb/s PCI Express PCI Express x16 (Gen3) (1x16 or 2 x8 or 1 x8 plus 2 x4) 7x PCI Express x1 (Gen3) (x4, x2, x1 available) Management Bus I2C, SMBus SEMA Support Yes Power Supply Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT) Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) OS support Windows Server, Windows 7, Linux Form Factor & Compatibility PICMG COM.0 R3.0, Type 7 Basic size: 95 x 125 mm (L x W) Notes: ・ COM Express Type 7 pinout is still under review. Please refer to ADLINK website for the updated specification. ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 30 Core Module Interface Reference Carrier Board 10G Ethernet Add-on Cards Express-BASE7 SFP+ Card PICMG COM Express Revision 3.0, Type 7 10G Fiber PHY Inphi CS4223 SFP+ PHY Features Input: up to four 10GBASE-KR Output: up to four SFP+ connectors 305 mm x 244 mm (ATX) 1 PCI Express x4 slot Expansion Busses 10GBASE-T Card 3 PCI Express x1 slots 1 PCI Express x16 slot (PCIe Gen3 lanes) 1 PCI Express x16 slot (routes up to four 10G Ethernet signals from COM Express module to 10G Ethernet add-on card) POST LEDs Onboard diagnostics for BIOS POST Secondary BIOS SPI flash Audio TBD Super I/O Winbond WF83627DHG on LPC bus Digital I/O I2C to GPIO bridge PCA9535 Connectors COM Express 220-pin (Type 7) VGA TBD LVDS TBD Digital Display Interface TBD Flat Panel Control TBD Audio TBD SATA 2x SATA, 2x eSATA LAN 10/100/1000BASE-T compatible RJ-45 on I/O panel USB 2.0 4x USB 1.0/2.0, 4x USB 1.0/2.0/3.0 Serial Port 1x DB-9 on I/O panel, 1x onboard 10-pin header KB/Mouse 2x 6-pin mini DIN Feature Connectors SMBus, I2C, module control signals Miscellaneous Reset, Power LED, HDD LED, Buzzer 10G Fiber PHY Intel® X557 10GBASE-T PHY Features Input: up to four 10GBASE-KR Output: up to four RJ-45 connectors Starter Kit Product Name COM Express Type 7 Starter Kit Plus The Type 7 Starter Kit Plus consists of a COM Express Type 7 core module with ATX size reference carrier board that offers one PCIe x16 Express slot with proprietary pinout for 10G Ethernet add-on card, one PCI Express graphics slot x16, 0ne PCI Express x4 slot and three PCI Express x1 slots, Serial ATA, USB 3.0/2.0, Gigabit LAN, and Super I/O. All necessary cables are included. ・ Live Linux USB stick with SEMA pre-installed ・ Schematics, Design Guide, and User Manuals ・ ADLINK USB stick with Documentation, Drivers, BSPs, Libraries Features ・ Express-BASE7 Reference Carrier Board ・ 10G Ethernet Add-on Card ・ COM Express Type 7 Module (optional) ・ CPU, Memory (optional) ・ Thermal Solution (optional) Note: All specifications are subject to change without further notice. P 31 COM Express® Type 6 Basic Size Modules Product Name Express-SL/Express-SLE Express-BL 6th Gen. Intel Xeon E3 family E3-GT4e (TBC), E3-1505M/E3-1505L Intel® Core™ i7-6820EQ/6822EQ i5-6440EQ/6442E Q, i3-6100E/6102E Intel® Celeron® (TBC) 5th Gen. Intel Xeon E3-1278L/1258L ® Intel Core™ i7-5850EQ/5700EQ ® CPU ® ® Express-BE ® AMD® R-Series APU RX-427BB/425BB/225FB (cTDP support on i7 SKUs) (cTDP support on specific SKUs) Chipset Intel® QM170/HM170 (for non-ECC)/ CM236 (for ECC) Intel® QM87 AMD® A77E Memory Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2133/1867 MHz (ECC support dependent on CPU/PCH SKU) Up to 32 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz BIOS Type AMI EFI with Intel® AMT 11.0 support (No AMT support with HM170) AMI EFI with Intel® AMT 10.0 support AMI EFI TPM Support (opt) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204 Integrated Graphics 18/24-bit singl/dual LVDS, eDP (opt.) 3x DDI ports supporting DP/HDMI/DVI 18/24-bit singl/dual LVDS, eDP (opt.) 3x DDI ports supporting DP/HDMI/DVI VGA 18/24-bit singl/dual LVDS 3x DDI ports supporting DP/HDMI/DVI (Up to 4 independent display) Graphics Features DirectX 12/11.2/11.1/11/10.1/10/9, OpenGL 4.4/4.3 and ES 2.0, OpenCL 2.1, 2.0/1.2 Note: support H.265/HEVC DirectX 11.1/11.1+/11/10.1/10/9 OpenGL 4.3 DirectX 11.1/10.1/10/9, OpenGL 4.2 and ES 2.0 OpenCL 1.2, OpenCV LAN Intel® i219LM, GbE Intel® i218LM, GbE Intel® i210LM, GbE USB 4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0 4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0 4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0 Serial ATA 4x SATA 6Gb/s 4x SATA 6Gb/s 4x SATA 6Gb/s PCI Express PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 8x PCI Express x1 (Gen3) (x4, x2, x1 available) PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI Express x1 (Gen3) (x4, x2, x1 available) PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 1x4) 7x PCI Express x1 (Gen3) (x4, x2, x1 available) Audio HDA integrated in PCH supporting ALC886 HDA integrated in PCH supporting ALC886 AMD Audio Coprocessor supporting ALC886 Management Bus I2C, SMBus I2C, SMBus I2C, SMBus SEMA Support Yes Yes Yes Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT) Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT) Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT) Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT) Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT) Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C OS support Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWork (TBD) (WES 7 32/64-bit, Linux 64-bit, VxWork TBD) Win 7/8.1, WES 7, WE8 Std., Linux, VxWorks Win 7/8, Linux, WES 7/8, Linux Power Supply FormFactor & Compatibillity PICMG COM.0 R2.1, Type 6 Basic size: 95 x 125 mm (L x W) Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 32 Basic Size Modules Product Name Express-HL/HLE Express-IB CPU 4th Gen. Intel® Core™, i7-4860EQ/4700EQ i5-4400E/4402E, i3-4100E/4102E Intel® Celeron® 2000E/2002E Intel® Core™ i7-3615QE/3612QE/3555LE/3517UE i5-3610ME, i3-3120ME/3217UE Intel® Celeron® 1020E/1047UE/927UE Chipset Intel® QM87, Intel® HM86 Intel® QM77 Memory Up to 16 GB Dual Channel DDR3L at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz (ECC support on Express-HLE) BIOS Type AMI EFI with Intel® AMT 9.0 support (no AMT support with HM86) AMI EFI with Intel® AMT 8.0 support TPM Support (opt.) Atmel AT97SC3204 Infineon SLB9635TT Integrated Graphics 18/24-bit singl/dual LVDS 3x DDI ports supporting DP/HDMI/DVI VGA 18/24-bit singl/dual LVDS 3x DDI ports supporting DP/HDMI/DVI (DDI 1 supports SDVO) VGA Graphics Features DirectX* 11/10.1/10/9, OpenGL* 3.0 DirectX 11, OpenGL 3.1, OpenCL 1.1 LAN Intel® i217LM, GbE Intel® WG82579LM, GbE USB QM87: 4x USB 1.1/2.0/3.0 , 4x USB 1.1/2.0 HM86: 2x USB 1.1/2.0/3.0 , 6x USB 1.1/2.0 4x USB 1.1/2.0/3.0 4x USB 1.1/2.0 Serial ATA 4x SATA 6Gb/s (QM87) 2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86) 2x SATA 3Gb/s, 2x SATA 6Gb/s PCI Express PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI Express x1 (Gen2) (x4, x2, x1 available) PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI Express x1 (Gen2) (x4, x2, x1 available) Audio HDA integrated in PCH supporting ALC886 HDA integrated in PCH supporting ALC886 Management Bus I2C, SMBus I2C, SMBus SEMA Support Yes - Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT) Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT) Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT) Wide: 8.5-19 V / 5Vsb ±5% (ATX) 8.5 ~19V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -20°C to +70°C OS support Win7/8, Linux, WES 7/8, Linux , VxWorks, QNX WES 7, Linux, VxWorks Power Supply FormFactor & Compatibillity PICMG COM.0 R2.1, Type 6 Basic size: 95 x 125 mm (L x W) Note: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 33 COM Express® Type 6 Compact Size Modules Product Name cExpress-SL cExpress-BL cExpress-HL CPU 6th Gen. lntel® Core™ i7-6600U/i5-6300U/i3-6100U Intel® Celeron® 3955U 5th Gen. Intel® Core™ i7-5650U/i5-5350U/i3-5010U Intel® Celeron® 3765U 4th Gen. lntel® Core™ i7-4650/i5-4300U/i3-4010U (cTDP support on specific SKUs) (cTDP support on specific SKUs) Intel Celeron® 2980U Chipset - - - Memory Up to 32 GB non-ECC Dual Channel DDR4 at 2133/1867 MHz Up to 32 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz BIOS Type AMI EFI with Intel® AMT 11.0 support AMI EFI with Intel® AMT 10.0 support AMI EFI with Intel® AMT 9.0 support TPM Support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204 Integrated Graphics 18/24-bit singl/dual LVDS, eDP (opt.) 2x DDI ports supporting DP/HDMI/DVI 18/24-bit singl/dual LVDS, eDP (opt.) 2x DDI ports supporting DP/HDMI/DVI VGA 18/24-bit singl/dual LVDS 2x DDI ports supporting DP/HDMI/DVI VGA Graphics Features DirectX 12/11.2/11.1/11/10.1/10/9 OpenGL 4.4/4.3 and ES 2.0 OpenCL 2.1, 2.0/1.2 Note: support H.265/HEVC DirectX 11.1/11.1+/10.1/10/9 OpenGL 4.2/4.0 DirectX 11/10.1/10/9 OpenGL 3.0 LAN Intel® i219LM, GbE Intel® i218LM, GbE 4x SATA 6Gb/s USB 4x USB 1.1/2.0/3.0 4x USB 1.1/2.0 2x USB 1.1/2.0/3.0 6x USB 1.1/2.0 2x USB 1.1/2.0/3.0 6x USB 1.1/2.0 Serial ATA Core™ i7/i5: 3x SATA 6Gb/s Core™ i3/Celeron®: 2x SATA 6Gb/s 4x SATA 6Gb/s 4x SATA 6Gb/s PCI Express 5 PCIe x1 (Gen2) (x4, x2, x1 available) Note: Up to 6 PCIe x1 without GbE support (opt.) 4x PCIe x1 (Gen2) (x4, x2, x1 available) Note: Up to 5 PCIe x1 without GbE support (opt.) 4x PCIe x1 (Gen2) (x4, x2, x1 available) Audio HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886 Management Bus I2C, SMBus I2C, SMBus I2C, SMBus SEMA Support Yes Yes Yes Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT) Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT) Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) '0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) OS support Win10/Win 8.1/7, WES 7, Linux, VxWorks Win 7/8.1, WES 7, WE8 Std, Linux, VxWorks Win 7/8, Linux, WES 7/8, Linux , VxWorks Power Supply Form Factor & Compatibility P 34 PICMG COM.0 R2.1, Type 6 Compact size: 95 x 95 mm (L x W) Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. Compact Size Modules Product Name cExpress-AL cExpress-BW cExpress-BT CPU Future Intel® Processor Intel Pentium N3710 Intel® Celeron® N3160/N3060/N3010 Intel® Atom® x5-E8000 Future Intel® Atom™ Processor Intel® Atom™ E3800 Series SoC Intel® Celeron® N2930/J1900 Chipset - - - Memory Up to 16 GB non-ECC Dual channel DDR3L at 1867/1600 MHz Up to 8 GB non-ECC Dual channel DDR3L at 1600/1333 MHz Up to 8 GB non-ECC Dual Channel DDR3L at 1333/1066 MHz BIOS Type AMI Aptio EFI AMI Aptio EFI AMI Aptio EFI TPM Support (opt.) TPM 1.2/2.0 ATMEL AT97SC3204 ATMEL AT97SC3204 Integrated Graphics eDP, 18/24-bit singl/dual LVDS (opt.) 2x DDI ports supporting DP/HDMI/DVI eDP, 18/24-bit singl/dual LVDS (opt.) 3x DDI ports supporting DP/HDMI/DVI Note: DDI 3 muxed with eDP/LVDS 2x DDI ports supporting DP/HDMI/DVI VGA 18/24-bit singl/dual LVDS (opt.) ® ® Graphics Features newest DirectX, OpenGL/CL DirectX 11.1, OpenGL 4.2, ES 3.0, OpenCL 1.2 DirectX 11, OpenGL 3.2, ES 2.0, OpenCL 1.1 LAN Intel® i210/i211 series, GbE Intel® i210IT, GbE Intel® i210LM, GbE USB 2x USB 1.1/2.0/3.0 6x USB 1.1/2.0 4x USB 1.1/2.0/3.0 4x USB 1.1/2.0 1x USB 1.1/2.0/3.0 6x USB 1.1/2.0 Serial ATA 2x SATA 6Gb/s 2x SATA 6Gb/s 2x SATA 3Gb/s PCI Express Up to 5 PCIe x1 (Gen2) with PCIe switch (x4, x2, x1 available) 3 PCIe x1 (Gen2) (x2, x1 available) Note: Up to 5 PCIe x1 with PCIe switch (opt.) 3 PCIe x1 (Gen2) (x2, x1 available) Note: Up to 4 PCIe x1 without GbE support (opt.) Audio HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886 Management Bus I2C, SMBus I2C, SMBus I2C, SMBus Onboard Storage 8GB/16GB/32GB (opt.) 8GB/16GB/32GB (opt.) 8GB/16GB/32GB (opt.) SD Signal Yes Yes (opt.) Yes (mini SD sockete on module) SEMA Support Yes Yes Yes Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Power Supply Wide: 4.75~20 V / 5Vsb ±5% (ATX), 4.75 ~20V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C 0°C to +60°C -40°C to +85°C (opt.) OS support Win 10/7, WES7, Linux, VxWorks Win 10 IOT Enterprise Win 7/8, WES 7, Linux, VxWorks Win 7/8, Linux, WES 7, WE8 Std., VxWorks, QNX Form Factor & Compatibility PICMG COM.0 R2.1, Type 6 Compact size: 95 x 95 mm (L x W) Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 35 COM Express® Type 6 Starter Kit Reference Carrier Board COM Express Type 6 Starter Kit Plus Express-BASE6 The Type 6 Starter Kit Plus consists of a COM Express Type 6 core module (opt.) with ATX size reference carrier board that offers one PCIe x16 Express slot with proprietary pinout for a DDI adapter card, one PCI Express graphics slot x16, one PCI Express x4 slot and three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O. All necessary cables are included. CPU PICMG COM Express Revision 2.0, Type 6 Core Module Interface 305 mm x 244 mm (ATX) 1 PCI Express x4 slot 3 PCI Express x1 slots • Live Linux USB stick with SEMA pre-installed Expansion Busses 1 ExpressCard slot • Schematics, Design Guide, and User Manuals 1 PCI Express x16 / SDVO slot • ADLINK USB stick with Documentation Drivers, BSPs, Libraries • Express-BASE6 Reference Carrier Board • T6-DDI (3 DisplayPort or HDMI) Features POST LEDs Onboard diagnostics for BIOS POST Secondary BIOS SPI flash Audio Codec Realtek ALC886 HDA Super I/O Winbond WF83627DHG on LPC bus Digital I/O Extensive GPIO (through PCA9535) Connectors Two COM Express x 220-pin (Type 6) VGA DB-15 connector LVDS Onboard 34-pin header Digital Display Interface 3x DDI ports to HDMI/DVI/DP (through T6-DDI) Audio Interface Mic/Line-in/Line-out on I/O panel S/PDIF on header/jack SATA 2x SATA, 2x eSATA LAN 10/100/1000BASE-T compatible RJ-45 on I/O panel USB 2.0 4x USB 1.0/2.0 4x USB 1.0/2.0/3.0 Serial Port 1x DB-9 connector (from Super I/O) 3x onboard 10-pin header (one from Super I/O, two from COM Express module) KB/Mouse 2x 6-pin mini DIN Feature Connectors SMBus, I2C, module control signals Miscellaneous Reset button, Lid button, Sleep button, Power button, Power LED, HDD LED, Buzzer Smart Battery Support One 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board) • DisplayPort to DVI cable • P16TO28 (PCIex 16 to PCIe x8 x2 adapter) • DB40 Debug Card • All necessary cables and power supply • COM Express Type 6 Module (optional) • Memory (optional) • Thermal Solution (optional) Note: All specifications are subject to change without further notice. P 36 COM Express® Type 10 Mini Size Modules Product Name nanoX-AL nanoX-BT nanoX-TC nanoX-TCR CPU Future Intel® Processor Intel® Atom™ E3800 Series SoC Intel® Celeron® N2930/J1900 Intel® Atom™ E680/E660/E640/ E620T Intel® Atom™ E680T/E660T/ E640T/E620T Chipset - - Intel® EG20T PCH Intel® EG20T PCH Memory Soldered memory, Up to 8GB non-ECC/ECC DDR3L at 1867/1600 MHz Soldered memory, Up to 4GB non-ECC DDR3L at 1333 MHz Soldered memory, Up to 2 GB non-ECC DDR2 at 800MHz Soldered memory, Up to 1 GB non-ECC DDR2 at 800 MHz (opt. 512MB or 2GB) (ECC is optional) BIOS Type AMI Aptio EFI AMI Aptio EFI AMI Aptio EFI AMI Aptio EFI TPM support (opt) - - - - Integrated Graphics 18/24-bit single channel LVDS, eDP (opt.) 1x DDI ports supporting DP/ HDMI/DVI 18/24-bit single channel LVDS, eDP (opt.) 1x DDI ports supporting DP/ HDMI/DVI 18/24-bit single channel LVDS 1x SDVO 18/24-bit single channel LVDS 1x SDVO Graphics Features DirectX (latest vers.), OpenGL/CL DirectX 11, OpenGL 3.2, ES 2.0 OpenCL 1.1 LAN Intel® i210/i211 family, GbE Intel® i210LM, GbE Realtek RTL8211CL, GbE Intel® 82574IT, GbE USB 2x USB 1.1/2.0/3.0 6x USB 1.1/2.0 USB client (TBC) 1x USB 1.1/2.0/3.0 3x USB 1.1/2.0 1x USB 1.1/2.0 client 6x USB 1.1/2.0 1x USB 1.1/2.0 client 6x USB 1.1/2.0 1x USB 1.1/2.0 client Serial ATA 2x SATA 6Gb/s 2x SATA 3Gb/s 2x SATA 1.5Gb/s 2x SATA 1.5Gb/s PCI Express 4x PCIe x1 (Gen2) (x4, x2, x1 available) 3x PCIe x1 (Gen2) (up to 4 PCIe x1 without GbE, opt.) 3x PCIe x1 (up to 4 PCIe x1 without PCH support, opt.) 2x PCIe x1 (up to 3 PCIe x1 without PCH support, opt.) Audio HDA integrated in SoC supporting ALC262 HDA integrated in SoC supporting ALC262 HDA integrated in SoC supporting ALC888 HDA integrated in SoC supporting ALC888 Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus Onboard Storage 8GB/16GB/32GB (opt.) 8GB/16GB/32GB (opt.) - 4GB/8GB/16GB (opt.) SD Signal Yes Yes (opt.) Yes Yes SEMA Support Yes Yes - - Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT) Wide: 4.75~20 V / 5Vsb ±5% (ATX), 4.75 ~20V (AT) Wide: 5~14V / 5Vsb (ATX) or 5~14V (AT) Wide: 4.75~21 V / 5Vsb ±5% (ATX), 4.75 ~21V (AT) Wide: 4.75~21 V / 5Vsb ±5% (ATX), 4.75 ~21V (AT) Operating Temperature 0°C to +60°C, -40°C to +85°C (opt. for selected SKUs only) 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -20°C to +70°C -40°C to +85°C (opt.) OS support Win 10/7, WES7, Linux, VxWorks Win 10 IOT Enterprise Win 7/8, Linux, WES 7, WE8 Std., VxWorks Windows XPe, WES7, WinCE 6.0, WEC7, Linux, VxWorks Windows XPe, WES7, WinCE 6.0, WEC7, Linux, VxWorks Power Supply Form Factor & Compatibility PICMG COM.0 R2.1, Type 10 Mini size: 84 x 55 mm (L x W) Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 37 COM Express® Type 10 Starter Kit Reference Carrier Board nanoX Starter Kit Plus miniBASE-10R The nanoX Starter Kit Plus consists of a COM Express® Type 10 core module (opt.) with a reference carrier board that provides two PCIe Mini Card slots (one supports mSATA), two RJ-45 LAN ports, one SATA port, two USB 3.0, two USB 2.0, one USB client, two DB-9 COM, one SD card socket, and Mic/ Linein/ Line-out, one DP port, LVDS/eDP connector and Smart Battery support (opt.). All necessary cables are included. • Live Linux USB stick with SEMA pre-installed Core module interface PICMG COM Express Revision 2.1, Type 10 modules Dimensions 150 mm x 142 mm POST LEDs Onboard diagnostics for BIOS POST Secondary BIOS SPI flash Audio Codec Realtek ALC262 HDA Audio Interface Line-in, Line-out, Mic-in on I/O panel S/PDIF on jack Digital I/O Extensive GPIO (through PCA9535) LAN 2x 10/100/1000BASE-T compatible RJ-45 on I/O panel (one from COM Express module, one from Intel i210 controller on carrier board) Connectors 1x 220-pin (Type 10) LVDS/eDP Onboard 30-pin header Display Port 1x DisplayPort connector SATA 1x SATA PCIe Mini Card 2x onboard sockets (one supports mSATA) USB 2x USB 1.0/2.0/3.0 2x USB 1.0/2.0 1x USB client Serial Port 2x DB-9 connectors SD card 1x socket onboard Feature Connectors SMBus, I2C, module control signals Miscellaneous Reset button, Lid button, Sleep button, Power button, Power LED, HDD LED Smart Battery Support Integrated Smart Battery managemet system • Schematics, Design Guide, and User Manuals • ADLINK USB stick with Documentation, Drivers, BSPs, Libraries • miniBASE-10R Reference Carrier Board • DB40 Debug Card Features • DisplayPort to VGA cable • All necessary cables and power supply • COM Express Type 10 Module (optional) • Thermal Solution (optional) • Flat LVDS panel and cable (optional) • Smart Battery (optional) Note: All specifications are subject to change without further notice. P 38 COM Express® Type 2 Basic Size Modules Compact Size Product Name Express-HL2 Express-IBE2 cExpress-BT2 Express-CVC CPU 4th Gen. Intel Core™ i7-4860EQ/4700EQ, i5-4400E/4402E, i3-4100E/4102E Intel® Celeron® 2000E/2002E Intel Core™ i7-3615QE/3612QE/ 3555LE/3517UE i5-3610ME, i3-3120ME/3217UE Intel® Atom™ E3800 Series SoC Intel® Celeron® N2930/J1900 Intel® Atom™ N2600/N2800/D2550 Chipset Intel® QM87 Express Intel® HM86 Express Intel® QM77 Express - Intel® NM10 Memory Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 8 GB non-ECC Dual Channel DDR3L at 1333/1066 MHz Up to 4 GB non-ECC Single Channel DDR3 at 1066/800 MHz BIOS Type AMI EFI with Intel® AMT 9.0 support AMI EFI with Intel® iAMT support AMI Aptio EFI AMI Aptio EFI TPM Support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204 Integrated Graphics 18/24-bit single/dual channel LVDS VGA 18/24-bit single/dual channel LVDS VGA, SDVO (on PEG) 18/24-bit single/dual channel LVDS VGA 18/24-bit single/dual channel LVDS VGA Graphics Features DirectX* 11/10.1/10/9, OpenGL 3.0 DirectX 11, OpenGL 3.1, OpenCL 1.1 DirectX 11, OpenGL 3.2, ES 2.0, OpenCL 1.1 DirectX 9 LAN Intel i217LM, GbE Intel WG82579LM, GbE Intel® i210LM, GbE Intel i210LM, GbE USB 8x USB 1.0/2.0 8x USB 1.0/2.0 7x USB 1.1/2.0 8x USB 1.1/2.0 Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device one channel, one device Serial ATA 4x SATA 6Gb/s (QM87) 3x SATA6Gb/s (HM86) 2x SATA 3 Gb/s, 2x SATA 6 Gb/s 1x SATA 3Gb/s (up to 2x SATA 3Gb/s without PATA support) 1x SATA 3Gb/s (up to 2x SATA 3Gb/s without PATA support) PCI Express/PCI PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 6x PCI Express x1 (Gen2) (x4, x2, x1 available); 1x PCI PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 5x PCI Express x1 (Gen2) (x4, x2, x1 available); 1x PCI 2x PCI Express x1 (Gen2) (x2, x1 available); 1x PCI 3x PCI Express x1 (Gen2) (x2, x1 available); 1x PCI Audio HDA integrated in SoC supporting ALC880 HDA integrated in SoC supporting ALC880 HDA integrated in SoC supporting ALC880 HDA integrated in SoC supporting ALC880 Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus Onboard Storage - - 8GB/16GB/32GB (opt.) - SEMA Support Yes Yes Yes Yes Power Supply Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Wide: 8.5~20 V / 5Vsb ±5% (ATX) or 8.5~20V (AT) Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Wide: 8.5~20 V / 5Vsb ±5% (ATX) or 8.5~20V (AT) Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Wide: 5~20 V / 5Vsb ±5% (ATX) or 5~20V (AT) Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Wide: 5~20 V / 5Vsb ±5% (ATX) or 5~20V (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C, -40°C to +85°C (opt. for Atom™ E3800) 0°C to +60°C OS support Win 7/8, Linux, WES 7/8, Linux , VxWorks Windows XPe, WES7, Linux, VxWorks Win 7/8, Linux, WES 7, WE8 Std. Windows XPe, WES 7, WEC 7, Linux, VxWorks Form Factor & Compatibility PICMG COM.0 R2.1, Type 2 Basic size: 95 x 125 mm (L x W) PICMG COM.0 R2.1, Type 2 Compact size: 95 x 95 mm (L x W) Win 7/8, Linux, WES 7, WE8 Std. Windows XPe, WES 7, WEC 7, Linux, VxWorks ® ® Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 39 COM Express® Type 2 Reference Carrier Board Product Name Express-BASE Core Module Interface PICMG COM Express Revision 2.0, Type 2 Dimensions 305 mm x 244 mm (AT/ATX) 2x 32-bit PCI v2.3 slots Expansion Busses Starter Kit Type 2 Starter Kit Plus The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included. 5x PCI Express x1 slots Standard Items 1x PCI Express x16 / SDVO slot POST LEDs Onboard diagnostics for BIOS POST Secondary BIOS LPC & SPI flash Audio Codec Realtek ALC880 HDA Super I/O Winbond WF83627HG on LPC Bus Connectors 2x 220-pin (Type 2) VGA DB15 connector LVDS Onboard 34-pin header PATA "1x 40-pin header SATA 4x SATA connectors • Express-BASE reference carrier board • Accessory kit: • IDE cable • SATA cable • TV out cable • CF adapter • PCI 2-slot riser card Features • USB Stick with documentation, drivers, libraries, and BSPs for Linux, Windows CE, XPe • Carrier Design Guide and product manuals Optional Items • COM ExpressR Type 2 module ExpressCard One socket onboard LAN 10/100/1000BASE-T compatible RJ45 on I/O panel USB 2.0 6x USB 2.0 connector 1x USB 2.0 header 1x USB 2.0 through ExpressCard Serial Port One DB-9 on rear I/O panel one 10-pin header onboard Parallel Port One DB-25 on rear I/O panel KB/Mouse Two 6-pin mini DIN Digital I/O - Feature Connectors SMBus, I2C, module control signals Miscellaneous Reset button, Lid button, Sleep button, Power button, Power LED, HDD LED Smart Battery Support One 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board) Note: All specifications are subject to change without further notice. P 40 with CPU of your choice • Memory of your choice • Thermal solution of your choice (heatspreader, heatsink) Engineering Test Tools DB40 Debug Module PCIe x16-to-two-x8 Adapter Card The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules that support bifurbication on the PEG x16 interface. The card reroutes the PCIe x16 to two x8 and allows testing of two independent PCIe add-on cards with x8/x4/x2/x1 width. • Port 80/81 decoding for Power On Self Test (POST) via LPC • Interface to SPI Flash for BIOS update • Interface to Board Management Controller (BMC) for update • Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. Ordering Information Model Number DB40 Description Multipurpose debug board BattMan Smart Battery Management Reference Platform The BattMan Smart Battery Management Reference Platform allows developers to first verify on a system level and then easily implement the same type of battery power design into their own carrier board. BattMan supports single battery mode or balanced loading and unloading using two batteries. Ordering Information Model Number P16TO28 StarterKit-Battman Description Smart Battery Management Reference Platform for COM Express® modules (includes two Smart Batteries, 19V adapter and USB key) PCIe x16-to-two-x8 adapter card Flat Panel Transfer Board The Flat Panel Transfer Board (FPTB) supports prototyping and verification of LVDS and TTL flat panel displays . The module includes an LVDS-to-TTL converter to allow users to implement TTL displays with COM modules that support LVDS only. Onboard PWM circuitry supports backlight control for LVDS and TTL displays. Ordering Information Model Number Description Ordering Information Model Number FPTB LVDS cable for FPTB Description Flat Panel Transfer Board for LVDS-to-TTL signal conversion Reference carrier LVDS output to FPTB LVDS input cable Note: All specifications are subject to change without further notice. P 41 SMARC Supported by a number of embedded computing module vendors, the Smart Mobility ARChitecture (SMARC) specification provides an openstandard definition for ARM and x86-based embedded computing solutions, optimized for low power, cost efficiency and high performance. SMARC also provides support for systems that need more compact solutions than are offered by PC-oriented form factors. A Green Solution for Embedded Connectivity As ARM SoCs do not need the support chips of a PC platform and draw less power, the amount of board space required for power converters and power supply lines is greatly reduced. This allows the use of a smaller form factor, facilitating applications of SMARC-based modules in low-power portable equipment. SMARC CPU modules generally have an actual power intake between 2W to 6W, allowing for passive cooling, thus, further reducing subsequent design effort and overall cost. Ideal Solution for Mobile Devices By choosing SMARC, systems integrators can take full advantage of the user-interface options available to mobile device OEMs; options that are not usually found in x86-based embedded-computing systems. For example, SMARC not only supports a direct parallel display bus for low-cost connection to a wide variety of thin-film transistor LCDs, but also supports a display interface compatible with the MIPI specification. This provides access to the smaller, low cost display modules employed in smartphones and tablets as they find their way into the embedded market. Ultra-low Power Consumption Advantages SMARC has been adopted by multiple vendors and promises to form the basis of a successful commercial ecosystem. The connection system employed by SMARC offers a number of benefits over competing systems. SMARC is based on the new 314-pin MXM-III connector qualified for PCI Express Gen3. The MXM-III connector guarantees a high degree of signal integrity, required by high frequency serial interfaces that are commonly supported by ARM SoCs. For example, on 2.5 GHz signals as employed by PCI Express Gen2, the insertion loss of the MXM-III connector is just 0.5 dB. In comparison, the insertion loss encountered on the connection scheme used by older generation MXM connectors such as the 200 pin MXM-II connector is significantly higher at 3 dB. SMARC Pinout Up to 3 independent displays Parallel LCD, LVDS, HDMI/DP LCD support: panel & backlight enable, power management Up to 2 independent cameras Parallel and MIPI CSI serial cameras 1x GbE 3x PCIe x1 with support signals 3x USB 2.0, one is USB 2.0 OTG/client 1x SATA 1x SDIO 1x eMMC (may be boot device) 2x SPI, 3x I2S, 4x I2C, 1x S/PDIF 4x serial (2x 2-wire, 2x 4-wire) 2x CAN 12x GPIO Boot select, force recovery, watchdog, power management P 42 AFB: pin assignment is dependent on module use case (e.g. USB 3.0, GbE, SATA, fieldbus) A further advantage of SMARC over other small module formats is its support for a wider input voltage range, reducing the need to use additional DC/DC converters on the core module and resulting overall power dissipation. A SMARC module can support input voltages from 3 V to 5.25 V. Many other formats originally designed to support PC-class hardware are restricted to a nominal 5 V input. To take advantage of the greater I/O diversity of ARM-based SoCs, SMARC uses a different mix of connection options than those offered by COM Express or Qseven. In contrast to the PCI Express focus of COM Express, SMARC provides options for different types of video and graphics output, serial buses such as I2C and I2S, both USB host and client, serial and parallel camera interfaces and support for standard flash-memory card formats such as SD and eMMC. Based on the proven MXM-III connector that has been successfully employed on MXM video modules for several years, SMARC defines two sizes of module: a full-size module that measures 82 mm x 80 mm, and a short module for more compact systems that measures 82 mm x 50 mm. The edge connector supports 314 electrical contacts, supports up to PCI Express Gen3 transfer rates, and has a temperature range extending from -45°C to +85°C. For systems that are to be used in harsh environments, shock- and vibration-proof versions of the connector are available. SMARC SMARC® x86-based Modules Product Name LEC-BW LEC-BTS LEC-BT CPU Intel® Celeron® /Pentium® N3000 Series SoC Intel® Atom™ E3800 Series SoC Intel® Atom™ E3800 Series SoC Memory Up to 8GB DDR3L at 1600 MT/s Up to 4GB DDR3L at 1333/1066 MHz non-ECC Up to 8GB DDR3L at 1333/1066 MHz with ECC Cache L2: 2 MB L2: 512kB to 2 MB L2: 512 kB to 2 MB Boot Loader AMI UEFI BIOS AMI UEFI BIOS AMI UEFI BIOS Graphics Features DirectX 12/11.2, OpenGL 4.2/3.3, OpenCL 1.2 DirectX 11.1, OpenGLES 2.0, OpenGL 3.2 DirectX 11.1, OpenGLES 2.0, OpenGL 3.2 Integrated Graphics 8th Gen Intel® graphics core architecture, supports 3 independent displays 4K graphic resolution (up to 3840 x 2160 @ 30fps) 7th Gen Intel® graphics core architecture, supports 2 independent displays 7th Gen Intel® graphics core architecture, supports 2 independent displays LAN Intel® i211 MAC/PHY supporting 10/100/1000 GbE Intel® i210IT MAC/PHY supporting 10/100/1000 GbE Intel® i210IT MAC/PHY supporting 10/100/1000 GbE USB 1x USB 3.0 host 2x USB 2.0 host 1x USB 2.0 client 1x USB 3.0 host 2x USB 2.0 host 1x USB 2.0 client 1x USB 3.0 host 2x USB 2.0 host 1x USB 2.0 client Serial ATA 2x SATA 6Gb/s 1x SDIO/SD 1x eMMC 2x SATA 3Gb/s 1x SDIO/SD 1x eMMC 2x SATA 3Gb/s 1x SDIO/SD Audio HDA HDA HDA PCI Express 3x PCIe x1 3x PCIe x1 3x PCIe x1 SEMA Support Yes Yes Yes Power Supply 3.0 V ~ 5.25 V DC ±5% 3.0 V ~ 5.25 V DC ±5% 3.0 V ~ 5.25 V DC ±5% Operating Temperature 0°C to +60°C 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) Formfactor & Compatibility Operating Systems SMARC short size module, 82 x 50 mm (W x L) Windows 7, 8.1, 10, Yocto Linux, Android Linux, VxWorks, Android, Windows 7/8, WEC7 SMARC full size module 82 x 80 mm (W x L) Linux, VxWorks, Android, Windows 7/8, WEC7 Note: All specifications are subject to change without further notice. P 43 SMARC® ARM-based Modules Product Name LEC-iMX6 LEC-iMX6/2GbE CPU Freescale i.MX6 Quad, Dual, DualLite and Solo Processors Freescale i.MX6 Quad and Dual Processors Memory Up to 4GB DDR3L at 1066 MHz Up to 4GB DDR3L at 1066 MHz Cache L2: 512kB to 1 MB L2: 512kB to 1 MB Boot Loader U-Boot U-Boot Integrated Graphics 2D/3D graphics processor 2D/3D graphics processor Graphics Features 3D 1080p video processing 3D 1080p video processing LAN 1x GbE 2x GbE USB 2x USB 2.0 host 1x USB OTG 2x USB 2.0 host 1x USB OTG Serial ATA 1x SATA 3Gb/s (Quad and Dual only) 1x SDIO/SD 1x eMMC 1x SATA 3Gb/s (Quad and Dual only) 1x SDIO/SD 1x eMMC Audio Located on carrier S/PDIF Located on carrier S/PDIF PCI Express 1x PCIe x1 - SEMA Support Yes Yes Power Supply 3.0 V ~ 5.25 V DC ±5% 3.0 V ~ 5.25 V DC ±5% Operating Temperature 0°C to +60°C -40°C to +85°C 0°C to +60°C -40°C to +85°C Operation Systems Linux, Android, WEC7, QNX Linux, Android, WEC7, QNX Formfactor & Compatibility Note: All specifications are subject to change without further notice. P 44 SMARC short size module, 82 x 50 mm (W x L) SMARC Starter Kits Product Name LEC-Starter Kit R1 The Starter Kit consists of a SMARC compliant LEC-BASE R1 carrier board, 7" Flat Panel display 800 x 400 with assembly and USB touch cable, SD card and USB stick, interface cables and an AC/DC adapter. • SMARC compliant LEC-BASE R1 carrier board • 7” flat panel 800 x 400 display with assembly and USB touch cable Features • SD card and USB stick • Interface cables (one way open) for camera, GPIO, power management, I2S and SPI • AC/DC adapter, power cord and universal socket • Modules: LEC-iMX6, LEC-iMX6/2GbE Optional Items • Heatsing for LEC-iMX6 or LEC-iMX6/2GbE • Software: BSP depending on Operating System Product Name LEC-Starter Kit R2 The LEC-Starterkit R2 consists of a SMARC compliant LEC-BASE R1 carrier board, data media, interface cables, AC/DC adapter, power cord, universal socket to EU plug, an universal power socket (male) and is suitable for LEC-BT or LEC-BTS modules. • SMARC compliant LEC-BASE R1 carrier board • SD card and USB stick Features • Interface cables for camera, GPIO, power management, SPI, I2C and LVDS • AC/DC adapter, power cord and universal socket • Modules: LEC-BT, LEC-BTS or LEC-BW Optional Items • Heatsink: for LEC-BT, LEC-BTS or LEC-BW • Software: BSP for selected Operating System Note: All specifications are subject to change without further notice. P 45 Qseven Qseven® is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multivendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application-specific carrier board. Small Footprint, Low Power Envelope Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks. The Qseven footprint is smaller than that of COM Express or ETX, responding to system designers’ needs for minimal space. Qseven’s power consumption envelope is below a 12watt, whereas SMARC’s target is below 6W and COM Express can be well above 20W. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements. Product Name P 46 4x PCI Express 2x SATA, max. 8x USB2.0, max. 2x USB 3.0 Triple display support LVDS, DP, HDMI HDA or I2S Ethernet 10/100/1000Mbit 1x UART 1x LPC 1x SDIO 8-bit for SD/MMC cards 1x SMBus 1x I2C 1x SPI 1x CAN Watchdog trigger, power button, power good, reset button LID button, sleep button Suspend to RAM (S3 mode), wake, battery low alarm Thermal & fan control Q7-Starterkit R1 The Q7-Starterkit consists of a Qseven compliant Q7-BASE R1 carrier board, SD card, USB stick, ATX power supply, US power cord, EU power cord. Standard Items Qseven Pinout: • Qseven compliant Q7-BASE R1 carrier board • SD card, 4GB SDHC Card (Class 10) • USB stick (8GB USB 2.0 Flash Drives) • 300 Watt ATX power supply • US power cord, 10A at 125V • EU power cord, 220V Qseven Qseven® Product Name Q7-BASE R1 Product Name Q7-BW Q7-BT Displays HDMI, 18/24-bit dual channel LVDS with backlight connector CPU Intel® Celeron® Pentium® N3000 Series SoC Intel® Atom™ E3800 Processor Series SoC SDIO 4/8-bit SDIO for MMC/SD Memory Up to 8GB DDR3L at 1600 MT/s Up to 8GB DDR3L at 1333/1066 MHz SPI 1x SPI interface 1x SMBus 1x misc. Cache L2: 2 MB L2: 512kB to 2MB Integrated Graphics HD Audio 1x HD audio codec ALC886 1x line in 1x line out 1x microphone 1x S/PDIF in/out 8th Gen Intel® graphics core architecture, supports three independent displays 4K video (up to 3840 x 2160 @ 30fps) 7th Gen Intel® graphics core architecture, supports two independent displays Graphics Features DirectX 12/11.2, OpenGL 4.2/3.3, OpenCL 1.2 DirectX 11.1, OpenGLES 2.0, OpenGL 3.2 LAN Intel® i211 MAC/PHY supporting 10/100/1000 GbE Intel® i210IT MAC/PHY supporting 10/100/1000 GbE USB 1x USB 3.0 5x USB 2.0 host 1x USB 2.0 client 1x USB 3.0 5x USB 2.0 host 1x USB 2.0 client Serial ATA 2x SATA 6Gb/s or 1x SATA 6Gb/s and 1x SATA SSD 2x SATA 3Gb/s or 1x SATA 3Gb/s and 1x SATA SSD Audio HDA HDA PCI Express 3x PCIe x1 3x PCIe x1 eMMC 4 GB to 64 GB (opt.) 4 GB to 64 GB (opt.) SEMA Support Yes Yes Camera 2x MIPI CSI 4L/2L camera interfaces 1x MIPI CSI 4L/1L camera interface Power Supply 5.0V DC ±5% 5.0V DC ±5% I²C 1x I²C Asynchronous Serial Port 1x asynchronous serial port (UART) CAN Bus 1x CAN bus interface USB 1x USB 3.0 5x USB 2.0 host 1x USB 2.0 client PCI Express 3x PCIe x1, 1x PCIe Mini Card SATA 2x SATA LAN GbE Boot Source Select SPI, eMMC, SD card, SATA Miscellaneous PPC/TPM connector 2x COM 1x LPT 2x PS/2 for keyboard & mouse 7-segment display for BIOS post code status LEDs and control buttons Power Modes ATX/AT mode Standard Voltage Input 5.0V ±5%, ±50mV ripple, 12V, 3.3V from ATX connector Operating Temperature 0°C to +60°C 0°C to +60°C -40°C to +85°C (opt.) Standby Voltage Input 5.0V ±5%, ±50mV ripple from ATX connector Operating Systems Windows 7, 8.1, 10, Yocto Linux, Android Win 7, 8, WEC 7, Yocto Linux RTC Voltage Input 2.7V to 3.3V, dependent on module Board Connector MXM2 230-pin edge connector Formfactor & Compatibillity Qseven v2.0 70 x 70 mm Note: All specifications are subject to change without further notice. P 47 ETX The ETX® modules includes most generic functions needed for almost any application, such as graphics, Ethernet, audio, IDE, FDD, keyboard/mouse, parallel, serial, and USB ports. ETX modules are available in different performance levels with CPU speeds to match your requirements. A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplified system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification. Software Support To ensure software development does not lag behind hardware development, we provide a full set of BSPs to get you up and running in no time. BSPs for the following operating systems are provided: Embedded Linux Development Kit Linux BSP Windows CE .Net BSP VxWorks BSP Windows XP Embedded support Fastest Time to Market The concept of using custom carrier boards combined with off-the-shelf Computer-on-Modules is an excellent solution when you need to customize, but lack the time or quantity for a complete design from the ground up. The average time to design a carrier board is less than half of that for a full custom OEM board. ETX is economically feasible for system integration projects with production volumes in the range of 500 to 10,000 pcs per year. The ETX concept is well accepted and has numerous advantages over full custom designs. It reduces engineering complexity, lowers the threshold for total project quantity, and last but not least, brings your product to the market in no time. P 48 ETX ETX® Product Name ETX-BT Product Name ETX-Proto Form Factor & Compatibility ETX 3.02 Size: 95 x 114 mm Interface ETX v3.0 Intel® Atom™ Processor E3800 Family SoC Audio Onboard amplifier with Line-in, Speaker-out and Mic Line-In/Line-Out, Speaker-out Video VGA: DB-15 connector for analog VGA displays LVDS: Onboard header LVDS TV-out: Onboard header for PAL/NTSC TV Expansion Buses Four 32-bit PCI slots Three16-bit ISA slots One Mini PCI slot CPU Intel® Celeron® Processors N2930/J1900 Chipset - Memory Up to 4GB DDR3L at 1333/1066MHz Cache L2: 512 kB to 2MB BIOS Type AMI Aptio EFI TPM support (opt.) Atmel AT97SC3204 USB Four ports 1.1/2.0 compatible Integrated Graphics Decode: H.264, MPEG2, MVC, VC-1, WMV9 and VP8 Encode: H.264, MPEG2 and MVC LAN RJ-45 Graphics Features DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 Serial Port 2x 16550 compatible RS-232 ports 2x additional ports COM3/4 from secondary multi I/O LAN Intel® i211 MAC/PHY, supporting 10/100 Mbps (GbE via onboard connector) IDE Port Four IDE devices (two connectors) USB 4x USB 2.0 Parallel ATA (IDE) 2x PATA IDE Parallel Port One port SSP, ECP, and EEP mode Serial ATA 2x SATA 3Gb/s KB/Mouse Audio Integrated on E3800 SoC, supports, Realtek ALC 262 Two 6-pin mini DIN connectors (on rear I/O panel) SEMA Support Yes KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel) Power Supply 5V±5% / 5Vsb ±5% (ATX) 5V±5% (AT) Operating Temperature 0°C to +60°C -40°C to +85°C (optional) Power Modes ATX and AT onboard Onboard reset and ATX switches OS support Windows 7/8 Linux, (WES7, WE8 Std., WEC7; Linux, VxWorks) Formfactor 304.8 x 190 mm Note: ・ Optional TPM support for special bill of materials ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 49 PC/104 True Ruggedness by Design for Extreme Harsh Environments ADLINK CoreModule® products provide unmatched fanless operation over temperature extremes, resistance to shock and vibration, conformal coating, embedded BIOS, and a long product life reputation. The CoreModule® continues to distinguish itself as an Extreme Rugged™ product for a multitude of applications. CoreModule® products are stackable SBCs with a PC/104 footprint (90 × 96 mm) for rugged and compact embedded systems. They feature unmatched fanless operation over extreme temperature ranges, resistance to shock and vibration, optional conformal coating, no “wings (protrusions outside the board footprint), and a long product 0.6” 3.8” J1 P1 [opt.] 0 J1 3.6” 0 PC/104 is a family of embedded computer standards which define both a physical form factor and computer bus. The PC/104 concept was originally devised by Ampro in 1987, and later standardized by the PC/104 Consortium in 1992. The name PC/104 comes from the SA (or PC/AT) bus and the 104 pins on the connector. The distinguishing features of the PC/104 family that makes it more suited to embedded systems than motherboards with expansion cards are: Compact size (90 x 96 mm) No backplane – modules stack together like building blocks Interoperability with boards from numerous manufacturers Based on familiar PC technology for ease of design and development Rugged construction: stacking bus connectors and corner mounting holes The PC/104-Plus specification establishes a standard for the use of a high speed PCI bus in embedded applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique selfstacking bus, and high reliability due to PC/104’s inherent ruggedness. The PC/104 Consortium has established the PCI/104 Express a high speed PCI bus in embedded applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique selfstacking bus, and high reliability due to PC/104’s inherent ruggedness. The PC/104 Consortium has established the PCI/104 Express Specification in order to support the highperformance PCI Express interface while retaining compatibility with the existing PC/104 infrastructure. PCI/104 Express preserves the key attributes of PC/104 such as compact size (90 x 96 mm), stackability, ruggedness, and compatibility with PC technology. PCIe/104 is PCI/104-Express without the PCI bus. PC/104, PCI-104 PC/104-Plus & PCI/104-Express ADLINK products currently come in four flavors of PC/104: PCI Connector PC/104 TM PC/104- Plus TM ISA Connector ISA Connector PC/104: ISA bus only PC/104-Plus: PCI and ISA busses ISA Bus ISA and PCI Bus PCI-104: PCI bus only PCI/104-Express: PCI bus and PCI Express bus PCI Connector PCI-104 TM PCI Connector PCI/104-Express TM Stackable PCIe Connector P 50 PCI Bus PCI and PCIe Bus PC/104 PCI/104 PCI-104 Group Product Name CM3-BT4-E3845 CM3-BT1-E3815 CPU Intel® Atom™ E3845 SoC Intel® Atom™ E3815 SoC Cache Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache Memory Up to 4 GB DDR3L SO-DIMM Up to 4 GB DDR3L SO-DIMM PATA / SATA 1x SATA 3G/s shared with mSATA (opt. 2nd SATA 3Gb/s port w/o mSATA support) 1x SATA 3Gb/s shared with mSATA Serial Port 4x RS-232/485 2x RS-232/485 USB 3x USB 2.0 3x USB 2.0 GPIO 8 8 Audio HDA HDA LAN 2x GbE 1x GbE Graphics Intel® HD graphics Intel® HD graphics Video VGA VGA Flat Panel Single/dual channel 18/24-bit LVDS Single/dual channel 18/24-bit LVDS SEMA Support Yes Yes Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) OS support Windows 7, Windows 8, WEC7, Linux, VxWorks Windows 7, Windows 8, WEC7, Linux, VxWorks Dimensions (W x H) 90 x 96 mm 90 x 96 mm Note: All specifications are subject to change without further notice. P 51 PCI/104-Express and PC/104-Plus Modules PCI/104-Express PC/104-Plus Product Name CM-920 CM2-BT2-E3825 CPU Intel® Core™ i7-3517UE Intel® Celeron® 807UE Intel® Atom™ E3825 SoC Cache 4MB/1MB Level 3 Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache Memory Up to 4 GB soldered ECC DDR3 Up to 4GB DDR3L SODIMM PATA / SATA 2x SATA 6Gb/s 1x SATA 3Gb/s shared with mSATA (optional 2nd SATA 3GB/s port w/o mSATA support) Serial Port 2x RS-232 4x RS-232/485 USB 4x USB 2.0 3x USB 2.0 GPIO - 8 Audio available on HDMI port HDA LAN 2x GbE 2x GbE Graphics Intel® HD Graphics Intel® HD Graphics Video VGA, HDMI/DVI, DisplayPort VGA Flat Panel Dual channel 18/24-bit LVDS Single/dual channel 18/24-bit LVDS SEMA Support - Yes Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) OS support Windows 7, Windows XP, WEC7, Linux, VxWorks Windows 7, Windows 8, WEC7, Linux, VxWorks Dimensions (W x H) 116 x 96 mm 90 x 96 mm Note: All specifications are subject to change without further notice. P 52 PC/104 PC/104 Modules Product Name CM1-BT1-E3815 CM1-86DX3 CM1-86DX2 CM-430 CPU Intel® Atom™ E3815 SoC Vortex86DX3 SoC Vortex86DX2 SoC Vortex86DX SoC Cache Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache L2: 512kB L1 I: 16kB L1 D: 16kB L2: 256kB L1 I: 16kB L1 D: 16kB Memory Up to 4 GB DDR3L SO-DIMM 2 GB soldered DDR3L 512MB/1GB soldered DDR2 256MB soldered DDR2 PATA / SATA 1x SATA 3Gb/s shared with mSATA (opt. 2nd SATA 3Gb/s port w/o mSATA support) 1x SATA 1.5Gb/s (or CFast) 1x SATA 1.5Gb/s EIDE Serial Port 4x RS-232/485 2x RS-232 2x RS-232/422/485 Up to 4x RS-232/485 4x RS232 2x RS232/485 USB 3x USB 2.0 2x USB 2.0 3x USB 2.0 2x USB 2.0 GPIO 8 8 8 8 Audio HDA - HDA - LAN 2x GbE 1x GbE 1x 10/100 Mbit 1x GbE 1x 10/100 Mbit 1x 10/100 Mbit Graphics Intel® HD Graphics Integrated 2D graphics Integrated 2D graphics Integrated 2D graphics Video VGA VGA VGA VGA Flat Panel Single/dual channel 18/24-bit LVDS Single channel 18/24-bit TTL/TFT Single channel 18/24-bit LVDS TTL/TFT SEMA Support Yes Yes Yes - Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt., contact for availability) 0°C to +60°C -40°C to +85°C (opt.) 0°C to +60°C -40°C to +85°C (opt.) OS support Windows 7, Windows 8, WEC7, Linux, VxWorks WES2009, WES7, Linux, QNX on request: WEC7, Windows CE 6.0 Windows XP, Linux, Windows CE Windows CE 5.0/6.0, QNX v6.3 Dimensions (W x H) 90 x 96 mm 90 x 96 mm 90 x 96 mm 90 x 96 mm Note: All specifications are subject to change without further notice. P 53 Mini-ITX Smaller form factor for today's compact systems Industry trends indicate that users require a smaller and lower cost solution for their system requirements. Mini-ITX has a smaller board size and lower keep-out zones to enable a reduced chassis size for systems placed on the user’s desk, mounted on a display, or installed in space-restrictive environments. 7.50" (19.05 cm) 9.00 6.75" (17 cm) 6.75 9.625" (24.5 cm) 9.625 12.00 9.625" (24.5 cm) Mini-ITX Flex-ATX Micro-ATX ATX In addition to deployment in smaller chassis designed around the Mini-ITX form factor, these boards are compatible with ATX and microATX chassis without the need to retool the I/O shield. Mini-ITX embedded boards are ideal for applications in industrial automation, self-service kiosks, and other infotainment driven solutions. Flexible, high speed and better connectivity ADLINK Mini-ITX embedded boards support the latest Intel and AMD processors to deliver a high performance and space-saving platform for a wide array of embedded computing applications. Along with its compact footprint, this product line supports high processing speeds and high-bandwidth network connectivity with PCI Express®-based Gigabit Ethernet. Coupled with ample memory, diverse I/O, storage, and audio interfaces, ADLINK Mini-ITX embedded boards are suitable for multimedia, automation control, and gaming applications requiring a compact, easy-to deploy, and cost-effective mainboard. Special I/O for vertical markets Electro-mechabical compatibility with in the AmlTX-XX-G Mini-ITX family • Vertical on-board USB2.0 port • HDMI • Dual PCIe Expansion • Optional LVDS support • Internal Aubio Header • Multi Displayport • Internal Feature Header • PCIe slot for extemal graphice • TPM Header • SPI Header • Optional Socketed SPI BIOS Easy Development and Maintenance • BMC on-board SEMA and SEMA Cloud support IoT deployment • P 54 Others • SATADOM support • Optional TPM on-board • ATX or 12VDC-only power input • Latch able connectors Mini-ITX Infotainment Applications ADLINK Infotainment solutions are ideal for gaming and retail services including ATMs, floor plan guides, lottery & slot machines and supermarket self-service kiosks. ADLINK Mini-ITX embedded boards provide flexible connection possibilities for system integrators to link and manage multiple peripherals to meet application needs. Video lottery terminals and slot machines must sustain continuous operation, meaning hardware stability and ease of maintenance become essential. ADLINK's extensive experience and capabilities in hardware design and software development combined with our self-owned manufacturing base allows us to provide reliable products of superior quality for different solutions. In the retail environment, multimedia digital signage that combines entertainment and information is one of the best ways to communicate with consumers. Intelligent display panels powered by ADLINK Mini-ITX embedded boards can be installed above checkout counters or in other suitable locations. Supermarket self-service kiosks are stand-alone terminals which integrate environment information, promotional products, membership management and other relevant data through interactive multimedia communication. Medical applications require highly accurate video imaging with low latency during surgical procedures, such as X-ray, ultrasound, and endoscopy. This market presents diverse opportunities for embedded designers, fueled by demand for real-time data processing and sharing, high definition imaging and graphics displays, and creative, compact solutions that enable healthcare anywhere. ADLINK expertly solves these medical design challenges, offering intelligent embedded platforms that help OEMs/ODMs innovate, reduce risk and accelerate time-to-market with solutions validated for high performance and complex regulatory requirements. For medical device developers and manufacturers, ADLINK is your complete supplier of Mini-ITX embedded boards that provide robust, faultfree connectivity, as well as the wide range of high-speed I/O required to support the broad and growing spectrum of imaging and diagnostics applications. Development time is reduced, and medical device manufacturers can focus on their core competencies in creating competitive, high performance healthcare applications. Retail Requirements Applications • Time to market • Processing performance Medical Gaming • High performance HD graphics • Vertical on-board USB connector • Multi DisplayPort/HDMI/ LVDS outputs • Meet GLI criteria • Kiosks (e.g. ATM, POS) • Ultrasound • Betting machines • Vending machines • MRI • Lottery terminals • Digital signages • Point-of-care terminal • Slot machines • Patient bedside terminal P 55 Mini-ITX Embedded Boards High Performance Group Product Name AmITX-SL-G AmITX-HL-G AmITX-BE-G CPU 6th Gen. Intel® Core™ i7-6700/6700TE i5-6500/-6500TE i3-6100/6100TE 4th Gen. Intel® Core™ i7-4700S/4770TE/4790S i5-4570S/4570TE/4590S i3-4330/4330TE/4360/4350T AMD® R series RX-427BB/425BB/225FB Intel® Pentium® G4400/G4400TE Intel® Celeron® G3900/G3900TE Intel® Pentium® G3420/G3320TE Intel® Celeron® G1820/G1820TE Chipset Q170 and H110 PQ87 and H81 AMD A77E Memory Up to 32 GB non-ECC Dual Channel DDR4 at 2133/1866 MHz Up to 16 GB non-ECC Dual Channel DDR3/DDRL3 at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDRL3 at 1600/1333 MHz Integrated Graphics Intel® Gen 9 graphics 3 DisplayPort, LVDS co-lay with eDP (opt.) 3 DispayPort, LVDS (opt.) AMD® Radeon HD 9000 4 DisplayPort, LVDS (opt.) SATA 3x SATA 6 Gb/s Q87: 3x SATA 6 Gb/s H81: 1x SATA 3 Gb/s and 2x SATA 6Gb/s 3x SATA 6.0 Gb/s LAN 1x Intel® i219LM, GbE 1x Intel® i211AT, GbE 1x Intel® i218LM, GbE 1x Intel® i211AT, GbE 2x Intel® i211AT, GbE 1x RS-232/422/485 3x RS-232 Serial Port USB Expansion Slots Q170: 7x USB 3.0, 4x USB 2.0 H110: 4x USB 3.0, 7x USB 2.0 Q87: 4x USB 3.0, 9x USB 2.0 H81: 2x USB 3.0, 11x USB 2.0 4x USB 3.0 9x USB 2.0 1x PCIe x16, 1x PCIe x1 1x full size Mini PCIe + USB or mSATA 1x half size Mini PCIe+USB 1x PCIe x16, 1x PCIe x1 1x full size Mini PCIe + USB or mSATA 1x half size Mini PCIe + USB 1x SPI header for external BIOS 1x PCIe x16, 1x PCIe x1 1x full size Mini PCIe + USB or mSATA 1x half size Mini PCIe + USB 1x SPI header for external BIOS 1x SPI header for external BIOS SEMA Support Yes Power Supply 12V ±5% / 5Vsb ±5% (ATX), 12V ±5% (AT) Onboard headers for fan and SATA power Operating Temperature 0˚C to +60˚C Form Factor & Compatibility 170 mm x 170 mm (L x W) OS support Win10/Win 8.1/7, WES 7, Linux, VxWorks Note: All specifications are subject to change without further notice. P 56 WES 7/8 Linux, VxWorks Windows 7/8, WES 7/8, Linux Low Power Consumption Group Product Name AmITX-AL-I AmITX-BW-I AmITX-BT-I CPU Future Intel® Processor Intel® Pentium® N3710 Intel® Celeron® N3160/N3060/N3010 Future Intel® Atom™ Processor Intel® Atom™ E3800 series SoC Intel® Celeron® N2930/J1900 Memory Up to 16 GB non-ECC Dual Channel DDR3L at 1867/1600 MHz Up to 8GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 8 GB non-ECC Dual Channel DDRL3 at 1333/1066 MHz SATA 2x SATA 6 Gb/s 2x SATA 6 Gb/s 2x SATA 3 Gb/s 2x Intel® i211AT, GbE LAN Serial port 2x RS-232/422/485 4x RS-232 2x RS-232/422/485 4x RS-232 3x RS-232/422/485 3x RS-232 4x USB 1.1/2.0/3.0 4x USB 1.1/2.0 USB Integrated Graphics 1x HDMI, 2 DisplayPort, LVDS, eDP (opt.) 1x HDMI, 2 DisplayPort, LVDS, eDP (opt.) VGA, HDMI, LVDS Expansion slots 1x PCIe x1, 1x Mini-PCIe, 1x mSATA 1x SPI header for external BIOS 1x PCIe x1, 1x Mini-PCIe, 1x mSATA 1x SPI header for external BIOS 1x PCIe x1, 1x Mini-PCIe, 1x mSATA 1x SPI header for external BIOS SEMA Support Yes Power Supply 12V ±5% Supports ATX/AT mode Onboard headers for fan and SATA power 12V ±5% Supports ATX/AT mode Onboard headers for fan and SATA power Std: 12V ±5% / 5Vsb ±5% (ATX ), 12V ±5% (AT) Supports ATX/AT mode Onboard headers for fan and SATA power Operating Temperature 0°C to +60°C -40°C to +85°C (opt.) 0˚C to +60˚C 0°C to 60°C -40°C to + 85°C (opt.) Form Factor & Compatibility OS support 170 mm x 170 mm (L x W) Win 10/7, WES7, Linux, VxWorks Win 10 IOT Enterprise Windows 7/8, WES 7, Linux, VxWorks Windows 7/8, Linux, VxWorks Note: ・ Optional TPM support for special bill of materials ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only ・ All specifications are subject to change without further notice. P 57