Transcript
To our customers,
Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com
April 1st, 2010 Renesas Electronics Corporation
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Notice 1.
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”:
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DATA SHEET
MOS FIELD EFFECT TRANSISTOR
μ PA2592T1H
N- AND P-CHANNEL MOSFET FOR SWITCHING DESCRIPTION
PACKAGE DRAWING (Unit: mm)
The μ PA2592T1H is N- and P-channel MOSFETs designed for 2.9±0.1
DC/DC converters and power management applications of
A
0.65
portable equipments.
8
0.17±0.05
5
N- and P-channel MOSFETs are assembled in one package, to
• 2.5 V drive available
4
1
• Low on-state resistance
0.32±0.05
0.05 M S A
N-channel RDS(on)1 = 50 mΩ MAX. (VGS = 4.5 V, ID = 2 A)
N-channel 1: Source 2: Gate 7, 8: Drain
0.8±0.05
RDS(on)2 = 65 mΩ MAX. (VGS = 2.5 V, ID = 2 A) P-channel RDS(on)1 = 80 mΩ MAX. (VGS = −4.5 V, ID = −2 A) RDS(on)2 = 140 mΩ MAX. (VGS = −2.5 V, ID = −1 A)
(0.3)
FEATURES
0 to 0.025
2.4±0.1
2.8±0.1
contribute minimize the equipments.
P-channel 3: Source 4: Gate 5, 6: Drain
S
• Built-in gate protection diode • Small and surface mount package (8-pin VSOF (2429))
ORDERING INFORMATION PART NUMBER
LEAD PLATING
μ PA2592T1H-T1-AT
Note
μ PA2592T1H-T2-AT
Note
Pure Sn
PACKING 8 mm embossed taping 3000 p/reel
PACKAGE 8-pin VSOF (2429)
Note Pb-free (This product does not contain Pb in the external electrode and other parts.)
Marking: 2592
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G20215EJ1V0DS00 (1st edition) Date Published February 2010 NS Printed in Japan
2010
μ PA2592T1H ABSOLUTE MAXIMUM RATINGS (TA = 25°C) PARAMETER
SYMBOL
N-CHANNEL
P-CHANNEL
UNIT
Drain to Source Voltage (VGS = 0 V)
VDSS
20
−20
V
Gate to Source Voltage (VDS = 0 V)
VGSS
±12
m12
V
Drain Current (DC)
ID(DC)
±4.0
m3.0
A
ID(pulse)
±16
m12
A
Drain Current (pulse)
Note1
Total Power Dissipation (1 unit, 5 s)
Note2
PT1
1.5
W
PT2
1.24
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
−55 to +150
°C
Total Power Dissipation (2 units, 5 s)
Note2
Notes 1. PW ≤ 10 μs, Duty Cycle ≤ 1% 2. Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm
EQUIVALENT CIRCUIT N-channel
P-channel
Drain
Drain
Body Diode
Gate
Gate Protection Diode
Source
Body Diode
Gate Gate Protection Diode
Source
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
Caution This product is electrostatic-sensitive device due to low ESD capability and should be handled with caution for electrostatic discharge.
2
Data Sheet G20215EJ1V0DS
μ PA2592T1H ELECTRICAL CHARACTERISTICS (TA = 25°C) N-channel MOSFET CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = 20 V, VGS = 0 V
1
μA
Gate Leakage Current
IGSS
VGS = ±12 V, VDS = 0 V
±10
μA
VGS(off)
VDS = 10 V, ID = 1 mA
1.5
V
Gate to Source Cut-off Voltage Forward Transfer Admittance
Note
Drain to Source On-state Resistance
Note
0.5
| yfs |
VDS = 10 V, ID = 2 A
RDS(on)1
VGS = 4.5 V, ID = 2 A
29
50
mΩ
RDS(on)2
VGS = 2.5 V, ID = 2 A
41
65
mΩ
2
S
Input Capacitance
Ciss
VDS = 10 V,
455
pF
Output Capacitance
Coss
VGS = 0 V,
75
pF
Reverse Transfer Capacitance
Crss
f = 1.0 MHz
47
pF
Turn-on Delay Time
td(on)
VDD = 10 V, ID = 2 A,
8
ns
VGS = 4.5 V,
8
ns
RG = 6 Ω
20
ns
6
ns
Rise Time
tr
Turn-off Delay Time
td(off)
Fall Time
tf
Total Gate Charge
QG
VDD = 16 V, VGS = 4.5 V,
5.4
nC
Gate to Source Charge
QGS
ID = 4 A
0.9
nC
1.6
nC
0.85
V
Gate to Drain Charge Body Diode Forward Voltage
QGD Note
VF(S-D)
IF = 4 A, VGS = 0 V
Note Pulsed TEST CIRCUIT 1 SWITCHING TIME
TEST CIRCUIT 2 GATE CHARGE D.U.T.
D.U.T. VGS
RL VGS RG
PG.
Wave Form
VDD
0
VGS
10%
IG = 2 mA
RL
50 Ω
VDD
90%
PG.
VDS 90%
VGS 0
90%
VDS VDS τ
τ = 1 μs Duty Cycle ≤ 1%
0
10%
10%
tr
td(off)
Wave Form
td(on) ton
tf toff
Data Sheet G20215EJ1V0DS
3
μ PA2592T1H P-channel MOSFET CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = −20 V, VGS = 0 V
−1
μA
Gate Leakage Current
IGSS
VGS = m12 V, VDS = 0 V
m10
μA
VGS(off)
VDS = −10 V, ID = −1 mA
−0.5
−1.5
V
| yfs |
VDS = −10 V, ID = −1.5 A
2
RDS(on)1
VGS = −4.5 V, ID = −2 A
55
80
mΩ
RDS(on)2
VGS = −2.5 V, ID = −1 A
80
140
mΩ
Gate to Source Cut-off Voltage Forward Transfer Admittance
Note
Drain to Source On-state Resistance
Note
S
Input Capacitance
Ciss
VDS = −10 V,
445
pF
Output Capacitance
Coss
VGS = 0 V,
96
pF
Reverse Transfer Capacitance
Crss
f = 1.0 MHz
82
pF
Turn-on Delay Time
td(on)
VDD = −10 V, ID = −1.5 A,
12
ns
VGS = −4.5 V,
5
ns
RG = 6 Ω
36
ns
20
ns
Rise Time
tr
Turn-off Delay Time
td(off)
Fall Time
tf
Total Gate Charge
QG
VDD = −16 V, VGS = −4.5 V,
5.7
nC
Gate to Source Charge
QGS
ID = −3 A
1.2
nC
2.2
nC
0.88
V
Gate to Drain Charge Body Diode Forward Voltage
QGD Note
IF = −3 A, VGS = 0 V
VF(S-D)
Note Pulsed TEST CIRCUIT 1 SWITCHING TIME
TEST CIRCUIT 2 GATE CHARGE D.U.T.
D.U.T. VGS (−)
RL VGS RG
PG.
Wave Form
0
VGS
10%
PG.
VDD 90%
τ τ = 1 μs Duty Cycle ≤ 1%
4
90%
VDS
VDS
10%
0
10%
Wave Form
td(on)
tr ton
RL
50 Ω
VDD
90%
VDS (−) VGS (−) 0
IG = −2 mA
td(off)
tf toff
Data Sheet G20215EJ1V0DS
μ PA2592T1H TYPICAL CHARACTERISTICS (TA = 25°C) (1) N-channel MOSFET DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 2
PT - Total Power Dissipation - W
dT - Percentage of Rated Power - %
120 100 80 60 40 20
Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm 1.5 1 unit, 5 s 1 2 units, 5 s 0.5
0
0 0
25
50
75
100
125
150
0
175
25
50
75
100
125
150
175
TA - Ambient Temperature - °C
TA - Ambient Temperature - °C FORWARD BIAS SAFE OPERATING AREA 100 d it e Lim V ) 5 . 4 S=
10
R
ID(pulse)
N)
(V
G
PW
11
110
ID(DC) 110
1
0.1
m
m 1
m 1
0
1
5s
=3
00
μs
s
s
s
Single Pulse Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm PD(FET1):PD(FET2) = 1:1
0.01 0.1
1
10
100
VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000
rth(j-A) - Transient Thermal Resistance - °C/W
ID - Drain Current - A
1
(O DS
PD (FET1) : PD (FET2) = 1 : 1 100 PD (FET1) : PD (FET2) = 1 : 0
10
Single Pulse Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm 1
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s Data Sheet G20215EJ1V0DS
5
μ PA2592T1H DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
FORWARD TRANSFER CHARACTERISTICS
20
100 10
4.5 V
12
ID - Drain Current - A
ID - Drain Current - A
16
Pulsed VDS = 10 V
VGS = 2.5 V
8 4
TA = –25°C 0°C 25°C 75°C 125°C 150°C
1 0.1 0.01 0.001
Pulsed 0
0.0001 0.4
0.8
1.2
1.6
2
0
0.5
2
2.5
GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
2
1.5
1
0.5 VDS = 10 V ID = 1 mA 0 -50
0
50
100
150
10 TA = –25°C 0°C 25°C 1
75°C 125°C 150°C Pulsed VDS = 10 V
0.1 0.01
0.1
Pulsed 160 120 80 VGS = 2.5 V 40 4.5 V 0 10
10
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
100
RDS(on) - Drain to Source On-state Resistance - mΩ
200
1
1
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT RDS(on) - Drain to Source On-state Resistance - mΩ
1.5
VGS - Gate to Source Voltage - V
Tch - Channel Temperature - °C
ID - Drain Current - A
6
1
VDS - Drain to Source Voltage - V
| yfs | - Forward Transfer Admittance - S
VGS(off) - Gate to Source Cut-off Voltage - V
0
200 Pulsed ID = 2 A
160 120 80 40 0 0
2
4
6
8
VGS - Gate to Source Voltage - V
Data Sheet G20215EJ1V0DS
10
μ PA2592T1H CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
100
1000 Pulsed ID = 2 A
80 60
VGS = 2.5 V
40 4.5 V 20
Ciss, Coss, Crss - Capacitance - pF
RDS(on) - Drain to Source On-state Resistance - mΩ
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
0 -50 -25
0
25
50
Ciss
100 Coss Crss VGS = 0 V f = 1.0 MHz 10 0.01
75 100 125 150 175
1
10
100
VDS - Drain to Source Voltage - V
Tch - Channel Temperature - °C DYNAMIC INPUT CHARACTERISTICS
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
6
100
5
IF - Diode Forward Current - A
VGS - Gate to Source Voltage - V
0.1
VDD = 16 V 10 V 4V
4 3 2 1
10
VGS = 0 V 1
ID = 4 A 0
Pulsed 0.1
0
1
2
3
4
5
6
7
QG - Gate Charge - nC
0
0.5
1
1.5
VF(S-D) - Source to Drain Voltage - V
Data Sheet G20215EJ1V0DS
7
μ PA2592T1H (2) P-channel MOSFET DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 2
PT - Total Power Dissipation - W
dT - Percentage of Rated Power - %
120 100 80 60 40 20
Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm 1.5 1 unit, 5 s 1 2 units, 5 s 0.5
0
0 0
25
50
75
100
125
150
0
175
25
50
75
100
125
TA - Ambient Temperature - °C
TA - Ambient Temperature - °C FORWARD BIAS SAFE OPERATING AREA -100 d it e Lim 5 V ) . 4 =– S
ID - Drain Current - A
-10
RD
S(
(V
G
11 110
ID(DC)
110
-1
m
m 1
m 1
0
1
5s
-0.1
PW
ID(pulse)
1
) ON
=3
00
μs
s
s
s
Single Pulse Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm PD(FET1):PD(FET2) = 1:1
-0.01 -0.1
-1
-10
-100
VDS - Drain to Source Voltage - V
rth(j-A) - Transient Thermal Resistance - °C/W
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000 PD (FET1) : PD (FET2) = 1 : 1 100 PD (FET1) : PD (FET2) = 0 : 1
10
Single Pulse Mounted on FR-4 board of 25.4 mm x 25.4 mm x 0.8 mm 1
1m
10 m
100 m
1
PW - Pulse Width - s
8
150
Data Sheet G20215EJ1V0DS
10
100
1000
175
μ PA2592T1H DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
FORWARD TRANSFER CHARACTERISTICS
-20
-100 -10
ID - Drain Current - A
-16
ID - Drain Current - A
Pulsed VDS = –10 V
–4.5 V
-12 -8
VGS = –2.5 V -4
TA = –25°C 0°C 25°C 75°C 125°C 150°C
-1 -0.1 -0.01 -0.001
Pulsed -0
-0.0001 -0
-0.4
-0.8
-1.2
-1.6
-2
-0
VDS - Drain to Source Voltage - V
-1.5
-1
-0.5 VDS = –10 V ID = –1 mA -0 25
50
75 100 125 150 175
TA = –25°C 0°C 25°C
1
75°C 125°C 150°C Pulsed VDS = –10 V
0.1 -0.01
-0.1
Pulsed 160 120 VGS = –2.5 V –4.5 V
0 -10
-1
-10
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
-100
RDS(on) - Drain to Source On-state Resistance - mΩ
RDS(on) - Drain to Source On-state Resistance - mΩ
200
-1
-2.5
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
40
-2
10
Tch - Channel Temperature - °C
80
-1.5
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT | yfs | - Forward Transfer Admittance - S
VGS(off) - Gate to Source Cut-off Voltage - V
-2
0
-1
VGS - Gate to Source Voltage - V
GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
-50 -25
-0.5
ID - Drain Current - A
200 Pulsed 160 120 80 40 0 -0
-2
-4
-6
-8
-10
VGS - Gate to Source Voltage - V
Data Sheet G20215EJ1V0DS
9
μ PA2592T1H CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
140
1000 Pulsed
120
Ciss, Coss, Crss - Capacitance - pF
RDS(on) - Drain to Source On-state Resistance - mΩ
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
VGS = –2.5 V ID = –1 A
100 80 60
–4.5 V –2 A
40 20 0 -50 -25
0
25
50
Ciss
Crss
VGS = 0 V f = 1.0 MHz 10 -0.01
75 100 125 150 175
-1
-10
-100
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
DYNAMIC INPUT CHARACTERISTICS -6
-100
-5
IF - Diode Forward Current - A
VGS - Gate to Source Voltage - V
-0.1
VDS - Drain to Source Voltage - V
Tch - Channel Temperature - °C
VDD = –16 V –10 V –4 V
-4 -3 -2 -1
-10
VGS = 0 V -1
ID = –3 A
Pulsed
-0
-0.1 0
1
2
3
4
5
6
7
QG - Gate Charge - nC
10
Coss
100
0
0.5
1
VF(S-D) - Source to Drain Voltage - V
Data Sheet G20215EJ1V0DS
1.5
μ PA2592T1H
• The information in this document is current as of February, 2010. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special":
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-
"Specific":
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and
crime systems, safety equipment and medical equipment (not specifically designed for life support). medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc.
If customers wish to use NEC Electronics products in applications not intended by NEC
Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note 1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). (M8E0909E)
