Transcript
VEXG-13C
Art. No. 11151560
Technical Data
Digital Color Matrix Camera, GigE Firmware Revision 1.0 Sensor Information Model Name Type Shutter Resolution Scan Area Pixel Size
ON Semiconductor Python 1300 1/2“ progressive scan CMOS global 1280 x 1024 pixels 6.14 mm x 4.92 mm 4.8 μm x 4.8 μm
Data Quality
@ 20 °C, gain = 1, exposure time = 4 msec
Dark Noise () Saturation Dynamic Range SNR Quantum efficiency η
11 e- typical 8000 e- typical 57 dB typical 39 dB typical 46 % @ 465 nm, 50 % @ 536 nm, 52 % @ 631 nm typical
Acquisition Resolution Acquisition Frame Rate Interface Frame Rate Sensor Graph: Relative Response
(depends on used GigE interface performance)
Pixel Formats Partial Scan
Frame Rates / Partial Scan (Measured at Mono8/BayerRG8-Format)
Adjustable Acquisition Frame Rate Acquisition Mode Acquisition Status Exposure Mode
1280 px x 1024 px 61 fps | treadout = 16.16 msec (max. Resolution) @ 10 bit1) max. Frame Rate Format Resolution (@ Trigger Mode)
Full Frame 1280 x 1024 61 fps Binning 2x2 640 x 512 61 fps Binning 2x1 640 x 1024 61 fps Binning 1x2 1280 x 512 61 fps BayerRG8, BayerRG10 True Partial Scan with increasing Frame Rate on Y direction, Region of Interest (ROI) arbitrary Off or 0.01 … 3584 Hz Continuous, Single Frame and Multi Frame AcquisitionActive, AcquisitionTrigger Wait Timed
Image Pre-Processing Analog Controls Color Models Binning Horizontal Binning Vertical Defect Pixel Correction
Exposure Time (40 µsec … 1 sec | Step Size 1 µsec) Gain (0…12 dB), Offset (0 ... 63 LSB | 10 bit) Color 1 or 2 1 or 2 via Defect Pixel List with up to 512 Pixel Coordinates
Process Synchronization
Digital Output
Pin 1
Trigger Mode Trigger Overlap Type Trigger Sources
Off (Free Running), On (Trigger) Readout Hardware (Line0), Software or Off Trigger Delay out of treadout: 11 μsec @ 10 bit1) max. Trigger Delay during treadout: 25 μsec @ 10 bit1)
Trigger Delay External Flash Sync
via Exposure Active tdelay flash ≤ 3 µsec, tduration =texposure
Pin 4
1)
Sensor readout, different from pixel format
The Information in this document is subject to change without notice.
TDS_VEXG-13C 06.09.2016
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Baumer Optronic GmbH Radeberg, Germany
Digital I/Os
Digital Input
Lines Output Sources Line Debouncer
Pin 2
Input: Line 0, Output: Line1 Off, ExposureActive Low and high signal separately selectable Debouncing Time 0 … 5 msec, Step Size: 1 μsec
Interfaces and Connectors Data and Power Interface
Pin 3
Trigger Mode: Start up time and valid Trigger
2.4V 0.8V
Gigabit Ethernet Transfer Rate 1000 Mbits/sec Fast Ethernet Transfer Rate 100 Mbits/sec 8P8C Modular Jack (RJ45) Connector: screw lock type
1 – MX1+ 5 – MX32 – MX16 – MX23 – MX2+ 7 – MX4+ 4 – MX3+ 8 – MX4Process Interface Connector: M8/4-pin (SACC-DSI-M 8MS-4CON-L180) Assignment: 1 – VCC 3 – GND Caution (Power and OUT) (Power and IN) 2 – IN+ 4 – OUT Pin Assignment:
* Note I/Os: Ground loops are to be avoided and can lead to destruction of the device.
GPIO IN GPIO OUT High Active
Mechanical Data Housing
Zinc die casting, nickel-chrome-plated, IP40 (with mounted lens and GigE cable)
Dimensions
Weight
120 g
Optical Data Lens Mount Optical Filter
CS-Mount IR cut filter
The Information in this document is subject to change without notice.
TDS_VEXG-13C 06.09.2016
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Baumer Optronic GmbH Radeberg, Germany
Pin Assignment Data Interface
Electrical Data Power Supply (ext.) Power over Ethernet Power Consumption Digital Input
Digital Output Pin Assignment Process Interface (on camera side)
Caution
VCC: 12 V DC ± 20% I: 183 mA approx. 2.2 W @ 12VDC and 61 fps direct, without optocoupler UIN(low) : 0.0 … 0.8 VDC UIN(high) : 3.3 … 30 VDC IIN : <10 mA min. Impulse Length: 2.0 μsec direct, without optocoupler UEXT: VCC IOUT: max. 50 mA tON = typ. 3 µsec tOFF = typ. 40 µsec * The digital I/Os are not potential-free and do not have an overrun cut-off. Incorrect wiring (overvoltage, undervoltage or voltage reversal) can lead to defects in the electronic system. Ground loops are to be avoided and can lead to destruction of the device.
LED Signalling Green flash Green Yellow Yellow flash
LED wire colors on connecting cables (ordered separately) 1 Brown 2 White 3 Blue 4 Black
RX active Link ON Error TX active
Environmental Data Device Temperature: T = Measurement Point
-10 °C … +70 °C +5 °C … +65 °C @ T = Measurement Point Ambient temperature above 42 °C requires cooling measures
Storage Temperature Operating Temperature
Int. Temperature Sensor Humidity
10 % … 90 % non-condensing
Network Interface Data Interface
LED Signalling
Ethernet IP Configuration Packet Size Image Buffer
Gigabit Ethernet 1000BASE-T 1000 Mbits/sec Fast Ethernet 100 BASE-T 100 Mbits/sec Persistent IP, DHCP, LLA 576 … 9000 Byte, Jumbo Frames supported 1 Images (Trigger Mode) / 1 Image (Free Running Mode)
®
GigE Vision Features Events
-
Transmission via Asynchronous Message Channel
Conformity
up to 232 0 … 2621440 Byte 64 bit 0 .. 232– 1 Ticks Resend Buffer: 64 MB (32 Images) v2.0 (v1.2 backward compatible)
Frame Counter Payload Size Timestamp Packet Delay Packet Resend GigE Vision
The Information in this document is subject to change without notice.
TDS_VEXG-13C 06.09.2016
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Baumer Optronic GmbH Radeberg, Germany
GenICam
TM
Features Factory Settings: Freely Programmable: Parameters: Delay up to 16.2 msec v2.1
Timer User Sets
Acquisition Abort SFNC Version
UserSet0 (read only) UserSet1 any user definable Parameter
Factory Settings after Start-Up Trigger Mode Analog Controls Pixel Format Partial Scan Acquisition Frame Rate Timer Defect Pixel Correction Fixed Pattern Noise Correction Digital Input Digital Output GPIO 1/2 TriggerSource
Off (Free Running) Exposure Time: 4 msec, Gain: 0 dB, Offset: 0 BayerRG8 Off ON ON Line0, invert = false Line1, invert = false, line source = Off Off
The Information in this document is subject to change without notice.
TDS_VEXG-13C 06.09.2016
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Baumer Optronic GmbH Radeberg, Germany
