Transcript
VIA
VX855
Unified Digital Media IGP Chipset
The VIA VX855 is a low-power, highly integrated all-in-one system processor chip in a small 27 mm x 27 mm package that addresses key requirements of small form factor, high performance, power sensitive embedded applications. The VIA VX855 is VIA’s first integrated single chip that introduces the advantages of nextgeneration high definition H.264 and VC-1 video compression algorithms while maintaining a maximum power of only 2.3 watts, delivering the best performance in a small package. The VIA VX855 integrates a high performance DDR2 memory controller (up to 800 MHz), a 400/800 MHz FSB CPU interface, and extensive I/O capabilities (such as EIDE, USB 2.0, SDIO, UART, SPI, LPC and SMBus) in a single chip. It supports the VIA Chrome9™ HCM DX9 3D engine, High Definition audio controller, and plenty of display interfaces in its LVDS transmitter, CMOS LCD interface and CRT interface for more flexible multimedia playback options. It also supports dual independent displays on the same platform. VIA VX855 provides an advanced 3D graphics experience, which is powered by its high frequency GFX graphic engine and unified video decode acceleration. The high performance image processing features includes support for full hardware acceleration of leading video standards including H.264, MPEG-2, VC1, and WMV9 — greatly relieving the burden and reducing the power consumption of the CPU at the same time. The VX855 also supports up to three audio streams (up to eight channels each) with 32-bit sample depth and sample rates up to 192 kHz. The VX855 has a thermal design power (TDP) of 2.3 watts and is validated with Nano™, C7® and Eden™ processors. Together with Nano™ processor, the whole platform has a combined TDP of 15.3 watts, delivering incredibly high performance for demanding multimedia entertainment and making it ideal for many embedded market segments such as digital signage, in-vehicle entertainment, infotainment machines, interactive clients (POS, kiosks), gaming, and industrial control.
Key Features Host Interface VIA Nano™/C7®/Eden™ processor (up to 800 MHz FSB) Memory Controller Supports up to two 64-bit DDR2 800 DIMMs (4
GB max) High Definition Audio Interface Up to 32-bit sample depth at 192 kHz sampling rate Supports three codecs and eight streams Supports High Definition modem Integrated 2D / 3D / Video Processor VIA Chrome9™ HCM DX9 3D engine 128-bit 2D engine with hardware rotation capability High Definition video processor with VMR capability Up to 512 MB frame buffer Unified Video Decoding Processor MPEG-2, H.264 decoder VC1 video decoding acceleration Video Capture Port One 16-bit input or One 8-bit TS input + one Serial TS input or CCIR656/601 input + one Serial TS input
Display Interface Three 10-bit 350 MHz RAMDACs Single–channel LVDS 18-bit TTL Supports DuoView+™ Storage Interface Supports UDMA IDE Supports SD/MS/MMC/XD
Peripheral Expansion Bus Supports six USB 2.0 ports One USB client 2.0 device port Supports LPC bus Supports SDIO, SPI and UART Power Management ACPI 3.0 and PCI Bus Power Management 1.1 compliant Snapshot extensive system power management Package Flip-Chip Ball Grid Array (FCBGA) Size: 27 mm x 27 mm TDP Power TDP max: 2.3 W
VX855 Block Diagram
* All product specifications are subject to change without notice. Update: July 27, 2010.
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