Transcript
TM
YMU809 MC-3 Mobile Codec 3 OUTLINE The YMU809(MC-3) is an Audio CODEC chip developed for portable devices such as mobile phones, PNDs (Personal Navigation Device), which realizes voice source processing including hands-free capability and sound quality improvement of audio sources using AudioEngine(TM) technique. (MC-3 is another name for representing the functions of YMU809.) As for voice source processing, this device realizes high-performance hands-free capability by Echo Canceller, Noise Suppressor, etc. which was optimized even for a constrained reproduction environment as in a mobile terminal with a small diameter speaker. And, Noise Suppressor is applicable to both transmitter and receiver sides, which allows clearer voice to be sent to both sides by combining speech speed control function and voice quality improvement function using AudioEngine(TM) technique. And for sound quality improvement of audio sources, DSP processing using AudioEngine(TM) technique realizes high-performance and high-sound-quality audio processing functions such as Surround Sound Field Processing (including 2ch-5ch-2ch conversion), Bass Boost, Digital Equalizer, and Dynamic Range Controller. In addition, the YMU809 (MC-3) has decoders for a variety of compressed audio formats: MP3, Enhanced HE AAC, WMA, ATRAC3, etc., which is suitable for low-power consumption mobile phones and mobile audio devices. The YMU809 (MC-3) has an easy-to-use configuration that integrates the following audio-related peripherals: Stereo ADC/DAC, Stereo Headphone Amplifier, Receiver Amplifier, Separate 2-line Digital Audio I/O, 3-line Microphone Inputs, Analog I/O, Mixers, Volumes, etc. Moreover, power-down mode allows a block to be separately powered down when unused and this minimizes the consumption current. Thus, the YMU809 (MC-3) is the optimum I/O device for various sound sources handled in mobile devices such as voices for mobile phones, PND, camcorder, etc. and audio sound signals for music, analog/digital TV, radio, etc.
YMU809 CATALOG CATALOG No : LSI-4MU809A20 2009. 5
YMU809 FEATURES □ Processing of voice source, improvement of its sound quality ● Noise suppressor and echo canceller for hands-free processing ● Noise suppressor is applicable to both transmitter and receiver sides ● Speech speed control ● Improvement processing of voice quality ● Side-tone processing □ Improvement of audio-source sound quality ● Surround processing such as 2ch-5ch-2ch ● Sound enhancer ● Bass boost ● 10-band digital equalizer ● Dynamic range controller ● Sound field controller ● Multifunctional effectors ● Vocal canceller, pitch changer for Karaoke function □ Decode of various compressed audio formats, improvement of their sound quality ● Decoder: MP3 / AAC / HE AAC / Enhanced HE AAC / WMA / ATRAC3 / AMR / G.726 / PCM / SBC ● Encoder: AMR / PCM / SBC ● Sound quality improvement processing for compressed audio playback □ Comprehensive management of sound output, and adapt to various programming environments ● 16-bit AD/DA converter ● Multifunctional mixer ● Digital audio input interface (2 stereo lines, separately) ● Digital audio output interface (2 stereo lines, separately) ● Sampling frequency auto-detect function for digital audio inputs/outputs ● Microphone inputs (3 lines) ● 8-bit parallel CPU I/F ● General-purpose I/O port ● Stereo analog inputs (2 lines, differential input is possible) ● Stereo analog output (1 line, differential output is possible) ● Monaural analog output (1 line) ● Stereo headphone amplifier output ● Receiver amplifier output ● Built-in PLL and supporting clock input up to 27 MHz and TCXO (Temperature Compensated Crystal Oscillator) ● Power-down mode ● DSP parameter settings available for fine adjustment to acoustic characteristics of housing ● Provides a variety of middleware, drivers □ Power supply specification ● Core power supply ● Digital 3V-system power supply ● I/O power supply ● Analog circuit power supply ● Headphone amplifier power supply ● Receiver amplifier power supply
DVDD D3VDD IOVDD1 to 3 AVDD HPVDD RCVDD
1.10V to 1.30V (Typ. 1.20V) 2.70V to 3.30V (Typ. 3.00V) 1.65V to 3.30V (Typ. 1.80V) 2.70V to 3.30V (Typ. 3.00V) 2.70V to 4.50V (Typ. 3.00V) 2.70V to 4.50V (Typ. 3.60V)
□ Package ● Lead-free 77-ball FBGA package (YMU809-CZ)
[Note] When using decode or encode function for compression audio, it needs to get each decoder or encoder license.
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YMU809 SYSTEM CONFIGURATION EZAMPLES MC-3 can handle the voice processing concurrently with the audio CODEC processing available to improve the audio quality. Examples of the voice processing use are shown below.
1) PND with Hands-Free Capability
2) Mobile Phone for Voice Quality Improvement
3) Wi-Fi / Mobile Phone with Hands-Free Capability Noise Voice
AGC
NS
AEC
SRC
ADC MIC
Base band
Voice
or
SRC
NS
AGC
SSC
Wi-Fi Audio
Voice Improvement
Digital or Analog I/F
DAC
Echo
SP Amp.
SP Receiver Amp.
MC-3
Receiver
ADC: A/D Converter, AEC: Acoustic Echo Canceller, AGC: Auto Gain Controller, DAC: D/A Converter, NS: Noise Suppressor, SRC: Sampling Rate Converter, SSC: Speech Speed Controller
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YMU809 PIN CONFIGURATION FBGA 9X9 array with 77 balls
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YMU809 Pin FUNCTIONS No.
Pin Name
I/O
Power Supply
G P I P G P P O P
- -
Function
A1 A2 A3 A4 A5 A6 A7 A8 A9
DGND DVDD /CS IOVDD1 DGND IOVDD1 DVDD /IRQ IOVDD2
B1 B2 B3 B4 B5
PLLAGND A4 /WR D5 D6
G I I I/O I/O
IOVDD1 IOVDD1 IOVDD1 IOVDD1
A power supply pin for PLL (A capacitor connection pin) CPU interface Address 4 CPU interface Write CPU interface Data Bus 5 CPU interface Data Bus 6
B6 B7 B8 B9
D7 SDOUT#1 SDOUT#0 DGND
I/O O/Hi-Z O/Hi-Z G
IOVDD1 IOVDD2 IOVDD2 -
CPU interface Data Bus 7 Digital Audio #1 Data Output Digital Audio #0 Data Output A ground pin for digital circuits
C1 C2 C3 C4 C5 C6 C7 C8 C9
PLLAVDD A3 /RD D2 D3 D4 LRCK#1 LRCK#0 DVDD
P I I I/O I/O I/O I/O I/O P
IOVDD1 IOVDD1 IOVDD1 IOVDD1 IOVDD1 IOVDD2 IOVDD2 -
D1 D2 D3 D4 D5 D6
IOVDD3 A2 A1 D0 D1 GPIO
P I I I/O I/O I/O
IOVDD1 IOVDD1 IOVDD1 IOVDD1 IOVDD2
A power supply pin for CLKI CPU interface Address 2 CPU interface Address 1 CPU interface Data Bus 0 CPU interface Data Bus 1 GPIO control
D7 D8 D9
BCLK#1 BCLK#0 IOVDD2
I/O I/O P
IOVDD2 IOVDD2 -
Digital Audio #1 Bit Clock Digital Audio #0 Bit Clock A power supply pin for pins except CPU I/F and CLKI
E1 E2 E3 E6 E7 E8 E9
DVDD CLKI A0 TESTIO SDIN#1 SDIN#0 D3VDD
P Is/Itcxo I I/O I I P
-
IOVDD1 - - - - IOVDD2 - -
-
-
IOVDD3 IOVDD1 IOVDD2 IOVDD2 IOVDD2 -
A ground pin for digital circuits A power supply pin for digital circuits CPU interface Chip Select A power supply pin for CPU interface pin A ground pin for digital circuits A power supply pin for CPU interface pin A power supply pin for digital circuits Interrupt output A power supply pin for pins except CPU I/F and CLKI
A power supply pin for PLL CPU interface Address 3 CPU interface Read CPU interface Data Bus 2 CPU interface Data Bus 3 CPU interface Data Bus 4 Digital Audio #1 LR Clock Digital Audio #0 LR Clock A power supply pin for digital circuits
A power supply pin for digital circuits Clock input CPU interface Address 0 I/O pin for test Digital Audio #1 Data Input Digital Audio #0 Data Input Digital power supply (3V system)
PLLAGND pin connection Do not connect PLLAGND pin to the external ground. (It is connected to DGND internally.)
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YMU809 No. F1 F2 F3 F6
Pin Name D3VDD DVDDC3 DGND DGND
I/O P AI G G
Power Supply - - - -
F7
/TEST
I
IOVDD2
F8 F9 G1 G2 G3 G4 G5 G6 G7 G8 G9 H1 H2
/RST HPVDD AVDD MIN1 MOUT1 MBS1 AUX1R AUX2R LINEOUTR HPOUTR HPGND AGND MIN2
Is AP AP AI AO AO AI AI AO AO AG AG AI
IOVDD2 - - AVDD AVDD AVDD AVDD AVDD AVDD HPVDD - - AVDD
H3
MIG2
AI
AVDD
H4 H5 H6 H7 H8 H9
MBS2 AUX1L AUX2L LINEOUTL HPOUTL RCOUT2
AO AI AI AO AO AO
AVDD AVDD AVDD AVDD HPVDD RCVDD
J1
VREF
AI
AVDD
J2
HPC
AI
-
J3 J4 J5 J6 J7 J8 J9
MIN3 MOUT3 MBS3 LINEOUTM RCVDD RCGND RCOUT1
AI AO AO AO AP AG AO
AVDD AVDD AVDD AVDD - - RCVDD
I/O symbol description AG Analog ground AI Analog input AO Analog output AP Analog power supply G Digital Ground I Digital input I/O Digital in/output Is Digital input (Schmitt) Itcxo Digital input (TCXO) O Digital output O/Hi-z Digital output (settable to Hi-z) P Digital power supply
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Function Digital power supply (3V system) Capacitor connection pin of the digital-core power-supply division 3 A ground pin for digital circuits A ground pin for digital circuits A pin for test Be sure to connect to IOVDD2. Hardware reset input A power supply pin for headphone amplifier A power supply pin for analog circuits except amplifiers Microphone amplifier input #1 Microphone amplifier output #1 Microphone bias voltage #1 AUX#1 Rch input AUX#2 Rch input LINE output Rch Headphone amplifier Rch output A ground pin for headphone amplifier A ground pin for analog circuits except amplifiers Microphone amplifier input #2 Microphone 2 differential operation: Be sure to connect this pin to GND side of a microphone through a capacitor. Microphone 2 single-ended operation: Be sure to leave this pin open after the register setting (M2SNG=“1”). Microphone bias voltage #2 AUX#1 Lch input AUX#2 Lch input LINE output Lch Headphone amplifier Lch output Receiver amplifier differential output (-) Analog reference voltage Headphone output A capacitor is connected to this pin to prevent pop noise Microphone amplifier input #3 Microphone amplifier output #3 Microphone bias voltage #3 LINE output Mono A power supply pin for receiver amplifier A ground pin for receiver amplifier Receiver amplifier differential output (+)
YMU809 BLOCK DIAGRAMS 〔1〕 Digital Block
/RST
3D#0Send 3D#1Send
/IRQ
3D#2Send
Switch/Send/Panpot
CHV OL2
VOV OL
③ (DIR#0)
Clock Generation
PLL
CLKI
3D#3Send Lch Rch Sfx0Send Sfx1LSend Sfx1RSend BinauralLSend BinauralRSend
GPIO
GPIO
11ch
11ch
④ (DIR#1)
11ch
⑤ (ADC)
11ch
⑥ (C-DSP)
(SPE & PM)
Spectrum Analyzer
①-⑧
8 to 1 SEL (E)
Peak Meter
Intermediate Register
S P E_P M_S OURCE
出力FIFO
(ENC_L) 入力FIFO EFIFO (6KB)
SRC (ENC)
Lch
Rch
Write-in FIFO
1
(ENC_ R)
DFIFO _S OUR CE 0
SEL
1 DIT _S OUR CE_S E L
"0"
B DS P_S T
B-DSP
2ch
MUTE
B DS P_A DOUT
③ (DIR#0)
⑦
Analog
1
AGC
⑤ (ADC)
Parallel Conversion
HPF
0 A D_DS P S E L
(DIT#0)
Level Determination
DIT0_S RC_S OUR CE
2ch (L/Rch)
0
SRC ( DIR #1 )
DIR 1_FIFOW
(DIT#1) DIT1_S RC_S OUR CE
9 to 1 SEL (A)
DIT 1_S OUR CE
"0"
(R=R eserv ed)
(DIT #1) 2
L/Rch
ADC
Range Determination
⑧ ① - ⑦ , R, ⑨
SRC
④ (DIR#1 )
①-⑨
2 ch (L/Rch)
0
Deemphasis Filter 9 to 1 SEL (C)
1
②
(SFX /Sound -Quality Improvement )
1
SE L
SDOUT#1
(DIT # 0) 2
SEL
SDIN#1
SRC
DIT0_S OUR CE
Digital Audio I/F #1
BCLK#1
2 ch (L /Rch)
0
⑨
SEL
BYP ASS
LRCK#1
( DIR #0 )
DIR 0_FIFOW
1
①
B DS P_S T
E NC _S RC_S OURC E_R
Deemphasis Filter
① -⑨
SDOUT#0
SRC
9 to 1 SEL (B)
SDIN#0
2ch (L/Rch)
0
SEL
Digital Audio I/F #0
BCLK#0
SEL
1
LRCK#0
2 ch
MUTE
DFIFO (16KB)
1
1 4 t o 1 SEL (D)
SEL
SEL
0
10 band EQ
1
E NC _S RC_S OURC E_L
0 DIR_FIFOW _S E L
0
2ch
FFIFO (1KB )
2ch
(C-DSP )
SE L
FW Forward FIFO
R E C_S TA RT
(Path while B -DSP Is being stopped .)
⑥
1 1ch
D0-D7
1
SRC ( OUT)
14 to 1 SEL (D)
A0-A4
RFIFO (6KB )
C-DSP
/RD
SEL
/WR
OFIFO (9KB)
Read-out FIFO 0
①L - ⑦L, ①R - ⑦R ①L - ⑦L, ①R - ⑦R
CPU I/F (Interface Register)
/CS
Master Volume SWAP/ MONO
DAC ATT
HPF
OVS
P/S
L/ Rch (Serial )
S/P
DAC
(DAC)
DA C_S OURC E
/TEST TESTIO
Refer to the analog block diagram for details.
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YMU809
The CPU interface is a 8-bit parallel interface. This is a register block which can be accessed through the Interface Register. There are registers for setting various functions in the Intermediate Register. FIFOs are prepared around C-DSP. The data can be written and read from the CPU I/F and the digital audio I/F. The FIFO size differs with each path. This is a block to mainly perform various decoding and encoding processes. The data can be inputted and outputted from the CPU I/F and the digital audio I/F via the FIFO. This is a programmable DSP that performs the sound-quality improvement such as 3D processing, effector processing, and compression processing. This is a 3-band + 7-band digital equalizer. The equalizer is prepared on the assumption that 3-band is used for a parametric equalizer and 7-band is for graphic equalizers. This is a digital audio input-output interface for two stereo lines. The two lines are independent from each other, and can be concurrently used. The interface supports data of 16/20/24 bit 2’s complement and a sampling frequency of 8 kHz to 48 kHz. In addition, it supports both master mode and slave mode. Various processing in B-DSP and C-DSP can be applied to the input audio data. The function to connect the two lines (bypass mode) is also prepared. Six SRCs are located on the input and output side of the digital audio path and C-DSP path. The SRC converts various sampling frequencies that were input from the digital audio interface into 48 kHz. And, other SRCs on the digital audio output side and the C-DSP input path converts data of a sampling frequency of 48 kHz into a sampling frequency of 8 kHz to 48 kHz. The SRC on the C-DSP output path is used for playback pitch control. GPIO can outputs a signal level of setting in the register, or can read an external pin status through a register. In addition, an interrupt also can be generated by detecting the change of input pin status. A clock of 10 MHz to 27 MHz can be input to CLKI pin. This section also supports “TCXO” mode, which accept a low amplitude input, as well as usual CMOS input. PLL part generates the clocks from an input clock through CLKI pin to use for internal of LSI. This is a block to process bit stream signals from A/D converter. The processing performed are Parallel conversion, Dither cut (High Pass Filter), AGC (Auto Gain Control), etc.
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YMU809 〔2〕 Analog Block VOL2 spec. +22.5 to -22.5dB (1.5dB step) & MUTE MIXER ADL
ADC Lch
VOL2
To digital block ADC Rch
VOL2
MIXER ADR
DACL
MOUT1
ATT
MIXER STR
ATT
STL
From digital block
AUXR AUXL
MIXER STL
Microphone Input
DAC Lch
DACR
DAC Rch
STR ATT
LINEOUTL
MIXER LOL
MIN1
Line Output VOL MIXER LOR
+
SEL
MIG2
MOUT3
MIXER LOM
ATT
LINEOUTM
MC3 MC2 MC1
DMC3 DMC2 DMC1
ATT2 spec. 0 to -46dB (1.0dB step) & MUTE
SEL
SEL
Line Input
AUX1L
DAUXL
VOL
DIF_A1
+
+
SEL
SEL
AUX2R
DAUXR
VOL
MIXER HPL
ATT2
- +
HPOUTL
MIXER HPR
ATT2
- +
HPOUTR
AUXL
AUSEL
MBS1
LINEOUTR
VOL
MIN3
AUX1R
ATT
ATT spec. 0 to -30dB (1.0dB step) & MUTE
VOL
AUX2L
SEL
MIN2
Headphone Amplifier
AUXR
τ
HPC
In VOL (or ATT, ATT2) surrounded by , there is the circuit for the noise reduction (zero cross detection) during the volume change.
VOL spec. +12 to -33dB (1.5dB step) & MUTE
MIXER RC
ATT
MBS3
RCOUT1
Microphone Bias Circuit
RCOUT2
DACR DACL
+
STR STL AUXR AUXL
MBS2
Receiver Amplifier
+ VREF
VREF
AVDD AGND
HPVDD
HPGND
RCVDD RCGND
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YMU809 3-channel microphone inputs are prepared. There is a volume circuit for each channel in the later stage. For microphone 2, differential/single-ended operation can be selected. Two stereo external analog inputs are prepared. And, for AUX1L/R, a differential input can be selected. There is a separate volume circuit for Lch and Rch in the later stage. A stereo A/D converter is used. The sampling frequency is 48 kHz and all the analog inputs can be converted into digital signals by mixing them. There is a volume circuit which is located on the previous stage of the A/D converter, and a volume for Lch and Rch can be separately controlled. This section converts 16-bit stereo data from the digital section (after the 4×oversampling processing) into analog signals. The sampling frequency is 192 kHz. This circuit controls whether to mix or mute signals from DAC or analog inputs. A mixer circuit is prepared for each output path. After mixing 3-channel microphone inputs and adjusting its volume, the circuit outputs it as side-tone to both the mixer for headphone amplifier and the mixer for receiver amplifier. One stereo and one mono line outputs are prepared. The circuit can mixes all the analog inputs and DAC outputs in each channel (Lch, Rch) separately and outputs it to the line-output. For stereo line, a differential output is selectable. A stereo headphone amplifier is mounted in the chip. This is a linear amplifier needing a DC-cut capacitor. The volume for the headphone path is specified as 0 dB to -46 dB and MUTE. Receiver amplifier with differential output is mounted in the chip.
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YMU809 ELECTRICAL CHARACTERISTICS 〔1〕 Absolute Maximum Ratings Parameter DVDD pin, supply voltage IOVDD1 pin, supply voltage IOVDD2 pin, supply voltage IOVDD3 pin, supply voltage D3VDD pin, supply voltage AVDD pin, supply voltage HPVDD pin, supply voltage RCVDD pin, supply voltage Analog input voltage (*4) Digital input voltage 1 (*1) (*4) Digital input voltage 2 (*2) (*4) Digital input voltage 3 (*3) (*4) Power dissipation (*5) Storage temperature
Symbol
Min.
Max.
Unit
DVDD IOVDD1 IOVDD2 IOVDD3 D3VDD AVDD HPVDD RCVDD VINA VIND1 VIND2 VIND3 Pd TSTG
-0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3
1.70 4.20 4.20 4.20 4.20 4.20 5.20 5.20 AVDD+0.3 IOVDD1+0.3 IOVDD2+0.3 IOVDD3+0.3 1639 125
V V V V V V V V V V V V mW °C
-50
Condition DGND, AGND, HPGND and RCGND are all 0V. (*1) Applicable pins are Input and input-output pins operated by IOVDD1. (*2) Applicable pins are Input and input-output pins operated by IOVDD2. (*3) Applicable pin is CLKI pin. (*4) The value is applied even when the supply voltage is out of the recommended operating voltage range. For example: An input voltage in excess of 0.3V becomes a violation when a voltage being input to a power supply pin is 0V (*5) Take this value as a reference because it is calculated by simulation based on a certain environment condition, Top= 25°C, mounted on a glass epoxy PCB (114.3 mm × 76.2 mm × 1.6 mm), and the board wiring density is 200%. When operating above Top= 25 °C, the value decreases 16.4 mW per 1 °C.
〔2〕 Recommended Operating Conditions Parameter
Symbol
Min.
Typ.
Max.
Unit
DVDD pin supply voltage IOVDD1 pin supply voltage
DVDD IOVDD1
1.10 1.65
1.20 1.80
1.30 3.30
V V
IOVDD2 pin, supply voltage IOVDD3 pin, supply voltage D3VDD pin, supply voltage (*1) AVDD pin, supply voltage (*1) HPVDD pin, supply voltage RCVDD pin, supply voltage Operating ambient temperature
IOVDD2 IOVDD3 D3VDD AVDD HPVDD RGVDD TOP
1.65 1.65 2.70 2.70 2.70 2.70 -20
1.80 1.80 3.00 3.00 3.00 3.60 25
3.30 3.30 3.30 3.30 4.50 4.50 85
V V V V V V °C
Condition DGND, AGND, HPGND and RCGND are all 0V. (*1) For D3VDD and AVDD, supply a same voltage from same regulator to keep D3VDD = AVDD.
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YMU809 〔3〕 Current Consumption Parameter DVDD + PLLAVDD consumption current
Conditions HE AAC decoder playback →DAC operation MP3 decoder playback →DAC operation DIR#0 → DAC operation
IOVDD1 consumption current
HE AAC decoder playback
IOVDD2 consumption current
DIR#0 → DIT#1 operation
IOVDD3 consumption current (*8)
Typ. (*1)
Max. (*2)
Unit
6.2
(*4)
mA
5.3
(*5)
mA
2.2
(*6)
mA
(*4) (*5) (*6)
0.1
mA
0.6
mA
Normal operation (CMOS mode)
25
μA
Normal operation (TCXO mode)
80
μA
AVDD consumption current
AP*= all “0”
15
mA
D3VDD consumption current
ADC, DAC operation
0.7
mA
HPVDD consumption current (Headphone amplifier section)
AP*= all “0”, no sound generated
1.1
mA
At 16Ω load, f=1kHz, 1mW output (Lch/Rch simultaneously) AP*= all “0”, no sound generated
8.2
mA
1.1
mA
At 32Ω load, f=1kHz, 10mW output
17.5
mA
RCVDD consumption current (Receiver amplifier section)
(*7)
Power saving mode (*3) (*9)
Total current of all power supplies
80
320
μA
Power off mode (*3)
Total current of all power supplies
2
20
μA
(*1): Under the (Typ.) voltages of the Recommended Operating Conditions, ambient temperature is room temperature. (*2): Under the (Max.) voltages of the Recommended Operating Conditions, ambient temperature is room temperature. (*3): /CS input pin is fixed to VIH=IOVDD1, and other input pins are VIL=DGND, VIH= IOVDD1 and IOVDD2, IOVDD3. (*4): The value is at HE AAC data is during playback (fs=44.1 kHz, 48 kbps). Process of the B-DSP section is nothing. Digital blocks except DP0 to DP2, PLLRST* and CDSP_PS are power saving state. At PLL single mode (CLKI=18.432MHz). It increase +0.4mA when CLKI=19.2MHz. (*5): The value is at MP3 data is during playback (fs=44.1 kHz, 128 kbps). Process of the B-DSP section is nothing. Digital blocks except DP0 to DP2, PLLRST* and CDSP_PS are power saving state At PLL single mode (CLKI=18.432MHz). It increase +0.4mA when CLKI=19.2MHz. (*6): DA#0 settings are fs=44.1 kHz, BCLK=64fs and Master Mode. Process of the B-DSP section is nothing, Digital blocks except DP0 to DP2, PLLRST* and DA0_PS are power saving state. At PLL single mode (CLKI=18.432MHz). It increase +0.4mA when CLKI=19.2MHz. (*7): DA#0 and DA#1 settings are fs=48.0 kHz, BCLK=64fs and Master Mode. (*8): At CLKI=19.2 MHz (*9): *_PS= “1”, DP*= “1”, PLLRST*= “1”, ANA_RST= “1”
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YMU809 〔4〕 DC Characteristics Parameter
Symbol
Input voltage “H” level 1 Input voltage “L” level 1 Input voltage “H” level 2 Input voltage “L” level 2 Input voltage “H” level 3 Input voltage “L” level 3 Input voltage “H” level 4 Input voltage “L” level 4 Output voltage “H” level 1 Output voltage “L” level 1 Output voltage “H” level 2 Output voltage “L” level 2 Schmitt width 1 Schmitt width 2 Input leakage current Input capacity
VIH VIL VIH VIL VIH VIL VIH VIL VOH VOL VOH VOL Vsh1 Vsh2 IL CI
Condition (*1) (*1) (*2) (*2) (*3) (*3) /RST pin /RST pin (*1) IOH = (*4) (*1) IOL = (*4) (*2) IOH = (*4) (*2) IOL = (*4) /RST pin CLKI pin
Min.
Typ.
Max.
0.70 × IOVDD1 0.30 × IOVDD1 0.70 × IOVDD2 0.30 × IOVDD2 0.75 × IOVDD3 0.25 × IOVDD3 0.75 × IOVDD2 0.25× IOVDD2 0.80 × IOVDD1 0.20 × IOVDD1 0.80 × IOVDD2 0.20 × IOVDD2 120 30 10
10 10
Unit V V V V V V V V V V V V mV mV μA pF
Condition Under the Recommended Operating Conditions and Capacitor load=50pF. (*1) Applicable pins are operated by IOVDD1. (*2) Applicable pins are operated by IOVDD2. (*3) Applicable pin is CLKI (at CMOS mode). (*4) BCLK#0, BCLK#1 and GPIO are IOH = -2mA and IOL= +2mA. Other output pins are IOH = -1mA and IOL= +1mA.
Notes Drive capability of output pins became larger as a voltage of IOVDD* is higher. Insert an adequate damping resistor according to use conditions.
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YMU809 〔5〕 AC Characteristics (a) Power-on and Hardware-Reset Rules Parameter /RST “L” pulse width (*1) /RST (undefined → L) setup time (*2) Power supply rise time (*3) Power supply rise time interval (*4)
Symbol
Min.
TRSTW TRSTS TVRISE TVSKW
1 0
Typ.
0
Max.
Unit
10 50
μs μs ms ms
Condition Under the Recommended Operating Conditions. (*1) This is the rule between /RST pin and last rising power supply of DVDD, IOVDD1 to 3 and D3VDD(=AVDD). HPVDD and RCVDD can be powered on even after /RST has been changed from “L” to “H”. (*2) This is a rule between IOVDD2 and /RST pin. (*3) This is the rule for power supply rise time. (This time is from power-on to reaching the minimum voltage of the recommended operating condition.) (*4) This is the rule for time interval difference between first rising and last rising power supplies among DVDD, IOVDD1 to 3 and D3VDD (=AVDD). TVRISE
Power-on Start
2.7V
D3VDD AVDD TVRISE
Power-on Start
1.1V
DVDD IOVDD1 IOVDD2 IOVDD3
TVRISE
Power-on Start
1.65V 0.3V TVSKW
TRSTS
/RST
TRSTW
VIL= 0.25×IOVDD2
↑ Be sure not to violate the Absolute Maximum Rating during the undefined period of /RST. Notes for the order of power supplies rising The power-on order between DVDD and IOVDD* is arbitrary; however, the following order is recommended. 1. Power-on IOVDD1 to IOVDD3 (The power-on order between IOVDD1 to IOVDD3 is arbitrary.) 2. Power-on DVDD 3. Power-on D3VDD (=AVDD) 4. Reset cancel (/RST= “H”) *) When DVDD is powered on earlier than IOVDD2, leak current same as power-save mode will flow to DVDD until IOVDD2 is up.
14
YMU809 Notes Be sure to input “L” to /RST pin at the same time as IOVDD2 rise. With the condition where IOVDD2 power supply is established and /RST pin is at L level, the circuit is configured so that input-output direction of pins operating at IOVDD2, and output level at the output pin are defined. The input-output direction of D0 to D7 pins is settled by the input polarity of /RD and /CS which operates at IOVDD1. Therefore, the input-output direction of D0 to D7 is settled even if IOVDD1 has already risen and DVDD is not yet. (Inputting “H” to /CS in conjunction with the rise of IOVDD1 is recommended).
15
YMU809 (b) Input Clock (CLKI) 1) CMOS Mode Parameter CLKI frequency CLKI rise / fall time CLKI High time CLKI Low time Allowable frequency deviation range Condition
Symbol
Min.
1 / Tfreq Trckc, Tfckc Th Tl -
10
Typ.
15 15 -100
Max.
Unit
27 30
MHz ns ns ns ppm
+100
Under the Recommended Operating Conditions
2) TCXO Mode Parameter CLKI frequency CLKI rise / fall time CLKI amplitude H (10MHz≤CLKI frequency≤27MHz) (*1) CLKI amplitude L (10MHz≤CLKI frequency≤27MHz) (*1) Wait time to stable operation (*1) Feedback resistance Allowable frequency deviation range
Symbol
Min.
1 / Tfreq Trckt, Tfckt Vmax – Vcenter
10
Typ.
Max.
Unit
0.30
27 50 0.35 × IOVDD3
MHz ns V
Vcenter – Vmin
0.30
0.35 × IOVDD3
V
Twait Rck -
2 13.5 -100
54 +100
ms kΩ ppm
27
Condition Under the Recommended Operating Conditions (*1) : The value is under the condition of which TCXO parts is AC-coupled with the CLKI pin with a capacitor of 1000pF. Be sure to use a capacitor of 1000pF for AC coupling.
16
YMU809 • The voltage level of which Duty of CLKI becomes 50% (High time = Low time) is defined as Vcenter. However, input of such waveform (Positive pulse, negative pulse, etc. with duty ratio logically out of shape) that cannot define the Vcenter shall be prohibited. • The measurement point of Trckt and Tfckt is defined by the time taken for variation between Vcenter + 0.30 [V] and Vcenter – 0.30 [V]. • The timing measurement level of Tfreq should be Vcenter (Duty=50% ).
B
Vcenter A
OK : Input applicable to the definition of Vcenter [ Presence of a state of interval A = interval B ]
B
Vcenter A
NO : Input not applicable to the definition of Vcenter [ Absence of a state of interval A = interval B ]
Notes for the external circuit of CLKI pin Select TCXO mode or CMOS mode by CKSEL bit (A_ADR#5). Note that characteristics of CLKI pin's peripheral circuits and input signals vary depending on a setting value. Be sure to match the CKSEL setting value with characteristics of CLKI pin's external circuit and input signals.
When used in TCXO mode : YMU809 1000pF CLKI A capacitor is required. Watch out for this input amplitude! Refer to “CLKI amplitude” of TCXO mode.
Be sure to set the CKSEL to “1”
When used in CMOS mode: YMU809 Capacitor connection (AC-coupling) is not required. CLKI
Be sure to set the CKSEL to “0”
17
YMU809 (c) CPU Interface Timing The characteristics of the CPU interface are measured under the following conditions. VIL=0.20×IOVDD1 Input conditions in the measurement: VIH=0.80×IOVDD1, Measurement points: VIH=0.70×IOVDD1, VIL=0.30×IOVDD1 VOH=0.70 ×IOVDD1, VOL=0.30×IOVDD1
1) Write Cycle Parameter Address setup time Address hold time Chip select setup time Chip select hold time Write pulse width Data setup time Data hold time /CS, /WR, A0 to A4, D0 to D7 inputs raise/fall time Condition
Symbol
Min
TADS TADH TCSS TCSH TWW TWDS TWDH TRFI
30 0 30 0 30 20 0
Max.
Unit
20
ns ns ns ns ns ns ns ns
Max.
Unit
Under the Recommended Operating Conditions
2) Read Cycle Parameter Address hold time Chip select hold time Access time from /RD pin Access time from /CS pin Access time from A0-A4 pin Data hold time from /RD pin High-impedance transition time from /RD pin /CS, /RD, A0 to A4 inputs raise/fall time Condition
18
Symbol
Min
TADH TCSH TACCRD TACCCS TACCAD TDHRD TDZRD TRFI
0 0 50 50 50 0 10 20
ns ns ns ns ns ns ns ns
Under the Recommended Operating Conditions, Capacitor load=50pF, IOH and IOL = 0 mA.
YMU809 3) Timing Chart in the Write Operation
Notes : TADH :
TCSH :
TWDH :
TADS :
TCSS :
The hold time of A0-A4 pin, which is defined with respect to the point where the rise of /WR has reached 0.70×IOVDD1 under the condition that both two specifications (TCSH , TWDH) are secured more than minimum value (=0ns). The hold time of /CS pin, which is defined with respect to the point where the rise of /WR has reached 0.70×IOVDD1 under the condition that both two specifications (TADH , TWDH) are secured more than minimum value (=0ns). The hold time of D0-D7 pins, which is defined with respect to the point where the rise of /WR has reached 0.70×IOVDD1 under the condition that both two specifications (TADH , TCSH) are secured more than minimum value (=0ns). The hold time of A0-A4 pin, which is defined with respect to the point where /WR has become invalid (0.30×IOVDD1) under the condition that all of three specifications (TCSS, TWW, TWDS) are secured more than minimum value. The hold time of /CS pin, which is defined with respect to the point where /WR has become invalid (0.30×IOVDD1) under the condition that all of three specifications (TADS, TWW, TWDS) are secured more than minimum value.
19
YMU809 4) Timing Chart in the Read Operation
TRFI
TRFI
A0-A4 TACCAD
TADH
TRFI
TCSH
TRFI
/CS TACCCS TRFI
TRFI
/RD TACCRD
TDZRD TDHRD
D0-D7
Valid
Notes : TACCAD : The access time from when A0-A4 are defined (0.70×IOVDD1 or 0.30×IOVDD1) until when D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1). /RD and /CS shall be defined beforehand (*1). TACCCS : The access time from when /CS is defined (0.30×IOVDD1) until when D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1). A0-A4 and /RD shall be defined beforehand (*1). TACCRD : The access time from when /RD is defined (0.30×IOVDD1) until when D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1). A0-A4 and /CS shall be defined beforehand (*1). TDHRD : It is the period of time when D0 to D7 keeps outputting (holding) valid data from the point of 0.30×IOVDD1 at which /RD changes its state from a valid level to an invalid level. Time more than 0ns shall be secured for TADH and TCSH. TDZRD : This indicates the period from when /RD becomes invalid (0.70×IOVDD1) until when D0-D7 becomes high impedance state under the condition that TADH and TCSH secures 0 ns or over.
20
YMU809 (*1) “defined beforehand”. Means: A0-A4: It indicates the state in which A0-A4 are defined (0.70×IOVDD1 or 0.30×IOVDD1) more than TACCAD before when the reference is placed on a point where D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1). /CS: It indicates the state in which /CS is defined (0.30×IOVDD1) more than TACCCS before when the reference is placed on a point where D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1). /RD: It indicates the state in which /RD is defined (0.30×IOVDD1) more than TACCRD before when the reference is placed on a point where D0-D7 are defined (0.70×IOVDD1 or 0.30×IOVDD1).
21
YMU809 5) Waiting time during access Parameter
Symbol
Min 70 30 90 60 100 90 40
Write – Write access waiting time
(*1)
TWAITWW
Read – Read access waiting time
(*2)
TWAITRR
Write – Read access waiting time
(*3)
TWAITWR
Read – Write access waiting time
TWAITRW
Max.
Unit ns ns ns ns
(*1): It depends on the accessing area. See the table on the next page. (*2): TWAITRR of REC_FIFO continuous read is 90ns (*4). The rest of it is 60ns. (*3): TWAITWR of DEC_FIFO (Write) – DFIFO_FLG (Read) and FSQ_FIFO (Write) – FFIFO_FLG (Read) is 100ns (*5). The rest of it is 90ns. (*4): It is the value when CDSP_CLK_FREQ_HOST (DEC_B_ADR#111) is set to “3” (73.728MHz). When CDSP_CLK_FREQ_HOST to “1” (36.864MHz), it is 180ns. (*5): It is the value when CDSP_CLK_FREQ_HOST (DEC_B_ADR#111) is set to “3” (73.728MHz). When CDSP_CLK_FREQ_HOST to “1” (36.864MHz), it is 200ns.
/WR
VIH TWAITWW
/RD
VIH TWAITRR
/WR
VIH
VIH TWAITWR
/RD
22
TWAITRW VIH
YMU809 i) Waiting Time for Write – Write The table below shows the write waiting time (TWAITWW) when writing into the same address (A_ADR#) continuously. Note that the waiting time varies depending on address values. A_ADR#
Register name
Write waiting time (Min.)
#0
EIRQ, BANK
30ns
Supplementary
(when writing into the same A_ADR# continuously) #1
B_ADR
30ns
#2
W_WINDOW
— (Accessed together with #1)
#3
RST1
— (In actual use, no chance of continuous write)
#4
RST3, RWSW3
30ns
(*1)
#5
CKSEL, PLLRST*, DP*
30ns
(*1)
#6
DA*_INV, DA*_MS, DA*_MASK
30ns
#7
DA_BYPASS, DA*_*HIZ
30ns
#8
GP_DR, GP_MASK, GP_DDR, GP_MODE
30ns
#10
ANA_RST
— (In actual use, no chance of continuous write)
#16
DEC_B_ADR
30ns
#17
DEC_W_WINDOW
— (Accessed together with #16)
#18
DEC_FIFO
70ns
#19
FSQ_FIFO
70ns
#20
Interrupt flag (C-DSP related)
70ns
#21
Interrupt flag enable (C-DSP related)
70ns
#22
Interrupt flag
70ns
#23
Interrupt flag enable
70ns
#24
ANA_WADR
70ns
#25
ANA_WDATA
70ns
#26
ANA_RADR
— (In actual use, no chance of continuous write)
#27
AVALID
— (In actual use, no chance of continuous write)
#28
*_PS
30ns
(*1), (*2)
(*1): Set them according to the initialization procedure. (*2): For *_PS bits except CDSP_PS, it takes time up to 1/fs_SY to reflect the setting after writing.
Supplementary Explanation ▪ When writing to other than above address (A_ADR#), waiting time is 70ns minimum.
23
YMU809 ii) Waiting Time for Read – Read The table below shows the waiting time (TWAITRR) for Read-Read operations when reading from the same address (A_ADR#) continuously.
A_ADR#
Register name
Read waiting time (Min.)
Supplementary
(when reading from the same A_ADR# continuously) #0
EIRQ, BANK, BUSY, IRQ
#1
B_ADR
60ns 60ns
#2
R_WINDOW
— (Accessed together with #1)
#3
RST1
60ns
#4
RST3, RWSW3, PWSW3FLG
60ns
#5
CKSEL, PLLRST*, DP*
60ns
#6
DA*_INV, DA*_MS, DA*_MASK
60ns
#7
DA_BYPASS, DA*_*HIZ
60ns
#8
GP_DR, GP_MASK, GP_DDR, GP_MODE
60ns
#10
ANA_RST
60ns
#15
HW_ID
60ns
#16
DEC_B_ADR
60ns
#17
DEC_W_WINDOW
— (Accessed together with #16)
#18
REC_FIFO
90ns
#20
Interrupt flag (C-DSP related)
60ns
#21
Interrupt flag enable (C-DSP related)
60ns
#22
Interrupt flag
60ns
#23
Interrupt flag enable
60ns
#24
ANA_WADR
— (Normally, no chance of continuous read)
#25
ANA_WDATA
— (Normally, no chance of continuous read)
#26
ANA_RADR
— (Normally, no chance of continuous read)
#27
AVALID
60ns
#28
*_PS
60ns
(*1): It is the value when CDSP_CLK_FREQ_HOST (DEC_B_ADR#111) is set to “3” (73.728MHz). When CDSP_CLK_FREQ_HOST to “1” (36.864MHz), it is 180ns.
Supplementary Explanation * When reading to other than above address (A_ADR#), waiting time is 60ns minimum. In actual use, continuous read address is REC_FIFO(A_ADR#18) only.
24
(*1)
YMU809 (d) Digital Audio Interface Timing The characteristics are measured under the following conditions. Input conditions in the measurement: VIH=0.80×IOVDD2, Measurement points: VIH=0.70×IOVDD2, VOH=0.70×IOVDD2,
VIL=0.20×IOVDD2 VIL=0.30×IOVDD2 VOL=0.30×IOVDD2
The following specifications are common to bath DA#0 and DA#1 systems.
1) Master Mode Parameter BCLK#* output frequency (*2)(*3)
BCLK#* output “H” time BCLK#* output “L” time LRCK#* output frequency (*3) SDIN#* inputs raise/fall time
Symbol
Min.
1 / TBCLKW
TBCLKHW TBCLKLW
Typ.
Max.
64fs_DA 48fs_DA 32fs_DA (*1)
kHz
120 120
1 / TLRCKW
Unit
ns ns fs_DA(*1)
TRFI
kHz 20
ns
Condition Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA (*1) fs_DA is a sampling frequency of the digital audio interface. (*2) BCLK#0 and #1 outputs have logical jitters. (*3) The frequency may move over a little from the ideal value depending on CLKI frequency and PLL setting.
Parameter
Symbol
Min.
TLRCKD_A TSDIS_A
-20 65
SDIN#* inputs hold time
TSDIH_A
65
SDOUT#* output delay time
TSDOD_A
30
LRCK#* output delay time SDIN#* inputs setup time
Condition
Typ.
Max.
Unit
+20
ns ns
105
ns
ns
Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA
Parameter
Symbol
Min.
TLRCKD_B TSDIS_B
-20 65
SDIN#* inputs hold time
TSDIH_B
65
SDOUT#* output delay time
TSDOD_B
30
LRCK#* output delay time SDIN#* inputs setup time
Condition
Typ.
Max.
Unit
+20
ns ns
105
ns
ns
Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA
25
YMU809 The timing charts of DA#0 side are shown here. The charts of DA#1 side are the same.
TBCLKW TBCLKHW
TBCLKLW
TRFO
BCLK#0 (Output)
TRFO 0.70×IOVDD2 0.50×IOVDD2 0.30×IOVDD2
TLRCKW
LRCK#0 (Output)
0.50×IOVDD2
TRFI
SDIN#0 (Input)
26
TRFI 0.70×IOVDD2 0.30×IOVDD2
YMU809
27
YMU809 2) Slave Mode Parameter
Symbol
BCLK#* inputs frequency
1 / TBCLKW
BCLK#* inputs “H” time BCLK#* inputs “L” time LRCK#* output frequency BCLK#* LRCK#*, SDIN#* inputs raise/fall time
TBCLKHW TBCLKLW 1 / TLRCKW TRFI
Min.
Typ.
Max.
64fs_DA 48fs_DA 32fs_DA (*1)
Unit kHz
120 120 fs_DA(*1) 20
ns ns kHz ns
Condition Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA (*1) fs_DA is a sampling frequency of the digital audio interface.
Allowable Input Frequency (LRCK#0, #1) Range In the slave mode, the allowable range of input frequency (LRCK#0, #1) is predetermined. Normal playback operation cannot be guaranteed when a frequency is not within the range.
Parameter
Symbol
Min.
LRCK#* inputs setup time LRCK #* inputs hold time
TLRCKS_A TLRCKH_A
65 65
ns ns
SDIN#* inputs setup time
TSDIS_A
65
ns
SDIN#* inputs hold time
TSDIH_A
65
SDOUT#* output delay time
TSDOD_A
55
Condition
Typ.
Max.
Unit
ns 135
ns
Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA
Parameter LRCK#* inputs setup time LRCK #* inputs hold time
Min.
TLRCKS_B TLRCKH_B
65 65
Typ.
Max.
Unit ns ns
SDIN#* inputs setup time
TSDIS_B
65
ns
SDIN#* inputs hold time
TSDIH_B
65
ns
SDOUT#* output delay time
TSDOD_B
55
Condition
28
Symbol
135
Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA
ns
YMU809 The timing charts of DA#0 side are shown here. The charts of DA#1 side are the same.
TBCLKW TBCLKHW
TBCLKLW
TRFI
BCLK#0 (Input)
TRFI 0.70×IOVDD2 0.50×IOVDD2 0.30×IOVDD2
TLRCKW TRFI
TRFI
LRCK#0 (Input)
0.70×IOVDD2 0.50×IOVDD2 0.30×IOVDD2
TRFI
SDIN#0 (Input)
TRFI 0.70×IOVDD2 0.30×IOVDD2
29
YMU809
30
YMU809 3) Bypass Mode Parameter SDIN#* → SDOUT#* delay time (*1) BCLK#* → BCLK#* delay time (*2) LRCK#* → LRCK#* delay time (*3)
Symbol TDBYPSD TDBYPSB TDBYPSL
Min.
Typ.
Max.
Unit
50 50 50
ns ns ns
Condition Under the Recommended Operating Conditions, Capacitor load=30pF, IOH and IOL= 0mA (*1) Applicable path: SDIN#0 → SDOUT#1, SDIN#1 → SDOUT#0 (*2) Applicable path: BCLK#0 (input) → BCLK#1 (output), BCLK#1 (input) → BCLK#0 (output) (*3) Applicable path: LRCK#0 (input) → LRCK#1 (output), LRCK#1 (input) → LRCK#0 (output)
31
YMU809 (e) Other Digital Input Pin (GPIO)
Parameter Input raise/fall time Condition
32
Symbol TRFI
Under the Recommended Operating Conditions
Min.
Typ.
Max.
Unit
20
ns
YMU809 〔6〕 Analog Characteristics The measurement conditions are as follows. TOP=25°C DVDD=1.20V, IOVDD1=IOVDD2=IOVDD3=1.80V, AVDD=D3VDD==3.00V, HPVDD=3.00V RCVDD=3.60V
(a) Headphone Amplifier Parameter
Min.
GAIN setting (fixed) Minimum load resistance (RL) Maximum output voltage amplitude (RL=16Ω) Maximum output power (RL=16Ω, THD+N≤1.0%) THD + N (RL=16Ω, f=1kHz, 5mW output) Noise in no signal (A-filter: weighting filter) PSRR (f=1kHz)
Typ.
Max.
1 16 1.5 18 0.03 -105 77
Unit Times Ω Vp-p mW % dBV dB
(b) Receiver Amplifier Parameter
Min.
Gain setting (fixed) Minimum load resistance (RL) Maximum output voltage amplitude (RL=32Ω) Maximum output power (RL=32Ω, THD+N≤1.0%) THD+N (RL=32Ω, f= 1kHz) Noise in no signal (A-filter) PSRR Amplitude center potential Differential output voltage
Typ.
Max.
±1 32 3.8 55 0.025 -100 90 0.5×AVDD 3
Unit Times Ω Vp-p mW % dBV dB V mV
(c) MIC Amplifier #1, #3 Parameter Gain settable range Maximum output voltage amplitude THD+N (f= 1kHz, at 20dB Gain) (*) Noise in no signal (A-filter, at 20dB Gain) (*) Input impedance Feedback resistance between MIN1 and MOUT1 (MIN3 and MOUT3)
Min.
Typ. 2.7 0.005 -92
10 20
Max.
Unit
30
dB Vp-p % dBV MΩ kΩ
(*) It is measured at MOUT1, MOUT3.
33
YMU809 (d) MIC Amplifier #2 (Single-ended/Differential) Parameter
Min.
Gain settable range Gain step width THD+N (f= 1kHz, at 20dB Gain, Single-ended) (*) THD+N (f= 1kHz,at 20dB Gain, Differential) (*) Noise in no signal (A-filter, at 20dB Gain, Single-ended) (*) Noise in no signal (A-filter, at 20dB Gain, Differential) (*) Input impedance (at +15dB Gain) Input impedance (at +20dB Gain) Input impedance (at +25dB Gain) Input impedance (at +30dB Gain)
+15
Typ.
Max.
Unit
+30
dB dB % % dBV dBV kΩ kΩ kΩ kΩ
Max.
Unit
2.0
V mA dBV
Max.
Unit
5 0.009 0.011 -88 -86 61.6 37.1 21.7 12.5
(*) It is measured at LINEOUTL pin. (MC*VOL and LOVOL_L are set to 0dB.)
(e) MIC Bias #1 to #3 Parameter
Min.
Output voltage Output current Noise level (A-filter)
Typ. 2.0 -108
(f) VREF Parameter
Min.
VREF voltage
Typ. 0.5×AVDD
V
(g) DAC Parameter Resolution Full scale output voltage THD+N (f= 1 kHz) Noise in no signal (A-filter) Pass frequency band
Min.
Typ.
Max.
Unit
0.46×fs_SY
Bit Vp-p % dBV Hz
Max.
Unit
0.4×fs_SY
Bit Vp-p % dBFS Hz
Max.
Unit
0
dB dB dB
16 2.0 0.04 -100 20 (*)
(*) when setting the high-pass filter of the DAC path to the default value.
(h) ADC Parameter Resolution Maximum input voltage (-3dBFS) THD+N (f= 1kHz) Noise in no signal (A-filter) Pass frequency band
Min.
Typ. 16 2.0 0.015 -94
20 (*)
(*) when setting the high-pass filter of the ADC path to the default value.
(i) Headphone Volume (HPVOL_[L/R]) Parameter Volume setting range Volume step width MUTE attenuation rate
34
Min.
Typ.
-46 1 80
YMU809 (j) LINEOUT Volume (LOVOL_[L/R/M]) Parameter
Min.
Volume setting range Volume step width Attenuation rate at the time of Mute Minimum load resistance Maximum output voltage amplitude Output impedance
-30
Typ.
Max.
Unit
0
10 2.7 300
600
dB dB dB kΩ Vp-p Ω
Typ.
Max.
Unit
+22.5
dB dB dB
Max.
Unit
+12
dB dB dB
Max.
Unit
+12
dB dB dB kΩ kΩ
Max.
Unit
0
dB dB dB
Max.
Unit
0
dB dB dB
1 80
(k) ADC Volume (ADVOL_[L/R]) Parameter Volume setting range Volume step width MUTE attenuation rate
Min. -22.5
1.5 80
(l) MIC#1 to #3 Volume (MC[1/2/3]VOL) Parameter Volume setting range Volume step width MUTE attenuation rate
Min.
Typ.
-33 1.5 80
(m) AUX Volume (AUVOL_[L/R]) Parameter Volume setting range Volume step width MUTE attenuation rate Input impedance Input impedance (AUX1L /1R in differential input)
Min.
Typ.
-33 1.5 80 60 120
(n) Side Tone Volume (STVOL_[L/R]) Parameter Volume setting range Volume step width MUTE attenuation rate
Min.
Typ.
-30 1.0 80
(o) Receiver Volume (RCVOL) Parameter Volume setting range Volume step width MUTE attenuation rate
Min.
Typ.
-30 1 80
35
YMU809 PACKAGE DIMENSIONS
36
YMU809
PRECAUTIONS AND INSTRUCTIONS FOR SAFETY
37
YMU809
IMPORTANT NOTICE